U.S. patent application number 16/842075 was filed with the patent office on 2021-10-07 for multi-level isolation structure.
The applicant listed for this patent is GLOBALFOUNDRIES U.S. Inc.. Invention is credited to Gregory Costrini, Sipeng Gu, Lixia Lei, Shesh Mani Pandey, Haiting Wang.
Application Number | 20210313321 16/842075 |
Document ID | / |
Family ID | 1000004786051 |
Filed Date | 2021-10-07 |
United States Patent
Application |
20210313321 |
Kind Code |
A1 |
Wang; Haiting ; et
al. |
October 7, 2021 |
MULTI-LEVEL ISOLATION STRUCTURE
Abstract
One illustrative device disclosed herein includes at least one
fin structure and an isolation structure comprising a stepped upper
surface comprising a first region and a second region. The first
region has a first upper surface and the second region has a second
upper surface, wherein the first upper surface is positioned at a
first level and the second upper surface is positioned at a second
level and wherein the first level is below the second level. In
this illustrative example, the device also includes a gate
structure comprising a first portion and a second portion, wherein
the first portion of the gate structure is positioned above the
first upper surface of the isolation structure and above the at
least one fin structure and wherein the second portion of the gate
structure is positioned above the second upper surface of the
isolation structure.
Inventors: |
Wang; Haiting; (Clifton
Park, NY) ; Gu; Sipeng; (Clifton Park, NY) ;
Pandey; Shesh Mani; (Saratoga Springs, NY) ; Lei;
Lixia; (Clifton Park, NY) ; Costrini; Gregory;
(Flanders, NJ) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
GLOBALFOUNDRIES U.S. Inc. |
Santa Clara |
CA |
US |
|
|
Family ID: |
1000004786051 |
Appl. No.: |
16/842075 |
Filed: |
April 7, 2020 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 29/0649 20130101;
H01L 27/0924 20130101; H01L 21/823481 20130101; H01L 29/785
20130101; H01L 21/823431 20130101; H01L 27/0886 20130101 |
International
Class: |
H01L 27/088 20060101
H01L027/088; H01L 29/06 20060101 H01L029/06; H01L 29/78 20060101
H01L029/78; H01L 27/092 20060101 H01L027/092; H01L 21/8234 20060101
H01L021/8234 |
Claims
1. A device, comprising: at least one fin structure; an isolation
structure having a stepped upper surface comprising a first region
comprising a first upper surface and a second region comprising a
second upper surface, wherein the first upper surface of the
isolation structure is positioned at a first level and the second
upper surface of the isolation structure is positioned at a second
level, wherein the first level is below the second level; a gate
structure comprising a first portion and a second portion, wherein
the first portion of the gate structure is positioned above the
first upper surface of the isolation structure and above the at
least one fin structure and wherein the second portion of the gate
structure is positioned above the second upper surface of the
isolation structure; and first and second source/drain
metallization structures positioned on opposite sides of the gate
structure, wherein each of the first and second source/drain
metallization structures comprises a first portion and a second
portion, wherein the first portion of the source/drain
metallization structure is positioned above the first upper surface
of the layer of insulating material and a second portion of the
source/drain metallization structure is positioned above the second
upper surface of the layer of insulating material.
2. The device of claim 1, wherein the at least one fin structure
comprises a plurality of fin structures and wherein the first upper
surface of the isolation structure is positioned adjacent the
plurality of fin structures and between adjacent fins in the
plurality of fin structures.
3. The device of claim 1, wherein the at least one fin structure
comprises an upper surface that is substantially coplanar with the
second upper surface of the isolation structure.
4. The device of claim 1, wherein the at least one fin structure
comprises an upper surface and wherein the second upper surface of
the layer of insulating material is positioned at a level that is
below a level of the upper surface of the at least one fin
structure.
5. (canceled)
6. The device of claim 1, wherein a height difference between the
first level and the second level falls within a range of about
30-50 nm.
