Hou; Shang-Yun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hou; Shang-Yun.The latest application filed is for "semiconductor package and manufacturing method thereof".
Company Profile
75.200.200
- Hou; Shang-Yun - Jubei TW
- Hou; Shang-Yun - Hsinchu TW
- HOU; Shang-Yun - Jubei City TW
- Hou; Shang-Yun - Zhubei TW
- HOU; Shang-Yun - Zhubei City TW
- Hou; Shang-Yun - Hsin-Chu TW
Patent Activity
| Patent | Date |
|---|---|
| Optical transceiver and manufacturing method thereof Grant 11,454,773 - Yu , et al. September 27, 2 | 2022-09-27 |
| Semiconductor structure and method of fabricating the same Grant 11,450,580 - Huang , et al. September 20, 2 | 2022-09-20 |
| Semiconductor Package And Manufacturing Method Thereof App 20220293508 - Huang; Chi-Ming ; et al. | 2022-09-15 |
| Forming large chips through stitching Grant 11,444,038 - Wei , et al. September 13, 2 | 2022-09-13 |
| Chip package structure Grant 11,437,334 - Huang , et al. September 6, 2 | 2022-09-06 |
| Method for forming a package structure for optical fiber Grant 11,428,879 - Huang , et al. August 30, 2 | 2022-08-30 |
| Package Structure With Underfill App 20220270894 - HUANG; Kuan-Yu ; et al. | 2022-08-25 |
| Package structure and method of fabricating the same Grant 11,424,219 - Shen , et al. August 23, 2 | 2022-08-23 |
| Chiplet Interposer App 20220262742 - Hou; Shang-Yun ; et al. | 2022-08-18 |
| Package structures and methods of forming the same Grant 11,417,580 - Yu , et al. August 16, 2 | 2022-08-16 |
| Optical bench, method of making and method of using Grant 11,415,762 - Kuo , et al. August 16, 2 | 2022-08-16 |
| Package Structure And Fabricating Method Thereof App 20220254736 - Huang; Kuan-Yu ; et al. | 2022-08-11 |
| Semiconductor device and method of forming the same Grant 11,410,968 - Wu , et al. August 9, 2 | 2022-08-09 |
| Stacked Integrated Circuit Structure and Method of Forming App 20220246581 - Chen; Wei-Ming ; et al. | 2022-08-04 |
| Chip-on-wafer structure with chiplet interposer Grant 11,380,611 - Chen , et al. July 5, 2 | 2022-07-05 |
| Semiconductor package and manufacturing method thereof Grant 11,373,946 - Huang , et al. June 28, 2 | 2022-06-28 |
| Structure and formation method of package structure with underfill Grant 11,328,936 - Huang , et al. May 10, 2 | 2022-05-10 |
| Photonic Package And Method Of Manufacture App 20220099887 - Yu; Chen-Hua ; et al. | 2022-03-31 |
| Package structure and fabricating method thereof Grant 11,270,956 - Huang , et al. March 8, 2 | 2022-03-08 |
| Semiconductor Die Package and Method of Manufacture App 20220052009 - Huang; Kuan-Yu ; et al. | 2022-02-17 |
| Photonic Semiconductor Device And Method Of Manufacture App 20220043208 - Hsia; Hsing-Kuo ; et al. | 2022-02-10 |
| Tri-layer CoWoS structure Grant 11,244,924 - Yu , et al. February 8, 2 | 2022-02-08 |
| Joint Structure In Semiconductor Package And Manufacturing Method Thereof App 20220013492 - Huang; Kuan-Yu ; et al. | 2022-01-13 |
| Package And Manufacturing Method Thereof App 20220013495 - Huang; Sung-Hui ; et al. | 2022-01-13 |
| Package and manufacturing method thereof Grant 11,222,867 - Huang , et al. January 11, 2 | 2022-01-11 |
| Package Structure And Method Of Manufacturing The Same App 20210407963 - Lin; Wei-Ting ; et al. | 2021-12-30 |
| Three dimensional integrated circuits stacking approach Grant 11,201,135 - Lin , et al. December 14, 2 | 2021-12-14 |
| Semiconductor Package and Method of Forming the Same App 20210384154 - Huang; Kuan-Yu ; et al. | 2021-12-09 |
| Semiconductor Package And Manufacturing Method Thereof App 20210375711 - Shen; Wen-Wei ; et al. | 2021-12-02 |
| Giga Interposer Integration through Chip-On-Wafer-On-Substrate App 20210366814 - Hou; Shang-Yun ; et al. | 2021-11-25 |
| Semiconductor Package, Integrated Optical Communication System App 20210366802 - Huang; Sung-Hui ; et al. | 2021-11-25 |
| Semiconductor device and method of manufacture Grant 11,183,399 - Wei , et al. November 23, 2 | 2021-11-23 |
| Testing of semiconductor chips with microbumps Grant 11,169,207 - Wu , et al. November 9, 2 | 2021-11-09 |
| Package structure with a heat dissipating element and method of manufacturing the same Grant 11,164,855 - Chen , et al. November 2, 2 | 2021-11-02 |
| Photonic semiconductor device and method Grant 11,156,772 - Yu , et al. October 26, 2 | 2021-10-26 |
| Package Structures and Methods of Forming the Same App 20210327778 - Yu; Chen-Hua ; et al. | 2021-10-21 |
| Semicondutor Packages And Methods Of Forming Same App 20210327723 - Lu; Chung-Yu ; et al. | 2021-10-21 |
| Packages with interposers and methods for forming the same Grant 11,152,312 - Chiu , et al. October 19, 2 | 2021-10-19 |
| Integrated Circuit Package And Method Of Forming Same App 20210320097 - Hou; Shang-Yun ; et al. | 2021-10-14 |
| 3D Packages and Methods for Forming the Same App 20210313196 - Chiu; Tzu-Wei ; et al. | 2021-10-07 |
| Package Structure And Fabricating Method Thereof App 20210305173 - Huang; Kuan-Yu ; et al. | 2021-09-30 |
