Absorption board for an electric chuck used in semiconductor manufacture

Oohashi , et al. October 16, 2

Patent Grant D553104

U.S. patent number D553,104 [Application Number D/215,644] was granted by the patent office on 2007-10-16 for absorption board for an electric chuck used in semiconductor manufacture. This patent grant is currently assigned to Tokyo Electron Limited. Invention is credited to Shunsuke Mizukami, Kaoru Oohashi, Takehiro Ueda.


United States Patent D553,104
Oohashi ,   et al. October 16, 2007

Absorption board for an electric chuck used in semiconductor manufacture

Claims

CLAIM We claim the ornamental design for an absorption board for an electric chuck used in semiconductor manufacture, as shown.
Inventors: Oohashi; Kaoru (Nirasaki, JP), Mizukami; Shunsuke (Nirasaki, JP), Ueda; Takehiro (Nirasaki, JP)
Assignee: Tokyo Electron Limited (Tokyo, JP)
Appl. No.: D/215,644
Filed: October 19, 2004

Foreign Application Priority Data

Apr 21, 2004 [JP] 2004-012083
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/182 ;156/345.53 ;279/128 ;361/234

References Cited [Referenced By]

U.S. Patent Documents
3078565 February 1963 Sanders
4502094 February 1985 Lewin et al.
5350479 September 1994 Collins et al.
5671116 September 1997 Husain
6033478 March 2000 Kholodenko
6278600 August 2001 Shamouilian et al.
6628503 September 2003 Sogard
6721162 April 2004 Weldon et al.
2002/0027762 March 2002 Yamaguchi
2002/0159217 October 2002 Tsuruta et al.
2004/0177927 September 2004 Kikuchi et al.
2004/0179323 September 2004 Litman et al.
2004/0190215 September 2004 Weldon et al.
2004/0212947 October 2004 Nguyen et al.
2004/0218339 November 2004 Nakamura
2005/0111161 May 2005 Tran
2005/0146277 July 2005 Ueda et al.
2006/0002053 January 2006 Brown et al.
2006/0164785 July 2006 Pellegrin
2006/0221539 October 2006 Morita et al.
Foreign Patent Documents
D1041644 Jun 1999 JP
2004-047653 Feb 2004 JP
D1197395 Feb 2004 JP
Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Ladas and Parry LLP

Description



FIG. 1 is a perspective view of an absorption board for an electric chuck used in semiconductor manufacture.

FIG. 2 is a front elevational view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a right side elevational view thereof, the left side elevational view being a mirror image and not shown; and,

FIG. 5 is a top plan view thereof, the bottom plan view being a mirror image and not shown.

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