7. The device of claim 1, wherein the isolation structure is a
single layer of silicon dioxide and wherein the stepped upper
surface is formed in the single layer of silicon dioxide.
8. A device, comprising: at least one fin structure; an isolation
structure comprising an upper surface having a first region and a
second region, wherein an upper surface of the first region of the
isolation structure is positioned at a first level and an upper
surface of the second region of the isolation structure is
positioned at a second level, wherein the first level is below the
second level; a gate structure comprising a first portion and a
second portion, wherein the first portion of the gate structure is
positioned above the first region of the isolation structure and
above the at least one fin structure and wherein the second portion
of the gate structure is positioned above the second portion of the
isolation structure; and first and second source/drain
metallization structures positioned on opposite sides of the gate
structure, wherein each of the first and second source/drain
metallization structures comprises a first portion and a second
portion, wherein the first portion of the source/drain
metallization structure is positioned above the first region of the
isolation structure and a second portion of the source/drain
metallization structure is positioned above the second portion of
the isolation structure.
9. The device of claim 8, wherein each of the plurality of fin
structures comprise an upper surface that is substantially coplanar
with the upper surface of the second region of the isolation
structure.
10. The device of claim 8, wherein each of the plurality of fin
structures comprises an upper surface and wherein the upper surface
of the second region of the isolation structure is positioned at a
level that is below a level of the upper surface of at least one of
the plurality of fin structures.
11. The device of claim 8, wherein a height difference between the
first level and the second level falls within a range of about
30-50 nm.
12. The device of claim 8, wherein the upper surface of the
isolation structure is an upper surface of a single layer of
insulating material.
13. An IC product, comprising: a first transistor comprising at
least one first fin structure; a second transistor comprising at
least one second fin structure; an isolation structure comprising
an upper surface having a first region, a second region and a third
region that is positioned between the first region and the second
region, wherein the first region of the isolation structure is
positioned adjacent the at least one first fin structure and the
second region of the isolation structure is positioned adjacent the
at least one second fin structure and, wherein an upper surface of
the first and second regions of the isolation structure are
positioned at a first level and an upper surface of the third
region of the isolation structure is positioned at a second level,
wherein the first level is below the second level; a shared gate
structure comprising a first portion, a second portion and a third
portion, wherein the second portion is positioned between the first
portion and the third portion, and wherein the first portion of the
shared gate structure is positioned above the first region of the
isolation structure and above the at least one first fin structure,
the third portion of the shared gate structure is positioned above
the second region of the isolation structure and above the at least
one second fin structure and the third portion of the shared gate
structure is positioned above the second portion of the isolation
structure; and first and second source/drain metallization
structures positioned on opposite sides of the shared gate
structure, wherein each of the first and second source/drain
metallization structures comprises a first portion, a second
portion and a third portion, wherein the second portion is
positioned between the first portion and the third portion, and
wherein the first portion of the source/drain metallization
structure is positioned above the first region of the isolation
structure, the third portion of the source/drain metallization
structure is positioned above the second region of the isolation
structure and the third portion of the source/drain metallization
structure is positioned above the second portion of the isolation
structure.
14. The product of claim 13, wherein: the at least one first fin
structure comprises a plurality of first fin structures and wherein
the first region of the isolation structure is further positioned
between adjacent fins in the plurality of first fin structures; and
the at least one second fin structure comprises a plurality of
second fin structures and wherein the second region of the
isolation structure is further positioned between adjacent fins in
the plurality of second fin structures.
15. The product of claim 13, wherein the at least one first fin
structure comprises a first upper surface and the at least one
second fin structure comprises a second upper surface, wherein the
first upper surface and the second upper surface are substantially
coplanar with the upper surface of the second region of the
isolation structure.
16. The product of claim 13, wherein the at least one first fin
structure comprises a first upper surface and the at least one
second fin structure comprises a second upper surface, wherein the
upper surface of the second region of the isolation structure is
positioned at a level that is below a level of the first upper
surface and the second upper surface.
