U.S. patent application number 16/989974 was filed with the patent office on 2020-11-26 for fingerprint sensor package and display apparatus including the same.
This patent application is currently assigned to Samsung Electronics Co., Ltd.. The applicant listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Jeong-Kyu HA, Sungeun JO, WOONBAE KIM, Ji-Yong PARK, Jikho SONG.
Application Number | 20200372232 16/989974 |
Document ID | / |
Family ID | 1000005006930 |
Filed Date | 2020-11-26 |
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United States Patent
Application |
20200372232 |
Kind Code |
A1 |
KIM; WOONBAE ; et
al. |
November 26, 2020 |
FINGERPRINT SENSOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE
SAME
Abstract
Disclosed are fingerprint sensor packages and display
apparatuses including the same. The fingerprint sensor package
comprises a flexible film having a top surface and a bottom surface
opposite to the top surface, a fingerprint sensor surrounded by a
cap, and a display driver integrated circuit on the flexible film.
The fingerprint sensor and the display driver integrated circuit
are mounted on the top surface of the flexible film.
Inventors: |
KIM; WOONBAE; (Seoul,
KR) ; SONG; Jikho; (Seoul, KR) ; JO;
Sungeun; (Incheon, KR) ; PARK; Ji-Yong;
(Hwaseong-si, KR) ; HA; Jeong-Kyu; (Hwaseong-si,
KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Electronics Co., Ltd. |
Suwon-si |
|
KR |
|
|
Assignee: |
Samsung Electronics Co.,
Ltd.
Suwon-si
KR
|
Family ID: |
1000005006930 |
Appl. No.: |
16/989974 |
Filed: |
August 11, 2020 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
16027620 |
Jul 5, 2018 |
10776601 |
|
|
16989974 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G09G 2380/02 20130101;
G09G 3/3208 20130101; G06K 9/0004 20130101; G06K 9/0002
20130101 |
International
Class: |
G06K 9/00 20060101
G06K009/00; G09G 3/3208 20060101 G09G003/3208 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 11, 2018 |
KR |
10-2018-0003774 |
Claims
1.-40. (canceled)
41. A fingerprint sensor package, comprising: a flexible film
having a top surface and a bottom surface opposite to the top
surface; a fingerprint sensor on the flexible film; and a display
driver integrated circuit, wherein a portion of the display driver
integrated circuit is mounted on a first end of the flexible film,
and wherein the flexible film is partially folded at a portion
adjacent to the first end of the flexible film.
42. The package of claim 41, wherein the fingerprint sensor and the
display driver integrated circuit are mounted on the top surface of
the flexible film.
43. The package of claim 41, wherein the display driver integrated
circuit is wire-bonded to the flexible film.
44. The package of claim 41, further comprising: a main board
electrically connected to the fingerprint sensor.
45. The package of claim 41, further comprising: wherein the
fingerprint sensor comprises an image sensor having a plurality of
micro-lenses.
46. The package of claim 41, further comprising: wherein the
fingerprint sensor comprises pin holes and a plurality of
micro-lenses.
47. The package of claim 41, further comprising: a cap overlying
the fingerprint sensor; an infrared cut filter on the cap; and an
adhesive layer between the cap and the infrared cut filter.
48. The package of claim 41, further comprising: a stiffener on the
bottom surface of the flexible film, wherein the stiffener overlaps
the fingerprint sensor provided on the top surface of the flexible
film.
49. A display apparatus, comprising: an organic light emitting
diode (OLED) display panel; and a fingerprint sensor package below
the OLED display panel, wherein the fingerprint sensor package
comprises: a flexible film electrically connected to the OLED
display panel, the flexible film having a top surface facing the
OLED display panel and a bottom surface opposite to the top
surface; a fingerprint sensor mounted on the flexible film; a
display driver integrated circuit configured to drive the OLED
display panel; and a semiconductor memory device on the top surface
of the flexible film, wherein a portion of the display driver
integrated circuit is mounted on a first end of the flexible film,
and wherein the flexible film is partially folded at a portion
adjacent to the first end of the flexible film.
50. The apparatus of claim 49, wherein the fingerprint sensor and
the display driver integrated circuit are mounted on the top
surface of the flexible film.
51. The apparatus of claim 49, wherein the OLED display panel
comprises an organic layer in which a plurality of red-colored
light emitting layers, a plurality of green-colored light emitting
layers, and a plurality of blue-colored light emitting layers are
arrayed.
