U.S. patent number D577,691 [Application Number D/303,833] was granted by the patent office on 2008-09-30 for grooves formed around a semiconductor device on a circuit board.
This patent grant is currently assigned to Nitto Denko Corporation. Invention is credited to Tetsuya Ohsawa, Emiko Tani.
United States Patent |
D577,691 |
Ohsawa , et al. |
September 30, 2008 |
Grooves formed around a semiconductor device on a circuit board
Claims
CLAIM The ornamental design for grooves formed around a
semiconductor device on a circuit board, as shown and described.
Inventors: |
Ohsawa; Tetsuya (Ibaraki,
JP), Tani; Emiko (Ibaraki, JP) |
Assignee: |
Nitto Denko Corporation (Osaka,
JP)
|
Appl.
No.: |
D/303,833 |
Filed: |
February 19, 2008 |
Related U.S. Patent Documents
|
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
|
29240188 |
Oct 11, 2005 |
D566060 |
|
|
|
Foreign Application Priority Data
|
|
|
|
|
Apr 13, 2005 [JP] |
|
|
2005-010991 |
Apr 13, 2005 [JP] |
|
|
2005-010992 |
Apr 13, 2005 [JP] |
|
|
2005-010995 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182,158-177
;336/200 ;324/754 ;D1/106 ;D19/10 ;361/813 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Bui; Daniel
Assistant Examiner: Johannes; Thomas J
Attorney, Agent or Firm: Osha .cndot. Liang LLP
Description
FIG. 1 shows a plan view of grooves formed around a semiconductor
device on a circuit board showing our new design.
FIG. 2 shows an enlarged view of the claimed portion identified by
the area boxed by the dot-dash line in FIG. 1; and,
FIG. 3 shows an enlarged sectional view along the line III--III in
FIG. 2.
The special dot-dash broken line defines the boundary of the
claimed design; the gray stippling indicates the surface of the
groove bed; the broken lines show unclaimed subject matter forming
no part of the claimed design.
* * * * *