17. (canceled)
18. The product of claim 13, wherein a height difference between
the first level and the second level falls within a range of about
30-50 nm.
19. The product of claim 13, wherein the isolation structure
comprises silicon dioxide, the gate structure comprises a high-k
gate insulation layer, a metal work-function adjusting layer and a
bulk conductive material layer.
20. The product of claim 13, wherein the upper surface of the
isolation structure is an upper surface of a single layer of
insulating material.
Description
BACKGROUND
Field of the Invention
[0001] The present disclosure generally relates to various novel
embodiments of a multi-level isolation structure for integrated
circuit products and various novel methods of making such
multi-level isolation structures.
Description of the Related Art
[0002] In modern integrated circuits, such as microprocessors,
storage devices and the like, a very large number of circuit
elements, especially transistors, are provided on a restricted chip
area. Transistors come in a variety of shapes and forms, e.g.,
planar transistors, FinFET transistors, nanowire devices, etc. The
transistors are typically either NFET or PFET type devices wherein
the "N" and "P" designation is based upon the type of dopants used
to create the source/drain regions of the devices.
[0003] The various transistor devices that are formed for an IC
product must be electrically isolated from one another to properly
function in an electrical circuit. Typically, in the case of FinFET
devices, forming such an isolation structure involves depositing an
insulating material, such as silicon dioxide, such that it
overfills the spaces between the fins. Thereafter, a CMP process is
typically performed to planarize the upper surface of the
insulating material. At that point, a recess etching process is
performed to remove a portion of the vertical thickness of the
insulating material. This recess etching process exposes the
desired final fin height of the fins for the devices. This recess
etching process also results in an isolation structure that has a
substantially planar upper surface.
[0004] The present disclosure is generally directed to various
novel embodiments of a multi-level isolation structure for
integrated circuit products and various novel methods of making
such multi-level isolation structures.
SUMMARY
[0005] The following presents a simplified summary of the invention
in order to provide a basic understanding of some aspects of the
invention. This summary is not an exhaustive overview of the
invention. It is not intended to identify key or critical elements
of the invention or to delineate the scope of the invention. Its
sole purpose is to present some concepts in a simplified form as a
prelude to the more detailed description that is discussed
later.
[0006] The present disclosure is directed to various novel
embodiments of a multi-level isolation structure for integrated
circuit products and various novel methods of making such
multi-level isolation structures. One illustrative device disclosed
herein includes at least one fin structure and an isolation
structure comprising a stepped upper surface comprising a first
region and a second region. The first region has a first upper
surface and the second region has a second upper surface, wherein
the first upper surface of the isolation structure is positioned at
a first level and the second upper surface of the isolation
structure is positioned at a second level and wherein the first
level is below the second level. In this illustrative example, the
device also includes a gate structure comprising a first portion
and a second portion, wherein the first portion of the gate
structure is positioned above the first upper surface of the
isolation structure and above the at least one fin structure and
wherein the second portion of the gate structure is positioned
above the second upper surface of the isolation structure.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] The disclosure may be understood by reference to the
following description taken in conjunction with the accompanying
drawings, in which like reference numerals identify like elements,
and in which:
[0008] FIGS. 1-21 depict various novel embodiments of a multi-level
isolation structure for integrated circuit products and various
novel methods of making such multi-level isolation structures. The
drawings are not to scale.
[0009] While the subject matter disclosed herein is susceptible to
various modifications and alternative forms, specific embodiments
thereof have been shown by way of example in the drawings and are
herein described in detail. It should be understood, however, that
the description herein of specific embodiments is not intended to
limit the invention to the particular forms disclosed, but on the
contrary, the intention is to cover all modifications, equivalents,
and alternatives falling within the spirit and scope of the
invention as defined by the appended claims.