52. The apparatus of claim 49, further comprising: an active device
and a passive device that are provided on the top surface of the
flexible film, wherein the active device comprises a semiconductor
memory device, and wherein the passive device comprises one or more
of a capacitor, a resistor, and an inductor.
53. The apparatus of claim 49, wherein the display driver
integrated circuit is flip-chip bonded to the flexible film.
54. The apparatus of claim 49, further comprising: wherein the
fingerprint sensor comprises an image sensor having a plurality of
micro-lenses.
55. The apparatus of claim 49, further comprising: wherein the
fingerprint sensor comprises pin holes and a plurality of
micro-lenses.
56. The apparatus of claim 49, further comprising: a cap overlying
the fingerprint sensor; an infrared cut filter on the cap; and an
adhesive layer between the cap and the infrared cut filter.
57. The apparatus of claim 49, further comprising: a stiffener on
the bottom surface of the flexible film, wherein the stiffener
overlaps the fingerprint sensor provided on the top surface of the
flexible film.
58. A display apparatus, comprising: a display panel; and a
fingerprint sensor package below the display panel, wherein the
fingerprint sensor package comprises: a flexible film; a
fingerprint sensor; a display driver integrated circuit configured
to drive the display panel; and active and passive devices, wherein
the flexible film comprises a top surface facing the display panel
and a bottom surface opposite to the top surface, wherein a portion
of the display driver integrated circuit is mounted on a first end
of the flexible film, wherein the flexible film is partially folded
at a portion adjacent to the first end of the flexible film, and
wherein the active and passive devices are provided on the top
surface of the flexible film.
59. The apparatus of claim 58, wherein the fingerprint sensor and
the display driver integrated circuit are mounted on the top
surface of the flexible film.
60. The apparatus of claim 58, further comprising: a cap overlying
the fingerprint sensor, wherein the cap has an L-shaped
cross-section that surrounds a lateral surface of the fingerprint
sensor and partially covers a top surface of the fingerprint
sensor.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This U.S. nonprovisional application is a continuation of
U.S. patent application Ser. No. 16/027,620, filed Jul. 5, 2018, in
the U.S. Patent and Trademark Office, which claims the benefit of
priority under 35 U.S.C. .sctn. 119 to Korean Patent Application
No. 10-2018-0003774, filed on Jan. 11, 2018, in the Korean
Intellectual Property Office, the entire contents of both of which
are hereby incorporated by reference.
BACKGROUND
[0002] The disclosed concepts relate to a sensor package and a
display apparatus including the same, and more particularly, to a
fingerprint sensor package and a display apparatus including the
same.
[0003] A fingerprint sensor is a recognition sensor for human
fingerprints, and widely used on door locks, mobile phones, and the
like. The fingerprint sensor can be broadly categorized into
optical-type, capacitive-type, and ultrasonic-type sensors,
depending on an operating principle thereof. To be suitable for
mobile devices, such as cellular phones, fingerprint sensor
packages are compact and thin.
SUMMARY
[0004] Some embodiments provide a fingerprint sensor package that
is reduced in size and thickness and a display apparatus including
the same.
[0005] Some embodiments provide a fingerprint sensor package that
is reduced in number of components and a display apparatus
including the same.
[0006] According the exemplary embodiments, the disclosure is
directed to a fingerprint sensor package, comprising: a flexible
film having a top surface and a bottom surface opposite to the top
surface; a fingerprint sensor; and a display driver integrated
circuit on the flexible film, wherein the fingerprint sensor and
the display driver integrated circuit are mounted on the top
surface of the flexible film.
[0007] According the exemplary embodiments, the disclosure is
directed to a display apparatus, comprising: a display panel; and a
fingerprint sensor package below the display panel, wherein the
fingerprint sensor package comprises: a flexible film; a
fingerprint sensor; a display driver integrated circuit configured
to drive the display panel; and active and passive devices, wherein
the flexible film comprises a top surface facing the display panel
and a bottom surface opposite to the top surface, and wherein the
fingerprint sensor, the display driver integrated circuit, and the
active and passive devices are provided on the top surface of the
flexible film.