| Chip-on-wafer Structure With Chiplet Interposer App 20210305146 - Chen; Weiming Chris ; et al. | 2021-09-30 |
| Semiconductor Package And Manufacturing Method Thereof App 20210305145 - Huang; Chi-Ming ; et al. | 2021-09-30 |
| Integrated circuit stacking approach Grant 11,121,118 - Lin , et al. September 14, 2 | 2021-09-14 |
| Semiconductor package and method of forming the same Grant 11,101,236 - Huang , et al. August 24, 2 | 2021-08-24 |
| Method of forming a dummy die of an integrated circuit having an embedded annular structure Grant 11,101,260 - Hou , et al. August 24, 2 | 2021-08-24 |
| Semiconductor device and method of manufacture Grant 11,101,140 - Wei , et al. August 24, 2 | 2021-08-24 |
| Stacked Integrated Circuit Structure and Method of Forming App 20210242173 - Chen; Wei-Ming ; et al. | 2021-08-05 |
| Package system for integrated circuits Grant 11,081,372 - Wu , et al. August 3, 2 | 2021-08-03 |
| Package Structure And Method Of Fabricating The Same App 20210225806 - Shen; Wen-Wei ; et al. | 2021-07-22 |
| Integrated Circuit Package And Method App 20210225666 - Lin; Shih Ting ; et al. | 2021-07-22 |
| 3D packages and methods for forming the same Grant 11,069,539 - Chiu , et al. July 20, 2 | 2021-07-20 |
| Chip package having die structures of different heights and method of forming same Grant 11,069,657 - Wei , et al. July 20, 2 | 2021-07-20 |
| Method For Forming A Package Structure For Optical Fiber App 20210215894 - Huang; Sung-Hui ; et al. | 2021-07-15 |
| Semiconductor Structure And Method Of Fabricating The Same App 20210193538 - Huang; Kuan-Yu ; et al. | 2021-06-24 |
| Optical Transceiver and Manufacturing Method Thereof App 20210132310 - Yu; Chen-Hua ; et al. | 2021-05-06 |
| Semiconductor Device, Electronic Device Including The Same, And Manufacturing Method Thereof App 20210125907 - Huang; Kuan-Yu ; et al. | 2021-04-29 |
| Semiconductor Device And Method Of Forming The Same App 20210118844 - Wu; Jiun Yi ; et al. | 2021-04-22 |
| Stacked integrated circuit structure and method of forming Grant 10,985,137 - Chen , et al. April 20, 2 | 2021-04-20 |
| Chip package structure Grant 10,985,125 - Huang , et al. April 20, 2 | 2021-04-20 |
| Conductive vias in semiconductor packages and methods of forming same Grant 10,978,346 - Huang , et al. April 13, 2 | 2021-04-13 |
| Interconnect Chips App 20210098408 - Ting; Kuo-Chiang ; et al. | 2021-04-01 |
| Stacked integrated circuit structure and method of forming Grant 10,964,667 - Chen , et al. March 30, 2 | 2021-03-30 |
| Optical Bench, Method Of Making And Method Of Using App 20210088737 - KUO; Ying-Hao ; et al. | 2021-03-25 |
| Photonic Semiconductor Device And Method Of Manufacture App 20210088723 - Yu; Chen-Hua ; et al. | 2021-03-25 |
| Package Structure And Method Of Manufacturing The Same App 20210082894 - Chen; Weiming Chris ; et al. | 2021-03-18 |
| Package structure for optical fiber and method for forming the same Grant 10,948,668 - Huang , et al. March 16, 2 | 2021-03-16 |
| Chip Package Structure App 20210066230 - HUANG; Kuan-Yu ; et al. | 2021-03-04 |
| Semiconductor Devices and Methods of Manufacture App 20210043571 - Hou; Shang-Yun ; et al. | 2021-02-11 |
| Photonic Semiconductor Device and Method App 20210018678 - Yu; Chen-Hua ; et al. | 2021-01-21 |
| Chip Package Structure App 20210005567 - HUANG; Kuan-Yu ; et al. | 2021-01-07 |
| Package structure and method for forming the same Grant 10,886,147 - Huang , et al. January 5, 2 | 2021-01-05 |
| Package Structures and Methods of Forming the Same App 20200402877 - Yu; Chen-Hua ; et al. | 2020-12-24 |
| Chip package structure with dummy bump and method for forming the same Grant 10,872,871 - Huang , et al. December 22, 2 | 2020-12-22 |
| Optical transceiver and manufacturing method thereof Grant 10,866,373 - Yu , et al. December 15, 2 | 2020-12-15 |
| Interconnect chips Grant 10,867,954 - Ting , et al. December 15, 2 | 2020-12-15 |
| Optical bench on substrate and method of making the same Grant 10,866,374 - Kuo , et al. December 15, 2 | 2020-12-15 |
| Tri-Layer CoWoS Structure App 20200381392 - Yu; Chen-Hua ; et al. | 2020-12-03 |
| 3D packages and methods for forming the same Grant 10,854,567 - Hou , et al. December 1, 2 | 2020-12-01 |
| Chip package structure and method for forming the same Grant 10,847,485 - Huang , et al. November 24, 2 | 2020-11-24 |
| Interposer Test Structures and Methods App 20200350221 - Liu; Tzuan-Horng ; et al. | 2020-11-05 |
| Chip package structure Grant 10,790,254 - Huang , et al. September 29, 2 | 2020-09-29 |
| Package structures and methods of forming the same Grant 10,770,365 - Yu , et al. Sep | 2020-09-08 |
| Package Structure For Optical Fiber And Method For Forming The Same App 20200278509 - Huang; Sung-Hui ; et al. | 2020-09-03 |
| Testing Of Semiconductor Chips With Microbumps App 20200264231 - Wu; Wei-Cheng ; et al. | 2020-08-20 |
| 3D Packages and Methods for Forming the Same App 20200266076 - Chiu; Tzu-Wei ; et al. | 2020-08-20 |