DETAILED DESCRIPTION
[0010] Various illustrative embodiments of the invention are
described below. In the interest of clarity, not all features of an
actual implementation are described in this specification. It will
of course be appreciated that in the development of any such actual
embodiment, numerous implementation-specific decisions must be made
to achieve the developers' specific goals, such as compliance with
system-related and business-related constraints, which will vary
from one implementation to another. Moreover, it will be
appreciated that such a development effort might be complex and
time-consuming but would nevertheless be a routine undertaking for
those of ordinary skill in the art having the benefit of this
disclosure.
[0011] The present subject matter will now be described with
reference to the attached figures. Various structures, systems and
devices are schematically depicted in the drawings for purposes of
explanation only and so as to not obscure the present disclosure
with details that are well known to those skilled in the art.
Nevertheless, the attached drawings are included to describe and
explain illustrative examples of the present disclosure. The words
and phrases used herein should be understood and interpreted to
have a meaning consistent with the understanding of those words and
phrases by those skilled in the relevant art. No special definition
of a term or phrase, i.e., a definition that is different from the
ordinary and customary meaning as understood by those skilled in
the art, is intended to be implied by consistent usage of the term
or phrase herein. To the extent that a term or phrase is intended
to have a special meaning, i.e., a meaning other than that
understood by skilled artisans, such a special definition will be
expressly set forth in the specification in a definitional manner
that directly and unequivocally provides the special definition for
the term or phrase. As will be readily apparent to those skilled in
the art upon a complete reading of the present application, the
presently disclosed method may be applicable to a variety of
products, including, but not limited to, logic products, memory
products, etc., and the transistor devices disclosed herein may be
NFET or PFET devices. The various components, structures and layers
of material depicted herein may be formed using a variety of
different materials and by performing a variety of known process
operations, e.g., chemical vapor deposition (CVD), atomic layer
deposition (ALD), a thermal growth process, spin-coating
techniques, masking, etching, etc. The thicknesses of these various
layers of material may also vary depending upon the particular
application. With reference to the attached figures, various
illustrative embodiments of the methods and devices disclosed
herein will now be described in more detail.
[0012] FIGS. 1-21 depict various novel embodiments of a multi-level
isolation structure for integrated circuit products and various
novel methods of making such multi-level isolation structures. FIG.
1 is a simplistic plan view of the IC product 100 at a relatively
early stage of fabrication. In the example depicted herein, when
completed, the IC product 100 will comprise a first transistor
device 101A and a second transistor device 101B (collectively
referenced using the numeral 101). In one illustrative example, the
first transistor device 101A may be an N-type FinFET device while
the second transistor device 101B may be a P-type FinFET device, or
vice-versa. As will be appreciated by those skilled in the art
after a complete reading of the present application, both of the
devices 101 could also be the same type, both of the devices 101
could be P-type devices. Moreover, the methods and multi-level
isolation structures disclosed herein can be employed to improve
the performance of a single transistor device.
[0013] FIG. 1 also depicts a plurality of fins 104A-D (collectively
referenced using the numeral 104) that were formed in a
semiconductor substrate 102 (see FIG. 2). The first transistor
device 101A comprises the fins 104A-B, while the second transistor
device 101B comprises the fins 104C-D. Of course, in practice, the
devices 101 may comprise one or more fins 104, and the first
transistor device 101A and the second transistor device 101B need
not have the same number of fins 104, but that may be the case in
some applications.
[0014] Various cross-sectional views ("X-X" and "Y-Y") of the IC
product 100 that are depicted in some of the attached drawings are
taken where indicated in FIG. 1. The cross-sectional view X-X is
taken in the gate width direction of the devices 101, while the
view Y-Y is a cross-sectional view taken along the long axis (i.e.,
the axial length) of the fin 104B.
