| Patent | Date |
|---|
Singulation and Bonding Methods and Structures Formed Thereby
App 20220310565 - Yu; Chen-Hua ; et al. | 2022-09-29 |
Semiconductor Structures And Method Of Manufacturing The Same
App 20220310542 - Yu; Chen-Hua ; et al. | 2022-09-29 |
Semiconductor Device With Nanostructures Aligned With Grating Coupler And Manufacturing Method Thereof
App 20220308284 - Liao; Yu-Kuang ; et al. | 2022-09-29 |
Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor device
Grant 11,456,256 - Tung , et al. September 27, 2 | 2022-09-27 |
Optical transceiver and manufacturing method thereof
Grant 11,454,773 - Yu , et al. September 27, 2 | 2022-09-27 |
Semiconductor package and method of fabricating the same
Grant 11,456,226 - Lin , et al. September 27, 2 | 2022-09-27 |
Semiconductor structure, package structure, and manufacturing method thereof
Grant 11,456,251 - Chen , et al. September 27, 2 | 2022-09-27 |
Semiconductor device and method of manufacture
Grant 11,454,888 - Liao , et al. September 27, 2 | 2022-09-27 |
Semiconductor device and method of manufacture
Grant 11,456,240 - Yu , et al. September 27, 2 | 2022-09-27 |
Semiconductor Package and Method
App 20220302067 - Wu; Jiun Yi ; et al. | 2022-09-22 |
Package Having Redistribution Layer Structure With Protective Layer
App 20220302038 - Yu; Chen-Hua ; et al. | 2022-09-22 |
3d Semiconductor Packages
App 20220302100 - Yu; Chen-Hua ; et al. | 2022-09-22 |
Structure and Method of Forming a Joint Assembly
App 20220302069 - Chen; Ying-Ju ; et al. | 2022-09-22 |
Semiconductor Package And Method Of Manufacture
App 20220302009 - Wu; Jiun Yi ; et al. | 2022-09-22 |
Package Structure For Heat Dissipation
App 20220301973 - Yu; Chen-Hua ; et al. | 2022-09-22 |
Integrated Circuit Packages and Methods of Forming Same
App 20220301889 - Yu; Chen-Hua ; et al. | 2022-09-22 |
Semiconductor Structure
App 20220302068 - Yu; Chen-Hua ; et al. | 2022-09-22 |
Chip Package Structure Including A Silicon Substrate Interposer And Methods For Forming The Same
App 20220302003 - PAN; Kuo Lung ; et al. | 2022-09-22 |
Semiconductor Die Connection System and Method
App 20220302062 - Chen; Ming-Fa ; et al. | 2022-09-22 |
Package structure including a solenoid inductor laterally aside a die and method of fabricating the same
Grant 11,450,628 - Tang , et al. September 20, 2 | 2022-09-20 |
Die Stack Structure And Manufacturing Method Thereof
App 20220293568 - Yu; Chen-Hua ; et al. | 2022-09-15 |
Package structure
Grant 11,444,002 - Lai , et al. September 13, 2 | 2022-09-13 |
Package structures and methods of forming
Grant 11,444,057 - Yu , et al. September 13, 2 | 2022-09-13 |
Via for semiconductor device connection and methods of forming the same
Grant 11,444,020 - Yu , et al. September 13, 2 | 2022-09-13 |
Redistribution structure for integrated circuit package and method of forming same
Grant 11,444,034 - Yu , et al. September 13, 2 | 2022-09-13 |
Bonding method of package components and bonding apparatus
Grant 11,443,981 - Hsiao , et al. September 13, 2 | 2022-09-13 |
Integrated circuit package and method
Grant 11,443,995 - Yu , et al. September 13, 2 | 2022-09-13 |
Package Structure And Method Of Forming The Same
App 20220285317 - Yu; Tsung-Yuan ; et al. | 2022-09-08 |
Semiconductor Packages and Methods of Forming Same
App 20220285323 - Yu; Chen-Hua ; et al. | 2022-09-08 |
Package Structure And Manufacturing Method Thereof
App 20220285331 - Wang; Chuei-Tang ; et al. | 2022-09-08 |
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
App 20220285310 - Yu; Chen-Hua ; et al. | 2022-09-08 |
Integrated Circuit Package Pad and Methods of Forming
App 20220285171 - Yu; Chen-Hua ; et al. | 2022-09-08 |
Wafer bonding method
Grant 11,437,344 - Lin , et al. September 6, 2 | 2022-09-06 |
Semiconductor Package And Method Of Forming Same
App 20220278036 - Wu; Jiun Yi ; et al. | 2022-09-01 |
Semiconductor Package and Method of Forming Thereof
App 20220278066 - Wu; Jiun Yi ; et al. | 2022-09-01 |
Semiconductor Device Package And Methods Of Manufacture
App 20220278087 - Wu; Jiun Yi ; et al. | 2022-09-01 |
Integrated circuit package and method of forming same
Grant 11,424,173 - Yu , et al. August 23, 2 | 2022-08-23 |
Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same
Grant 11,424,197 - Wang , et al. August 23, 2 | 2022-08-23 |
Pad structure design in fan-out package
Grant 11,424,189 - Yu , et al. August 23, 2 | 2022-08-23 |
Integrated Circuit Package and Method
App 20220262783 - Yu; Chen-Hua ; et al. | 2022-08-18 |
Passivation Structure with Planar Top Surfaces
App 20220262698 - Chen; Yi-Hsiu ; et al. | 2022-08-18 |
Deep Partition Power Delivery with Deep Trench Capacitor
App 20220262778 - Yu; Chen-Hua ; et al. | 2022-08-18 |
Package Structure And Manufacturing Method Thereof
App 20220262703 - Yu; Chen-Hua ; et al. | 2022-08-18 |
Chiplet Interposer
App 20220262742 - Hou; Shang-Yun ; et al. | 2022-08-18 |
Semiconductor structures
Grant 11,417,638 - Lai , et al. August 16, 2 | 2022-08-16 |
Dense redistribution layers in semiconductor packages and methods of forming the same
Grant 11,417,604 - Yu , et al. August 16, 2 | 2022-08-16 |
Post-passivation interconnect structure
Grant 11,417,610 - Chen , et al. August 16, 2 | 2022-08-16 |
Package structures and methods of forming the same
Grant 11,417,580 - Yu , et al. August 16, 2 | 2022-08-16 |
Package structure and method of fabricating the same
Grant 11,417,606 - Lin , et al. August 16, 2 | 2022-08-16 |
Integrated circuit package and method
Grant 11,417,633 - Yu , et al. August 16, 2 | 2022-08-16 |
Package Structure And Manufacturing Method Thereof
App 20220254722 - Yu; Chen-Hua ; et al. | 2022-08-11 |
Cross-Wafer RDLs in Constructed Wafers
App 20220254656 - YU; Chen-Hua ; et al. | 2022-08-11 |
Semiconductor Package And Method For Manufacturing The Same
App 20220254747 - WANG; CHUEI-TANG ; et al. | 2022-08-11 |
Chip Package And Method Of Forming The Same
App 20220254724 - Hu; Yu-Hsiang ; et al. | 2022-08-11 |
Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrier
Grant 11,410,918 - Yu , et al. August 9, 2 | 2022-08-09 |
Semiconductor device and method of forming the same
Grant 11,410,968 - Wu , et al. August 9, 2 | 2022-08-09 |
Semiconductor device, integrated fan-out package and method of forming the same
Grant 11,410,923 - Tsai , et al. August 9, 2 | 2022-08-09 |
Package Structure Having Hollow Cylinders And Method Of Fabricating The Same
App 20220246570 - Yu; Chen-Hua ; et al. | 2022-08-04 |
Methods of Forming Semiconductor Packages Having a Die with an Encapsulant
App 20220246559 - Tsai; Chung-Hao ; et al. | 2022-08-04 |
Integrated Fan-Out Packages and Methods of Forming the Same
App 20220246590 - Yu; Chen-Hua ; et al. | 2022-08-04 |
Bonded Semiconductor Devices and Methods of Forming The Same
App 20220246574 - Yu; Chen-Hua ; et al. | 2022-08-04 |
Semiconductor Devices and Methods of Manufacture
App 20220246598 - Chen; Ming-Fa ; et al. | 2022-08-04 |
System, device and methods of manufacture
Grant 11,404,316 - Yu , et al. August 2, 2 | 2022-08-02 |
Semiconductor Device
App 20220238408 - Yu; Chen-Hua ; et al. | 2022-07-28 |
Methods of Forming Semiconductor Device Packages
App 20220238398 - Yu; Chen-Hua ; et al. | 2022-07-28 |
Polymer layers embedded with metal pads for heat dissipation
Grant 11,398,440 - Chuang , et al. July 26, 2 | 2022-07-26 |
Semiconductor device and method of manufacture
