| Patent | Date |
|---|
Package Structure With Fan-out Feature
App 20220310468 - LIN; Meng-Liang ; et al. | 2022-09-29 |
Package Structure And Methods Of Manufacturing The Same
App 20220310532 - Yeh; Shu-Shen ; et al. | 2022-09-29 |
Semiconductor Device And Manufacturing Method Thereof
App 20220310502 - Chen; Chien-Hung ; et al. | 2022-09-29 |
Semiconductor Device And Manufacturing Method Thereof
App 20220310474 - Yeh; Shu-Shen ; et al. | 2022-09-29 |
Semiconductor Package
App 20220310501 - Wang; Chin-Hua ; et al. | 2022-09-29 |
Metallization Structure And Package Structure
App 20220310503 - Hsu; Chia-Kuei ; et al. | 2022-09-29 |
Semiconductor package with dual sides of metal routing
Grant 11,456,257 - Jeng , et al. September 27, 2 | 2022-09-27 |
Semiconductor Package And Method Of Manufacturing The Same
App 20220302081 - Hsu; Chia-Kuei ; et al. | 2022-09-22 |
Package Structure And Method Of Fabricating The Same
App 20220301971 - Lin; Yu-Sheng ; et al. | 2022-09-22 |
Package Structure And Method Of Fabricating The Same
App 20220302011 - Lin; Yu-Sheng ; et al. | 2022-09-22 |
Semiconductor Package
App 20220302030 - Hsu; Feng-Cheng ; et al. | 2022-09-22 |
Semiconductor package
Grant 11,450,622 - Wang , et al. September 20, 2 | 2022-09-20 |
Chip package structure with cavity in interposer
Grant 11,443,993 - Jeng , et al. September 13, 2 | 2022-09-13 |
Package Structure
App 20220278065 - Lee; Tsung-Yen ; et al. | 2022-09-01 |
Package Structure With Buffer Layer Embedded In Lid Layer
App 20220278015 - Yeh; Shu-Shen ; et al. | 2022-09-01 |
Semiconductor Structure And Manufacturing Method Thereof
App 20220278034 - CHEN; SHUO-MAO ; et al. | 2022-09-01 |
Semiconductor Package And Manufacturing Method Thereof
App 20220278037 - Hsu; Chia-Kuei ; et al. | 2022-09-01 |
Semiconductor devices and methods of manufacturing
Grant 11,430,776 - Wu , et al. August 30, 2 | 2022-08-30 |
Structure and formation method of package structure with fan-out structure
Grant 11,430,739 - Tsai , et al. August 30, 2 | 2022-08-30 |
Semiconductor Structure And Manufacturing Method Thereof
App 20220271024 - LU; HSIANG-TAI ; et al. | 2022-08-25 |
Semiconductor Device And Manufacturing Method Thereof
App 20220270949 - Yeh; Shu-Shen ; et al. | 2022-08-25 |
Chip Package Structure And Method For Forming The Same
App 20220270893 - LIN; Yu-Sheng ; et al. | 2022-08-25 |
Pad structure design in fan-out package
Grant 11,424,189 - Yu , et al. August 23, 2 | 2022-08-23 |
Semiconductor Package And Method Manufacturing The Same
App 20220262767 - Hsu; Feng-Cheng ; et al. | 2022-08-18 |
Semiconductor device encapsulated by molding material attached to redestribution layer
Grant 11,417,620 - Jeng , et al. August 16, 2 | 2022-08-16 |
Semiconductor devices and methods of manufacturing
Grant 11,410,982 - Yang , et al. August 9, 2 | 2022-08-09 |
Chip package with lid
Grant 11,410,939 - Yeh , et al. August 9, 2 | 2022-08-09 |
Multi-chip Packages
App 20220246579 - Chen; Shuo-Mao ; et al. | 2022-08-04 |
Semiconductor Device and Method of Manufacture
App 20220246490 - Yeh; Shu-Shen ; et al. | 2022-08-04 |
Chip package structure with integrated device integrated beneath the semiconductor chip
Grant 11,404,394 - Hsu , et al. August 2, 2 | 2022-08-02 |
Package Structure And Method Of Fabricating The Same
App 20220238456 - Wu; Yi-Wen ; et al. | 2022-07-28 |
Semiconductor Package
App 20220230970 - Wang; Chin-Hua ; et al. | 2022-07-21 |
Semiconductor Packages
App 20220230990 - Yew; Ming-Chih ; et al. | 2022-07-21 |
Package Structure And Method Of Fabricating The Same
App 20220230969 - Yeh; Shu-Shen ; et al. | 2022-07-21 |
Reinforcing package using reinforcing patches
Grant 11,393,746 - Hsu , et al. July 19, 2 | 2022-07-19 |
Package Structure And Method Of Manufacturing The Same
App 20220223424 - Hsu; Feng-Cheng ; et al. | 2022-07-14 |
Semiconductor package having a semiconductor device bonded to a circuit substrate through connection terminals and dummy conductors and method of manufacturing the same
Grant 11,387,183 - Hsu , et al. July 12, 2 | 2022-07-12 |
Semiconductor Packages And Methods Of Forming Same
App 20220216192 - Jeng; Shin-Puu ; et al. | 2022-07-07 |
Fan-out package with cavity substrate
Grant 11,380,666 - Tsai , et al. July 5, 2 | 2022-07-05 |
Semiconductor Package
App 20220208707 - Hsu; Chia-Kuei ; et al. | 2022-06-30 |
Dual-sided Routing in 3D SiP Structure
App 20220199541 - Tsai; Po-Hao ; et al. | 2022-06-23 |
Semiconductor Packages Including Passive Devices And Methods Of Forming Same
App 20220189919 - Jeng; Shin-Puu ; et al. | 2022-06-16 |
Formation Method Of Chip Package
App 20220189884 - CHUANG; Po-Yao ; et al. | 2022-06-16 |
Structure and formation method of chip package with fan-out feature
Grant 11,362,010 - Lin , et al. June 14, 2 | 2022-06-14 |
Semiconductor Device And Method
App 20220181298 - Hsu; Chia-Kuei ; et al. | 2022-06-09 |
Method For Forming Package Structure With Lid
App 20220181232 - JENG; Shin-Puu ; et al. | 2022-06-09 |
Semiconductor package and method manufacturing the same
Grant 11,355,474 - Hsu , et al. June 7, 2 | 2022-06-07 |
Semiconductor device and bump formation process
Grant 11,348,889 - Hsiao , et al. May 31, 2 | 2022-05-31 |
Integrated Passive Device Package And Methods Of Forming Same
App 20220165587 - Hsu; Feng-Cheng ; et al. | 2022-05-26 |
Multi-chip wafer level packages
Grant 11,342,306 - Chen , et al. May 24, 2 | 2022-05-24 |