[0015] With reference to FIG. 2, in the examples depicted herein,
the IC product 100 will be formed above a semiconductor substrate
102. The substrate 102 may have a variety of configurations, such
as a simple bulk configuration, as depicted herein or a
semiconductor-on-insulator (SOI) configuration that includes a base
semiconductor layer, a buried insulation layer positioned on the
base semiconductor layer and an active semiconductor layer
positioned above the buried insulation layer, wherein the
transistor devices 101 are formed in and above the active
semiconductor layer. The substrate 102 may be made of silicon or it
may be made of semiconductor materials other than silicon. Thus,
the terms "substrate" or "semiconductor substrate" should be
understood to cover all semiconductor materials and all forms of
such materials.
[0016] FIGS. 1-3 depict the IC product 100 after several process
operations were performed. More specifically, the fins 104 were
formed in the substrate 102 using traditional manufacturing
techniques. For example, a patterned fin-formation etch mask (not
shown--comprised of, for example, a layer of silicon dioxide and a
layer of silicon nitride) was formed above the substrate 102.
Thereafter, one or more etching processes, e.g., anisotropic
etching processes, were performed through the patterned
fin-formation etch mask to form a plurality of fin-formation
trenches 103 in the substrate 102 and thereby define the plurality
of fins 104 each having an upper surface 104X. The overall size,
shape and configuration of the fin-formation trenches 103 and fins
104 may vary depending on the particular application. In the
examples depicted herein, the fins 104 will be depicted as have a
simplistic rectangular cross-sectional configuration having a
substantially uniform thickness throughout the height of the fin
104. In a real-world device, the fins 104 may have a tapered
cross-sectional configuration, wherein the width of the upper
surface 104X of the fin 104 (i.e., the top critical dimension) is
less than the width of the bottom of the fin 104.
[0017] Next, a layer of insulating material 106 was formed so as to
over-fill the trenches 103 between the fins 104. That is, the layer
of insulating material 106 was initially formed such that its upper
surface was positioned above the upper surface of the patterned
fin-formation etch mask. Thereafter, one or more planarization
processes (e.g., a CMP and/or etch-back process) was performed to
remove portions of the layer of insulating material 106 and the
patterned fin-formation etch mask. These processes result in the
layer of insulating material 106 having a planarized upper surface
106X and in the exposure of the upper surface 104X of the fins 104.
The layer of insulating material 106 may be comprised of, for
example, silicon dioxide.
[0018] FIGS. 4 and 5 depict the IC product 100 after a layer of
material 110 was formed above the substrate 102. The layer of
material 110 may be comprised of, for example, silicon nitride, and
it may be formed to any desired thickness.
[0019] FIGS. 6 and 7 depict the IC product 100 after several
process operations were performed. First, a patterned etch mask
(not shown) was formed above the layer of material 110. In one
illustrative example, the patterned etch mask may be a patterned
layer of photoresist or OPL. Thereafter, an etching process was
performed to remove exposed portions of the layer of material 110.
These operations result in the formation of a plurality of
substantially rectangular shaped openings 110A (when viewed from
above) in the patterned layer of material 110.
[0020] FIGS. 8 and 9 depict the IC product 100 after several
process operations were performed. First, a layer of insulating
material 112 was formed so as to over-fill the openings 110A in the
patterned layer of material 110. Thereafter, one or more
planarization processes (e.g., a CMP and/or etch-back process) was
performed to remove portions of the layer of insulating material
112 positioned above the upper surface of the patterned layer of
material 110. These processes result in portions of the layer of
insulating material 112 being positioned in the openings 110A in
the patterned layer of material 110. The layer of insulating
material 112 may be comprised of any of a variety of different
oxide materials, e.g., an HDP oxide, etc.
[0021] FIGS. 10 and 11 are cross-sectional views that depict the IC
product 100 after an etching process was performed to remove the
patterned layer of material 110 selectively relative to the
surrounding materials. FIG. 12 is a plan view of the IC product 100
showing the remaining islands of the layer of insulating material
112 after the patterned layer of material 110 was removed. Note
that the upper surface 112X of the islands of the layer of
insulating material 112 is positioned at a level that is above the
level of the upper surface 106X of the insulating material 106.