Grant 11,393,770 - Lin , et al. July 19, 2 | 2022-07-19 |
Wafer level transfer molding and apparatus for performing the same
Grant 11,390,000 - Jang , et al. July 19, 2 | 2022-07-19 |
Anisotropic carrier for high aspect ratio fanout
Grant 11,393,701 - Yu , et al. July 19, 2 | 2022-07-19 |
3D semiconductor packages
Grant 11,393,805 - Yu , et al. July 19, 2 | 2022-07-19 |
Architecture for Computing System Package
App 20220223530 - Yu; Chen-Hua ; et al. | 2022-07-14 |
Three-Dimension Large System Integration
App 20220223572 - Yu; Chen-Hua ; et al. | 2022-07-14 |
Integrated circuit package and method
Grant 11,387,191 - Yu , et al. July 12, 2 | 2022-07-12 |
Integrated circuit package and method
Grant 11,387,222 - Yu , et al. July 12, 2 | 2022-07-12 |
Semiconductor die connection system and method
Grant 11,387,205 - Chen , et al. July 12, 2 | 2022-07-12 |
Integrated circuit packages and methods of forming same
Grant 11,387,118 - Yu , et al. July 12, 2 | 2022-07-12 |
Semiconductor device and method of manufacture
Grant 11,387,217 - Lin , et al. July 12, 2 | 2022-07-12 |
Package And Method Of Manufacturing The Same
App 20220216152 - Wu; Chih-Wei ; et al. | 2022-07-07 |
Semiconductor Package And Manufacturing Method Of The Same
App 20220216146 - CHEN; MING-FA ; et al. | 2022-07-07 |
Integrated Circuit Structure
App 20220217847 - Yu; Chen-Hua ; et al. | 2022-07-07 |
Integrated circuit package and method of forming same
Grant 11,380,598 - Chen , et al. July 5, 2 | 2022-07-05 |
Semiconductor structure comprising at least one system-on-integrated-circuit component
Grant 11,380,645 - Yu , et al. July 5, 2 | 2022-07-05 |
Die stacks and methods forming same
Grant 11,380,655 - Yu , et al. July 5, 2 | 2022-07-05 |
Semiconductor package including cavity-mounted device
Grant 11,380,620 - Wu , et al. July 5, 2 | 2022-07-05 |
Die stack structure and manufacturing method thereof
Grant 11,380,653 - Yu , et al. July 5, 2 | 2022-07-05 |
Memory Packages And Methods Of Forming Same
App 20220208735 - Yu; Chen-Hua ; et al. | 2022-06-30 |
Semiconductor Packages
App 20220208633 - Wu; Jiun-Yi ; et al. | 2022-06-30 |
Semiconductor Package And Method
App 20220199461 - Yu; Chen-Hua ; et al. | 2022-06-23 |
Photonic semiconductor device and method
Grant 11,362,077 - Chang , et al. June 14, 2 | 2022-06-14 |
Package structure for heat dissipation
Grant 11,362,013 - Yu , et al. June 14, 2 | 2022-06-14 |
Passenger seat with support structure defining empty space
Grant 11,358,722 - Erhel , et al. June 14, 2 | 2022-06-14 |
Chip Package Structure With Conductive Shielding Film
App 20220181305 - YU; Chen-Hua ; et al. | 2022-06-09 |
Structure and method of forming a joint assembly
Grant 11,355,468 - Chen , et al. June 7, 2 | 2022-06-07 |
Singulation and bonding methods and structures formed thereby
Grant 11,355,475 - Yu , et al. June 7, 2 | 2022-06-07 |
Semiconductor package and method
Grant 11,355,463 - Wu , et al. June 7, 2 | 2022-06-07 |
Package structure and manufacturing method thereof
Grant 11,355,418 - Yu , et al. June 7, 2 | 2022-06-07 |
Semiconductor package
Grant 11,355,428 - Wu , et al. June 7, 2 | 2022-06-07 |
Warpage Control of Packages Using Embedded Core Frame
App 20220173003 - Wu; Jiun Yi ; et al. | 2022-06-02 |
Semiconductor device and bump formation process
Grant 11,348,889 - Hsiao , et al. May 31, 2 | 2022-05-31 |
Semiconductor Device Structure, Stacked Semiconductor Device Structure And Method Of Manufacturing Semiconductor Device Structure
App 20220165669 - Yu; Chen-Hua ; et al. | 2022-05-26 |
Packaged Semiconductor Devices With Wireless Charging Means
App 20220166254 - YU; Chen-Hua ; et al. | 2022-05-26 |
Raised Via for Terminal Connections on Different Planes
App 20220165611 - Yu; Chen-Hua ; et al. | 2022-05-26 |
Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same
Grant 11,339,258 - Liao , et al. May 24, 2 | 2022-05-24 |
Bonding with pre-deoxide process and apparatus for performing the same
Grant 11,342,302 - Yu , et al. May 24, 2 | 2022-05-24 |
Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof
Grant 11,342,269 - Yu , et al. May 24, 2 | 2022-05-24 |
Semiconductor packages and methods of forming same
Grant 11,342,309 - Yu , et al. May 24, 2 | 2022-05-24 |
Integrated circuit package pad and methods of forming
Grant 11,342,196 - Chen , et al. May 24, 2 | 2022-05-24 |
Electronic assembly, package structure having hollow cylinders and method of fabricating the same
Grant 11,342,295 - Yu , et al. May 24, 2 | 2022-05-24 |
Integrated Circuit Package and Method
App 20220157760 - Chen; Chien-Hsun ; et al. | 2022-05-19 |
3d Integrated Circuit (3dic) Structure
App 20220157785 - Yu; Chen-Hua ; et al. | 2022-05-19 |
Multi-chip package and method of formation
Grant 11,335,658 - Lin , et al. May 17, 2 | 2022-05-17 |
Package structure and method of fabricating the same
Grant 11,335,767 - Yu , et al. May 17, 2 | 2022-05-17 |
Semiconductor device
Grant 11,328,975 - Yu , et al. May 10, 2 | 2022-05-10 |
Integrated Circuit Package and Method
App 20220139839 - Yu; Chen-Hua ; et al. | 2022-05-05 |
Optical semiconductor package and method for manufacturing the same
Grant 11,322,470 - Wang , et al. May 3, 2 | 2022-05-03 |
Chip package and method of forming the same
Grant 11,322,450 - Hu , et al. May 3, 2 | 2022-05-03 |
Method Of Manufacturing Package Structure
App 20220130815 - Huang; Shih-Ya ; et al. | 2022-04-28 |
Aligning Bumps in Fan-Out Packaging Process
App 20220130794 - Huang; Ying-Jui ; et al. | 2022-04-28 |
Bonded semiconductor devices and methods of forming the same
Grant 11,315,900 - Yu , et al. April 26, 2 | 2022-04-26 |
Methods of forming semiconductor packages having a die with an encapsulant
Grant 11,315,891 - Tsai , et al. April 26, 2 | 2022-04-26 |
Conical-shaped or tier-shaped pillar connections
Grant 11,315,896 - Kuo , et al. April 26, 2 | 2022-04-26 |
Cross-wafer RDLs in constructed wafers
Grant 11,315,805 - Yu , et al. April 26, 2 | 2022-04-26 |
Photoresist System and Method
App 20220121120 - Kuo; Hung-Jui ; et al. | 2022-04-21 |
High thermal conductivity prepreg and uses of the same
Grant 11,306,239 - Liao , et al. April 19, 2 | 2022-04-19 |
Method of forming semiconductor device package having dummy devices on a first die
Grant 11,309,223 - Yu , et al. April 19, 2 | 2022-04-19 |
Package on package devices and methods of packaging semiconductor dies
Grant RE49,045 - Yu , et al. April 19, 2 | 2022-04-19 |
Integrated fan-out packages and methods of forming the same
Grant 11,309,294 - Yu , et al. April 19, 2 | 2022-04-19 |
Semiconductor device with shielding structure for cross-talk reduction
Grant 11,302,649 - Huang , et al. April 12, 2 | 2022-04-12 |
Semiconductor structures and methods
Grant 11,304,290 - Yu , et al. April 12, 2 | 2022-04-12 |
Semiconductor Device and Method of Manufacture
App 20220108961 - Yu; Chen-Hua ; et al. | 2022-04-07 |
Semiconductor package device with integrated antenna and manufacturing method thereof
Grant 11,295,979 - Liao , et al. April 5, 2 | 2022-04-05 |
Three-dimension large system integration
Grant 11,296,062 - Yu , et al. April 5, 2 | 2022-04-05 |
Photonic Package And Method Of Manufacture
App 20220099887 - Yu; Chen-Hua ; et al. | 2022-03-31 |
Integrated circuit packages and methods of forming same
Grant 11,289,410 - Yu , et al. March 29, 2 | 2022-03-29 |
Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof
Grant 11,289,449 - Wang , et al. March 29, 2 | 2022-03-29 |
Integrated circuit structure
Grant 11,291,116 - Yu , et al. March 29, 2 | 2022-03-29 |
Package and method of manufacturing the same
Grant 11,289,424 - Wu , et al. March 29, 2 | 2022-03-29 |
Integrated Circuit Packages And Methods Of Forming The Same
App 20220093560 - Yu; Chen-Hua ; et al. | 2022-03-24 |
Hybrid Dielectric Scheme in Packages
App 20220093498 - Chen; Chien-Hsun ; et al. | 2022-03-24 |
TSV Structure and Method Forming Same
App 20220093461 - Chung; Ming-Tsu ; et al. | 2022-03-24 |
Semiconductor Device and Method of Manufacture
App 20220091505 - Liao; Sih-Hao ; et al. | 2022-03-24 |
Semiconductor package and manufacturing method of the same
Grant 11,282,784 - Chen , et al. March 22, 2 | 2022-03-22 |
Wireless charging package with chip integrated in coil center
Grant 11,282,785 - Yu , et al. March 22, 2 | 2022-03-22 |
Integrated fan-out structure with rugged interconnect
Grant 11,282,793 - Lin , et al. March 22, 2 | 2022-03-22 |
Semiconductor packages and methods of manufacturing the same
Grant 11,282,761 - Wu , et al. March 22, 2 | 2022-03-22 |
Memory packages and methods of forming same
Grant 11,282,816 - Yu , et al. March 22, 2 | 2022-03-22 |
Semiconductor Device and Method of Manufacture
App 20220082939 - Liao; Sih-Hao ; et al. | 2022-03-17 |
System Formed Through Package-In-Package Formation
App 20220077117 - Yu; Chen-Hua ; et al. | 2022-03-10 |
Semiconductor Structure And Manufacturing Method Thereof
App 20220077072 - YU; CHEN-HUA ; et al. | 2022-03-10 |
Semiconductor Device Including Heat Dissipation Structure And Fabricating Method Of The Same
App 20220077024 - Teng; Po-Yuan ; et al. | 2022-03-10 |
Semiconductor Structure
App 20220068880 - YU; CHEN-HUA ; et al. | 2022-03-03 |
Fingerprint Sensor Device And Method
App 20220067334 - Huang; Yu-Chih ; et al. | 2022-03-03 |
Integrated Circuit Package and Method
App 20220068856 - Chiou; Wen-Chih ; et al. | 2022-03-03 |
Semiconductor Device Package And Method Of Manufacture
App 20220068862 - Wu; Jiun Yi ; et al. | 2022-03-03 |
Chip package structure with seal ring structure
Grant 11,264,363 - Yu , et al. March 1, 2 | 2022-03-01 |
Package on package structure and method for forming the same
Grant 11,264,342 - Yu , et al. March 1, 2 | 2022-03-01 |
Electronic Apparatus
App 20220059450 - Tang; Tzu-Chun ; et al. | 2022-02-24 |
Interconnect crack arrestor structure and methods
Grant 11,257,767 - Yu , et al. February 22, 2 | 2022-02-22 |
Warpage control of packages using embedded core frame
Grant 11,251,099 - Wu , et al. February 15, 2 | 2022-02-15 |
Raised via for terminal connections on different planes
Grant 11,251,071 - Yu , et al. February 15, 2 | 2022-02-15 |
Packaged semiconductor devices with wireless charging means
Grant 11,251,644 - Yu , et al. February 15, 2 | 2022-02-15 |
Semiconductor Device and Method
App 20220045254 - Yu; Chen-Hua ; et al. | 2022-02-10 |
Photonic Semiconductor Device And Method Of Manufacture
App 20220043208 - Hsia; Hsing-Kuo ; et al. | 2022-02-10 |
Package structure and method of forming the same
Grant 11,244,939 - Tsai , et al. February 8, 2 | 2022-02-08 |
Package structure, electronic device and method of fabricating package structure
Grant 11,245,176 - Hsiao , et al. February 8, 2 | 2022-02-08 |
Tri-layer CoWoS structure
Grant 11,244,924 - Yu , et al. February 8, 2 | 2022-02-08 |
Package Structure
App 20220037228 - Lai; Yu-Chia ; et al. | 2022-02-03 |
3D integrated circuit (3DIC) structure
Grant 11,239,201 - Yu , et al. February 1, 2 | 2022-02-01 |
Integrated circuit package and method
Grant 11,239,193 - Chen , et al. February 1, 2 | 2022-02-01 |
Package structure and package-on-package structure
Grant 11,239,157 - Wang , et al. February 1, 2 | 2022-02-01 |
Semiconductor Structure and Method
App 20220028823 - Cheng; Chia-Shen ; et al. | 2022-01-27 |
Integrated circuit package and method
Grant 11,227,837 - Yu , et al. January 18, 2 | 2022-01-18 |
Package structure and method of manufacturing the same
Grant 11,222,883 - Huang , et al. January 11, 2 | 2022-01-11 |
Photoresist system and method
Grant 11,215,929 - Kuo , et al. January 4, 2 | 2022-01-04 |
Embedded voltage regulator structure and method forming same
Grant 11,217,546 - Wu , et al. January 4, 2 | 2022-01-04 |
Aligning bumps in fan-out packaging process
Grant 11,217,555 - Huang , et al. January 4, 2 | 2022-01-04 |
Semiconductor Device
App 20210407887 - Yu; Chen-Hua ; et al. | 2021-12-30 |
Packaged Semiconductor Device and Method of Forming Thereof
App 20210407942 - Yu; Chen-Hua ; et al. | 2021-12-30 |
Passive device module, semiconductor package including the same, and manufacturing method thereof
Grant 11,211,360 - Huang , et al. December 28, 2 | 2021-12-28 |
Semiconductor device
Grant 11,211,339 - Wang , et al. December 28, 2 | 2021-12-28 |
Integrated circuit package and method
Grant 11,211,371 - Yu , et al. December 28, 2 | 2021-12-28 |
Semiconductor device and method of manufacture
Grant 11,211,346 - Yu , et al. December 28, 2 | 2021-12-28 |
Integrated fan-out package and method for fabricating the same
Grant 11,211,336 - Yu , et al. December 28, 2 | 2021-12-28 |
Packages with Thick RDLs and Thin RDLs Stacked Alternatingly
App 20210398905 - Teng; Po-Yuan ; et al. | 2021-12-23 |
Molding wafer chamber
Grant 11,205,579 - Lin , et al. December 21, 2 | 2021-12-21 |
Segregated Power and Ground Design for Yield Improvement
App 20210391270 - Chun; Shu-Rong ; et al. | 2021-12-16 |
Semiconductor package, package on package structure and method of froming package on package structure
Grant 11,201,142 - Huang , et al. December 14, 2 | 2021-12-14 |
Wafer chuck
Grant 11,201,079 - Liao , et al. December 14, 2 | 2021-12-14 |
Method Of Forming Semiconductor Package With Composite Thermal Interface Material Structure
App 20210384103 - SHAO; Tung-Liang ; et al. | 2021-12-09 |
Isolation Bonding Film for Semiconductor Packages and Methods of Forming the Same
App 20210384158 - Chung; Ming-Tsu ; et al. | 2021-12-09 |
Semiconductor package and manufacturing method thereof
Grant 11,195,817 - Huang , et al. December 7, 2 | 2021-12-07 |
Fingerprint sensor device and method
Grant 11,194,990 - Huang , et al. December 7, 2 | 2021-12-07 |
Integrated circuit packages comprising a plurality of redistribution structures and methods of forming the same
Grant 11,195,816 - Yu , et al. December 7, 2 | 2021-12-07 |
Hybrid dielectric scheme in packages
Grant 11,195,788 - Chen , et al. December 7, 2 | 2021-12-07 |
Semiconductr Device, Stacked Semiconductor Device And Manufacturing Method Of Semiconductor Device
App 20210375766 - Tung; Chih-Hang ; et al. | 2021-12-02 |
Fan-Out Package Having a Main Die and a Dummy Die
App 20210375775 - Lin; Yan-Fu ; et al. | 2021-12-02 |
Packages and Methods of Forming Packages
App 20210375842 - Yu; Chen-Hua ; et al. | 2021-12-02 |
Semiconductor Package Structure Comprising Rigid-flexible Substrate And Manufacturing Method Thereof
App 20210375770 - Wang; Chuei-Tang ; et al. | 2021-12-02 |
Package Structure
App 20210375724 - SHAO; Tung-Liang ; et al. | 2021-12-02 |
Semiconductor Device And Method Of Manufacture
App 20210375785 - Wu; Jiun Yi ; et al. | 2021-12-02 |
IPD Modules with Flexible Connection Scheme in Packaging
App 20210375840 - Lai; Yu-Chia ; et al. | 2021-12-02 |
Semiconductor packages and methods of forming same
Grant 11,189,603 - Yu , et al. November 30, 2 | 2021-11-30 |