| Photonic semiconductor device and method Grant 10,746,923 - Yu , et al. A | 2020-08-18 |
| Tri-layer COWOS structure Grant 10,748,870 - Yu , et al. A | 2020-08-18 |
| Interposer test structures and methods Grant 10,734,295 - Liu , et al. | 2020-08-04 |
| Interconnect chips Grant 10,720,401 - Ting , et al. | 2020-07-21 |
| Chip Package Structure And Method For Forming The Same App 20200203300 - HUANG; Kuan-Yu ; et al. | 2020-06-25 |
| Structure And Formation Method Of Package Structure With Underfill App 20200203186 - Huang; Kuan-Yu ; et al. | 2020-06-25 |
| Chip Package Structure With Dummy Bump And Method For Forming The Same App 20200203299 - HUANG; Sung-Hui ; et al. | 2020-06-25 |
| Testing of semiconductor chips with microbumps Grant 10,663,512 - Wu , et al. | 2020-05-26 |
| 3D packages and methods for forming the same Grant 10,665,474 - Chiu , et al. | 2020-05-26 |
| Package structure for optical fiber and method for forming the same Grant 10,656,351 - Huang , et al. | 2020-05-19 |
| Chip Package Having Die Structures of Different Heights and Method of Forming Same App 20200152602 - Wei; Wen-Hsin ; et al. | 2020-05-14 |
| Method For Manufacturing Semiconductor Package Structure App 20200144155 - YEH; TING-YU ; et al. | 2020-05-07 |
| Package Structure For Optical Fiber And Method For Forming The Same App 20200132949 - Huang; Sung-Hui ; et al. | 2020-04-30 |
| Semiconductor Device And Method For Manufacturing The Same App 20200126900 - TING; KUO-CHIANG ; et al. | 2020-04-23 |
| 3D Packages and Methods for Forming the Same App 20200126938 - Hou; Shang-Yun ; et al. | 2020-04-23 |
| Semiconductor Device App 20200118979 - Chen; Weiming Chris ; et al. | 2020-04-16 |
| Package System For Integrated Circuits App 20200118839 - WU; Wei-Cheng ; et al. | 2020-04-16 |
| Forming Large Chips Through Stitching App 20200111755 - Wei; Wen Hsin ; et al. | 2020-04-09 |
| Semiconductor Package and Method of Forming the Same App 20200075527 - Huang; Kuan-Yu ; et al. | 2020-03-05 |
| Stacked Integrated Circuit Structure and Method of Forming App 20200035647 - Chen; Wei-Ming ; et al. | 2020-01-30 |
| Interconnect Chips App 20200027851 - Ting; Kuo-Chiang ; et al. | 2020-01-23 |
| Semiconductor Device and Method of Manufacture App 20200027750 - Wei; Wen-Hsin ; et al. | 2020-01-23 |
| Chip package having die structures of different heights and method of forming same Grant 10,535,633 - Wei , et al. Ja | 2020-01-14 |
| 3D packages and methods for forming the same Grant 10,529,679 - Hou , et al. J | 2020-01-07 |
| Photonic Semiconductor Device And Method App 20200003950 - Yu; Chen-Hua ; et al. | 2020-01-02 |
| Conductive Vias In Semiconductor Packages And Methods Of Forming Same App 20200006143 - Huang; Sung-Hui ; et al. | 2020-01-02 |
| Optical Transceiver and Manufacturing Method Thereof App 20200003975 - Yu; Chen-Hua ; et al. | 2020-01-02 |
| Package system for integrated circuits Grant 10,515,829 - Wu , et al. Dec | 2019-12-24 |
| Semiconductor package structure having a multi-thermal interface material structure Grant 10,515,869 - Yeh , et al. Dec | 2019-12-24 |
| Forming large chips through stitching Grant 10,515,906 - Wei , et al. Dec | 2019-12-24 |
| Semiconductor device and method for manufacturing the same Grant 10,515,888 - Ting , et al. Dec | 2019-12-24 |
| Conductive vias in semiconductor packages and methods of forming same Grant 10,510,603 - Huang , et al. Dec | 2019-12-17 |
| Semiconductor device and method for manufacturing the same Grant 10,510,722 - Chen , et al. Dec | 2019-12-17 |
| Semiconductor Package Structure Having A Multi-thermal Interface Material Structure App 20190371700 - YEH; TING-YU ; et al. | 2019-12-05 |
| Chip Package Structure App 20190348386 - HUANG; Kuan-Yu ; et al. | 2019-11-14 |
| Forming grounded through-silicon vias in a semiconductor substrate Grant RE47,709 - Hsieh , et al. No | 2019-11-05 |
| 3D semiconductor package interposer with die cavity Grant 10,446,520 - Jeng , et al. Oc | 2019-10-15 |
| Integrated Circuit Package And Method Of Forming Same App 20190237454 - Hou; Shang-Yun ; et al. | 2019-08-01 |
| 3D Packages and Methods for Forming the Same App 20190221445 - Chiu; Tzu-Wei ; et al. | 2019-07-18 |
| Chip package having die structures of different heights Grant 10,319,699 - Wei , et al. | 2019-06-11 |
| Packaging with substrates connected by conductive bumps Grant 10,304,800 - Chen , et al. | 2019-05-28 |
| Interconnect Chips App 20190148329 - Ting; Kuo-Chiang ; et al. | 2019-05-16 |
| Semiconductor Device and Method of Manufacture App 20190148166 - Wei; Wen-Hsin ; et al. | 2019-05-16 |
| Testing Of Semiconductor Chips With Microbumps App 20190128958 - Wu; Wei-Cheng ; et al. | 2019-05-02 |
| Tri-Layer CoWoS Structure App 20190123019 - Yu; Chen-Hua ; et al. | 2019-04-25 |
| 3D packages and methods for forming the same Grant 10,269,584 - Chiu , et al. | 2019-04-23 |
| Stacked Integrated Circuit Structure and Method of Forming App 20190115320 - Chen; Wei-Ming ; et al. | 2019-04-18 |