[0022] FIG. 13 (cross-sectional view), FIG. 14 (cross-sectional
view) and FIG. 15 (plan view) depict the IC product 100 after a
timed, anisotropic recess etching process was performed to remove
some of the thickness of the exposed portions of the layer of
insulating material 106 and to remove substantially all of the
islands of the layer of insulating material 112. The recess etching
process was performed for a sufficient duration such that the layer
of insulating material 106 in the area adjacent and between the
fins 104 has a recessed upper surface 106S that is positioned at a
desired height level within the trenches 103. The amount of
recessing of the layer of insulating material 106 may vary
depending upon the particular application. This recess etching
process exposes the desired final fin height of the fins 104 for
the devices 101. Also note that, due to the presence of the islands
of the layer of insulating material 112, the portions of the layer
of insulating material 106 positioned under the islands of the
layer of insulating material 112 may not be etched at all, or to a
much less extent than the exposed portions of the layer of
insulating material 106 positioned adjacent and between the fins
104.
[0023] This process operation results in the formation of a
multi-level isolation structure 128 that has a non-planar upper
surface, i.e., there is a step height in the upper surface of the
overall isolation structure 128. In the depicted example, the
elevated regions 120 of the insulating material 106 have an upper
surface 120S that is positioned at a level that is above the level
of the recessed surface 106S of the insulating material 106
positioned between and adjacent the fins 104. The differences in
these height levels, i.e., the step height, may vary depending upon
the particular application, e.g., 30-50 nm. In one illustrative
embodiment, the upper surface 120S of the elevated regions 120 of
insulating material may be positioned at a level that is
substantially coplanar with the upper surface 104X of the fins 104.
In other situations, the upper surface 120S of the elevated regions
120 of insulating material may be positioned at a level that is
below or above the upper surface 104X of the fins 104 by an amount
that may vary depending upon the particular application, e.g.,
about 10 nm above or about 10 nm below the upper surface 104X of
the fins 104. In the illustrative example wherein the upper surface
120S of the elevated regions 120 of the insulating material are
positioned above the upper surface 104X of the fins 104, a portion
of the layer of material 112 will be part of the elevated regions
120 of the insulating material. In other applications, the
isolation structure 128 is a single layer of material, e.g.,
silicon dioxide, wherein the stepped upper surface is formed in the
single layer of silicon dioxide.
[0024] In some applications, the regions of insulating material 120
may be islands of such material. In one illustrative embodiment,
the elevated island regions 120 of insulating material may be
positioned between the fins 104 of the two adjacent transistor
devices 101. With reference to FIG. 16, if desired, the process
flow could be modified such that substantially rectangular shaped
openings 120Y are formed in the regions 120 of elevated insulating
material, with the fins 104 being positioned within the
substantially rectangular shaped openings 120Y. Irrespective of the
form or shape of the elevated regions 120 of the insulating
material, the magnitude of the lateral spacing between the elevated
regions 120 of insulating material and the sidewall of the nearest
fin 104 may vary depending upon the particular application.
[0025] FIG. 17 depicts the IC product 100 after an illustrative
gate structure 130 and source/drain metallization structures 132
have been formed for the devices by performing known manufacturing
operations. As indicated in FIG. 17, FIG. 18 is a cross-sectional
view taken through the gate structure 130 in a direction
corresponding to the gate width direction of the devices 101, while
FIG. 19 is a cross-sectional view taken through one of the
source/drain metallization structures 132 in a direction
corresponding to the gate width direction of the devices 101. As
will be appreciated by those skilled in the art, other structures
or components of the completed devices 100 are not depicted in one
or more of FIGS. 17-19, e.g., gate cap structures, sidewall
spacers, epitaxial material that may be formed in the source/drain
regions of the devices 101, etc.