System formed through package-in-package formation
Grant 11,189,599 - Yu , et al. November 30, 2 | 2021-11-30 |
Giga Interposer Integration through Chip-On-Wafer-On-Substrate
App 20210366814 - Hou; Shang-Yun ; et al. | 2021-11-25 |
Semiconductor Device that Uses Bonding Layer to Join Semiconductor Substrates Together
App 20210366893 - Chen; Ming-Fa ; et al. | 2021-11-25 |
Chiplets 3D SoIC System Integration and Fabrication Methods
App 20210366854 - Yu; Chen-Hua ; et al. | 2021-11-25 |
Semiconductor Device And Method Of Manufacture
App 20210366877 - Wu; Jiun Yi ; et al. | 2021-11-25 |
Semiconductor Device, Circuit Board Structure And Manufacturing Method Thereof
App 20210366872 - Kuo; Tin-Hao ; et al. | 2021-11-25 |
Semiconductor Package and Method
App 20210366863 - Wu; Jiun Yi ; et al. | 2021-11-25 |
Integrated circuit structure having dies with connectors of different sizes
Grant 11,183,473 - Jeng , et al. November 23, 2 | 2021-11-23 |
Semiconductor device and method of manufacture
Grant 11,183,399 - Wei , et al. November 23, 2 | 2021-11-23 |
Semiconductor structure and manufacturing method thereof
Grant 11,183,461 - Yu , et al. November 23, 2 | 2021-11-23 |
Integrated circuit package and method
Grant 11,183,487 - Lai , et al. November 23, 2 | 2021-11-23 |
Semiconductor Device and Method
App 20210358870 - Huang; Tzu-Sung ; et al. | 2021-11-18 |
Redistribution Structure For Integrated Circuit Package And Method Of Forming Same
App 20210358854 - Yu; Chen-Hua ; et al. | 2021-11-18 |
Chip package
Grant 11,177,434 - Yu , et al. November 16, 2 | 2021-11-16 |
Semiconductor structure
Grant 11,177,238 - Yu , et al. November 16, 2 | 2021-11-16 |
Semiconductor device including heat dissipation structure and fabricating method of the same
Grant 11,177,192 - Teng , et al. November 16, 2 | 2021-11-16 |
Semiconductor structure and manufacturing method thereof
Grant 11,177,355 - Yu , et al. November 16, 2 | 2021-11-16 |
Semiconductor Device And Manufacturing Method Thereof
App 20210351111 - Yu; Chen-Hua ; et al. | 2021-11-11 |
Wafer Level Package Structure and Method of Forming Same
App 20210351076 - Yu; Chen-Hua ; et al. | 2021-11-11 |
Redistribution Layer Structures For Integrated Circuit Package
App 20210351130 - CHEN; Jie ; et al. | 2021-11-11 |
Semiconductor Package and Method
App 20210351172 - Pei; Hao-Jan ; et al. | 2021-11-11 |
Semiconductor package and manufacturing process thereof
Grant 11,171,016 - Chen , et al. November 9, 2 | 2021-11-09 |
Semiconductor device and method of manufacture
Grant 11,171,090 - Wu , et al. November 9, 2 | 2021-11-09 |
Compute-in-memory packages and methods forming the same
Grant 11,171,076 - Yu , et al. November 9, 2 | 2021-11-09 |
Electronic apparatus including antennas and directors
Grant 11,171,088 - Tang , et al. November 9, 2 | 2021-11-09 |
Testing of semiconductor chips with microbumps
Grant 11,169,207 - Wu , et al. November 9, 2 | 2021-11-09 |
Semiconductor Package And Method Of Manufacturing The Same
App 20210343547 - Chang; Chin-Chuan ; et al. | 2021-11-04 |
Semiconductor Package and Method of Manufacturing the Same
App 20210343693 - Chang; Chin-Chuan ; et al. | 2021-11-04 |
Semiconductor Package And Manufacturing Method Thereof
App 20210343651 - Tsai; Chung-Hao ; et al. | 2021-11-04 |
MEMS Packages and Methods of Manufacture Thereof
App 20210340008 - Yu; Chen-Hua ; et al. | 2021-11-04 |
Package Structure And Method Of Forming The Same
App 20210343666 - Yu; Chen-Hua ; et al. | 2021-11-04 |
Package Structures And Methods Of Manufacturing The Same
App 20210343622 - Lai; Yu-Chia ; et al. | 2021-11-04 |
System on Integrated Chips and Methods of Forming Same
App 20210343680 - Yeh; Sung-Feng ; et al. | 2021-11-04 |
Semiconductor Package and Method
App 20210335726 - Wu; Jiun Yi ; et al. | 2021-10-28 |
Chip Package Structure With Redistribution Layer Having Bonding Portion
App 20210335750 - TUNG; Chih-Hang ; et al. | 2021-10-28 |
Semiconductor Device And Method
App 20210335701 - Lin; Jing-Cheng ; et al. | 2021-10-28 |
Semiconductor device and method
Grant 11,158,775 - Yu , et al. October 26, 2 | 2021-10-26 |
Redistribution layers in semiconductor packages and methods of forming same
Grant 11,158,619 - Huang , et al. October 26, 2 | 2021-10-26 |
Photonic semiconductor device and method
Grant 11,156,772 - Yu , et al. October 26, 2 | 2021-10-26 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210327836 - Lin; Yung-Chi ; et al. | 2021-10-21 |
Redistribution Structures for Semiconductor Packages and Methods of Forming the Same
App 20210327726 - Hu; Yu-Hsiang ; et al. | 2021-10-21 |
Semiconductor Device and Method of Manufacture
App 20210327797 - Wu; Jiun Yi ; et al. | 2021-10-21 |
Integrated Circuit Package And Method
App 20210327866 - Yu; Chen-Hua ; et al. | 2021-10-21 |
InFO-POP structures with TIVs Having Cavities
App 20210327816 - Lin; Jing-Cheng ; et al. | 2021-10-21 |
Package Structures and Methods of Forming the Same
App 20210327778 - Yu; Chen-Hua ; et al. | 2021-10-21 |
Package with UBM and methods of forming
Grant 11,152,323 - Yu , et al. October 19, 2 | 2021-10-19 |
Packages with interposers and methods for forming the same
Grant 11,152,312 - Chiu , et al. October 19, 2 | 2021-10-19 |
Integrated circuit package and methods of forming same
Grant 11,152,344 - Yu , et al. October 19, 2 | 2021-10-19 |
Integrated Circuit Package And Method Of Forming Same
App 20210320097 - Hou; Shang-Yun ; et al. | 2021-10-14 |
Semiconductor device and method of manufacture
Grant 11,145,614 - Wu , et al. October 12, 2 | 2021-10-12 |
Package Structure
App 20210313671 - Chuang; Nan-Chin ; et al. | 2021-10-07 |
Method Of Manufacturing Semiconductor Package Structure
App 20210313309 - Chen; Yi-Hsiu ; et al. | 2021-10-07 |
Semiconductor devices and methods of forming the same
Grant 11,139,249 - Yu , et al. October 5, 2 | 2021-10-05 |
Semiconductor device with conductive shielding structure
Grant 11,139,206 - Yu , et al. October 5, 2 | 2021-10-05 |
Molded underfilling for package on package devices
Grant 11,139,281 - Yu , et al. October 5, 2 | 2021-10-05 |
Semiconductor device and manufacturing method thereof
Grant 11,139,223 - Yu , et al. October 5, 2 | 2021-10-05 |
Wafer Bonding Method
App 20210305200 - Lin; Yung-Chi ; et al. | 2021-09-30 |
Semiconductor Package And Manufacturing Method Thereof
App 20210305122 - Lai; Wei-Chih ; et al. | 2021-09-30 |
Package Structure And Method Of Forming The Same
App 20210305226 - Tsai; Chung-Hao ; et al. | 2021-09-30 |
Package and Method for Manufacturing the Same
App 20210305123 - Yu; Chen-Hua ; et al. | 2021-09-30 |
Wafer Level Chip Scale Packaging Intermediate Structure Apparatus and Method
App 20210305086 - Yu; Chen-Hua ; et al. | 2021-09-30 |
COWOS structures and methods forming same
Grant 11,133,282 - Yu , et al. September 28, 2 | 2021-09-28 |
Polymer-based-semiconductor structure with cavity
Grant 11,133,236 - Yu , et al. September 28, 2 | 2021-09-28 |
Fan-out interconnect structure and method for forming same
Grant 11,133,274 - Yu , et al. September 28, 2 | 2021-09-28 |
Package with bridge die for interconnection and method forming same
Grant 11,133,258 - Yu , et al. September 28, 2 | 2021-09-28 |
FinFETs having dielectric punch-through stoppers
Grant 11,133,387 - Chang , et al. September 28, 2 | 2021-09-28 |
Integrated fan-out device
Grant 11,133,283 - Wu , et al. September 28, 2 | 2021-09-28 |