| Package Structures and Methods of Forming the Same App 20190115272 - Yu; Chen-Hua ; et al. | 2019-04-18 |
| Configurable routing for packaging applications Grant 10,262,939 - Lu , et al. | 2019-04-16 |
| Semiconductor Device And Method For Manufacturing The Same App 20190088582 - TING; KUO-CHIANG ; et al. | 2019-03-21 |
| Novel Integrated Circuit Stacking Approach App 20190088620 - Lin; Jing-Cheng ; et al. | 2019-03-21 |
| Conductive Vias In Semiconductor Packages And Methods Of Forming Same App 20190067104 - Huang; Sung-Hui ; et al. | 2019-02-28 |
| Interposer Test Structures and Methods App 20190057912 - Liu; Tzuan-Horng ; et al. | 2019-02-21 |
| Testing of semiconductor chips with microbumps Grant 10,175,294 - Wu , et al. J | 2019-01-08 |
| COWOS structures and method of forming the same Grant 10,170,457 - Chen , et al. J | 2019-01-01 |
| Semiconductor Structure And Manufacturing Method Thereof App 20180374821 - CHEN; WEIMING CHRIS ; et al. | 2018-12-27 |
| Stacked integrated circuit structure and method of forming Grant 10,163,856 - Chen , et al. Dec | 2018-12-25 |
| Tri-layer CoWoS structure Grant 10,163,851 - Yu , et al. Dec | 2018-12-25 |
| Formation method of chip package Grant 10,163,853 - Wei , et al. Dec | 2018-12-25 |
| Semiconductor Device And Method For Manufacturing The Same App 20180366440 - CHEN; WEIMING CHRIS ; et al. | 2018-12-20 |
| Method of manufacturing a capacitor Grant 10,153,338 - Chang , et al. Dec | 2018-12-11 |
| Package structures and methods of forming the same Grant 10,153,222 - Yu , et al. Dec | 2018-12-11 |
| Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 10,153,205 - Yu , et al. Dec | 2018-12-11 |
| Interposer test structures and methods Grant 10,090,213 - Liu , et al. October 2, 2 | 2018-10-02 |
| Packages with Interposers and Methods for Forming the Same App 20180277495 - Chiu; Sao-Ling ; et al. | 2018-09-27 |
| Chip Package Having Die Structures of Different Heights and Method of Forming Same App 20180254260 - Wei; Wen-Hsin ; et al. | 2018-09-06 |
| Bump structure for yield improvement Grant 10,056,347 - Chiu , et al. August 21, 2 | 2018-08-21 |
| CoWoS Structures and Method of Forming the Same App 20180190638 - Chen; Wei-Ming ; et al. | 2018-07-05 |
| Packages with interposers and methods for forming the same Grant 9,984,981 - Chiu , et al. May 29, 2 | 2018-05-29 |
| Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs) Grant 9,978,637 - Liu , et al. May 22, 2 | 2018-05-22 |
| Package Structures And Methods Of Forming The Same App 20180138101 - Yu; Chen-Hua ; et al. | 2018-05-17 |
| Pillar design for conductive bump Grant 9,953,948 - Hsieh , et al. April 24, 2 | 2018-04-24 |
| Formation Method Of Chip Package App 20180047703 - WEI; Wen-Hsin ; et al. | 2018-02-15 |
| Chip Package Having Die Structures of Different Heights and Method of Forming Same App 20180040586 - Wei; Wen-Hsin ; et al. | 2018-02-08 |
| 3D Semiconductor Package Interposer with Die Cavity App 20180026008 - Jeng; Shin-Puu ; et al. | 2018-01-25 |
| Underbump metallization structure Grant 9,859,235 - Liu , et al. January 2, 2 | 2018-01-02 |
| Forming Large Chips Through Stitching App 20170373022 - Wei; Wen Hsin ; et al. | 2017-12-28 |
| Structure and formation method for chip package Grant 9,818,720 - Wei , et al. November 14, 2 | 2017-11-14 |
| Reinforcement structure and method for controlling warpage of chip mounted on substrate Grant 9,806,038 - Yu , et al. October 31, 2 | 2017-10-31 |
| Chip package having die structures of different heights and method of forming same Grant 9,806,058 - Wei , et al. October 31, 2 | 2017-10-31 |
| Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages Grant 9,786,567 - Wu , et al. October 10, 2 | 2017-10-10 |
| 3D semiconductor package interposer with die cavity Grant 9,780,072 - Jeng , et al. October 3, 2 | 2017-10-03 |
| Semiconductor device design methods and conductive bump pattern enhancement methods Grant 9,760,670 - Wang , et al. September 12, 2 | 2017-09-12 |
| Forming large chips through stitching Grant 9,741,669 - Wei , et al. August 22, 2 | 2017-08-22 |
| Thermal structure for integrated circuit package Grant 9,741,638 - Hsieh , et al. August 22, 2 | 2017-08-22 |
| Method Of Manufacturing A Capacitor App 20170229534 - CHANG; Chun Hua ; et al. | 2017-08-10 |
| Packages with Interposers and Methods for Forming the Same App 20170229401 - Chiu; Sao-Ling ; et al. | 2017-08-10 |
| Tri-Layer CoWoS Structure App 20170221858 - Yu; Chen-Hua ; et al. | 2017-08-03 |
| Optical Bench On Substrate And Method Of Making The Same App 20170212318 - KUO; Ying-Hao ; et al. | 2017-07-27 |
| Testing Of Semiconductor Chips With Microbumps App 20170212167 - Wu; Wei-Cheng ; et al. | 2017-07-27 |
| Forming Large Chips Through Stitching App 20170213798 - Wei; Wen Hsin ; et al. | 2017-07-27 |
| Cylindrical embedded capacitors Grant 9,691,840 - Su , et al. June 27, 2 | 2017-06-27 |
