HA; Jeong-Kyu

Patent Applications and Registrations

Patent applications and USPTO patent grants for HA; Jeong-Kyu.The latest application filed is for "semiconductor device".

Company Profile

2.29.36

HA; Jeong-Kyu - Hwaseong-si KR
Ha; Jeong-Kyu - Gyeonggi-do KR
Ha; Jeong-kyu - Yongin-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device App 20220165652 - HAN; Sang-Uk ; et al.	2022-05-26
Semiconductor Package App 20220068771 - KIM; MINKI ; et al.	2022-03-03
Fingerprint Sensor Package And Display Apparatus Including The Same App 20200372232 - KIM; WOONBAE ; et al.	2020-11-26
Fingerprint sensor package and display apparatus including the same Grant 10,776,601 - Kim , et al. Sept	2020-09-15
Semiconductor package and semiconductor module including the same Grant 10,504,829 - Ha Dec	2019-12-10
Fingerprint Sensor Package And Display Apparatus Including The Same App 20190213373 - KIM; Woonbae ; et al.	2019-07-11
Semiconductor Package And Semiconductor Module Including The Same App 20190189551 - HA; JEONG-KYU	2019-06-20
Film product, film packages and package modules using the same Grant 10,304,764 - Chung , et al.	2019-05-28
Sensing module substrate and sensing module including the same Grant 10,282,587 - Choi , et al.	2019-05-07
Chip-on-film semiconductor packages and display apparatus including the same Grant 10,134,667 - Kim , et al. November 20, 2	2018-11-20
Chip-on-film Semiconductor Packages And Display Apparatus Including The Same App 20180247882 - Kim; Jung-woo ; et al.	2018-08-30
Chip-on-film semiconductor packages and display apparatus including the same Grant 9,978,674 - Kim , et al. May 22, 2	2018-05-22
Semiconductor packages and package modules using the same Grant 9,929,083 - Ha March 27, 2	2018-03-27
Film for semiconductor package, semiconductor package using film and display device including the same Grant 9,922,891 - Lim , et al. March 20, 2	2018-03-20
Film Product, Film Packages And Package Modules Using The Same App 20170372992 - CHUNG; Yechung ; et al.	2017-12-28
Chip-on-film package and device assembly including the same Grant 9,818,732 - Jung , et al. November 14, 2	2017-11-14
Chip-on-film Semiconductor Packages And Display Apparatus Including The Same App 20170287814 - KIM; Jung-woo ; et al.	2017-10-05
Sensing Module Substrate And Sensing Module Including The Same App 20170235997 - CHOI; Inho ; et al.	2017-08-17
Film For Semiconductor Package, Semiconductor Package Using Film And Display Device Including The Same App 20170125314 - LIM; Soyoung ; et al.	2017-05-04
Methods of fabricating tape film packages Grant 9,620,389 - Ha , et al. April 11, 2	2017-04-11
Film for semiconductor package, semiconductor package using film and display device including the same Grant 9,576,865 - Lim , et al. February 21, 2	2017-02-21
Chip on film package including distributed via plugs Grant 9,437,526 - Lim , et al. September 6, 2	2016-09-06
Semiconductor Packages And Package Modules Using The Same App 20160218065 - HA; JEONG-KYU	2016-07-28
Film For Semiconductor Package, Semiconductor Package Using Film And Display Device Including The Same App 20160197020 - LIM; Soyoung ; et al.	2016-07-07
Chip On Film Package And Display Device Including The Same App 20160162091 - HA; JEONG-KYU ; et al.	2016-06-09
Semiconductor packages and display devices including semiconductor packages Grant 9,362,333 - Jung , et al. June 7, 2	2016-06-07
Chip-on-film package having bending part Grant 9,349,683 - Jung , et al. May 24, 2	2016-05-24
Methods of Fabricating Tape Film Packages App 20160111299 - HA; Jeong-Kyu ; et al.	2016-04-21