Semiconductor structure and manufacturing method thereof
Grant 11,342,255 - Chen , et al. May 24, 2 | 2022-05-24 |
Semiconductor Device Package Having Dummy Dies And Method Of Forming The Same
App 20220157777 - Yang; Che-Chia ; et al. | 2022-05-19 |
Semiconductor structure and manufacturing method thereof
Grant 11,335,672 - Lu , et al. May 17, 2 | 2022-05-17 |
Semiconductor device and method of manufacture
Grant 11,328,971 - Yeh , et al. May 10, 2 | 2022-05-10 |
Structure and formation method for chip package
Grant 11,329,031 - Hung , et al. May 10, 2 | 2022-05-10 |
Organic Interposer Including Intra-die Structural Reinforcement Structures And Methods Of Forming The Same
App 20220139816 - LIAO; Li-Ling ; et al. | 2022-05-05 |
Package with fan-out structures
Grant 11,322,449 - Jeng , et al. May 3, 2 | 2022-05-03 |
Dual-sided routing in 3D SiP structure
Grant 11,322,447 - Tsai , et al. May 3, 2 | 2022-05-03 |
Package structure and method of fabricating the same
Grant 11,302,650 - Wu , et al. April 12, 2 | 2022-04-12 |
Formation Method Of Chip Package With Fan-out Feature
App 20220108956 - TSAI; Po-Hao ; et al. | 2022-04-07 |
Chip Package Structure
App 20220108967 - JENG; Shin-Puu ; et al. | 2022-04-07 |
Semiconductor packages and methods of forming same
Grant 11,296,065 - Jeng , et al. April 5, 2 | 2022-04-05 |
Package structure and method of manufacturing the same
Grant 11,295,957 - Hsu , et al. April 5, 2 | 2022-04-05 |
Embedded Stress Absorber in Package
App 20220102313 - Jeng; Shin-Puu ; et al. | 2022-03-31 |
Device, semiconductor package and method of manufacturing semiconductor package
Grant 11,282,803 - Hsu , et al. March 22, 2 | 2022-03-22 |
Organic interposer including stress-resistant bonding structures and methods of forming the same
Grant 11,282,756 - Lee , et al. March 22, 2 | 2022-03-22 |
Chip package structure having warpage control and method of forming the same
Grant 11,282,759 - Hsu , et al. March 22, 2 | 2022-03-22 |
Structure and formation method of chip package with shielding structure
Grant 11,270,953 - Chuang , et al. March 8, 2 | 2022-03-08 |
Semiconductor packages including passive devices and methods of forming same
Grant 11,270,975 - Jeng , et al. March 8, 2 | 2022-03-08 |
Package structure with lid and method for forming the same
Grant 11,264,300 - Jeng , et al. March 1, 2 | 2022-03-01 |
Chip bonded to a redistribution structure with curved conductive lines
Grant 11,264,359 - Hsu , et al. March 1, 2 | 2022-03-01 |
Organic Interposer Including Stress-resistant Bonding Structures And Methods Of Forming The Same
App 20220051959 - LEE; Tsung-Yen ; et al. | 2022-02-17 |
Integrated passive device package and methods of forming same
Grant 11,251,054 - Hsu , et al. February 15, 2 | 2022-02-15 |
Method of fabricating package structure
Grant 11,251,142 - Lin , et al. February 15, 2 | 2022-02-15 |
Package Structure With Reinforced Element And Formation Method Thereof
App 20220045016 - JENG; Shin-Puu ; et al. | 2022-02-10 |
Semiconductor Package and Method of Manufacture
App 20220037247 - Hsu; Chia-Kuei ; et al. | 2022-02-03 |
Package Structure And Method
App 20220037243 - Yeh; Shu-Shen ; et al. | 2022-02-03 |
Structure and formation method of chip package with fan-out feature
Grant 11,239,173 - Tsai , et al. February 1, 2 | 2022-02-01 |
Chip package structure
Grant 11,239,194 - Jeng , et al. February 1, 2 | 2022-02-01 |
Semiconductor Packages Including Passive Devices And Methods Of Forming Same
App 20220028825 - Jeng; Shin-Puu ; et al. | 2022-01-27 |
Eccentric Via Structures for Stress Reduction
App 20220020693 - Yeh; Shu-Shen ; et al. | 2022-01-20 |
Stacking Via Structures for Stress Reduction
App 20220020700 - Yeh; Shu-Shen ; et al. | 2022-01-20 |
Molding wafer chamber
Grant 11,205,579 - Lin , et al. December 21, 2 | 2021-12-21 |
Semiconductor package and method manufacturing the same
Grant 11,205,603 - Hsu , et al. December 21, 2 | 2021-12-21 |
Semiconductor Packages And Methods Of Forming Same
App 20210391314 - Jeng; Shin-Puu ; et al. | 2021-12-16 |
Semiconductor Devices And Methods Of Manufacturing
App 20210391317 - Wu; Yi-Wen ; et al. | 2021-12-16 |
Method For Forming Package Structure
App 20210384125 - TSAI; Po-Hao ; et al. | 2021-12-09 |
Methods of Manufacturing An Integrated Circuit Having Stress Tuning Layer
App 20210375789 - Jeng; Shin-Puu ; et al. | 2021-12-02 |
Semiconductor Package With Improved Interposer Structure
App 20210375755 - Wu; Yi-Wen ; et al. | 2021-12-02 |
Methods of forming multi-chip wafer level packages
Grant 11,189,596 - Chen , et al. November 30, 2 | 2021-11-30 |
Integrated circuit structure having dies with connectors of different sizes
Grant 11,183,473 - Jeng , et al. November 23, 2 | 2021-11-23 |
Integrated Fan-out Package, Package-on-package Structure, And Manufacturing Method Thereof
App 20210358824 - Jeng; Shin-Puu ; et al. | 2021-11-18 |
Fan-Out Package with Controllable Standoff
App 20210351118 - Tsai; Po-Hao ; et al. | 2021-11-11 |
Testing of semiconductor chips with microbumps
Grant 11,169,207 - Wu , et al. November 9, 2 | 2021-11-09 |
Method For Forming Chip Package Structure
App 20210343652 - JENG; Shin-Puu ; et al. | 2021-11-04 |
Semiconductor Device and Method of Manufacture
App 20210343665 - Chuang; Po-Yao ; et al. | 2021-11-04 |
Fan-out packages and methods of forming the same
Grant 11,164,754 - Tsai , et al. November 2, 2 | 2021-11-02 |