[0008] According the exemplary embodiments, the disclosure is
directed to a display apparatus, comprising: an organic light
emitting diode (OLED) display panel; and a fingerprint sensor
package below the OLED display panel, wherein the fingerprint
sensor package comprises: a flexible film electrically connected to
the OLED display panel, the flexible film having a top surface
facing the OLED display panel and a bottom surface opposite to the
top surface; a fingerprint sensor on the top surface of the
flexible film; a display driver integrated circuit on the top
surface of the flexible film and configured to drive the OLED
display panel; a semiconductor memory device on the top surface of
the flexible film; and a passive device on the top surface of the
flexible film.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1A illustrates a cross-sectional view showing a display
apparatus including a fingerprint sensor package, according to
exemplary embodiments.
[0010] FIG. 1B illustrates a cross-sectional view showing a
fingerprint recognition operation of a fingerprint sensor package,
according to exemplary embodiments.
[0011] FIG. 2A illustrates a cross-sectional view showing a display
apparatus including a fingerprint sensor package, according to
exemplary embodiments.
[0012] FIG. 2B illustrates a cross-sectional view showing a
fingerprint recognition operation of a fingerprint sensor package,
according to exemplary embodiments.
[0013] FIG. 2C illustrates a cross-sectional view showing a display
apparatus including a fingerprint sensor package, according to
exemplary embodiments.
[0014] FIG. 3 illustrates a perspective view showing an application
example of a display apparatus including a fingerprint sensor
package, according to exemplary embodiments.
DETAILED DESCRIPTION
[0015] A fingerprint sensor package and a display apparatus
including the same according to exemplary embodiments will be
discussed hereinafter in detail with reference to the accompanying
drawings.
[0016] FIG. 1A illustrates a cross-sectional view showing a display
apparatus including a fingerprint sensor package, according to
exemplary embodiments.
[0017] Referring to FIG. 1A, a display apparatus 1 may include a
display panel 120 and a fingerprint sensor package 100 electrically
connected to the display panel 120. The fingerprint sensor package
100 may be provided below the display panel 120. For example, the
fingerprint sensor package 100 may be electrically connected to a
top surface 120a of the display panel 120, and extend to a region
below the display panel 120. The display panel 120 may be or may
include an organic light emitting diode (OLED) type display panel.
For example, the display panel 120 may include an organic layer 122
in which arranged are a plurality of red-colored light emitting
layers 122a, a plurality of green-colored light emitting layers
122b, and a plurality of blue-colored light emitting layers 122c.
The organic layer 122 may give off or emit auto-luminescent light
that is discharged upward from a top surface 120a of the display
panel 120. The display apparatus 1 may further include a main board
130 electrically connected to the fingerprint sensor package
100.
[0018] The fingerprint sensor package 100 may include a flexible
film 101 consisting of a polymeric material such as polyimide, a
fingerprint sensor 105 to recognize fingerprints, and a display
driver integrated circuit (e.g., formed as a semiconductor chip)
(DDI) 103 to drive the display panel 120. The fingerprint sensor
package 100 may further include a semiconductor memory device (e.g.
chip) 111 storing data required to operate the display panel 120, a
passive device 109 such as capacitor, resistor, and inductor, an
infrared cut filter 113 provided above the fingerprint sensor 105,
and a stiffener 115 provided below the fingerprint sensor 105.
[0019] The fingerprint sensor 105 may be wire-bonded to the
flexible film 101, and the semiconductor memory device 111 and the
DDI 103 may be flip-chip bonded to the flexible film 101.
Alternatively, the fingerprint sensor 105 may be flip-chip bonded
to the flexible film 101, and the semiconductor memory device 111
and the DDI 103 may be wire-bonded to the flexible film 101.
Dissimilarly, the fingerprint sensor 105, the semiconductor memory
device 111, and the DDI 103 may all be either wire-bonded or
flip-chip bonded to the flexible film 101.
[0020] The fingerprint sensor 105 may include an image sensor
(e.g., as CMOS image sensor semiconductor device or chip) having a
plurality of micro-lenses 105a. The fingerprint sensor 105 may be
surrounded by a cap 107 having an opening 107a that is opened
between the fingerprint sensor 105 and the display panel 120. The
opening 107a may have a rectangular, circular, or polygonal shape
in a plan view. The cap 107 may have an L-shaped cross-section that
surrounds a lateral surface of the fingerprint sensor 105 and
partially covers a top surface of the fingerprint sensor 105,
thereby providing a protective cover for side and top surfaces of
the fingerprint sensor 105. The opening 107a may expose the
micro-lenses 105a of the fingerprint sensor 105. The cap 107 may
include a metallic material (e.g., stainless steel) or a relatively
stiff insulating material (e.g., polymer).