[0026] With reference to FIG. 18, and as will be appreciated by
those skilled in the art after a complete reading of the present
application, the gate structure 130 of the transistor devices 101
disclosed herein may be manufactured using known gate-first or
replacement gate manufacturing techniques, and the materials of
construction for the gate structure 130 may vary depending upon the
particular application. In one illustrative example, the gate
structure 130 may comprise a high-k gate insulation layer 140, such
as hafnium oxide, a material having a dielectric constant greater
than 10, etc., one or more conductive work-function adjusting metal
layers 142, e.g., titanium, tantalum, titanium nitride, tantalum
nitride, titanium carbide, etc., as well as one or more bulk
conductive layers of material 144, e.g., titanium, tungsten,
aluminum, etc. The thickness of the layers of material 140, 142 and
144 may vary depending upon the particular application. In other
situations, the gate structure 130 may comprise a gate insulation
layer 140 made of silicon dioxide and the bulk conductive layer of
material 144 may comprise polysilicon.
[0027] FIG. 19 depicts the IC product 100 after several process
operations were performed. First, epitaxial semiconductor material
146 was formed on the portions of the fins 104 in the source/drain
regions of the devices. Thereafter, various known process
operations were performed to form the illustrative conductive
source/drain metallization structures 132 (e.g., trench silicide
structures) that are conductively coupled to the epi semiconductor
material 146 in the source/drain regions of the transistor devices.
In the depicted example, the conductive source/drain metallization
structures 132 extend across substantially the entire active region
of the devices 101 in the gate width (GW) direction of the devices
101. In one illustrative embodiment, the conductive source/drain
metallization structures 132 may comprise a variety of different
conductive materials, e.g., tungsten, cobalt, aluminum, a metal, a
metal compound, cobalt silicide, nickel silicide, titanium
silicide, nickel platinum silicide, etc.
[0028] Simulations have shown that the multi-level isolation
structure 128 disclosed herein can reduce capacitance (Csg (F)) of
the devices 101 as reflected in Table I below, wherein the
step-height of the isolation structure is the difference in height
between the upper surface 106S of the insulating material 106
positioned between the fins 104 and the upper surface 120S of the
elevated regions 120 of the insulating material.
TABLE-US-00001 TABLE I Structure Step-Height (nm) Csg (F) Isolation
Structure 1 0 (control) 8.9167e-17 Isolation Structure 2 36
8.9605e-17 Isolation Structure 3 65 8.3956e-17
As reflected in the above Table 1, isolation structure 1--with zero
step-height--was used to compare the impact of the formation of the
multi-level isolation structure 128 disclosed herein (isolation
structures 2 and 3) in terms of reducing the parasitic capacitance
of the devices 101. As will be appreciated by those skilled in the
art after a complete reading of the present application, the
above-referenced decreases in the parasitic capacitance of the
devices 101 using the multi-level isolation structure 128 disclosed
herein can be useful in improving the performance characteristics
of the devices 101.
[0029] In the example depicted above, the gate structure 130 was
shared by both of the transistor devices 101. However, as will be
appreciated by those skilled in the art after a complete reading of
the present application, the novel multi-level isolation structure
128 disclosed herein can be used on single transistor devices as
well. FIGS. 20 and 21 show an embodiment where separate transistor
devices 101A, 101B with separate gate structures 130A, 130B and
separate conductive source/drain metallization structures 132A,
132B are formed above the novel multi-level isolation structure 128
disclosed herein. As shown in FIG. 20, a sidewall spacer 150, e.g.,
silicon nitride, was formed on each of the gate structures 130A,
130B and an insulating material 152, e.g., silicon dioxide, was
formed between the spacers 150. As shown in FIG. 21, the conductive
source/drain metallization structures 132A, 132B were formed in
openings formed in the insulating material 152.