Semiconductor Package And Methods Of Forming The Same
App 20210296270 - Tu; Meng-Che ; et al. | 2021-09-23 |
Package Having Redistribution Layer Structure With Protective Layer And Method Of Fabricating The Same
App 20210296252 - Yu; Chen-Hua ; et al. | 2021-09-23 |
Die Stacking Structure and Method Forming Same
App 20210288040 - Yu; Chen-Hua ; et al. | 2021-09-16 |
Integrated fan-out device, 3D-IC system, and method
Grant 11,121,052 - Lai , et al. September 14, 2 | 2021-09-14 |
Semiconductor device and method
Grant 11,121,299 - Hu , et al. September 14, 2 | 2021-09-14 |
Integrated fan-out package
Grant 11,121,070 - Chun , et al. September 14, 2 | 2021-09-14 |
Semiconductor Device and Method
App 20210281037 - Yu; Chen-Hua ; et al. | 2021-09-09 |
Semiconductor Structure
App 20210280528 - YU; CHEN-HUA ; et al. | 2021-09-09 |
Package Structure
App 20210280524 - Lin; Chun-Wen ; et al. | 2021-09-09 |
Semiconductor devices with low junction capacitances and methods of fabrication thereof
Grant 11,114,563 - Chang , et al. September 7, 2 | 2021-09-07 |
Package Structures And Method Of Forming The Same
App 20210272894 - Yu; Chen-Hua ; et al. | 2021-09-02 |
Symmetrical Substrate For Semiconductor Packaging
App 20210272889 - Wu; Jiun Yi ; et al. | 2021-09-02 |
Stacked Image Sensor Device And Method Of Forming Same
App 20210273013 - Chiou; Wen-Chih ; et al. | 2021-09-02 |
Package Structure And Manufacturing Method Thereof
App 20210272929 - Tsai; Chung-Hao ; et al. | 2021-09-02 |
Fingerprint Sensor In Info Structure And Formation Method
App 20210271842 - Chen; Chih-Hua ; et al. | 2021-09-02 |
Semiconductor packages and methods of forming the same
Grant 11,107,798 - Yu , et al. August 31, 2 | 2021-08-31 |
Segregated power and ground design for yield improvement
Grant 11,107,771 - Chun , et al. August 31, 2 | 2021-08-31 |
Semiconductor package with composite thermal interface material structure and method of forming the same
Grant 11,107,747 - Shao , et al. August 31, 2 | 2021-08-31 |
Chip Package With Antenna Element
App 20210265289 - CHIANG; Yung-Ping ; et al. | 2021-08-26 |
Dummy Dies for Reducing Warpage in Packages
App 20210265284 - Yu; Chen-Hua ; et al. | 2021-08-26 |
Integrated Circuit Package and Method
App 20210265228 - Chun; Shu-Rong ; et al. | 2021-08-26 |
Package Structure And Manufacturing Method Thereof
App 20210265276 - Wu; Kai-Chiang ; et al. | 2021-08-26 |
Electronic Assembly Having Circuit Carrier And Manufacturing Method Thereof
App 20210267068 - Wu; Jiun-Yi ; et al. | 2021-08-26 |
Isolation bonding film for semiconductor packages and methods of forming the same
Grant 11,101,240 - Chung , et al. August 24, 2 | 2021-08-24 |
Package structure and method for forming the same
Grant 11,101,195 - Shao , et al. August 24, 2 | 2021-08-24 |
Semiconductor device and method of manufacture
Grant 11,101,140 - Wei , et al. August 24, 2 | 2021-08-24 |
Method of forming a dummy die of an integrated circuit having an embedded annular structure
Grant 11,101,260 - Hou , et al. August 24, 2 | 2021-08-24 |
Semiconductor Device And Manufacturing Method Thereof
App 20210257339 - Yu; Chen-Hua ; et al. | 2021-08-19 |
Package with thinned substrate
Grant 11,094,671 - Yu , et al. August 17, 2 | 2021-08-17 |
Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof
Grant 11,094,634 - Wang , et al. August 17, 2 | 2021-08-17 |
Fan-out package having a main die and a dummy die
Grant 11,094,641 - Lin , et al. August 17, 2 | 2021-08-17 |
Packages and methods of forming packages
Grant 11,094,680 - Yu , et al. August 17, 2 | 2021-08-17 |
IPD modules with flexible connection scheme in packaging
Grant 11,088,125 - Lai , et al. August 10, 2 | 2021-08-10 |
Semiconductor device that uses bonding layer to join semiconductor substrates together
Grant 11,088,131 - Chen , et al. August 10, 2 | 2021-08-10 |
Semiconductor device, circuit board structure and manufacturing method thereof
Grant 11,088,110 - Kuo , et al. August 10, 2 | 2021-08-10 |
Semiconductor Package And Manufacturing Method Thereof
App 20210239902 - Chang; Chih-Chieh ; et al. | 2021-08-05 |
Semiconductor Package System and Method
App 20210242150 - Huang; Hui-Min ; et al. | 2021-08-05 |
Processes for Reducing Leakage and Improving Adhesion
App 20210242083 - Hsieh; Yun Chen ; et al. | 2021-08-05 |
Package system for integrated circuits
Grant 11,081,372 - Wu , et al. August 3, 2 | 2021-08-03 |
Semiconductor Package and Method
App 20210233852 - Yu; Chen-Hua ; et al. | 2021-07-29 |
Method of Forming Semiconductor Packages Having Through Package Vias
App 20210233854 - Yu; Chen-Hua ; et al. | 2021-07-29 |
Integrated Circuit Package and Method
App 20210233835 - Lai; Chi-Hui ; et al. | 2021-07-29 |
Semiconductor device and method
Grant 11,075,176 - Huang , et al. July 27, 2 | 2021-07-27 |
InFO-POP structures with TIVs having cavities
Grant 11,075,168 - Lin , et al. July 27, 2 | 2021-07-27 |
Semiconductor package and method of fabricating semiconductor package
Grant 11,075,184 - Yu , et al. July 27, 2 | 2021-07-27 |
Semiconductor device including through die via and manufacturing method thereof
Grant 11,075,145 - Yu , et al. July 27, 2 | 2021-07-27 |
Packages with Si-Substrate-Free Interposer and Method Forming Same
App 20210225750 - Yu; Chen-Hua ; et al. | 2021-07-22 |
Semiconductor Device and Method of Manufacture
App 20210225764 - Wu; Jiun Yi ; et al. | 2021-07-22 |
Passive Device Module, Semiconductor Package Including The Same, And Manufacturing Method Thereof
App 20210225804 - Huang; Shih-Ya ; et al. | 2021-07-22 |
Memory Packages And Methods Of Forming Same
App 20210225809 - Yu; Chen-Hua ; et al. | 2021-07-22 |
Integrated Circuit Package and Method
App 20210225792 - Chen; Chien-Hsun ; et al. | 2021-07-22 |
Integrated Devices in Semiconductor Packages and Methods of Forming Same
App 20210225786 - Yu; Chen-Hua ; et al. | 2021-07-22 |
Semiconductor Device And Methods Of Manufacture
App 20210225664 - Wu; Jiun Yi ; et al. | 2021-07-22 |
Semiconductor Device And Method Of Manufacture
App 20210225780 - Wu; Jiun Yi ; et al. | 2021-07-22 |
Semiconductor Packages And Methods Of Forming The Same
App 20210225812 - Yu; Chen-Hua ; et al. | 2021-07-22 |
Semiconductor Device Having Via Sidewall Adhesion with Encapsulant
App 20210225751 - Yu; Chen-Hua ; et al. | 2021-07-22 |
Semiconductor Devices and Methods of Manufacture
App 20210223489 - Weng; Chung-Ming ; et al. | 2021-07-22 |
Semiconductor package and method
Grant 11,069,671 - Pei , et al. July 20, 2 | 2021-07-20 |
MEMS packages and methods of manufacture thereof
Grant 11,066,297 - Yu , et al. July 20, 2 | 2021-07-20 |
System on integrated chips and methods of forming same
Grant 11,069,658 - Yeh , et al. July 20, 2 | 2021-07-20 |
Method of manufacturing semiconductor structure
Grant 11,069,652 - Kalnitsky , et al. July 20, 2 | 2021-07-20 |
Package structure and method of forming the same
Grant 11,069,636 - Yu , et al. July 20, 2 | 2021-07-20 |
Wafer level package structure and method of forming same
Grant 11,069,573 - Yu , et al. July 20, 2 | 2021-07-20 |
Semiconductor Device And Manufacturing Method Of The Same
App 20210217736 - LIN; JING-CHENG ; et al. | 2021-07-15 |
Package Structure And Manufacturing Method Thereof
App 20210217715 - Yu; Chen-Hua ; et al. | 2021-07-15 |
Chip on Package Structure and Method
App 20210217726 - Yu; Chen-Hua ; et al. | 2021-07-15 |