[0021] The infrared cut filter 113 may be provided between the
fingerprint sensor 105 and the display panel 120, while vertically
overlapping the fingerprint sensor 105. The infrared cut filter 113
may be rigidly adhered onto a bottom surface 120b of the display
panel 120. An adhesive layer 116 may be provided between the cap
107 and the infrared cut filter 113.
[0022] The fingerprint sensor 105, the DDI 103, the semiconductor
memory device 111, and one or more passive devices 109 (e.g.,
capacitors, resistors, and inductors) may be mounted on a top
surface 101a of the flexible film 101. Although not shown in
figures, the flexible film 101 may include therein electrical
wiring lines that consist of metal such as copper. Some or all of
the fingerprint sensor 105, the DDI 103, the semiconductor memory
device 111, and the passive device 109 may be electrically
connected with one another through the electrical wiring lines
within the flexible film 101. In addition, the electrical wiring
lines may electrically connect a first end of the flexible film 101
to the display panel 120 and also electrically connect a second end
of the flexible film 101, which is opposite to the first end, to
the main board 130. The display panel 120 and the main board 130
may include electrical wiring lines coupled to the electrical
wiring lines of the flexible film 101. For example, the flexible
film may include conductive patterns formed thereon (not shown),
including bonding pads to connect to the devices formed thereon
(e.g., the fingerprint sensor 105, the semiconductor memory device
111, the DDI 103 and passive devices 109, etc.) and the electrical
wiring extending between bonding pads to interconnect these
devices. For example, the electrical wiring may interconnect the
DDI 103 to the main board 130 to provide image data (e.g., a
plurality of pixel data values) from the main board 130 to the DDI
103. Also, the electrical wiring may interconnect the DDI 103 to
the display panel 120 to provide driving signals from DDI 103 to
the display panel 120 to drive the display of the display panel 120
(e.g., switch pixels of the display according to the pixel data
received from the main board 130).
[0023] The stiffener 115 may be provided on a bottom surface 101b
of the flexible film 101, while vertically overlapping the
fingerprint sensor 105. For example, the stiffener 115 may be
provided below the fingerprint sensor 105 to provide support for
the fingerprint sensor 105. The stiffener 115 may include a
metallic material such as stainless steel or a stiff insulating
material. The stiffener 115 may rigidly support the flexible film
101 when the fingerprint sensor 105 is wire-bonded to the flexible
film 101. The flexible film 101 may be configured such that the top
surface 101a faces the display panel 120 and the bottom surface
101b is opposite to the top surface 110a and faces away from the
display panel 120.
[0024] In some embodiments, the flexible film 101 may be packaged
with active devices (e.g., the fingerprint sensor 105, the DDI 103,
and the semiconductor memory device 111) and with the passive
devices 109 (e.g., capacitors, resistors, and inductors). For
example, a separate FPCB (flexible print circuit board) may not be
required to mount thereon the fingerprint sensor 105, the
semiconductor memory device 111, and the passive devices 109. The
active devices 103, 105, and 111 and the passive devices 109 may be
mounted on the flexible film 101 in a reel-to-reel manner.
[0025] As discussed above, the flexible film 101 may be mounted
thereon not only with the DDI 103, but also with all of the passive
devices 109 and the active devices, such as the fingerprint sensor
105 and the semiconductor memory device 111. The fingerprint sensor
package 100 and the display apparatus 1 including the same may then
achieve a decrease in the number of components, improvement in the
degree of design freedom, reduction in cost, thinness and
compactness in size, and simplification in supply chain management
of components.
[0026] FIG. 1B illustrates a cross-sectional view showing a
fingerprint recognition operation of a fingerprint sensor package,
according to exemplary embodiments.
[0027] Referring to FIG. 1B, a fingerprint cognition target 140,
such as human fingerprint, may be provided on the top surface 120a
of the display panel 120. When the target 140 is provided on the
top surface 120a of the display panel 120, a light (represented by
solid arrows) emitted from the organic layer 122 toward the target
140 may be reflected on the target 140 and then travel toward the
fingerprint sensor 105. The light reflected on the target 140 may
be filtered through the infrared cut filter 113 and then detected
on the fingerprint sensor 105 after passing through the opening
107a. For example, the fingerprint sensor 105 may selectively
detect infrared-filtered visible light of the light emitted from
the organic layer 122 and reflect on the target 140. The
fingerprint sensor package 100 may accordingly perform fingerprint
recognition based on the selectively detected infrared-filtered
visible light.
