U.S. patent number 5,615,158 [Application Number 08/559,195] was granted by the patent office on 1997-03-25 for sense amplifier circuit for detecting degradation of digit lines and method thereof.
This patent grant is currently assigned to Micron Technology, Inc.. Invention is credited to Daniel R. Loughmiller, Roland Ochoa.
United States Patent |
5,615,158 |
Ochoa , et al. |
March 25, 1997 |
Sense amplifier circuit for detecting degradation of digit lines
and method thereof
Abstract
To permit effective testing of a sense amplifier circuit, the
sense amplifier is designed to be responsive to data stored in a
selected memory cell in a controlled test mode. The sense amplifier
circuit includes a pull-down circuit having delay circuit to
receive and respond to a control signal which indicates whether the
sensing circuit is to operate in test mode or normal mode. The
sense amplifier circuit also includes an output circuit which is
configured and arranged to generate a reference signal
corresponding to the data stored in a selected memory cell. To
permit sufficient time to test the circuit for correct data values
at the output signal, the reference signal is delayed in response
to the control signal indicating that the sensing circuit is to
operate in test mode.
Inventors: |
Ochoa; Roland (Boise, ID),
Loughmiller; Daniel R. (Boise, ID) |
Assignee: |
Micron Technology, Inc. (Boise,
ID)
|
Family
ID: |
24232672 |
Appl.
No.: |
08/559,195 |
Filed: |
November 13, 1995 |
Current U.S.
Class: |
365/201; 327/52;
327/57; 365/189.07; 365/190; 365/194; 365/196; 365/200; 365/205;
365/208 |
Current CPC
Class: |
G11C
7/065 (20130101); G11C 29/02 (20130101); G11C
29/026 (20130101); G11C 29/38 (20130101); G11C
29/50 (20130101); G11C 11/401 (20130101) |
Current International
Class: |
G11C
7/06 (20060101); G11C 29/02 (20060101); G11C
29/38 (20060101); G11C 29/50 (20060101); G11C
29/04 (20060101); G11C 029/00 () |
Field of
Search: |
;365/205,208,201,190,194,196,189.07,200 ;327/51,52,57 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Nelms; David C.
Assistant Examiner: Tran; Andrew Q.
Attorney, Agent or Firm: Schwegman, Lundberg, Woessner &
Kluth, P.A.
Claims
What is claimed is:
1. A sense amplifier circuit responsive to data stored in a
selected memory cell, the sense amplifier circuit comprising:
an amplifier responsive to a signal representing the data stored in
the selected memory cell; and
a pull-down circuit, coupled to said amplifier, having
a delay circuit responsive to a control signal indicating whether
the sense amplifier circuit is to operate in a test mode or a
normal mode,
an output circuit configured and arranged to generate a pull-down
reference signal corresponding to the data stored in the selected
memory cell, the pull-down reference signal delayed in response to
the control signal indicating that the sense amplifier circuit is
to operate in the test mode.
2. A sense amplifier circuit, according to claim 1, wherein the
delay circuit further includes a drive circuit which is
de-activated in response to the control signal.
3. A sense amplifier circuit, according to claim 2, wherein the
drive circuit includes a transistor configured and controlled to
provide a selected level of drive to the pull-down reference
signal.
4. A sense amplifier circuit, according to claim 2, wherein the
delay circuit, in response to the control signal, provides an
expected time delay in a transition of the pull-down reference
signal.
5. A sense amplifier circuit, according to claim 3, wherein the
delay circuit, in response to the control signal, provides an
expected time delay in a transition of the pull-down reference
signal.
6. A sense amplifier circuit, according to claim 1, wherein the
signal representing the data stored in the selected memory cell is
provided on a pair of digit lines.
7. A sense amplifier circuit, according to claim 1, wherein the
delay circuit includes a transistor circuit configured and
controlled to provide a drive to the pull-down reference signal in
the test mode, and configured and controlled to substantially
reduce said drive to the pull-down reference signal in the normal
mode.
8. A sense amplifier circuit, according to claim 1, wherein the
output circuit is further configured and arranged to respond to a
second control signal indicating that the sense amplifier circuit
is enabled to generate the pull-down reference signal.