Info Structure and Method Forming Same
App 20210217709 - Wang; Po-Han ; et al. | 2021-07-15 |
Redistribution structures for semiconductor packages and methods of forming the same
Grant 11,062,915 - Hu , et al. July 13, 2 | 2021-07-13 |
Semiconductor package and manufacturing method thereof
Grant 11,062,998 - Tsai , et al. July 13, 2 | 2021-07-13 |
Semiconductor structure and manufacturing method thereof
Grant 11,063,008 - Lin , et al. July 13, 2 | 2021-07-13 |
Package structures
Grant 11,062,975 - Lai , et al. July 13, 2 | 2021-07-13 |
Semiconductor device
Grant 11,062,987 - Lin , et al. July 13, 2 | 2021-07-13 |
Integrated fan-out package including voltage regulators and methods forming same
Grant 11,063,016 - Yu , et al. July 13, 2 | 2021-07-13 |
Package Structure and Method
App 20210210399 - Lin; Jing-Cheng ; et al. | 2021-07-08 |
Chip package structure and method for forming the same
Grant 11,056,459 - Tung , et al. July 6, 2 | 2021-07-06 |
Semiconductor package, semiconductor device and method of forming the same
Grant 11,056,474 - Yu , et al. July 6, 2 | 2021-07-06 |
Redistribution layer structures for integrated circuit package
Grant 11,056,433 - Chen , et al. July 6, 2 | 2021-07-06 |
Packages with metal line crack prevention design
Grant 11,056,464 - Yu , et al. July 6, 2 | 2021-07-06 |
Buffer Design for Package Integration
App 20210202463 - Chen; Jie ; et al. | 2021-07-01 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20210202335 - Yu; Chen-Hua ; et al. | 2021-07-01 |
Photonic Semiconductor Device And Method
App 20210202453 - Chang; Chih-Chieh ; et al. | 2021-07-01 |
Semiconductor Devices And Methods Of Manufacturing
App 20210202266 - Chen; Chien-Hsun ; et al. | 2021-07-01 |
Semiconductor Device and Method of Manufacturing
App 20210202396 - Wu; Jiun Yi ; et al. | 2021-07-01 |
System on Integrated Chips and Methods of Forming the Same
App 20210202398 - Yu; Chen-Hua ; et al. | 2021-07-01 |
System, Device And Methods Of Manufacture
App 20210202312 - Yu; Chen-Hua ; et al. | 2021-07-01 |
Segregated Power and Ground Design for Yield Improvement
App 20210202391 - Chun; Shu-Rong ; et al. | 2021-07-01 |
Methods of bonding the strip-shaped under bump metallization structures
Grant 11,049,850 - Tai , et al. June 29, 2 | 2021-06-29 |
Semiconductor device and method of manufacture
Grant 11,049,802 - Wu , et al. June 29, 2 | 2021-06-29 |
Redistribution Layers in Semiconductor Packages and Methods of Forming Same
App 20210193618 - Hsieh; Cheng-Hsien ; et al. | 2021-06-24 |
Integrated Fan-Out Package with 3D Magnetic Core Inductor
App 20210193572 - Liao; Wen-Shiang ; et al. | 2021-06-24 |
Integrated Circuit Package and Method
App 20210193582 - Yu; Chen-Hua ; et al. | 2021-06-24 |
Fan-Out Structure and Method of Fabricating the Same
App 20210193485 - Yu; Chen-Hua ; et al. | 2021-06-24 |
Method of manufacturing semiconductor package structure
Grant 11,043,481 - Chen , et al. June 22, 2 | 2021-06-22 |
Package structure
Grant 11,043,731 - Chuang , et al. June 22, 2 | 2021-06-22 |
Package Structure And Method Of Fabricating The Same
App 20210183794 - Tang; Tzu-Chun ; et al. | 2021-06-17 |
Package Structures and Method of Forming the Same
App 20210183745 - Yu; Chen-Hua ; et al. | 2021-06-17 |
Conductive Traces in Semiconductor Devices and Methods of Forming Same
App 20210183760 - Shih; Chao-Wen ; et al. | 2021-06-17 |
Opening in the Pad for Bonding Integrated Passive Device in InFO Package
App 20210185810 - Hsieh; Cheng-Hsien ; et al. | 2021-06-17 |
Singulation and bonding methods and structures formed thereby
Grant 11,037,904 - Yu , et al. June 15, 2 | 2021-06-15 |
System and method for source/drain contact processing
Grant 11,038,056 - Yu , et al. June 15, 2 | 2021-06-15 |
Wafer level chip scale packaging intermediate structure apparatus and method
Grant 11,037,819 - Yu , et al. June 15, 2 | 2021-06-15 |
Package Structure for Heat Dissipation
App 20210175143 - Yu; Chen-Hua ; et al. | 2021-06-10 |
Routing design of dummy metal cap and redistribution line
Grant 11,031,352 - Yu , et al. June 8, 2 | 2021-06-08 |
Semiconductor package and methods of forming the same
Grant 11,031,289 - Tu , et al. June 8, 2 | 2021-06-08 |
Package having redistribution layer structure with protective layer and method of fabricating the same
Grant 11,031,344 - Yu , et al. June 8, 2 | 2021-06-08 |
Mixing organic materials into hybrid packages
Grant 11,031,354 - Chen , et al. June 8, 2 | 2021-06-08 |
Integrated Fan-Out Package with 3D Magnetic Core Inductor
App 20210167011 - Liao; Wen-Shiang ; et al. | 2021-06-03 |
Electronics Card Including Multi-Chip Module
App 20210167051 - Yu; Chen-Hua ; et al. | 2021-06-03 |
3DIC Architecture with Interposer or Bonding Dies
App 20210167018 - Hu; Hsien-Pin ; et al. | 2021-06-03 |
Package And Method Of Forming Same
App 20210157052 - Tai; Chih-Hsuan ; et al. | 2021-05-27 |
Integrated Circuit Package And Method
App 20210159217 - Yu; Chen-Hua ; et al. | 2021-05-27 |
Semiconductor Device
App 20210159139 - Yu; Chen-Hua ; et al. | 2021-05-27 |
Semiconductor Structure
App 20210159201 - Yu; Chen-Hua ; et al. | 2021-05-27 |
Underfill control structures and method
Grant 11,018,069 - Chen , et al. May 25, 2 | 2021-05-25 |
Semiconductor structure
Grant 11,018,095 - Yu , et al. May 25, 2 | 2021-05-25 |
Dummy features in redistribution layers (RDLS) and methods of forming same
Grant 11,018,088 - Hsieh , et al. May 25, 2 | 2021-05-25 |
Integrated circuit package and method of forming same
Grant 11,018,066 - Chen , et al. May 25, 2 | 2021-05-25 |
Integrated Circuit Package and Method of Forming Same
App 20210151412 - Chen; Ming-Fa ; et al. | 2021-05-20 |
Integrated Circuit Package and Method
App 20210151408 - Yu; Chen-Hua ; et al. | 2021-05-20 |
Fingerprint sensor in InFO structure and formation method
Grant 11,010,580 - Chen , et al. May 18, 2 | 2021-05-18 |
Package structures and method of forming the same
Grant 11011464 - | 2021-05-18 |
Multi-Stack Package-on-Package Structures
App 20210143143 - Yu; Chen-Hua ; et al. | 2021-05-13 |
Semiconductor structure
Grant 11004811 - | 2021-05-11 |
Dummy dies for reducing warpage in packages
Grant 11004803 - | 2021-05-11 |
Package structure and manufacturing method thereof
Grant 11004799 - | 2021-05-11 |
3DIC formation with dies bonded to formed RDLs
Grant 11004826 - | 2021-05-11 |
Circuit carrier and manifacturing method thereof
Grant 11006532 - | 2021-05-11 |
Semiconductor Structures and Methods of Forming the Same
App 20210134730 - Yu; Chen-Hua ; et al. | 2021-05-06 |
Hybrid Integrated Circuit Package and Method
App 20210134776 - Yu; Chen-Hua ; et al. | 2021-05-06 |
Semiconductor Device
App 20210134611 - Liu; Zi-Jheng ; et al. | 2021-05-06 |
Semiconductor Device with Shield for Electromagnetic Interference
App 20210134734 - Wang; Chuei-Tang ; et al. | 2021-05-06 |
Optical Transceiver and Manufacturing Method Thereof
App 20210132310 - Yu; Chen-Hua ; et al. | 2021-05-06 |
3DIC Formation with Dies Bonded to Formed RDLs
App 20210125968 - Yu; Chen-Hua ; et al. | 2021-04-29 |
Semiconductor Package And Manufacturing Method Thereof
App 20210125960 - Huang; Shih-Ya ; et al. | 2021-04-29 |
Circuit Board And Semiconductor Device Including The Same
App 20210127500 - Wu; Jiun-Yi ; et al. | 2021-04-29 |
Semiconductor device and method
Grant 10992100 - | 2021-04-27 |
Semiconductor Device And Method Of Manufacture
