Grooves formed around a semiconductor device on a circuit board
Ohsawa , et al. April 8, 2
U.S. patent number D566,060 [Application Number D/240,188] was granted by the patent office on 2008-04-08 for grooves formed around a semiconductor device on a circuit board. This patent grant is currently assigned to Nitto Denko Corporation. Invention is credited to Tetsuya Ohsawa, Emiko Tani.
| United States Patent | D566,060 |
| Ohsawa , et al. | April 8, 2008 |
Grooves formed around a semiconductor device on a circuit board
Claims
CLAIM The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
| Inventors: | Ohsawa; Tetsuya (Osaka, JP), Tani; Emiko (Osaka, JP) |
|---|---|
| Assignee: | Nitto Denko Corporation (Osaka,
JP) |
| Appl. No.: | D/240,188 |
| Filed: | October 11, 2005 |
Foreign Application Priority Data
| Apr 13, 2005 [JP] | 2005-010991 | |||
| Apr 13, 2005 [JP] | 2005-010992 | |||
| Apr 13, 2005 [JP] | 2005-010995 | |||
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182,158-177 ;336/200 ;324/754 ;D1/106 ;D19/10 ;361/813 |
References Cited [Referenced By]
U.S. Patent Documents
| 3676748 | July 1972 | Kobayashi et al. |
| D279670 | July 1985 | Lukits |
| D288556 | March 1987 | Wallgren |
| D295401 | April 1988 | Klees |
| 5008614 | April 1991 | Shreeve et al. |
| D318271 | July 1991 | Hasegawa et al. |
| D319629 | September 1991 | Hasegawa et al. |
| D374541 | October 1996 | Garza |
| 5969590 | October 1999 | Gutierrez |
| 6114937 | September 2000 | Burghartz et al. |
| D487430 | March 2004 | Asaka et al. |
| D510103 | September 2005 | Allard et al. |
| 11-8275 | Jan 1999 | JP | |||
Other References
|
Office Action dated Nov. 4, 2005 for Japanese Application No. 2005-010995 (2 pages). cited by other . English Translation of Japanese Publication No. 11-8275 dated Jan. 12, 1999 (16 pages). cited by other . English translation of Office Action dated Nov. 4, 2005 for Japanese Patent Application No. 2005-010995 (1 page). cited by other. |
Primary Examiner: Bui; Daniel
Assistant Examiner: Johannes; Thomas J
Attorney, Agent or Firm: Osha Liang LLP
Description
FIG. 1 shows a plan view of grooves formed around a semiconductor device on a circuit board showing our new design.
FIG. 2 shows an enlarged view of the claimed portion identified by the dot-dash line in FIG. 1; and,
FIG. 3 shows an enlarged sectional view along the line 3--3 in FIG. 2.
The special dot-dash broken line defines the boundary of the claimed design; the gray stippling indicates the surface of the groove bed; the broken lines show environmental detail for illustrative purposes only and form no part of the claimed design.
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