9. A sense amplifier circuit, according to claim 1, wherein the
signal representing the data stored in the selected memory cell is
provided on a pair of digit lines, and the pull-down reference
signal is used as a reference signal for the sense amplifier
circuit.
10. A semiconductor memory device including the sense amplifier
circuit of claim 1, the semiconductor memory device comprising:
a memory array including a multitude of memory cells;
a control circuit configured and arranged to access selected ones
of the memory cells;
an output buffer presenting an output signal corresponding to data
stored in the selected memory cell; and
the sense amplifier circuit configured and arranged between the
memory array and the output buffer.
11. A semiconductor memory device, according to claim 10, wherein
the control circuit is configured and arranged to generate the
control signal.
12. A method for testing the semiconductor memory device of claim
10, the method comprising:
generating the control signal; sensing the data stored in the
selected memory cell;
comparing the data present at the output buffer to a predetermined
data; and
in response to the step of comparing, determining whether or not
the semiconductor memory device is faulty.
13. A method, according to claim 12, further including the step of
repairing the semiconductor memory device in response to the step
of determining that the semiconductor memory device is faulty.
14. A method, according to claim 13, wherein the step of repairing
the semiconductor memory device further includes replacing faulty
circuitry with redundant circuitry.
15. A semiconductor memory device, comprising:
a memory array including a multitude of memory cells;
a control circuit configured and arranged to access selected ones
of the memory cells;
an output buffer presenting an output signal corresponding to data
stored in a selected memory cell;
a sensing circuit, coupled between the memory array and the output
buffer, and having a pull-down circuit including
a first input port receiving a memory signal representing data
stored in the selected memory cell,
a second input port receiving an output command signal commanding
the data in the selected memory cell to be coupled to the output
buffer,
a third input port receiving a control signal indicating whether
the sensing circuit is to operate in test mode or normal mode,
a reference port generating a reference signal corresponding to the
memory signal; and
the sensing circuit configured and arranged to delay the change in
the reference signal in response to the control signal indicating
that the sensing circuit is to operate in test mode.
16. A semiconductor memory device, according to claim 15, wherein
the first input port feeds first and second transistors receiving a
pair of differential memory input signals representing the data in
the selected memory cell.
17. A semiconductor memory device, according to claim 16, wherein
the sensing circuit includes a first circuit path including the
first transistor and a second circuit path including the second
transistor.
18. A semiconductor memory device, according to claim 17, wherein
each of the first and second circuit paths is coupled to a drive
circuit configured and arranged to add a drive to the reference
signal in response to the control signal indicating that the
sensing circuit is to operate in test mode.
19. A semiconductor memory device, according to claim 15, further
including a test pad configured and arranged to receive the control
signal.
Description
FIELD OF THE INVENTION
The present invention relates generally to semiconductor devices,
such as memory chips. More particularly, the present invention
relates to memory chips having sense amplifiers which are
susceptible to producing faulty output signals.
BACKGROUND OF THE INVENTION
An increasing number of electronic equipment and electronic-based
systems require some form of high-speed memory devices for storing
and retrieving information (or "data"). While the types of such
memory devices vary widely, semiconductor memory devices are most
commonly used in memory applications requiring implementation in a
relatively small area. Within this class of semiconductor memory
devices, the DRAM (Dynamic Random Access Memory) is one of the more
commonly used types.
The DRAM has memory arrays consisting of a number of intersecting
row and column lines of individual transistors or memory cells.
Typically, a microcomputer circuit selects (or activates)
particular row and column lines to access selected memory cells.
"Access" typically refers to reading data from or writing data to
selected memory cells. Reading data from the memory cells involves
the use of a sense amplifier to detect whether the voltage level
stored in the memory cell represents a binary one or a binary
zero.