App 20210118835 - Wu; Jiun Yi ; et al. | 2021-04-22 |
Integrated Circuit Package and Method
App 20210118759A1 - | 2021-04-22 |
Thermal Interface Materials, 3d Semiconductor Packages And Methods Of Manufacture
App 20210118770A1 - | 2021-04-22 |
Hybrid Dielectric Scheme in Packages
App 20210118787A1 - | 2021-04-22 |
Integrated Circuit Package and Method
App 20210118859A1 - | 2021-04-22 |
Integrated Circuit Package and Method
App 20210118858A1 - | 2021-04-22 |
Semiconductor Device And Method Of Forming The Same
App 20210118844A1 - | 2021-04-22 |
Semiconductor device and manufacturing method thereof
Grant 10978424 - | 2021-04-13 |
3D stacked-chip package
Grant 10971417 - | 2021-04-06 |
Packages with Si-substrate-free interposer and method forming same
Grant 10971443 - | 2021-04-06 |
Multi-chip structure and method of forming same
Grant 10971371 - | 2021-04-06 |
Semiconductor device having via sidewall adhesion with encapsulant
Grant 10971442 - | 2021-04-06 |
Package structure and manufacturing method thereof
Grant 10971462 - | 2021-04-06 |
Integrated devices in semiconductor packages and methods of forming same
Grant 10971460 - | 2021-04-06 |
Semiconductor packages and methods of forming the same
Grant 10971477 - | 2021-04-06 |
Semiconductor device and method of manufacture
Grant 10971446 - | 2021-04-06 |
Package Structure And Method Of Fabricating The Same
App 20210098382A1 - | 2021-04-01 |
Method of Forming RDLS and Structure Formed Thereof
App 20210098383A1 - | 2021-04-01 |
Semiconductor Device and Method
App 20210098397A1 - | 2021-04-01 |
Semiconductor Structure And Method Manufacturing The Same
App 20210098381A1 - | 2021-04-01 |
Package Structure And Method Of Fabricating The Same
App 20210098395A1 - | 2021-04-01 |
Photonic Semiconductor Device And Method Of Manufacture
App 20210096311A1 - | 2021-04-01 |
Dam For Three-dimensional Integrated Circuit
App 20210098318A1 - | 2021-04-01 |
Package Assembly And Manufacturing Method Thereof
App 20210096310A1 - | 2021-04-01 |
Integrated Circuit Package and Method
App 20210098323A1 - | 2021-04-01 |
Package Structure And Manufacturing Method Thereof
App 20210098335A1 - | 2021-04-01 |
Semiconductor Component With Cooling Structure
App 20210098336A1 - | 2021-04-01 |
Semiconductor Package and Method of Manufacture
App 20210098353A1 - | 2021-04-01 |
Die bonder and methods of using the same
Grant 10964663 - | 2021-03-30 |
Semiconductor package and manufacturing method thereof
Grant 10962711 - | 2021-03-30 |
Method of forming semiconductor packages having through package vias
Grant 10964641 - | 2021-03-30 |
Chip on package structure and method
Grant 10964666 - | 2021-03-30 |
Photonic Semiconductor Device And Method Of Manufacture
App 20210088723A1 - | 2021-03-25 |
Semiconductor Device and Method of Manufacture
App 20210082827A1 - | 2021-03-18 |
Fingerprint Sensor Device and Method
App 20210081636A1 - | 2021-03-18 |
Semiconductor Device and Method of Manufacture
App 20210082845A1 - | 2021-03-18 |
Packages with Si-substrate-free Interposer and Method Forming Same
App 20210082857A1 - | 2021-03-18 |
IPD Modules with Flexible Connection Scheme in Packaging
App 20210082888A1 - | 2021-03-18 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210082846A1 - | 2021-03-18 |
Semiconductor Devices And Methods Of Manufacturing
App 20210082871A1 - | 2021-03-18 |
System on integrated chips and methods of forming the same
Grant 10950553 - | 2021-03-16 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 10950514 - | 2021-03-16 |
Semiconductor packages with electromagnetic interference shielding layer and methods of forming the same
Grant 10950554 - | 2021-03-16 |
Package structure and method of forming the same
Grant 10950575 - | 2021-03-16 |
EMI shielding structure in InFO package
Grant 10950556 - | 2021-03-16 |
Die bonder and methods of using the same
Grant 10950572 - | 2021-03-16 |
Semiconductor Die Contact Structure and Method
App 20210074627A1 - | 2021-03-11 |
Cross-Wafer RDLs in Constructed Wafers
App 20210074553A1 - | 2021-03-11 |
Bump-on-Trace Interconnect
App 20210074673A1 - | 2021-03-11 |
Semiconductor Device and Method of Manufacture
App 20210074683A1 - | 2021-03-11 |
Structure And Formation Method For Chip Package
App 20210074684A1 - | 2021-03-11 |
Under-Bump-Metallization Structure and Redistribution Layer Design for Integrated Fan-Out Package with Integrated Passive Device
App 20210074694A1 - | 2021-03-11 |
Schemes for forming barrier layers for copper in interconnect structures
Grant 10943867 - | 2021-03-09 |
Fan-out structure and method of fabricating the same
Grant 10943798 - | 2021-03-09 |
Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same
Grant 10943873 - | 2021-03-09 |
Bonding Passive Devices on Active Device Dies to Form 3D Packages
App 20210066242A1 - | 2021-03-04 |
Die Stack Structure And Manufacturing Method Thereof
App 20210066254A1 - | 2021-03-04 |
Semicondcutor Packages
App 20210066279A1 - | 2021-03-04 |
Package structures and method of forming the same
Grant 10937718 - | 2021-03-02 |
Hybrid integrated circuit package and method
Grant 10937736 - | 2021-03-02 |
Semiconductor structure
Grant 10937721 - | 2021-03-02 |
Opening in the pad for bonding integrated passive device in InFO package
Grant 10939551 - | 2021-03-02 |
Conductive traces in semiconductor devices and methods of forming same
Grant 10937734 - | 2021-03-02 |
InFO Coil on Metal Plate with Slot
App 20210057144A1 - | 2021-02-25 |
Sensor Package and Method
App 20210057302A1 - | 2021-02-25 |
Semiconductor Package for Thermal Dissipation
App 20210057387A1 - | 2021-02-25 |
Semiconductor Package And Manufacturing Method Thereof
App 20210057346A1 - | 2021-02-25 |
Bonding Method Of Package Components And Bonding Apparatus
App 20210050251A1 - | 2021-02-18 |
Packages with Stacked Dies and Methods of Forming the Same
App 20210050332A1 - | 2021-02-18 |
Anisotropic Carrier for High Aspect Ratio Fanout
App 20210050229A1 - | 2021-02-18 |
Integrated fan-out package with 3D magnetic core inductor
Grant 10923417 - | 2021-02-16 |
Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same
Grant 10920008 - | 2021-02-16 |
Method for forming a 3D IC architecture including forming a first die on a first side of a first interconnect structure and a second die in an opening formed in a second side
Grant 10923431 - | 2021-02-16 |
Die Stacks and Methods Forming Same
App 20210043608A1 - | 2021-02-11 |
Semiconductor Device and Method of Manufacture
App 20210043581A1 - | 2021-02-11 |
Package structure and manufacturing method thereof
Grant 10914895 - | 2021-02-09 |
Electronics card including multi-chip module
Grant 10916529 - | 2021-02-09 |
Integrated Circuit Package Pad and Methods of Forming
App 20210035819A1 - | 2021-02-04 |
Warpage Control of Packages Using Embedded Core Frame
App 20210035877A1 - | 2021-02-04 |
Devices Employing Thermal And Mechanical Enhanced Layers And Methods Of Forming Same
App 20210035953A1 - | 2021-02-04 |
Semiconductor Package And Manufacturing Method Thereof
App 20210035890A1 - | 2021-02-04 |
Integrated Circuit Package and Method of Forming Same
App 20210028081A1 - | 2021-01-28 |
Integrated Circuit Packages And Methods Of Forming The Same
App 20210028145A1 - | 2021-01-28 |
Multi-Die Package Structures Including Redistribution Layers
App 20210028147A1 - | 2021-01-28 |
Package with Bridge Die For Interconnection and Method Forming Same
App 20210020574A1 - | 2021-01-21 |
