Kim; Woonbae

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Woonbae.The latest application filed is for "semiconductor package including image sensor chip".

Company Profile

12.7.9

Kim; Woonbae - Seoul KR
Kim; Woonbae - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sensor package, method of manufacturing the same, and method of manufacturing lid structure Grant 11,131,568 - Jo , et al. September 28, 2	2021-09-28
Electronic device including slidable body Grant 10,944,853 - Lee , et al. March 9, 2	2021-03-09
Semiconductor Package Including Image Sensor Chip App 20210050377 - KIM; WOONBAE	2021-02-18
Sensor Package, Method Of Manufacturing The Same, And Method Of Manufacturing Lid Structure App 20200386585 - JO; Sungeun ; et al.	2020-12-10
Fingerprint Sensor Package And Display Apparatus Including The Same App 20200372232 - KIM; WOONBAE ; et al.	2020-11-26
Electronic Device Including Slidable Body App 20200358887 - LEE; Younghoon ; et al.	2020-11-12
Fingerprint sensor package and display apparatus including the same Grant 10,776,601 - Kim , et al. Sept	2020-09-15
Sensor package, method of manufacturing the same, and method of manufacturing lid structure Grant 10,760,930 - Jo , et al. Sep	2020-09-01
Fingerprint Sensor Package And Display Apparatus Including The Same App 20190213373 - KIM; Woonbae ; et al.	2019-07-11
Sensor Package, Method Of Manufacturing The Same, And Method Of Manufacturing Lid Structure App 20190186960 - JO; Sungeun ; et al.	2019-06-20
Film product, film packages and package modules using the same Grant 10,304,764 - Chung , et al.	2019-05-28
Sensing module substrate and sensing module including the same Grant 10,282,587 - Choi , et al.	2019-05-07
Film Product, Film Packages And Package Modules Using The Same App 20170372992 - CHUNG; Yechung ; et al.	2017-12-28
Sensing Module Substrate And Sensing Module Including The Same App 20170235997 - CHOI; Inho ; et al.	2017-08-17
Semiconductor packages Grant 9,601,445 - Park , et al. March 21, 2	2017-03-21
Semiconductor Packages App 20160148881 - Park; Ji-Yong ; et al.	2016-05-26

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