Conventionally, a DRAM contains one sense amplifier for a
designated group (row or column) of memory cells. The sense
amplifier senses the voltage level in the selected memory cell of
the memory cell group via a pair of digit lines. If the voltage
level stored in the memory cell represents a binary zero, one of
the digit lines will increase in level and the other digit line
will decrease in level. If the voltage level stored in the selected
memory cell corresponds to a binary one, a change in the opposite
direction occurs. Through this complementary operation, the sense
amplifier yields a single output signal which is coupled through an
output buffer to an output pin of the DRAM device.
In connection with the present invention, it has been discovered
that the output signal from the sense amplifier is often defective,
or bordering on being defective, due to one or more circuit
problems in the path between the memory cell and the output pad
controlled by the output buffer. For example, laboratory testing
has shown that such defects are caused by an imbalance in the
sections of the sense amplifier which couple to the digit lines,
excessive resistivity in a node or metal contact, or a defect in a
poly layer.
Detecting such defects before the DRAM circuit is encapsulated as
part of the final product is important, because the only remedy to
such a problem when it is detected after packaging is the disposal
of the device. By detecting such defects before packaging, spare
(or redundant) memory cells and/or sense amplifiers can be used to
replace the defective circuits, for example, using conventional
laser fusing equipment.
Accordingly, there is a need for an improved method and circuit
arrangement that overcomes the above-mentioned deficiencies and
increases the yield of memory devices during the manufacturing
process. The present invention provides a solution to these and
other problems, offering advantages over conventional
implementations.
SUMMARY OF THE INVENTION
In an exemplary embodiment of the present invention, a sense
amplifier circuit is responsive to data stored in a selected memory
cell in a controlled test mode. The sense amplifier circuit
includes pull-down circuit having a delay circuit receiving and
responding to a control signal which indicates whether the sensing
circuit is to operate in test mode or normal mode. The sense
amplifier circuit also includes an output circuit which is
configured and arranged to generate a pull-down reference signal
corresponding to the data stored in a selected memory cell. To
permit effective testing of the circuit in the test mode, the
output signal is delayed in response to the control signal
indicating that the sensing circuit is to operate in test mode.
In another exemplary embodiment, the present invention provides a
semiconductor memory device, such as a DRAM, including the
above-described sensing circuit. The semiconductor memory device
includes: a memory array including a multitude of memory cells; a
control circuit configured and arranged to access selected ones of
the memory cells; an output buffer presenting an output signal
corresponding to data stored in a selected memory cell; and the
sensing circuit configured and arranged between the memory array
and the output buffer.
In yet another embodiment, the present invention provides a method
for testing the above-described semiconductor memory device. The
method includes: generating the control signal; providing an
electronic probe to measure a power-related parameter of the output
signal; using the electronic probe to measure the output signal in
response the control signal being generated; comparing the
power-related parameter to a criterion; and, in response to the
step of comparing, determining whether or not the semiconductor
memory device is acceptable. Redundant circuitry can be used to
replace the failed circuitry before completing the packaging of the
semiconductor device.
The above summary of the present invention is not intended to
present each embodiment or every aspect of the present invention.
This is the purpose of the figures and the associated description
which follow.
BRIEF DESCRIPTION OF THE DRAWINGS
Other aspects and advantages of the present invention may become
apparent upon reading the following detailed description and upon
reference to the drawings in which:
FIGS. 1A and 1B illustrate a DRAM device from a perspective view
(FIG. 1A) and in the form of a block diagram (FIG. 1B), both
exemplifying a semiconductor DRAM device implemented in accordance
with the principles of the present invention;
FIG. 2 illustrates an expanded block diagram of the sense amplifier
of FIG. 1;
FIG. 3A illustrates the sense amplifier of FIG. 2 with additional
detail directed to a pull-down circuit for a sense amplifier in
accordance with the principles of the present invention;
FIG. 3B illustrates a timing diagram corresponding to the operation
of the circuit shown in FIG. 3A when it is operating in normal
conditions; and
FIG. 3C illustrates a timing diagram for the circuit of FIG. 3A
corresponding to a test mode operation.
While the invention is susceptible to various modifications and
alterative forms, specifics thereof have been shown by way of
example in the drawings and will be described in detail. It should
be understood, however, that the intention is not to limit the
invention to the particular embodiment described. On the contrary,
the intention is to cover all modifications, equivalents, and
alternatives falling within the spirit and scope of the invention
as defined by the appended claims.