Integrated Circuit Package and Method
App 20210020584A1 - | 2021-01-21 |
Chuck Design and Method for Wafer
App 20210020492A1 - | 2021-01-21 |
Semiconductor Device and Method of Manufacture
App 20210020556A1 - | 2021-01-21 |
Photonic Semiconductor Device and Method
App 20210018678A1 - | 2021-01-21 |
Bonding Through Multi-Shot Laser Reflow
App 20210013173A1 - | 2021-01-14 |
Semiconductor Structure, Package Structure, And Manufacturing Method Thereof
App 20210013140A1 - | 2021-01-14 |
Package Structure And Manufacturing Method Thereof
App 20210013151A1 - | 2021-01-14 |
Package Structure And Method Of Manufacturing The Same
App 20210013191A1 - | 2021-01-14 |
Semiconductor Package
App 20210005591A1 - | 2021-01-07 |
Apparatus, System And Method
App 20210003922A1 - | 2021-01-07 |
Semiconductor Component Having Through-silicon Vias
App 20210005515A1 - | 2021-01-07 |
Multi-Stacked Package-on-Package Structures
App 20210005556A1 - | 2021-01-07 |
Semiconductor Structures
App 20210005586A1 - | 2021-01-07 |
Multi-Stack Package-on-Package Structures
App 20210005594A1 - | 2021-01-07 |
Manufacturing method of circuit board and of semiconductor device including the same
Grant 10888000 - | 2021-01-05 |
Chip package structure
Grant 10879153 - | 2020-12-29 |
Package-on-package structure and manufacturing method thereof
Grant 10879220 - | 2020-12-29 |
Package Structure And Method Of Forming Thereof
App 20200402847A1 - | 2020-12-24 |
Integrated Circuit Package And Method Of Forming Same
App 20200402875A1 - | 2020-12-24 |
Package Structures and Methods of Forming the Same
App 20200402877A1 - | 2020-12-24 |
Package structure for heat dissipation
Grant 10872836 - | 2020-12-22 |
Semiconductor device and manufacturing method thereof
Grant 10872842 - | 2020-12-22 |
Electric magnetic shielding structure in packages
Grant 10872865 - | 2020-12-22 |
Bonding apparatus and method of bonding substrates
Grant 10872874 - | 2020-12-22 |
Integrated Circuit Package and Method
App 20200395257A1 - | 2020-12-17 |
Hybrid Integrated Circuit Package and Method
App 20200395302A1 - | 2020-12-17 |
Hybrid Integrated Circuit Package and Method
App 20200395347A1 - | 2020-12-17 |
Semiconductor Package and Methods of Forming the Same
App 20200395308A1 - | 2020-12-17 |
Package structure and method of fabricating the same
Grant 10867939 - | 2020-12-15 |
Method and structure of three-dimensional chip stacking
Grant 10867985 - | 2020-12-15 |
Hybrid integrated circuit package and method
Grant 10867982 - | 2020-12-15 |
Package structures and methods of forming the same
Grant 10867965 - | 2020-12-15 |
Semiconductor structures and methods of forming the same
Grant 10867929 - | 2020-12-15 |
Semiconductor device, circuit board structure and method of fabricating the same
Grant 10869385 - | 2020-12-15 |
Dummy metal with zigzagged edges
Grant 10867900 - | 2020-12-15 |
Semiconductor device with shield for electromagnetic interference
Grant 10867936 - | 2020-12-15 |
Package structure
Grant 10867938 - | 2020-12-15 |
Heat spreading device and method
Grant 10867885 - | 2020-12-15 |
InFO coil structure and methods of manufacturing same
Grant 10867911 - | 2020-12-15 |
Semiconductor device and method
Grant 10867874 - | 2020-12-15 |
Integrated circuit package and method
Grant 10867879 - | 2020-12-15 |
Semiconductor device
Grant 10867811 - | 2020-12-15 |
Optical transceiver and manufacturing method thereof
Grant 10866373 - | 2020-12-15 |
Device package including molding compound having non-planar top surface around a die and method of forming same
Grant 10867960 - | 2020-12-15 |
Heat spreading device and method
Grant 10867884 - | 2020-12-15 |
Apparatus for holding semiconductor wafers
Grant 10867832 - | 2020-12-15 |
Semiconductor packages and methods of manufacturing the same
Grant 10867947 - | 2020-12-15 |
Integrated circuit with a thermally conductive underfill
Grant 10867958 - | 2020-12-15 |
Semiconductor device and method
Grant 10867941 - | 2020-12-15 |
Semiconductor Structure
App 20200388584A1 - | 2020-12-10 |
Semiconductor Device and Method of Manufacture
App 20200388563A1 - | 2020-12-10 |
Lithography system and method
Grant 10859922 - | 2020-12-08 |
Semiconductor package and manufacturing method thereof
Grant 10861773 - | 2020-12-08 |
Semiconductor structure and method of forming
Grant 10861809 - | 2020-12-08 |
Integrated fan-out packages and methods of forming the same
Grant 10861814 - | 2020-12-08 |
Solution for reducing poor contact in InFO package
Grant 10861835 - | 2020-12-08 |
System Formed Through Package-In-Package Formation
App 20200381397A1 - | 2020-12-03 |
Tri-Layer CoWoS Structure
App 20200381392A1 - | 2020-12-03 |
Packages with Si-Substrate-Free Interposer and Method Forming Same
App 20200381346A1 - | 2020-12-03 |
COWOS Structures and Methods Forming Same
App 20200381391A1 - | 2020-12-03 |
Package Structure And Package-on-package Structure
App 20200381357A1 - | 2020-12-03 |
3D die stacking structure with fine pitches
Grant 10854577 - | 2020-12-01 |
Semiconductor device and method of manufacture
Grant 10854552 - | 2020-12-01 |
Fingerprint sensor device and method
Grant 10853616 - | 2020-12-01 |
Chip Package
App 20200373485A1 - | 2020-11-26 |
Bump-on-trace interconnect
Grant 10847493 - | 2020-11-24 |
Stacked chip package and methods of manufacture thereof
Grant 10840217 - | 2020-11-17 |
Semiconductor device and method of manufacture
Grant 10840218 - | 2020-11-17 |
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
Grant 10840227 - | 2020-11-17 |
Packages Formed Using RDL-Last Process
App 20200357769A1 - | 2020-11-12 |
Multi-chip fan out package and methods of forming the same
Grant 10833039 - | 2020-11-10 |
Semiconductor device and method of manufacture
Grant 10833030 - | 2020-11-10 |
Interposer Test Structures and Methods
App 20200350221A1 - | 2020-11-05 |
Wireless Charging Devices Having Wireless Charging Coils and Methods of Manufacture Thereof
App 20200350782A1 - | 2020-11-05 |
Stacked coil for wireless charging structure on InFO package
Grant 10825602 - | 2020-11-03 |
Cross-wafer RDLs in constructed wafers
Grant 10825696 - | 2020-11-03 |
Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the same
Grant 10825773 - | 2020-11-03 |
Semiconductor Packages and Methods of Forming Same
App 20200343224A1 - | 2020-10-29 |
Semiconductor Package and Method of Forming the Same
App 20200343193A1 - | 2020-10-29 |
Planarizing RDLS in RDL-First Processes Through CMP Process
App 20200343170A1 - | 2020-10-29 |
Wireless Charging Package with Chip Integrated in Coil Center
App 20200343181A1 - | 2020-10-29 |
Semiconductor device and method of manufacture
Grant 10818607 - | 2020-10-27 |
Die stacks and methods forming same
Grant 10818640 - | 2020-10-27 |
Semiconductor package for thermal dissipation
Grant 10811389 - | 2020-10-20 |
Package structure and method of manufacturing the same
Grant 10811404 - | 2020-10-20 |
Devices employing thermal and mechanical enhanced layers and methods of forming same
Grant 10811394 - | 2020-10-20 |
Fingerprint Sensor Pixel Array and Methods of Forming Same
App 20200327214A1 - | 2020-10-15 |
Method of Manufacturing Semiconductor Device that Uses Bonding Layer to Join Semiconductor Substrates Together
App 20200328200A1 - | 2020-10-15 |
Fan-Out Interconnect Structure and Method for Forming Same
App 20200328169A1 - | 2020-10-15 |
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