Semiconductor device

Fukumoto , et al. August 6, 2

Patent Grant D461171

U.S. patent number D461,171 [Application Number D/144,816] was granted by the patent office on 2002-08-06 for semiconductor device. This patent grant is currently assigned to Mitsubishi Denki Kabushiki Kaisha. Invention is credited to Takakazu Fukumoto, Tetsuya Matsuura, Muneharu Tokunaga.


United States Patent D461,171
Fukumoto ,   et al. August 6, 2002

Semiconductor device

Claims

The ornamental design for a semiconductor device, as shown and described.
Inventors: Fukumoto; Takakazu (Tokyo, JP), Tokunaga; Muneharu (Tokyo, JP), Matsuura; Tetsuya (Tokyo, JP)
Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP)
Appl. No.: D/144,816
Filed: July 11, 2001

Foreign Application Priority Data

Feb 15, 2001 [JP] 2001-003335
Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/182 ;D14/114 ;174/52.1,52.2,52.4,52.5,16.3 ;206/710,719 ;257/254,659,697,730,738 ;324/755,765 ;361/752,798,820,718,730

References Cited [Referenced By]

U.S. Patent Documents
3706840 December 1972 Moyle et al.
4748538 May 1988 Tsuji
4843695 July 1989 Doe et al.
5237201 August 1993 Tanaki et al.
D345731 April 1994 Owens et al.
5464054 November 1995 Hinshaw et al.
D416872 November 1999 Burke
6020625 February 2000 Qin et al.
D421969 March 2000 Kawafuji et al.
6093957 July 2000 Kwon
D432096 October 2000 Jeon et al.
D432097 October 2000 Song et al.
D448740 October 2001 Iwasaki et al.
6300685 October 2001 Hasegawa et al.
Foreign Patent Documents
63-73694 Apr 1988 JP
63-114245 May 1988 JP
2-134890 May 1990 JP
4-276649 Oct 1992 JP
6-177501 Jun 1994 JP
6-314885 Nov 1994 JP
6-334294 Dec 1994 JP
7-22727 Jan 1995 JP
10-173122 Jun 1998 JP
Primary Examiner: Shooman; Ted
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.

Description



FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;

FIG. 2 is a front, bottom and right side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a right side elevational view thereof; the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a cross-sectional view thereof, taken along line 8--8 of FIG. 5, with the internal system omitted.

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