Package Structure
App 20210335728 - LEE; Hsiao-Wen ; et al. | 2021-10-28 |
Semiconductor Device and Method
App 20210335753 - Hsu; Chia-Kuei ; et al. | 2021-10-28 |
Bump Joint Structure with Distortion and Method Forming Same
App 20210335699 - Lin; Po-Yao ; et al. | 2021-10-28 |
Packages with interposers and methods for forming the same
Grant 11,152,312 - Chiu , et al. October 19, 2 | 2021-10-19 |
Package with UBM and methods of forming
Grant 11,152,323 - Yu , et al. October 19, 2 | 2021-10-19 |
Package With Fan-out Structures
App 20210320069 - JENG; Shin-Puu ; et al. | 2021-10-14 |
3D Packages and Methods for Forming the Same
App 20210313196 - Chiu; Tzu-Wei ; et al. | 2021-10-07 |
Semiconductor Device and Method of Manufacture
App 20210305170 - Chuang; Po-Yao ; et al. | 2021-09-30 |
Semiconductor Devices And Methods Of Manufacturing
App 20210305228 - Yang; Chang-Yi ; et al. | 2021-09-30 |
Package with embedded heat dissipation features
Grant 11,133,237 - Hung , et al. September 28, 2 | 2021-09-28 |
Reinforcing Package Using Reinforcing Patches
App 20210296220 - Hsu; Chia-Kuei ; et al. | 2021-09-23 |
3DIC Packaging with Hot Spot Thermal Management Features
App 20210287956 - Hung; Wensen ; et al. | 2021-09-16 |
Wafer level mold chase
Grant 11,114,313 - Liu , et al. September 7, 2 | 2021-09-07 |
Chip package structure and method for forming the same
Grant 11,114,311 - Tsai , et al. September 7, 2 | 2021-09-07 |
Heterogeneous Fan-out Structure And Method Of Manufacture
App 20210272888 - Tsai; Po-Hao ; et al. | 2021-09-02 |
Method For Forming Semiconductor Package
App 20210272869 - WANG; Chin-Hua ; et al. | 2021-09-02 |
Multi fan-out package structure and method for forming the same
Grant 11,107,801 - Jeng , et al. August 31, 2 | 2021-08-31 |
Package structure with dam structure and method for forming the same
Grant 11,101,214 - Tsai , et al. August 24, 2 | 2021-08-24 |
Methods of manufacturing an integrated circuit having stress tuning layer
Grant 11,094,646 - Jeng , et al. August 17, 2 | 2021-08-17 |
Semiconductor package with improved interposer structure
Grant 11,094,625 - Wu , et al. August 17, 2 | 2021-08-17 |
Semiconductor Package And Method Of Manufacturing The Same
App 20210242117 - Hung; Shih-Ting ; et al. | 2021-08-05 |
Chip Package With Redistribution Structure
App 20210242122 - JENG; Shin-Puu ; et al. | 2021-08-05 |
Package system for integrated circuits
Grant 11,081,372 - Wu , et al. August 3, 2 | 2021-08-03 |
Fan-out package with controllable standoff
Grant 11,075,151 - Tsai , et al. July 27, 2 | 2021-07-27 |
Integrated fan-out package, package-on-package structure, and manufacturing method thereof
Grant 11,075,132 - Jeng , et al. July 27, 2 | 2021-07-27 |
Semiconductor Device And Method Of Manufacture
App 20210225785 - Tsai; Po-Hao ; et al. | 2021-07-22 |
Package Structure And Method Of Fabricating The Same
App 20210225776 - Wu; Yi-Wen ; et al. | 2021-07-22 |
Three-layer package-on-package structure and method forming same
Grant 11,069,656 - Hung , et al. July 20, 2 | 2021-07-20 |
3D packages and methods for forming the same
Grant 11,069,539 - Chiu , et al. July 20, 2 | 2021-07-20 |
Chip Package Structure With Ring Structure And Method For Forming The Same
App 20210217676 - YEH; Shu-Shen ; et al. | 2021-07-15 |
Semiconductor device and method of manufacture
Grant 11,063,007 - Chuang , et al. July 13, 2 | 2021-07-13 |
Semiconductor package
Grant 11,063,023 - Hsu , et al. July 13, 2 | 2021-07-13 |
Method for forming chip package structure
Grant 11,062,997 - Jeng , et al. July 13, 2 | 2021-07-13 |
Packages with metal line crack prevention design
Grant 11,056,464 - Yu , et al. July 6, 2 | 2021-07-06 |
Package structure with buffer layer sandwiched between encapsulation layer and semiconductor substrate
Grant 11,056,445 - Lee , et al. July 6, 2 | 2021-07-06 |
Integrated Circuit Package and Method Forming Same
App 20210193637 - Jeng; Shin-Puu ; et al. | 2021-06-24 |
3DIC packaging with hot spot thermal management features
Grant 11,037,852 - Hung , et al. June 15, 2 | 2021-06-15 |
Semiconductor Devices and Methods of Manufacture
App 20210159182 - Jeng; Shin-Puu ; et al. | 2021-05-27 |
Heterogeneous fan-out structure and method of manufacture
Grant 11,018,081 - Tsai , et al. May 25, 2 | 2021-05-25 |
Semiconductor package and method for forming the same
Grant 11,011,447 - Wang , et al. May 18, 2 | 2021-05-18 |
Profile of through via protrusion in 3DIC interconnect
Grant 11,004,741 - Wu , et al. May 11, 2 | 2021-05-11 |
Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
Grant 11,004,771 - Hsieh , et al. May 11, 2 | 2021-05-11 |
Structure And Formation Method Of Chip Package With Fan-out Feature
App 20210118757 - LIN; Meng-Liang ; et al. | 2021-04-22 |
Chip package with recessed interposer substrate
Grant 10,985,100 - Jeng , et al. April 20, 2 | 2021-04-20 |
Semiconductor structure and manufacturing method thereof
Grant 10,971,483 - Jeng , et al. April 6, 2 | 2021-04-06 |
Semiconductor device and method of manufacture
Grant 10,971,461 - Tsai , et al. April 6, 2 | 2021-04-06 |
Method For Forming Chip Package Structure
App 20210098379 - JENG; Shin-Puu ; et al. | 2021-04-01 |
Semiconductor Device and Method
App 20210090906 - Tsai; Chen-Yu ; et al. | 2021-03-25 |
Semiconductor Package Structure
App 20210082882 - HSU; FENG-CHENG ; et al. | 2021-03-18 |
Device, Semiconductor Package And Method Of Manufacturing Semiconductor Package
