U.S. patent number D566,060 [Application Number D/240,188] was granted by the patent office on 2008-04-08 for grooves formed around a semiconductor device on a circuit board. This patent grant is currently assigned to Nitto Denko Corporation. Invention is credited to Tetsuya Ohsawa, Emiko Tani.
United States Patent | D566,060 |
Ohsawa , et al. | April 8, 2008 |
Inventors: | Ohsawa; Tetsuya (Osaka, JP), Tani; Emiko (Osaka, JP) |
---|---|
Assignee: | Nitto Denko Corporation (Osaka,
JP) |
Appl. No.: | D/240,188 |
Filed: | October 11, 2005 |
Apr 13, 2005 [JP] | 2005-010991 | |||
Apr 13, 2005 [JP] | 2005-010992 | |||
Apr 13, 2005 [JP] | 2005-010995 | |||
Current U.S. Class: | D13/182 |
Current International Class: | 1303 |
Field of Search: | ;D13/182,158-177 ;336/200 ;324/754 ;D1/106 ;D19/10 ;361/813 |
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11-8275 | Jan 1999 | JP | |||
Office Action dated Nov. 4, 2005 for Japanese Application No. 2005-010995 (2 pages). cited by other . English Translation of Japanese Publication No. 11-8275 dated Jan. 12, 1999 (16 pages). cited by other . English translation of Office Action dated Nov. 4, 2005 for Japanese Patent Application No. 2005-010995 (1 page). cited by other. |
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