DETAILED DESCRIPTION OF THE DRAWINGS
Turning now to the drawings, FIG. 1A illustrates a semiconductor
DRAM device after it is constructed, tested and packaged for
shipment. FIG. 1B illustrates a block diagram of the DRAM device of
FIG. 1A. The block diagram exemplifies an embodiment constructed
for proper testing of the DRAM device in accordance with the
principles of the present invention.
In FIG. 1B, a conventional power supply 8 provides power signals,
such as Vcc, to power a memory array 10 and related memory access
circuits. The memory array 10 consists of a number of individual
memory cells or transistors organized in rows and columns. Each
memory cell can hold one of two states, corresponding to binary
zero and binary one. For a data access (read or write) operation to
be performed upon a particular memory cell within the array, a
read/write control circuit 12 provides the row address of the cell
to a row decoder 16 and the column address of the cell to a column
decoder 14. Data in/out buffers 18 are used provide an interface
for the data between the selected memory cell and external data
(input/output) ports (not shown), which are coupled to the buffers
18. Sense amplifiers 20, which are directed by the read/write
control circuit 12, are used to convert the information provided by
the selected memory cell to the appropriate voltage level for the
data in/out buffer 18. Control over the timing and direction of
data flow is provided by the read/write control circuit 12. As
described further below, redundant memory cell groups 10A and
redundant sense amplifier circuits 20A are used during the
manufacturing process as replacement circuitry in the event that
the semiconductor DRAM device is tested and determined to be
defective is these circuit areas.
Apart from the certain aspects of the sense amplifiers, which are
discussed below in connection with FIGS. 3A and 3B, each of the
above circuit types is well known in the art. Reference may be
made, for example, to U.S. Pat. No. 5,335,202, which issued on Aug.
2, 1994, and U.S. Pat. No. 5,042,011, which issued on Aug. 20,
1991.
As illustrated in FIG. 2, each sense amplifier 20 of FIG. 1B can be
viewed as sensing and amplifying a pair of complementary digit
lines, D and D*, using a central circuit 32 and a pull-down circuit
34. The read/write control 12 generates a control signal ("WORD")
to select a memory cell 38, and generates an enable signal
("ENABLE") to permit the sense amplifier to bias the digit lines
for coupling to the output buffer contained within data in/out
buffer 18 of FIG. 1B. The signals D and D*, when no memory cell is
selected, are equal and set by the voltage of an internal
reference. Once a memory cell is selected, however, a slight
voltage difference is created between D and D* signals which
represent the polarity (binary one or binary zero) of the data
stored in the selected memory cell 38. The slight voltage
difference results from the charge stored on capacitor 38A being
transferred to one of the digit lines D or D*. Thus, when there is
a charge on the capacitor 38A, the voltage at D is raised to a
level slightly higher than the voltage at D*; conversely, when
there is no charge on the capacitor 38A, the voltage at D is
reduced to a level slightly lower than the voltage at D*.
As mentioned, the sense amplifier senses and amplifies the slight
voltage difference in D and D* through interaction of the central
circuit 32 and the pull-down circuit 34. The purpose of the
pull-down circuit 34, discussed in detail below, is to provide a
reference voltage at node 36 which corresponds to the lower of the
two voltages at signals D and D*. This causes only one of the two
central circuit transistors 32A and 32B to activate and amplify the
difference between the digit lines.
For example, when there is a slight charge in the capacitor 38A of
selected memory cell 38, the voltage on D is expected to be
slightly higher than the voltage on D*. At this time, which is
prior to enablement of the pull-down circuit, the voltage at node
36 is high. When enabled, the pull-down circuit 34 causes the
reference voltage at node 36 to be pulled to ground. This, in turn,
causes transistor 32A to remain in the nonconducting state and
transistor 32B to conduct, thereby pulling the voltage at D* to
ground. When the voltage at node 36 drops, this does not activate
transistor 32A because the voltage drop also occurs at D*, which is
the input to the gate of transistor 32A. Because substrate ground
is typically substantially below the lower of the two voltages at
signals D and D*, the consequential action of the sense amplifier
20 is to amplify the difference in voltage level between the
complementary digit lines D and D*.