[0028] FIG. 2A illustrates a cross-sectional view showing a display
apparatus including a fingerprint sensor package, according to
exemplary embodiments. FIG. 2B illustrates a cross-sectional view
showing a fingerprint recognition operation of a fingerprint sensor
package according to exemplary embodiments. FIG. 2C illustrates a
cross-sectional view showing a display apparatus including a
fingerprint sensor package, according to exemplary embodiments. In
the embodiments that follow, explanations repetitive to those
discussed above with reference to FIGS. 1A and 1B will be omitted
or abridged in the interest of brevity of description.
[0029] Referring to FIG. 2A, a display apparatus 2 may include a
display panel 120 such as an organic light emitting diode (OLED)
type display panel and a fingerprint sensor package 100 including a
flexible film 101 electrically connected to the display panel 120.
The flexible film 101 may have a top surface 101a mounted thereon
with active devices such as a fingerprint sensor 105, a display
driver integrated circuit (DDI) 103, and a semiconductor memory
device 111 and with one or more passive devices 109 (e.g.,
capacitors, resistors, and inductors). The flexible film 101 may
have a bottom surface 101b on which a stiffener 115 is
provided.
[0030] In some embodiments, the fingerprint sensor 105 may include
no micro-lenses 105a of FIG. 1A. A cap 107 surrounding the
fingerprint sensor 105 may have a plurality of pin holes 107b that
are opened between the fingerprint sensor 105 and the display panel
120. The pin holes 107b may be regularly or irregularly arranged to
have a rectangular, circular, or polygonal shape in a plan view.
Alternatively, as illustrated in FIG. 2C, the fingerprint sensor
105 may further include both pin holes 107b and a plurality of
micro-lenses 105a.
[0031] Referring to FIG. 2B, when a target 140 is provided on a top
surface 120a of the display panel 120, a light emitted from an
organic layer 122 may be reflected on the target 140. Some of the
reflected light may pass through the pin hole 107b (represented by
the solid arrow), and others of the reflected light may not pass
through the pin hole 107b (represented by the dotted arrow). The
fingerprint sensor 105 may receive the light (represented by the
solid arrow) passing through the pin hole 107b, thereby performing
fingerprint recognition based on the light passing through the pin
hole 107b. The principle of the fingerprint recognition may hold
true for the display apparatus 2 of FIG. 2A. The principle of the
fingerprint recognition may be identically or similarly applicable
to the display apparatus 2 of FIG. 2C.
[0032] FIG. 3 illustrates a perspective view showing an application
example of a display apparatus including a fingerprint sensor
package according to exemplary embodiments.
[0033] Referring to FIG. 3, any of the display apparatuses 1 and 2
may be adopted as a component for a handheld or mobile electronic
device, such as, for example, mobile phone 1000. For example, the
mobile phone 1000 may include a full front display 1100 with no or
minimal bezel. The full front display 1100 may include the display
apparatus 1 of FIG. 1A or the display apparatus 2 of FIG. 2A or
2C.
[0034] When a fingerprint 145 is provided on the full front display
1100, the fingerprint sensor package 100 of FIG. 1A, 2A, or 2C may
detect the fingerprint 145. The fingerprint sensor package 100 may
be selectively disposed on a specific area of the full front
display 1100 or dispersedly disposed on the whole area of the full
front display 1100. The fingerprint sensor package 100 or the
display apparatuses 1 and 2 may also be used for other electronic
devices such as tablet computers, laptop computers, game devices,
automotive electronic devices, and wearable devices.
[0035] According to certain disclosed embodiments, the flexible
film is mounted thereon not only with the fingerprint sensor, but
also with active and passive devices required for the display
apparatus, and thus the fingerprint sensor package may have an
effect on achieving thinness and compactness in size.
[0036] Furthermore, since the fingerprint sensor package does not
need a flexible printed circuit board, the fingerprint sensor
package and the display apparatus including the same may achieve a
decrease in the number of components, improvement in the degree of
design freedom, reduction in cost, thinness and compactness in
size, and simplification in supply chain management of
components.
[0037] This detailed description should not be construed as limited
to the embodiments set forth herein, and it is intended that
inventive concepts cover the various combinations, the
modifications and variations of this invention without departing
from the spirit and scope of inventive concepts. The appended
claims should be construed to include other embodiments.
* * * * *