App 20210082847 - Hsu; Chia-Kuei ; et al. | 2021-03-18 |
Chip Package Structure With Integrated Device Integrated Beneath The Semiconductor Chip
App 20210074678 - HSU; Feng-Cheng ; et al. | 2021-03-11 |
Chip Package Structure Having Warpage Control And Method Of Forming The Same
App 20210074602 - HSU; Feng-Cheng ; et al. | 2021-03-11 |
Chip Package Structure And Method Of Forming The Same
App 20210074682 - CHEN; Shuo-Mao ; et al. | 2021-03-11 |
Chip Package Structure With Cavity In Interposer
App 20210074600 - JENG; Shin-Puu ; et al. | 2021-03-11 |
Semiconductor Package for Thermal Dissipation
App 20210057387 - Yu; Chen-Hua ; et al. | 2021-02-25 |
Dual-sided Routing in 3D SiP Structure
App 20210050295 - Tsai; Po-Hao ; et al. | 2021-02-18 |
Fan-Out Package with Cavity Substrate
App 20210035966 - Tsai; Po-Hao ; et al. | 2021-02-04 |
Alignment marks in substrate having through-substrate via (TSV)
Grant 10,910,267 - Chang , et al. February 2, 2 | 2021-02-02 |
Integrated Circuit Package and Method
App 20210013053 - Tsai; Po-Hao ; et al. | 2021-01-14 |
Chip Package With Lid
App 20210013160 - YEH; Shu-Shen ; et al. | 2021-01-14 |
Package Structure And Method Of Forming The Same
App 20210005562 - JENG; Shin-Puu ; et al. | 2021-01-07 |
Method Of Manufacturing Semiconductor Package Structure
App 20200411474 - JENG; SHIN-PUU ; et al. | 2020-12-31 |
Structure And Formation Method Of Chip Package With Conductive Support Elements
App 20200411444 - TSAI; Po-Hao ; et al. | 2020-12-31 |
Integrated fan-out packages
Grant 10,879,162 - Jeng , et al. December 29, 2 | 2020-12-29 |
Electric magnetic shielding structure in packages
Grant 10,872,865 - Yu , et al. December 22, 2 | 2020-12-22 |
Multi-chip Wafer Level Packages
App 20200395335 - Chen; Shuo-Mao ; et al. | 2020-12-17 |
Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routing
Grant 10,867,924 - Jeng , et al. December 15, 2 | 2020-12-15 |
Method for forming chip package structure
Grant 10,867,925 - Jeng , et al. December 15, 2 | 2020-12-15 |
Solution for reducing poor contact in InFO package
Grant 10,861,835 - Lin , et al. December 8, 2 | 2020-12-08 |
Wafer level package (WLP) and method for forming the same
Grant 10,861,801 - Jeng , et al. December 8, 2 | 2020-12-08 |
Structure and Formation Method for Chip Package
App 20200381407 - Hung; Jui-Pin ; et al. | 2020-12-03 |
Semiconductor package structure
Grant 10,854,579 - Hsu , et al. December 1, 2 | 2020-12-01 |
Device, semiconductor package and method of manufacturing semiconductor package
Grant 10,854,563 - Hsu , et al. December 1, 2 | 2020-12-01 |
3D packages and methods for forming the same
Grant 10,854,567 - Hou , et al. December 1, 2 | 2020-12-01 |
Semiconductor Package
App 20200373278 - HSU; FENG-CHENG ; et al. | 2020-11-26 |
Embedded 3D interposer structure
Grant 10,847,414 - Shih , et al. November 24, 2 | 2020-11-24 |
Wafer Level Mold Chase
App 20200365421 - LIU; Hsien-Wen ; et al. | 2020-11-19 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200357785 - LU; HSIANG-TAI ; et al. | 2020-11-12 |
Semiconductor Device and Method of Manufacture
App 20200357714 - Yeh; Shu-Shen ; et al. | 2020-11-12 |
Interposer Test Structures and Methods
App 20200350221 - Liu; Tzuan-Horng ; et al. | 2020-11-05 |
Methods Of Forming Multi-chip Wafer Level Packages
App 20200343220 - Chen; Shuo-Mao ; et al. | 2020-10-29 |
Package Structure And Method Of Manufacturing The Same
App 20200343096 - Hsu; Feng-Cheng ; et al. | 2020-10-29 |
Semiconductor package for thermal dissipation
Grant 10,811,389 - Yu , et al. October 20, 2 | 2020-10-20 |
Semiconductor package structure and method of manufacturing the same
Grant 10,804,244 - Jeng , et al. October 13, 2 | 2020-10-13 |
Fan-out package with cavity substrate
Grant 10,804,254 - Tsai , et al. October 13, 2 | 2020-10-13 |
Alignment Marks in Substrate Having Through-Substrate Via (TSV)
App 20200321249 - Chang; Hsin ; et al. | 2020-10-08 |
Semiconductor Package And Method Manufacturing The Same
App 20200321313 - Hsu; Feng-Cheng ; et al. | 2020-10-08 |
Structure and formation method of chip package with lid
Grant 10,797,006 - Yeh , et al. October 6, 2 | 2020-10-06 |
Structure And Formation Method Of Chip Package With Fan-out Feature
App 20200312773 - TSAI; Po-Hao ; et al. | 2020-10-01 |
Integrated circuit package and method
Grant 10,790,162 - Tsai , et al. September 29, 2 | 2020-09-29 |
Method for forming package structure
Grant 10,790,164 - Lin , et al. September 29, 2 | 2020-09-29 |
Semiconductor Package And Method Manufacturing The Same
App 20200303277 - Hsu; Feng-Cheng ; et al. | 2020-09-24 |
Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layer
Grant 10,784,220 - Jeng , et al. Sept | 2020-09-22 |
Method Of Fabricating Package Structure
App 20200286744 - Lin; Chia-Hsiang ; et al. | 2020-09-10 |
Device, Semiconductor Package And Method Of Manufacturing Semiconductor Package
App 20200286843 - Hsu; Chia-Kuei ; et al. | 2020-09-10 |
Method Of Forming Semicondcutor Device Package
App 20200286878 - Lin; Po-Yao ; et al. | 2020-09-10 |
Semiconductor package and manufacturing method of the same
Grant 10,770,437 - Hung , et al. Sep | 2020-09-08 |
Multi-chip wafer level packages and methods of forming the same
Grant 10,763,239 - Chen , et al. Sep | 2020-09-01 |
Semiconductor Package
App 20200273797 - Hsu; Feng-Cheng ; et al. | 2020-08-27 |
Manufacturing method of semiconductor package