| Interposer Test Structures and Methods App 20170178983 - Liu; Tzuan-Horng ; et al. | 2017-06-22 |
| Package System For Integrated Circuits App 20170148715 - WU; Wei-Cheng ; et al. | 2017-05-25 |
| Method of manufacturing a capacitor Grant 9,660,016 - Chang , et al. May 23, 2 | 2017-05-23 |
| Chip-on-Wafer Process Control Monitoring for Chip-on-Wafer-on-Substrate Packages App 20170133282 - Wu; Wei-Cheng ; et al. | 2017-05-11 |
| Bump Structure for Yield Improvement App 20170133346 - Chiu; Tzu-Wei ; et al. | 2017-05-11 |
| Stacked Integrated Circuit Structure and Method of Forming App 20170125379 - Chen; Wei-Ming ; et al. | 2017-05-04 |
| Through silicon via keep out zone formation method and system Grant 9,640,490 - Hsieh , et al. May 2, 2 | 2017-05-02 |
| Packages with interposers and methods for forming the same Grant 9,633,869 - Chiu , et al. April 25, 2 | 2017-04-25 |
| Tri-layer CoWoS structure Grant 9,627,365 - Yu , et al. April 18, 2 | 2017-04-18 |
| Methods and apparatus of packaging with interposers Grant 9,627,223 - Lu , et al. April 18, 2 | 2017-04-18 |
| Optical bench on substrate and method of making the same Grant 9,618,712 - Kuo , et al. April 11, 2 | 2017-04-11 |
| Testing of semiconductor chips with microbumps Grant 9,618,572 - Wu , et al. April 11, 2 | 2017-04-11 |
| Configurable Routing for Packaging Applications App 20170098607 - Lu; Chung-Yu ; et al. | 2017-04-06 |
| Pillar Design for Conductive Bump App 20170084571 - Hsieh; Cheng-Chieh ; et al. | 2017-03-23 |
| Test structure for seal ring quality monitor Grant 9,601,443 - Tsai , et al. March 21, 2 | 2017-03-21 |
| Interposer test structures and methods Grant 9,589,857 - Liu , et al. March 7, 2 | 2017-03-07 |
| Chip-on-wafer process control monitoring for chip-on-wafer-on-substrate packages Grant 9,581,638 - Wu , et al. February 28, 2 | 2017-02-28 |
| Method of manufacturing package system Grant 9,570,324 - Wu , et al. February 14, 2 | 2017-02-14 |
| Passivation layer for packaged chip Grant 9,570,366 - Jeng , et al. February 14, 2 | 2017-02-14 |
| Novel Three Dimensional Integrated Circuits Stacking Approach App 20170040290 - Lin; Jing-Cheng ; et al. | 2017-02-09 |
| Bump structure for yield improvement Grant 9,553,053 - Chiu , et al. January 24, 2 | 2017-01-24 |
| Structure And Formation Method For Chip Package App 20170005071 - WEI; Wen-Hsin ; et al. | 2017-01-05 |
| Structure And Formation Method For Chip Package App 20170005072 - WEI; Wen-Hsin ; et al. | 2017-01-05 |
| Configurable routing for packaging applications Grant 9,530,730 - Lu , et al. December 27, 2 | 2016-12-27 |
| Packaging structures and methods with a metal pillar Grant 9,508,666 - Yu , et al. November 29, 2 | 2016-11-29 |
| Three dimensional integrated circuits stacking approach Grant 9,502,380 - Lin , et al. November 22, 2 | 2016-11-22 |
| Warpage control for flexible substrates Grant 9,502,271 - Yu , et al. November 22, 2 | 2016-11-22 |
| Pillar design for conductive bump Grant 9,496,235 - Hsieh , et al. November 15, 2 | 2016-11-15 |
| Reinforcement Structure and Method for Controlling Warpage of Chip Mounted on Substrate App 20160315057 - Yu; Chen-Hua ; et al. | 2016-10-27 |
| Test structure and method of testing electrical characteristics of through vias Grant 9,462,692 - Hou , et al. October 4, 2 | 2016-10-04 |
| Semiconductor Device Design Methods and Conductive Bump Pattern Enhancement Methods App 20160283639 - Wang; Tzu-Yu ; et al. | 2016-09-29 |
| Testing Of Semiconductor Chips With Microbumps App 20160274183 - WU; WEI-CHENG ; et al. | 2016-09-22 |
| 3D Semiconductor Package Interposer with Die Cavity App 20160254249 - Jeng; Shin-Puu ; et al. | 2016-09-01 |
| Thermal Structure for Integrated Circuit Package App 20160254211 - Hsieh; Cheng-Chieh ; et al. | 2016-09-01 |
| Structure and method for 3D IC package Grant 9,412,678 - Hou , et al. August 9, 2 | 2016-08-09 |
| Methods and Apparatus of Packaging with Interposers App 20160204079 - Lu; Chung-Yu ; et al. | 2016-07-14 |
| 3D semiconductor package interposer with die cavity Grant 9,385,095 - Jeng , et al. July 5, 2 | 2016-07-05 |
| Reinforcement structure and method for controlling warpage of chip mounted on substrate Grant 9,385,091 - Yu , et al. July 5, 2 | 2016-07-05 |
| 3D Packages and Methods for Forming the Same App 20160181124 - Chiu; Tzu-Wei ; et al. | 2016-06-23 |
| Semiconductor device design methods and conductive bump pattern enhancement methods Grant 9,372,951 - Wang , et al. June 21, 2 | 2016-06-21 |
| Testing of semiconductor chips with microbumps Grant 9,372,206 - Wu , et al. June 21, 2 | 2016-06-21 |
| Thermal structure for integrated circuit package Grant 9,337,123 - Hsieh , et al. May 10, 2 | 2016-05-10 |
| Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20160118301 - Yu; Chen-Hua ; et al. | 2016-04-28 |
| Methods and apparatus of packaging with interposers Grant 9,305,808 - Lu , et al. April 5, 2 | 2016-04-05 |
| 3D packages and methods for forming the same Grant 9,299,649 - Chiu , et al. March 29, 2 | 2016-03-29 |
