Grooves formed around a semiconductor device on a circuit board

Description

FIG. 1 is a plan view of a first embodiment of the grooves formed around a semiconductor device on a circuit board showing our new design;

FIG. 2 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 1;

FIG. 3 is a sectional view taken along line 3--3 in FIG. 2;

FIG. 4 is a sectional view taken along line 4--4 in FIG. 2;

FIG. 5 is a plan view of a second embodiment;

FIG. 6 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 5;

FIG. 7 is a sectional view taken along line 7--7 in FIG. 6;

FIG. 8 is a sectional view taken along line 8--8 in FIG. 6;

FIG. 9 is a plan view of a third embodiment;

FIG. 10 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 9;

FIG. 11 is a sectional view taken along line 11--11 in FIG. 10; and,

FIG. 12 is a sectional view taken along line 12--12 in FIG. 10.

The broken lines represent unclaimed subject matter.

Claims

CLAIM The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.

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Inventors:	Terada; Naohiro (Osaka, JP), Kataoka; Kouji (Osaka, JP), Ohsawa; Tetsuya (Osaka, JP), Naito; Toshiki (Osaka, JP)
Assignee:	Nitto Denko Corporation (Osaka, JP)
Appl. No.:	D/268,260
Filed:	November 1, 2006

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Foreign Application Priority Data

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May 1, 2006 [JP]			2006-011426
May 1, 2006 [JP]			2006-011429
May 1, 2006 [JP]			2006-011430
May 1, 2006 [JP]			2006-011431
May 1, 2006 [JP]			2006-011432
May 1, 2006 [JP]			2006-011435
May 1, 2006 [JP]			2006-011439
May 1, 2006 [JP]			2006-011440
May 1, 2006 [JP]			2006-011441
May 1, 2006 [JP]			2006-011442

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;174/250,251,253,254,255,256,265,260,261 ;361/760,748,720 ;336/200

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References Cited [Referenced By]

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U.S. Patent Documents

D319629	September 1991	Hasegawa et al.
5420558	May 1995	Ito et al.
5467252	November 1995	Nomi et al.
5777277	July 1998	Inagawa
5969590	October 1999	Gutierrez
6114937	September 2000	Burghartz et al.
6121552	September 2000	Brosnihan et al.
6486412	November 2002	Kato
6798326	September 2004	Iida
6922128	July 2005	Vilander et al.
7068138	June 2006	Edelstein et al.
7126452	October 2006	Teshima et al.
2006/0266545	November 2006	Takeuchi et al.
2007/0188287	August 2007	Lien et al.
2007/0205856	September 2007	Matsunaga et al.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Osha Liang LLP