[0030] With reference to the single device 101A shown in FIG. 20,
one illustrative IC product disclosed herein comprises at least one
fin structure, e.g., one of the fin structures 104A, 104B, an
isolation structure 128 comprising a single layer of insulating
material, the layer of insulating material 106 having a stepped
upper surface comprising a first upper surface 106S and a second
upper surface 120S, wherein the first upper surface 106S is
positioned at a first level and the second upper surface 120S is
positioned at a second level, wherein the first level is below the
second level. The product also includes a gate structure 130A
comprising a first portion and a second portion, wherein the first
portion of the gate structure 130A is positioned above the first
upper surface 106S of the layer of insulating material 106 and
above the at least one fin structure, e.g., one of the fin
structures 104A, 104B, and the second portion of the gate structure
is positioned above the second upper surface 120S of the layer of
insulating material 106, i.e., one or both of the end portions of
the gate structure 130A is positioned above regions 120 of elevated
insulating material 106.
[0031] With reference to the single device 101A shown in FIG. 20,
another illustrative IC product disclosed herein comprises at least
one fin structure, e.g., one of the fin structures 104A, 104B, an
isolation structure 128 comprising a first region of insulating
material positioned adjacent the at least one fin structure, i.e.,
the portion of the insulation material 106 with a recessed upper
surface 106S and a second region of insulating material, i.e., the
elevated regions 120 of the insulating material that are positioned
adjacent the first region of insulating material. In this example,
the upper surface 106S of the first region of the isolation
structure 128 is positioned at a first level and the upper surface
120S of the second region of the isolation structure 128 is
positioned at a second level, wherein the first level is below the
second level. Additionally, the gate structure 130A comprises a
first portion and a second portion, wherein the first portion of
the gate structure 130A is positioned above the first region of the
isolation structure and above the at least one fin structure, e.g.,
one of the fin structures 104A, 104B, and wherein the second
portion of the gate structure 130A is positioned above the second
portion of the isolation structure 128, i.e., one or both of the
end portions of the gate structure 130 is positioned above elevated
regions 120 of insulating material.
[0032] With reference to the two devices 101 shown in FIG. 18,
another illustrative IC product disclosed herein comprises a first
transistor 101A comprising at least one first fin structure, e.g.,
one of the fin structures 104A, 104B, and a second transistor
comprising at least one second fin structure, e.g., one of the fin
structures 104C, 104D. The IC product also includes an isolation
structure 128 comprising an upper surface having a first region, a
second region and a third region that is positioned between the
first region and the second region, wherein the first region of the
isolation structure 128 is positioned adjacent the at least one
first fin structure and the second region of the isolation
structure 128 is positioned adjacent the at least one second fin
structure. In this example, the upper surface 106S of the first and
second regions of the isolation structure 128 are positioned at a
first level and an upper surface 120S of the third region of the
isolation structure 128 is positioned at a second level, wherein
the first level is below the second level. This embodiment of the
IC product 100 also includes a shared gate structure 130 comprising
a first portion, a second portion and a third portion, wherein the
second portion is positioned between the first portion and the
third portion. The first portion of the shared gate structure 130
is positioned above the first region of the isolation structure 128
and above the at least one first fin structure, e.g., one of the
fin structures 104A, 104B, the third portion of the shared gate
structure 130 is positioned above the second region of the
isolation structure 128 and above the at least one second fin
structure, e.g., one of the fin structures 104C, 104D, and the
third portion of the shared gate structure 130 is positioned above
the second portion of the isolation structure 128.
[0033] The particular embodiments disclosed above are illustrative
only, as the invention may be modified and practiced in different
but equivalent manners apparent to those skilled in the art having
the benefit of the teachings herein. For example, the process steps
set forth above may be performed in a different order. Furthermore,
no limitations are intended to the details of construction or
design herein shown, other than as described in the claims below.
It is there-fore evident that the particular embodiments disclosed
above may be altered or modified and all such variations are
considered within the scope and spirit of the invention. Note that
the use of terms, such as "first," "second," "third" or "fourth" to
describe various processes or structures in this specification and
in the attached claims is only used as a shorthand reference to
such steps/structures and does not necessarily imply that such
steps/structures are performed/formed in that ordered sequence. Of
course, depending upon the exact claim language, an ordered
sequence of such processes may or may not be required. Accordingly,
the protection sought herein is as set forth in the claims
below.
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