| Novel Three Dimensional Integrated Circuits Stacking Approach App 20160086918 - Lin; Jing-Cheng ; et al. | 2016-03-24 |
| Package with metal-insulator-metal capacitor and method of manufacturing the same Grant 9,263,511 - Yu , et al. February 16, 2 | 2016-02-16 |
| Interposer Test Structures and Methods App 20150380324 - Liu; Tzuan-Horng ; et al. | 2015-12-31 |
| Testing Of Semiconductor Chips With Microbumps App 20150362526 - WU; Wei-Cheng ; et al. | 2015-12-17 |
| Three dimensional integrated circuits stacking approach Grant 9,209,156 - Len , et al. December 8, 2 | 2015-12-08 |
| Forming interconnect structures using pre-ink-printed sheets Grant 9,159,673 - Ko , et al. October 13, 2 | 2015-10-13 |
| Through Silicon Via Keep Out Zone Formation Method and System App 20150270230 - Hsieh; Cheng-Chieh ; et al. | 2015-09-24 |
| 3D Packages and Methods for Forming the Same App 20150262958 - Hou; Shang-Yun ; et al. | 2015-09-17 |
| Interposer test structures and methods Grant 9,128,123 - Liu , et al. September 8, 2 | 2015-09-08 |
| Methods and Apparatus of Packaging with Interposers App 20150249019 - Lu; Chung-Yu ; et al. | 2015-09-03 |
| Testing of semiconductor chips with microbumps Grant 9,116,203 - Wu , et al. August 25, 2 | 2015-08-25 |
| Optical Bench On Substrate And Method Of Making The Same App 20150234137 - KUO; Ying-Hao ; et al. | 2015-08-20 |
| Method Of Manufacturing Package System App 20150235873 - WU; Wei-Cheng ; et al. | 2015-08-20 |
| Test Structure and Method of Testing Electrical Characteristics of Through Vias App 20150208504 - Hou; Shang-Yun ; et al. | 2015-07-23 |
| Structure and Method for 3D IC Package App 20150194361 - Hou; Shang-Yun ; et al. | 2015-07-09 |
| Methods and apparatus of packaging with interposers Grant 9,064,705 - Lu , et al. June 23, 2 | 2015-06-23 |
| Through silicon via keep out zone formation method and system Grant 9,054,166 - Hsieh , et al. June 9, 2 | 2015-06-09 |
| 3D packages and methods for forming the same Grant 9,048,231 - Hou , et al. June 2, 2 | 2015-06-02 |
| Package systems having interposers Grant 9,048,233 - Wu , et al. June 2, 2 | 2015-06-02 |
| Packages with passive devices and methods of forming the same Grant 9,040,381 - Yu , et al. May 26, 2 | 2015-05-26 |
| Semiconductor Device Design Methods and Conductive Bump Pattern Enhancement Methods App 20150143324 - Wang; Tzu-Yu ; et al. | 2015-05-21 |
| Integrated thermal solutions for packaging integrated circuits Grant 9,034,695 - Hsieh , et al. May 19, 2 | 2015-05-19 |
| Configurable Routing for Packaging Applications App 20150130082 - Lu; Chung-Yu ; et al. | 2015-05-14 |
| Mechanism for Forming Patterned Metal Pad connected to Multiple Through Silicon Vias (TSVs) App 20150102482 - Liu; Tzuan-Horng ; et al. | 2015-04-16 |
| Test structure and method of testing electrical characteristics of through vias Grant 8,993,432 - Hou , et al. March 31, 2 | 2015-03-31 |
| Structure and method for 3D IC package Grant 8,993,380 - Hou , et al. March 31, 2 | 2015-03-31 |
| Test line placement to improve die sawing quality Grant 8,993,355 - Tsai , et al. March 31, 2 | 2015-03-31 |
| Packages with Interposers and Methods for Forming the Same App 20150048503 - Chiu; Sao-Ling ; et al. | 2015-02-19 |
| Method Of Manufacturing A Capacitor App 20150037960 - CHANG; Chun Hua ; et al. | 2015-02-05 |
| Semiconductor devices comprising GSG interconnect structures Grant 8,937,389 - Liu , et al. January 20, 2 | 2015-01-20 |
| Pillar Design for Conductive Bump App 20140361432 - Hsieh; Cheng-Chieh ; et al. | 2014-12-11 |
| Connector design for packaging integrated circuits Grant 8,901,735 - Yu , et al. December 2, 2 | 2014-12-02 |
| Interposers for semiconductor devices and methods of manufacture thereof Grant 8,896,089 - Chiu , et al. November 25, 2 | 2014-11-25 |
| Testing Of Semiconductor Chips With Microbumps App 20140327464 - WU; Wei-Cheng ; et al. | 2014-11-06 |
| Capacitor for interposers and methods of manufacture thereof Grant 8,878,338 - Chang , et al. November 4, 2 | 2014-11-04 |
| Probe pad design for 3DIC package yield analysis Grant 8,878,182 - Wang , et al. November 4, 2 | 2014-11-04 |
| Forming grounded through-silicon vias in a semiconductor substrate Grant 8,872,345 - Hsieh , et al. October 28, 2 | 2014-10-28 |
| 3D semiconductor package interposer with die cavity Grant 8,865,521 - Jeng , et al. October 21, 2 | 2014-10-21 |
| 3D Packages and Methods for Forming the Same App 20140306341 - Hou; Shang-Yun ; et al. | 2014-10-16 |
| Heat spreader structures in scribe lines Grant 8,860,208 - Chen , et al. October 14, 2 | 2014-10-14 |
| Warpage Control for Flexible Substrates App 20140302642 - Yu; Chen-Hua ; et al. | 2014-10-09 |
| Chip-on-Wafer Process Control Monitoring for Chip-on-Wafer-on-Substrate Packages App 20140266283 - Wu; Wei-Cheng ; et al. | 2014-09-18 |
| Package Device Including An Opening In A Flexible Substrate And Methods Of Forming The Same App 20140264803 - Lin; Tsung-Shu ; et al. | 2014-09-18 |
