Grooves formed around a semiconductor device on a circuit board
Tani , et al. January 6, 2
U.S. patent number D584,249 [Application Number D/303,706] was granted by the patent office on 2009-01-06 for grooves formed around a semiconductor device on a circuit board. This patent grant is currently assigned to Nitto Denko Corporation. Invention is credited to Tetsuya Ohsawa, Emiko Tani.
| United States Patent | D584,249 |
| Tani , et al. | January 6, 2009 |
Grooves formed around a semiconductor device on a circuit board
Claims
CLAIM The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
| Inventors: | Tani; Emiko (Ibaraki, JP), Ohsawa; Tetsuya (Ibaraki, JP) |
|---|---|
| Assignee: | Nitto Denko Corporation (Osaka,
JP) |
| Appl. No.: | D/303,706 |
| Filed: | February 15, 2008 |
Related U.S. Patent Documents
| Application Number | Filing Date | Patent Number | Issue Date | ||
|---|---|---|---|---|---|
| 29268261 | Nov 1, 2006 | D567774 | |||
Foreign Application Priority Data
| May 1, 2006 [JP] | 2006-011443 | |||
| May 1, 2006 [JP] | 2006-011445 | |||
| May 1, 2006 [JP] | 2006-011446 | |||
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182 ;174/250,251,253,254,255,256,265,260,261 ;361/760,748,720 ;336/200 |
References Cited [Referenced By]
U.S. Patent Documents
| D319629 | September 1991 | Hasegawa et al. |
| 5420558 | May 1995 | Ito et al. |
| 5467252 | November 1995 | Nomi et al. |
| 5777277 | July 1998 | Inagawa |
| 5969590 | October 1999 | Gutierrez |
| 6114937 | September 2000 | Burghartz et al. |
| 6121552 | September 2000 | Brosnihan et al. |
| 6486412 | November 2002 | Kato |
| 7126452 | October 2006 | Teshima et al. |
| D566060 | April 2008 | Ohsawa et al. |
| D567774 | April 2008 | Tani et al. |
| D568836 | May 2008 | Ohsawa et al. |
| D568838 | May 2008 | Terada et al. |
| 2006/0266545 | November 2006 | Takeuchi et al. |
| 2007/0188287 | August 2007 | Lien et al. |
| 2007/0205856 | September 2007 | Matsunaga et al. |
Attorney, Agent or Firm: Osha .cndot. Liang LLP
Description
FIG. 1 shows a plan view of the grooves formed around a semiconductor device on a circuit board showing the design according to the invention.
FIG. 2 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1.
FIG. 3 shows an enlarged sectional view along the line 3--3 in FIG. 2; and,
FIG. 4 shows an enlarged sectional view along the line 4--4 in FIG. 2.
The elements shown in broken lines and dash-dot-dash lines are for illustrative purposes only and form no part of the claimed invention.
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