Grant 10,756,064 - Hsu , et al. A | 2020-08-25 |
3D Packages and Methods for Forming the Same
App 20200266076 - Chiu; Tzu-Wei ; et al. | 2020-08-20 |
Testing Of Semiconductor Chips With Microbumps
App 20200264231 - Wu; Wei-Cheng ; et al. | 2020-08-20 |
Structure and formation method for chip package
Grant 10,748,882 - Hung , et al. A | 2020-08-18 |
Method For Manufacturing Semiconductor Package Structure
App 20200258849 - A1 | 2020-08-13 |
Package structure and method of manufacturing the same
Grant 10,741,404 - Hsu , et al. A | 2020-08-11 |
Semiconductor structure and manufacturing method thereof
Grant 10,741,537 - Lu , et al. A | 2020-08-11 |
Package With Embedded Heat Dissipation Features
App 20200251398 - Kind Code | 2020-08-06 |
Interposer test structures and methods
Grant 10,734,295 - Liu , et al. | 2020-08-04 |
Semiconductor devices, methods of manufacture thereof, and capacitors
Grant 10,727,294 - Chiou , et al. | 2020-07-28 |
Semiconductor package and method manufacturing the same
Grant 10,727,198 - Hsu , et al. | 2020-07-28 |
Semiconductor device and method of manufacture
Grant 10,727,147 - Yeh , et al. | 2020-07-28 |
Method of forming semicondcutor device package
Grant 10,714,463 - Lin , et al. | 2020-07-14 |
Semiconductor package and method manufacturing the same
Grant 10,707,142 - Hsu , et al. | 2020-07-07 |
Package Structure And Method For Forming The Same
App 20200211962 - TSAI; Po-Hao ; et al. | 2020-07-02 |
Semiconductor Package With Improved Interposer Structure
App 20200211956 - WU; Yi-Wen ; et al. | 2020-07-02 |
Heterogeneous Antenna in Fan-Out Package
App 20200212537 - Chuang; Po-Yao ; et al. | 2020-07-02 |
Semiconductor package with dummy bumps connected to non-solder mask defined pads
Grant 10,692,813 - Hsu , et al. | 2020-06-23 |
Alignment marks in substrate having through-substrate via (TSV)
Grant 10,692,764 - Chang , et al. | 2020-06-23 |
Chip-on-substrate packaging on carrier
Grant 10,679,951 - Yu , et al. | 2020-06-09 |
3D packages and methods for forming the same
Grant 10,665,474 - Chiu , et al. | 2020-05-26 |
Testing of semiconductor chips with microbumps
Grant 10,663,512 - Wu , et al. | 2020-05-26 |
Package structure and method of fabricating the same
Grant 10,665,473 - Lin , et al. | 2020-05-26 |
Device, semiconductor package and method of manufacturing semiconductor package
Grant 10,665,559 - Hsu , et al. | 2020-05-26 |
Chip Package Structure
App 20200161267 - JENG; Shin-Puu ; et al. | 2020-05-21 |
Packages and packaging methods for semiconductor devices, and packaged semiconductor devices
Grant 10,658,337 - Yu , et al. | 2020-05-19 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200152563 - CHEN; SHUO-MAO ; et al. | 2020-05-14 |
Semiconductor Package Structure And Method Of Manufacturing The Same
App 20200152603 - JENG; SHIN-PUU ; et al. | 2020-05-14 |
Profile of Through Via Protrusion in 3DIC Interconnect
App 20200144119 - Wu; Jiung ; et al. | 2020-05-07 |
Three-Layer Package-on-Package Structure and Method Forming Same
App 20200135694 - Hung; Jui-Pin ; et al. | 2020-04-30 |
Structure And Formation Method Of Package Structure With Fan-out Structure
App 20200135653 - TSAI; Po-Hao ; et al. | 2020-04-30 |
Package Structure
App 20200135661 - LEE; Hsiao-Wen ; et al. | 2020-04-30 |
Semiconductor package structure
Grant 10,636,747 - Hung , et al. | 2020-04-28 |
Semiconductor Device and Bump Formation Process
App 20200126937 - Hsiao; Yi-Li ; et al. | 2020-04-23 |
Chip Package With Interposer Substrate
App 20200126812 - JENG; Shin-Puu ; et al. | 2020-04-23 |
3D Packages and Methods for Forming the Same
App 20200126938 - Hou; Shang-Yun ; et al. | 2020-04-23 |
Package with embedded heat dissipation features
Grant 10,629,510 - Hung , et al. | 2020-04-21 |
Package System For Integrated Circuits
App 20200118839 - WU; Wei-Cheng ; et al. | 2020-04-16 |
Manufacturing method of semiconductor package
Grant 10,622,336 - Hsu , et al. | 2020-04-14 |
Semiconductor Device and Method
App 20200111682 - Tsai; Chen-Yu ; et al. | 2020-04-09 |
Integrated Circuit Package and Method
App 20200105663 - Tsai; Po-Hao ; et al. | 2020-04-02 |
Fan-Out Packages And Methods Of Forming The Same
App 20200105544 - Tsai; Po-Hao ; et al. | 2020-04-02 |
Method For Forming Chip Package Structure
App 20200098693 - JENG; Shin-Puu ; et al. | 2020-03-26 |
Method Of Forming Semicondcutor Device Package
App 20200098739 - Lin; Po-Yao ; et al. | 2020-03-26 |
Wafer Level Package (WLP) and Method for Forming the Same
App 20200098705 - Jeng; Shin-Puu ; et al. | 2020-03-26 |
Pad Structure Design in Fan-Out Package
App 20200091075 - Yu; Chen-Hua ; et al. | 2020-03-19 |
Alignment Mark Design for Packages
App 20200091086 - Huang; Li-Hsien ; et al. | 2020-03-19 |
Integrated Passive Device Package And Methods Of Forming Same
App 20200090955 - Hsu; Feng-Cheng ; et al. | 2020-03-19 |
Package Structure With Lid And Method For Forming The Same
App 20200091029 - JENG; Shin-Puu ; et al. | 2020-03-19 |
Structure And Formation Method Of Chip Package With Shielding Structure
App 20200075503 - CHUANG; Po-Yao ; et al. | 2020-03-05 |
Package Structure And Method For Forming The Same
App 20200075569 - JENG; Shin-Puu ; et al. | 2020-03-05 |
Chip Package Structure And Method For Forming The Same
App 20200075350 - TSAI; Po-Hao ; et al. | 2020-03-05 |
Semiconductor Package And Method For Forming The Same
App 20200058571 - WANG; Chin-Hua ; et al. | 2020-02-20 |