| Package device including an opening in a flexible substrate and methods of forming the same Grant 8,836,094 - Lin , et al. September 16, 2 | 2014-09-16 |
| Structure and Method for 3D IC Package App 20140252572 - Hou; Shang-Yun ; et al. | 2014-09-11 |
| Reinforcement Structure And Method For Controlling Warpage Of Chip Mounted On Substrate App 20140252591 - Yu; Chen-Hua ; et al. | 2014-09-11 |
| Interposer system and method Grant 8,810,006 - Yu , et al. August 19, 2 | 2014-08-19 |
| Package With Metal-insulator-metal Capacitor And Method Of Manufacturing The Same App 20140225222 - YU; Chen-Hua ; et al. | 2014-08-14 |
| 3D Packages and Methods for Forming the Same App 20140225258 - Chiu; Tzu-Wei ; et al. | 2014-08-14 |
| 3D packages and methods for forming the same Grant 8,802,504 - Hou , et al. August 12, 2 | 2014-08-12 |
| 3D Semiconductor Package Interposer with Die Cavity App 20140217610 - Jeng; Shin-Puu ; et al. | 2014-08-07 |
| Testing of semiconductor chips with microbumps Grant 8,797,057 - Wu , et al. August 5, 2 | 2014-08-05 |
| Forming Interconnect Structures Using Pre-Ink-Printed Sheets App 20140191395 - Ko; Jung Cheng ; et al. | 2014-07-10 |
| Capacitor for interposers and methods of manufacture thereof Grant 8,765,549 - Chang , et al. July 1, 2 | 2014-07-01 |
| Approach for bonding dies onto interposers Grant 8,759,150 - Hu , et al. June 24, 2 | 2014-06-24 |
| Methods and Apparatus of Packaging with Interposers App 20140167269 - Lu; Chung-Yu ; et al. | 2014-06-19 |
| Dummy metal design for packaging structures Grant 8,753,971 - Liu , et al. June 17, 2 | 2014-06-17 |
| Connector Design for Packaging Integrated Circuits App 20140131864 - Yu; Chen-Hua ; et al. | 2014-05-15 |
| Warpage Control for Flexible Substrates App 20140131897 - Yu; Chen-Hua ; et al. | 2014-05-15 |
| Forming interconnect structures using pre-ink-printed sheets Grant 8,716,867 - Ko , et al. May 6, 2 | 2014-05-06 |
| Cylindrical Embedded Capacitors App 20140106536 - Su; An-Jhih ; et al. | 2014-04-17 |
| Cylindrical embedded capacitors Grant 8,693,163 - Su , et al. April 8, 2 | 2014-04-08 |
| Novel Three Dimensional Integrated Circuits Stacking Approach App 20140091473 - LEN; Jing-Cheng ; et al. | 2014-04-03 |
| Packages with passive devices and methods of forming the same Grant 8,680,647 - Yu , et al. March 25, 2 | 2014-03-25 |
| Packages with Passive Devices and Methods of Forming the Same App 20140073091 - Yu; Chen-Hua ; et al. | 2014-03-13 |
| Connector design for packaging integrated circuits Grant 8,664,760 - Yu , et al. March 4, 2 | 2014-03-04 |
| Through Silicon Via Keep Out Zone Formation Method and System App 20140045332 - Hsieh; Cheng-Chieh ; et al. | 2014-02-13 |
| Semiconductor Devices and Methods of Manufacture Thereof App 20140042612 - Liu; Christianto Chih-Ching ; et al. | 2014-02-13 |
| Interposer System and Method App 20140042643 - Yu; Chen-Hua ; et al. | 2014-02-13 |
| Packaging Structures and Methods with a Metal Pillar App 20140038405 - Yu; Chen-Hua ; et al. | 2014-02-06 |
| Seal ring structure with improved cracking protection and reduced problems Grant 8,643,147 - Jeng , et al. February 4, 2 | 2014-02-04 |
| Bump Structure for Yield Improvement App 20140027900 - Chiu; Tzu-Wei ; et al. | 2014-01-30 |
| Thermal Structure for Integrated Circuit Package App 20140015106 - Hsieh; Cheng-Chieh ; et al. | 2014-01-16 |
| Passivation Layer For Packaged Chip App 20140014959 - JENG; Shin-Puu ; et al. | 2014-01-16 |
| 3D IC packaging structures and methods with a metal pillar Grant 8,610,285 - Yu , et al. December 17, 2 | 2013-12-17 |
| Through silicon via keep out zone formation along different crystal orientations Grant 8,604,619 - Hsieh , et al. December 10, 2 | 2013-12-10 |
| Capacitor For Interposers And Methods Of Manufacture Thereof App 20130320493 - CHANG; Chun Hua ; et al. | 2013-12-05 |
| Test Line Placement to Improve Die Sawing Quality App 20130316471 - Tsai; Hao-Yi ; et al. | 2013-11-28 |
| Integrated circuit device and method of manufacturing the same Grant 8,575,717 - Yeh , et al. November 5, 2 | 2013-11-05 |
| Capacitor for Interposers and Methods of Manufacture Thereof App 20130285200 - Chang; Chun Hua ; et al. | 2013-10-31 |
| Integrated Thermal Solutions for Packaging Integrated Circuits App 20130273694 - Hsieh; Cheng-Chieh ; et al. | 2013-10-17 |
| Passivation layer for packaged chip Grant 8,558,229 - Jeng , et al. October 15, 2 | 2013-10-15 |
| 3D Semiconductor Package Interposer with Die Cavity App 20130252378 - Jeng; Shin-Puu ; et al. | 2013-09-26 |
| 3D semiconductor package interposer with die cavity Grant 8,519,537 - Jeng , et al. August 27, 2 | 2013-08-27 |
| Test line placement to improve die sawing quality Grant 8,519,512 - Tsai , et al. August 27, 2 | 2013-08-27 |
| Packages with Passive Devices and Methods of Forming the Same App 20130168805 - Yu; Chen-Hua ; et al. | 2013-07-04 |
| Passivation Layer For Packaged Chip App 20130147032 - JENG; Shin-Puu ; et al. | 2013-06-13 |