Display apparatus Grant 9,313,889 - Yang , et al. April 12, 2	2016-04-12
Chip-on-film package and device assembly including the same Grant 9,305,990 - Jung , et al. April 5, 2	2016-04-05
Chip on film package and display device including the same Grant 9,280,182 - Ha , et al. March 8, 2	2016-03-08
Chip-on-film Package Having Bending Part App 20160049356 - JUNG; Jae-Min ; et al.	2016-02-18
Chip-on-film Package And Device Assembly Including The Same App 20160020196 - JUNG; Jae-Min ; et al.	2016-01-21
Tape film packages and methods of fabricating the same Grant 9,241,407 - Ha , et al. January 19, 2	2016-01-19
Chip-on-film package and device assembly including the same Grant 9,177,904 - Jung , et al. November 3, 2	2015-11-03
Tape wiring substrate and chip-on-film package including the same Grant 9,113,545 - Han , et al. August 18, 2	2015-08-18
Chip on film (COF) substrate, COF package and display device including the same Grant 9,059,162 - Ha , et al. June 16, 2	2015-06-16
Semiconductor Packages And Display Devices Including Semiconductor Packages App 20150060931 - Jung; Jae-Min ; et al.	2015-03-05
Methods of forming semiconductor modules including flexible panels Grant 8,940,621 - Han , et al. January 27, 2	2015-01-27
Display Devices App 20140367659 - CHO; KyongSoon ; et al.	2014-12-18
Display Apparatus App 20140328031 - YANG; KYOUNGSUK ; et al.	2014-11-06
Chip On Film Package Including Distributed Via Plugs App 20140327148 - LIM; So-Young ; et al.	2014-11-06
Chip-on-film Package And Device Assembly Including The Same App 20140300849 - JUNG; JAE-MIN ; et al.	2014-10-09
Chip on film package including test pads and semiconductor devices including the same Grant 8,853,694 - Han , et al. October 7, 2	2014-10-07
Chip On Film Package And Display Device Including The Same App 20140246687 - Ha; Jeong-Kyu ; et al.	2014-09-04
Chip on Film (COF) Substrate, COF Package and Display Device Including the Same App 20140054793 - Ha; Jeong-Kyu ; et al.	2014-02-27
Chip-on-film Package And Device Assembly Including The Same App 20130293816 - JUNG; Jae-Min ; et al.	2013-11-07
Semiconductor Package Having A Conductive Layer For Electrostatic Discharge And Display Device Including The Same App 20130240917 - Cho; Kyong soon ; et al.	2013-09-19
Tape Film Packages and Methods of Fabricating the Same App 20130186680 - Ha; Jeong-Kyu ; et al.	2013-07-25
Chip On Film Package Including Test Pads And Semiconductor Devices Including The Same App 20130175528 - Han; Sang-Uk ; et al.	2013-07-11
Tape Wiring Substrate And Chip-on-film Package Including The Same App 20130148312 - Han; Sang-Uk ; et al.	2013-06-13
Methods Of Forming Semiconductor Modules And Semiconductor Modules Formed By The Same App 20130005088 - HAN; Sang-Uk ; et al.	2013-01-03
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same Grant 8,222,089 - Choi , et al. July 17, 2	2012-07-17
Method Of Fabricating Film Circuit Substrate And Method Of Fabricating Chip Package Including The Same App 20120021600 - Han; Sang-Uk ; et al.	2012-01-26
Tape For Heat Dissipating Member, Chip On Film Type Semiconductor Package Including Heat Dissipating Member, And Electronic Apparatus Including The Same App 20110143625 - Choi; Kyoung-sei ; et al.	2011-06-16
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same Grant 7,915,727 - Choi , et al. March 29, 2	2011-03-29
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and elctronic apparatus including the same App 20090273076 - CHOI; Kyong-sei ; et al.	2009-11-05

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