Semiconductor Device And Method Of Manufacture
App 20200058606 - Tsai; Po-Hao ; et al. | 2020-02-20 |
Profile of through via protrusion in 3DIC interconnect
Grant 10,566,237 - Wu , et al. Feb | 2020-02-18 |
Manufacturing Method Of Semiconductor Package
App 20200043900 - HSU; FENG-CHENG ; et al. | 2020-02-06 |
Integrated Circuit Structure Having Dies with Connectors of Different Sizes
App 20200043879 - Jeng; Shin-Puu ; et al. | 2020-02-06 |
Embedded 3D Interposer Structure
App 20200035554 - Shih; Ying-Ching ; et al. | 2020-01-30 |
Heterogeneous Fan-out Structure And Method Of Manufacture
App 20200035590 - Tsai; Po-Hao ; et al. | 2020-01-30 |
Chip package structure
Grant 10,546,830 - Jeng , et al. Ja | 2020-01-28 |
Method For Forming Chip Package Structure
App 20200027837 - JENG; Shin-Puu ; et al. | 2020-01-23 |
3DIC Packaging with Hot Spot Thermal Management Features
App 20200027809 - Hung; Wensen ; et al. | 2020-01-23 |
Semiconductor structure and manufacturing method thereof
Grant 10,535,597 - Chen , et al. Ja | 2020-01-14 |
Semiconductor package structure and method of manufacturing the same
Grant 10,535,632 - Jeng , et al. Ja | 2020-01-14 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20200013707 - Jeng; Shin-Puu ; et al. | 2020-01-09 |
3D packages and methods for forming the same
Grant 10,529,679 - Hou , et al. J | 2020-01-07 |
Package structure and method for forming the same
Grant 10,529,671 - Lee , et al. J | 2020-01-07 |
Chip Package Structure With Molding Layer And Method For Forming The Same
App 20200006176 - TSAI; Po-Hao ; et al. | 2020-01-02 |
Semiconductor Package With Dual Sides Of Metal Routing
App 20200006234 - Jeng; Shin-Puu ; et al. | 2020-01-02 |
Fan-Out Package with Cavity Substrate
App 20200006307 - Tsai; Po-Hao ; et al. | 2020-01-02 |
Electric Magnetic Shielding Structure in Packages
App 20200006248 - Yu; Chen-Hua ; et al. | 2020-01-02 |
Fan-out Package with Controllable Standoff
App 20200006214 - Tsai; Po-Hao ; et al. | 2020-01-02 |
Semiconductor device and bump formation process
Grant 10,522,491 - Hsiao , et al. Dec | 2019-12-31 |
Alignment mark design for packages
Grant 10,522,473 - Huang , et al. Dec | 2019-12-31 |
Three-layer package-on-package structure and method forming same
Grant 10,515,930 - Hung , et al. Dec | 2019-12-24 |
Method for forming chip package with recessed interposer substrate
Grant 10,515,827 - Jeng , et al. Dec | 2019-12-24 |
Package system for integrated circuits
Grant 10,515,829 - Wu , et al. Dec | 2019-12-24 |
Pad structure design in fan-out package
Grant 10,510,670 - Yu , et al. Dec | 2019-12-17 |
Semiconductor device package including conformal metal cap contacting each semiconductor die
Grant 10,510,561 - Tsai , et al. Dec | 2019-12-17 |
Wafer level package (WLP) and method for forming the same
Grant 10,510,690 - Jeng , et al. Dec | 2019-12-17 |
Integrated passive device package and methods of forming same
Grant 10,504,752 - Hsu , et al. Dec | 2019-12-10 |
Method of forming semicondcutor device package
Grant 10,504,880 - Lin , et al. Dec | 2019-12-10 |
Embedded 3D interposer structure
Grant 10,497,616 - Shih , et al. De | 2019-12-03 |
Semiconductor Device and Method of Manufacture
App 20190355680 - Chuang; Po-Yao ; et al. | 2019-11-21 |
Integrated circuit structure having dies with connectors of different sizes
Grant 10,475,759 - Jeng , et al. Nov | 2019-11-12 |
Semiconductor package and manufacturing method of the same
Grant 10,475,769 - Hsu , et al. Nov | 2019-11-12 |
Forming grounded through-silicon vias in a semiconductor substrate
Grant RE47,709 - Hsieh , et al. No | 2019-11-05 |
Heterogeneous fan-out structure and method of manufacture
Grant 10,468,339 - Tsai , et al. No | 2019-11-05 |
Solution for Reducing Poor Contact in InFO Package
App 20190333900 - Lin; Jing-Cheng ; et al. | 2019-10-31 |
3DIC packaging with hot spot thermal management features
Grant 10,461,009 - Hung , et al. Oc | 2019-10-29 |
Device, Semiconductor Package And Method Of Manufacturing Semiconductor Package
App 20190319002 - Hsu; Chia-Kuei ; et al. | 2019-10-17 |
3D semiconductor package interposer with die cavity
Grant 10,446,520 - Jeng , et al. Oc | 2019-10-15 |
Semiconductor Package Structure
App 20190279968 - HSU; FENG-CHENG ; et al. | 2019-09-12 |
Semiconductor Package And Method Manufacturing The Same
App 20190259680 - Hsu; Feng-Cheng ; et al. | 2019-08-22 |
Chip Package Structure
App 20190259726 - JENG; Shin-Puu ; et al. | 2019-08-22 |
Method Of Forming Semicondcutor Device Package
App 20190252363 - Lin; Po-Yao ; et al. | 2019-08-15 |
Methods of Manufacturing an Integrated Circuit Having Stress Tuning Layer
App 20190252328 - Jeng; Shin-Puu ; et al. | 2019-08-15 |
Cooling Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices
App 20190252294 - Hsieh; Cheng-Chieh ; et al. | 2019-08-15 |
Package with UBM and Methods of Forming
App 20190252341 - Yu; Chen-Hua ; et al. | 2019-08-15 |
Heterogeneous Fan-Out Structure and Method of Manufacture
App 20190229046 - Tsai; Po-Hao ; et al. | 2019-07-25 |
3D Packages and Methods for Forming the Same
App 20190221445 - Chiu; Tzu-Wei ; et al. | 2019-07-18 |
Using metal-containing layer to reduce carrier shock in package formation
Grant 10,354,988 - Jeng , et al. July 16, 2 | 2019-07-16 |
Solution for reducing poor contact in InFO package
Grant 10,347,612 - Lin , et al. July 9, 2 | 2019-07-09 |
Integrated fan-out packages