| Test Structure and Method of Testing Electrical Characteristics of Through Vias App 20130120018 - Hou; Shang-Yun ; et al. | 2013-05-16 |
| Interposers for Semiconductor Devices and Methods of Manufacture Thereof App 20130113070 - Chiu; Tzu-Wei ; et al. | 2013-05-09 |
| Probe Pad Design for 3DIC Package Yield Analysis App 20130092935 - Wang; Tzu-Yu ; et al. | 2013-04-18 |
| Through Silicon Via Keep Out Zone Formation Method and System App 20130049220 - Hsieh; Cheng-Chieh ; et al. | 2013-02-28 |
| Scribe line metal structure Grant 8,368,180 - Yu , et al. February 5, 2 | 2013-02-05 |
| Pillar Design for Conductive Bump App 20130020698 - Hsieh; Cheng-Chieh ; et al. | 2013-01-24 |
| Forming Grounded Through-silicon Vias In A Semiconductor Substrate App 20130009317 - HSIEH; Chi-Chun ; et al. | 2013-01-10 |
| Protective seal ring for preventing die-saw induced stress Grant 8,334,582 - Jeng , et al. December 18, 2 | 2012-12-18 |
| Packaging Structures and Methods App 20120306080 - Yu; Chen-Hua ; et al. | 2012-12-06 |
| Interposer Test Structures and Methods App 20120305916 - Liu; Tzuan-Horng ; et al. | 2012-12-06 |
| Connector Design for Packaging Integrated Circuits App 20120306073 - Yu; Chen-Hua ; et al. | 2012-12-06 |
| Approach for bonding dies onto interposers Grant 8,319,349 - Hu , et al. November 27, 2 | 2012-11-27 |
| Integrated Circuit Device And Method Of Manufacturing The Same App 20120267753 - Yeh; Der-Chyang ; et al. | 2012-10-25 |
| Semiconductor device having pad structure with stress buffer layer Grant 8,283,781 - Wu , et al. October 9, 2 | 2012-10-09 |
| Approach for Bonding Dies onto Interposers App 20120238057 - Hu; Hsien-Pin ; et al. | 2012-09-20 |
| Testing Of Semiconductor Chips With Microbumps App 20120206160 - WU; Wei-Cheng ; et al. | 2012-08-16 |
| Bond pad design for fine pitch wire bonding Grant 8,227,917 - Hsu , et al. July 24, 2 | 2012-07-24 |
| Dummy Metal Design for Packaging Structures App 20120178252 - Liu; Tzuan-Horng ; et al. | 2012-07-12 |
| Dummy metal design for packaging structures Grant 8,193,639 - Liu , et al. June 5, 2 | 2012-06-05 |
| Approach for Bonding Dies onto Interposers App 20120104578 - Hu; Hsien-Pin ; et al. | 2012-05-03 |
| Semiconductor Device Having Pad Structure With Stress Buffer Layer App 20120061823 - WU; Wei-Cheng ; et al. | 2012-03-15 |
| Cylindrical Embedded Capacitors App 20120049322 - Su; An-Jhih ; et al. | 2012-03-01 |
| Seal ring structure with improved cracking protection Grant 8,125,052 - Jeng , et al. February 28, 2 | 2012-02-28 |
| Approach for bonding dies onto interposers Grant 8,105,875 - Hu , et al. January 31, 2 | 2012-01-31 |
| Bond pad structures and integrated circuit chip having the same Grant 8,072,076 - Hsu , et al. December 6, 2 | 2011-12-06 |
| Package Systems Having Interposers App 20110291288 - WU; Wei-Cheng ; et al. | 2011-12-01 |
| Forming Interconnect Structures Using Pre-Ink-Printed Sheets App 20110277655 - Ko; Francis ; et al. | 2011-11-17 |
| Dummy Metal Design for Packaging Structures App 20110241202 - Liu; Tzuan-Horng ; et al. | 2011-10-06 |
| Integrated circuit with protective structure Grant 8,030,776 - Yu , et al. October 4, 2 | 2011-10-04 |
| 3D Semiconductor Package Using An Interposer App 20110210444 - Jeng; Shin-Puu ; et al. | 2011-09-01 |
| Heat Spreader Structures in Scribe Lines App 20110127648 - Chen; Hsien-Wei ; et al. | 2011-06-02 |
| Scribe line layout design Grant 7,952,167 - Lee , et al. May 31, 2 | 2011-05-31 |
| Integrated Circuit With Protective Structure, And Method Of Fabricating The Integrated Circuit App 20110079922 - Yu; Chen-Hua ; et al. | 2011-04-07 |
| Heat spreader structures in scribe lines Grant 7,906,836 - Chen , et al. March 15, 2 | 2011-03-15 |
| Semiconductor device and fabrication methods thereof Grant 7,888,236 - Pu , et al. February 15, 2 | 2011-02-15 |
| Single passivation layer scheme for forming a fuse Grant 7,811,866 - Tsai , et al. October 12, 2 | 2010-10-12 |
| Scribe Line Metal Structure App 20100207251 - Yu; Chen-Hua ; et al. | 2010-08-19 |
| Flexible structures for interconnect reliability test Grant 7,776,627 - Jeng , et al. August 17, 2 | 2010-08-17 |
| Underbump Metallization Structure App 20100187687 - Liu; Yu-Wen ; et al. | 2010-07-29 |
| Heat Spreader Structures in Scribe Lines App 20100123219 - Chen; Hsien-Wei ; et al. | 2010-05-20 |
| Pad structure design with reduced density Grant 7,714,443 - Chen , et al. May 11, 2 | 2010-05-11 |
| Protective Seal Ring for Preventing Die-Saw Induced Stress App 20090321890 - Jeng; Shin-Puu ; et al. | 2009-12-31 |
| Seal Ring in Semiconductor Device App 20090140391 - Hou; Shang-Yun ; et al. | 2009-06-04 |
| Seal ring structure with improved cracking protection and reduced problems App 20090115024 - Jeng; Shin-Puu ; et al. | 2009-05-07 |
| Bond Pad Design for Fine Pitch Wire Bonding App 20090091032 - Hsu; Shih-Hsun ; et al. | 2009-04-09 |
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