Seal ring structure with improved cracking protection and reduced problems

Jeng , et al. February 4, 2

Patent Grant 8643147

U.S. patent number 8,643,147 [Application Number 11/933,931] was granted by the patent office on 2014-02-04 for seal ring structure with improved cracking protection and reduced problems. This patent grant is currently assigned to Taiwan Semiconductor Manufacturing Company, Ltd.. The grantee listed for this patent is Shang-Yun Hou, Shih-Hsun Hsu, Shin-Puu Jeng, Hao-Yi Tsai, Chen-Hua Yu. Invention is credited to Shang-Yun Hou, Shih-Hsun Hsu, Shin-Puu Jeng, Hao-Yi Tsai, Chen-Hua Yu.


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