Grant 10,347,574 - Jeng , et al. July 9, 2 | 2019-07-09 |
Packaged semiconductor devices
Grant 10,332,823 - Chen , et al. | 2019-06-25 |
Semiconductor Structure And Manufacturing Method Thereof
App 20190148347 - JENG; SHIN-PUU ; et al. | 2019-05-16 |
Stacked semiconductor device and method of manufacturing the same
Grant 10,290,590 - Jeng , et al. | 2019-05-14 |
Fan-out package structure and method for forming the same
Grant 10,290,605 - Jeng , et al. | 2019-05-14 |
Package Structure And Method Of Manufacturing The Same
App 20190139896 - Hsu; Feng-Cheng ; et al. | 2019-05-09 |
Package Structure And Method Of Fabricating The Same
App 20190139784 - Lin; Chia-Hsiang ; et al. | 2019-05-09 |
Chip package structure and method for forming the same
Grant 10,283,474 - Jeng , et al. | 2019-05-07 |
Semiconductor package and method manufacturing the same
Grant 10,283,428 - Hsu , et al. | 2019-05-07 |
Multi-chip Wafer Level Packages And Methods Of Forming The Same
App 20190131273 - Chen; Shuo-Mao ; et al. | 2019-05-02 |
Package With Fan-out Structures
App 20190131241 - JENG; Shin-Puu ; et al. | 2019-05-02 |
Alignment Marks in Substrate Having Through-Substrate Via (TSV)
App 20190131172 - Chang; Hsin ; et al. | 2019-05-02 |
Semiconductor Package for Thermal Dissipation
App 20190131280 - Yu; Chen-Hua ; et al. | 2019-05-02 |
Testing Of Semiconductor Chips With Microbumps
App 20190128958 - Wu; Wei-Cheng ; et al. | 2019-05-02 |
Chip Package With Interposer Substrate And Method For Forming The Same
App 20190131284 - JENG; Shin-Puu ; et al. | 2019-05-02 |
Semiconductor device package and method of forming semiconductor device package
Grant 10,276,551 - Lin , et al. | 2019-04-30 |
Packaged Semiconductor Devices
App 20190122959 - Chen; Kim Hong ; et al. | 2019-04-25 |
Profile of Through Via Protrusion in 3DIC Interconnect
App 20190122927 - Wu; Jiung ; et al. | 2019-04-25 |
Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
Grant 10,269,682 - Hsieh , et al. | 2019-04-23 |
Alignment mark design for packages
Grant 10,269,723 - Huang , et al. | 2019-04-23 |
Methods of manufacturing an integrated circuit having stress tuning layer
Grant 10,269,730 - Jeng , et al. | 2019-04-23 |
Package with UBM and methods of forming
Grant 10,269,752 - Yu , et al. | 2019-04-23 |
3D packages and methods for forming the same
Grant 10,269,584 - Chiu , et al. | 2019-04-23 |
Wafer warpage inspection system and method using the same
Grant 10,269,602 - Lin , et al. | 2019-04-23 |
Chip-on-Substrate Packaging on Carrier
App 20190115307 - Yu; Chen-Hua ; et al. | 2019-04-18 |
Configurable routing for packaging applications
Grant 10,262,939 - Lu , et al. | 2019-04-16 |
Manufacturing Method Of Semiconductor Package
App 20190103382 - HSU; FENG-CHENG ; et al. | 2019-04-04 |
3DIC Packaging with Hot Spot Thermal Management Features
App 20190096781 - Hung; Wensen ; et al. | 2019-03-28 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20190096791 - Jeng; Shin-Puu ; et al. | 2019-03-28 |
Structure And Formation Method Of Chip Package With Lid
App 20190096826 - YEH; Shu-Shen ; et al. | 2019-03-28 |
Integrated Fan-out Package, Package-on-package Structure, And Manufacturing Method Thereof
App 20190067144 - Jeng; Shin-Puu ; et al. | 2019-02-28 |
Semiconductor Device and Method of Manufacture
App 20190057916 - Yeh; Shu-Shen ; et al. | 2019-02-21 |
Interposer Test Structures and Methods
App 20190057912 - Liu; Tzuan-Horng ; et al. | 2019-02-21 |
Using Metal-Containing Layer to Reduce Carrier Shock in Package Formation
App 20190027469 - Jeng; Shin-Puu ; et al. | 2019-01-24 |
Semiconductor Package With Dual Sides Of Metal Routing
App 20190013273 - Jeng; Shin-Puu ; et al. | 2019-01-10 |
Testing of semiconductor chips with microbumps
Grant 10,175,294 - Wu , et al. J | 2019-01-08 |
Semiconductor Package And Method Manufacturing The Same
App 20190006315 - Hsu; Feng-Cheng ; et al. | 2019-01-03 |
Semiconductor Package And Method Manufacturing The Same
App 20190006257 - Hsu; Feng-Cheng ; et al. | 2019-01-03 |
Chip Package Structure And Method For Forming The Same
App 20190006309 - JENG; Shin-Puu ; et al. | 2019-01-03 |
Fan-out Package Structure And Method For Forming The Same
App 20190006314 - Jeng; Shin-Puu ; et al. | 2019-01-03 |
Semicondcutor Device Package And Method Of Forming Semicondcutor Device Package
App 20190006341 - Lin; Po-Yao ; et al. | 2019-01-03 |
Structure and Formation Method for Chip Package
App 20190006332 - Hung; Jui-Pin ; et al. | 2019-01-03 |
Through via structure extending to metallization layer
Grant 10,170,396 - Chen , et al. J | 2019-01-01 |
Wafer Level Package (WLP) and Method for Forming the Same
App 20180374801 - Jeng; Shin-Puu ; et al. | 2018-12-27 |
Chip-on-substrate packaging on carrier
Grant 10,163,822 - Yu , et al. Dec | 2018-12-25 |
Semiconductor structure and manufacturing method thereof
Grant 10,163,876 - Jeng , et al. Dec | 2018-12-25 |
Semiconductor package for thermal dissipation
Grant 10,163,861 - Yu , et al. Dec | 2018-12-25 |
Structure and formation method of chip package with lid
Grant 10,163,816 - Yeh , et al. Dec | 2018-12-25 |
Alignment marks in substrate having through-substrate via (TSV)
Grant 10,163,706 - Chang , et al. Dec | 2018-12-25 |
Semiconductor package structure
Grant 10,163,860 - Hsu , et al. Dec | 2018-12-25 |
Profile of through via protrusion in 3DIC interconnect
Grant 10,163,705 - Wu , et al. Dec | 2018-12-25 |