Conversely, when there is no charge in the capacitor 38A of
selected memory cell 38, the voltage on D is expected to be
slightly lower than the voltage on D*.
Because the voltage difference between the digit lines D and D* is
often so slight, testing the circuitry leading from the memory cell
is important. This is especially true in low voltage applications
where even slight imperfections in the manufacturing process can
result in erroneously sensed data. To accommodate this concern, the
sense amplifier shown in FIG. 2 is specially designed to respond to
a test control signal (TEST), which permits such testing of
circuitry in the path between the memory cell and output
buffer.
Turning now to FIG. 3A, the pull-down circuitry 34 of FIG. 2 is
shown in detail. The pulldown enable signal (ENABLE) is shown
controlling the gate of a transistor 54 and, via a tri-state buffer
gate 56, the gate of transistor 60.
Unlike prior art pull-down circuits, the pull-down circuit 34 of
FIG. 3A provides for an easily-implemented test circuit. This test
circuit, which can be used to test many, if not all, aspects of the
memory cell path, includes a test buffer enable control signal
(TEST) enabling the output of buffer 56. During the test mode, this
buffer enable signal is forced low to maintain transistor 60 in its
non-conducting state. The output of buffer 56 provides an enable
output signal to control the transistor 60.
The timing diagrams of FIGS. 3B and 3C illustrate the operation of
the circuitry and control signals for both the normal mode and the
test mode. In each of FIGS. 3B and 3C, the timing diagram includes
three timing lines. These timing lines respectively correspond to
the enable signal, the buffer enable signal and the signal at node
36.
Referring first to FIG. 3B, which illustrates the timing diagram
for operating in the normal mode, the enable and buffer enable
control signals control the transistors 54 and 60 to activate
substantially simultaneously in response to the ENABLE signal going
high. This forces the transistors 54 and 60 to conduct, thereby
causing the logic high level voltage at node 36 to be pulled
rapidly to ground. The timing diagram at the bottom of FIG. 3B
illustrates the rapid discharging of the voltage level at the node
36. The rate of the discharge is determined in part by the
intrinsic capacitance at the node 36, the initial capacitance
provided by the transistors 54 and 60 in their non-conducting
states, and the resistance provided by the transistors 54 and 60
once they are in their conducting states. Except for the presence
of the buffer enable signal, this timing diagram is
conventional.
In FIG. 3C, a timing diagram for these same signals is shown for
the test mode. The difference between the diagrams of FIGS. 3B and
3C is reflected in the bottom two timing lines, corresponding to
the buffer enable signal and the signal at node 36. By maintaining
the buffer enable signal at a logic high level for the entire
timing cycle when the signal at node 36 transits to a logic high
level, only transistor 54 conducts. The transistor 60 remains
non-conducting, thereby substantially reducing the drive at the
node 36. This causes the logic high level voltage at node 36 to be
pulled relatively slowly to substrate ground.
The timing line at the bottom of FIG. 3C illustrates this slow
discharge of the voltage level at the node 36. By sizing the
transistors 54 and 60 relative to one another, the discharge rate
can be optimized.
Further, because an increased discharge time of the signal at the
node 36 is known to detect faulty memory cell paths, any slight
imperfection in the cell path or imbalance in the sense amplifier
is readily detected by an incorrect sensing of the stored data via
the data present at the data out buffer 18. Corrective action
includes replacing the memory cell using a redundant row or column
of memory cells, and retesting, as described above, before
packaging (encapsulating) the circuitry.
The foregoing description, which has been disclosed by way of the
above examples and discussion, addresses embodiments of the present
invention encompassing the principles of the present invention. The
embodiments may be changed, modified and/or implemented using
various circuit types and arrangements. Those skilled in the art
will readily recognize that these and various other modifications
and changes may be made to the present invention without strictly
following the exemplary embodiments and applications illustrated
and described herein, and without departing from the true spirit
and scope of the present invention which is set forth in the
following claims.
* * * * *