3DIC packaging with hot spot thermal management features
Grant 10,157,813 - Hung , et al. Dec | 2018-12-18 |
Die-to-die gap control for semiconductor structure and method
Grant 10,157,879 - Lin , et al. Dec | 2018-12-18 |
Methods of cooling packaged semiconductor devices
Grant 10,157,818 - Chen , et al. Dec | 2018-12-18 |
Method of manufacturing a capacitor
Grant 10,153,338 - Chang , et al. Dec | 2018-12-11 |
Semiconductor Package And Manufacturing Method Of The Same
App 20180350786 - HUNG; JUI-PIN ; et al. | 2018-12-06 |
Packages and Packaging Methods for Semiconductor Devices, and Packaged Semiconductor Devices
App 20180337163 - Yu; Chen-Hua ; et al. | 2018-11-22 |
Semiconductor device and method of manufacture
Grant 10,109,547 - Yeh , et al. October 23, 2 | 2018-10-23 |
Embedded 3D Interposer Structure
App 20180301376 - Shih; Ying-Ching ; et al. | 2018-10-18 |
Semiconductor Package Structure
App 20180294237 - HUNG; JUI-PIN ; et al. | 2018-10-11 |
Package Structure And Method Of Forming Package Structure
App 20180286824 - JENG; Shin-Puu ; et al. | 2018-10-04 |
Interposer test structures and methods
Grant 10,090,213 - Liu , et al. October 2, 2 | 2018-10-02 |
Packages with Interposers and Methods for Forming the Same
App 20180277495 - Chiu; Sao-Ling ; et al. | 2018-09-27 |
Using metal-containing layer to reduce carrier shock in package formation
Grant 10,083,949 - Jeng , et al. September 25, 2 | 2018-09-25 |
Package with Embedded Heat Dissipation Features
App 20180269127 - Hung; Wensen ; et al. | 2018-09-20 |
Semiconductor Structure And Manufacturing Method Thereof
App 20180269189 - JENG; SHIN-PUU ; et al. | 2018-09-20 |
Packages and packaging methods for semiconductor devices, and packaged semiconductor devices
Grant 10,074,631 - Yu , et al. September 11, 2 | 2018-09-11 |
Structure and formation method for chip package
Grant 10,074,637 - Hung , et al. September 11, 2 | 2018-09-11 |
Wafer level package (WLP) and method for forming the same
Grant 10,074,617 - Jeng , et al. September 11, 2 | 2018-09-11 |
Semiconductor Device And Bump Formation Process
App 20180247907 - Hsiao; Yi-Li ; et al. | 2018-08-30 |
Semiconductor packages with thermal management features for reduced thermal crosstalk
Grant 10,062,665 - Chen , et al. August 28, 2 | 2018-08-28 |
Bump structure for yield improvement
Grant 10,056,347 - Chiu , et al. August 21, 2 | 2018-08-21 |
Semiconductor package and manufacturing method of the same
Grant 10,050,024 - Hung , et al. August 14, 2 | 2018-08-14 |
Embedded 3D interposer structure
Grant 10,049,928 - Shih , et al. August 14, 2 | 2018-08-14 |
Semiconductor package structure and manufacturing method thereof
Grant 9,997,471 - Hung , et al. June 12, 2 | 2018-06-12 |
Through silicon via structure
Grant 9,997,497 - Yu , et al. June 12, 2 | 2018-06-12 |
Semiconductor structure and manufacturing method thereof
Grant 9,985,006 - Jeng , et al. May 29, 2 | 2018-05-29 |
Packages with interposers and methods for forming the same
Grant 9,984,981 - Chiu , et al. May 29, 2 | 2018-05-29 |
3DIC package and methods of forming the same
Grant 9,985,001 - Chen , et al. May 29, 2 | 2018-05-29 |
Package with embedded heat dissipation features
Grant 9,978,660 - Hung , et al. May 22, 2 | 2018-05-22 |
Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs)
Grant 9,978,637 - Liu , et al. May 22, 2 | 2018-05-22 |
Semiconductor device and bump formation process
Grant 9,960,134 - Hsiao , et al. May 1, 2 | 2018-05-01 |
End point detection in grinding
Grant 9,960,088 - Mao , et al. May 1, 2 | 2018-05-01 |
Molding chamber apparatus and curing method
Grant 9,950,450 - Lin , et al. April 24, 2 | 2018-04-24 |
Pillar design for conductive bump
Grant 9,953,948 - Hsieh , et al. April 24, 2 | 2018-04-24 |
3DIC packages with heat dissipation structures
Grant 9,941,251 - Hung , et al. April 10, 2 | 2018-04-10 |
Three-layer Package-on-Package structure and method forming same
Grant 9,935,080 - Hung , et al. April 3, 2 | 2018-04-03 |
Packages with metal line crack prevention design
Grant 9,929,126 - Yu , et al. March 27, 2 | 2018-03-27 |
Chip-on-substrate packaging on carrier
Grant 9,922,943 - Yu , et al. March 20, 2 | 2018-03-20 |
Integrated passive device package and methods of forming same
Grant 9,911,629 - Hsu , et al. March 6, 2 | 2018-03-06 |
Semiconductor devices, methods of manufacture thereof, and capacitors
Grant 9,899,467 - Chiou , et al. February 20, 2 | 2018-02-20 |
Integrated fan-out package on package structure and methods of forming same
Grant 9,881,908 - Lin , et al. January 30, 2 | 2018-01-30 |
Chip package with thermal dissipation structure and method for forming the same
Grant 9,870,975 - Wang , et al. January 16, 2 | 2018-01-16 |
Underbump metallization structure
Grant 9,859,235 - Liu , et al. January 2, 2 | 2018-01-02 |
Semiconductor Package And Manufacturing Method Of The Same
App 20170373039A1 - | 2017-12-28 |
Solution for reducing poor contact in info packages
Grant 9,831,224 - Lin , et al. November 28, 2 | 2017-11-28 |
Methods of packaging semiconductor devices and packaged semiconductor devices
Grant 9,806,062 - Jeng , et al. October 31, 2 | 2017-10-31 |
Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages
Grant 9,786,567 - Wu , et al. October 10, 2 | 2017-10-10 |
3D semiconductor package interposer with die cavity
Grant 9,780,072 - Jeng , et al. October 3, 2 | 2017-10-03 |
Package structures
Grant 08618673 - | 2013-12-31 |
| 