U.S. patent application number 16/386545 was filed with the patent office on 2020-10-22 for shaped gate caps in dielectric-lined openings.
The applicant listed for this patent is GLOBALFOUNDRIES Inc.. Invention is credited to Shesh Mani Pandey, Hui Zang.
Application Number | 20200335594 16/386545 |
Document ID | / |
Family ID | 1000004063142 |
Filed Date | 2020-10-22 |
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United States Patent
Application |
20200335594 |
Kind Code |
A1 |
Zang; Hui ; et al. |
October 22, 2020 |
SHAPED GATE CAPS IN DIELECTRIC-LINED OPENINGS
Abstract
Structures for field effect-transistors and methods of forming
field-effect transistors. A gate structure includes a gate
electrode and a gate dielectric layer that are arranged between a
first sidewall spacer and a second sidewall spacer. The gate
structure has a top surface that is recessed relative to the first
and second sidewall spacers. A gate cap is arranged over a section
of the gate structure and over the first and sidewall spacers. The
gate cap has a first section of a first width arranged over the
section of the gate structure and a second section of a second
width arranged over the section of the gate cap, the first sidewall
spacer, and the second sidewall spacer. A dielectric liner is
arranged between the gate cap and the gate structure, between the
gate cap and the first sidewall spacer, and between the gate cap
and the second sidewall spacer.
Inventors: |
Zang; Hui; (Guilderland,
NY) ; Pandey; Shesh Mani; (Saratoga Springs,
NY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
GLOBALFOUNDRIES Inc. |
Grand Cayman |
|
KY |
|
|
Family ID: |
1000004063142 |
Appl. No.: |
16/386545 |
Filed: |
April 17, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 29/785 20130101;
H01L 21/823431 20130101; H01L 21/3212 20130101; H01L 29/0649
20130101; H01L 21/823437 20130101; H01L 21/76831 20130101; H01L
21/823468 20130101; H01L 21/28008 20130101; H01L 29/42376
20130101 |
International
Class: |
H01L 29/423 20060101
H01L029/423; H01L 21/28 20060101 H01L021/28; H01L 21/8234 20060101
H01L021/8234; H01L 29/78 20060101 H01L029/78; H01L 29/06 20060101
H01L029/06; H01L 21/768 20060101 H01L021/768; H01L 21/321 20060101
H01L021/321 |
Claims
1. A structure comprising: a first sidewall spacer; a second
sidewall spacer; a gate structure including a gate electrode and a
gate dielectric layer that are laterally arranged between the first
sidewall spacer and the second sidewall spacer, the gate structure
having a top surface recessed relative to the first sidewall spacer
and the second sidewall spacer, and the gate structure having a
first section and a second section; a gate cap arranged over the
top surface of the first section of the gate structure, the first
sidewall spacer, and the second sidewall spacer, the gate cap
having a first section of a first width dimension arranged over the
first section of the gate structure and a second section of a
second width dimension arranged over the first section of the gate
cap, the first sidewall spacer, and the second sidewall spacer; a
dielectric liner including a first section arranged between the
gate cap and the first section of the gate structure, a second
section arranged between the gate cap and the first sidewall
spacer, and a third section arranged between the gate cap and the
second sidewall spacer; and a contact coupled with the gate
electrode of the second section of the gate structure, the contact
having a first section of a first width dimension and a second
section of a second width dimension, the first section of the
contact arranged over the top surface of the second section of the
gate structure, and the second section of the contact arranged over
the first section of the contact, the first sidewall spacer, and
the second sidewall spacer.
2. (canceled)
3. The structure of claim 1 wherein the first section of the
dielectric liner and the second section of the dielectric liner
have approximately equal thicknesses.
4. The structure of claim 1 further comprising: an epitaxial
semiconductor layer arranged adjacent to the gate structure.
5. The structure of claim 1 wherein the second section of the
dielectric liner is arranged to connect the first section of the
dielectric liner with the third section of the dielectric
liner.
6. The structure of claim 5 wherein the first section and the third
section of the dielectric liner are oriented in a first direction,
and the second section of the dielectric liner is oriented in a
second direction transverse to the first direction.
7. (canceled)
8. The structure of claim 1 wherein the second width dimension is
greater than the first width dimension to define a T-shape.
9. The structure of claim 1 wherein the dielectric liner is
comprised of a first dielectric material, and the gate cap is
comprised of a second dielectric material selected to be removable
with an etching process selective to the first dielectric
material.
10. The structure of claim 9 wherein the first sidewall spacer and
the second sidewall spacer are comprised of a third dielectric
material, and the first dielectric material is selected to be
removable with an etching process selective to the third dielectric
material.
11. (canceled)
12. The structure of claim 1 wherein the first width dimension of
the gate cap is approximately equal to the first width dimension of
the contact, the second width dimension of the gate cap is
approximately equal to the second width dimension of the contact,
the first section and the second section of the gate structure are
arranged along a longitudinal axis, and the contact and the gate
cap are aligned along the longitudinal axis.
13. The structure of claim 1 further comprising: a semiconductor
fin, wherein the first section of the gate structure has an
overlapping arrangement with the semiconductor fin.
14. The structure of claim 1 further comprising: a trench isolation
region, wherein the contact and the second section of the gate
structure are arranged over the trench isolation region.
15. The structure of claim 14 further comprising: a semiconductor
fin, wherein the first section of the gate structure has an
overlapping arrangement with the semiconductor fin.
16-20. (canceled)
21. The structure of claim 1 wherein the dielectric liner is
comprised of aluminum nitride, aluminum oxide, or hafnium
oxide.
22. The structure of claim 1 wherein the contact is comprised of
tungsten.
23. The structure of claim 1 wherein the first sidewall spacer and
the second sidewall spacer are comprised of a low-k dielectric
material.
24. The structure of claim 1 wherein the gate cap is comprised of
silicon nitride.
Description
BACKGROUND
[0001] The present invention relates to semiconductor device
fabrication and integrated circuits and, more specifically, to
structures for field effect-transistors and methods of forming
field-effect transistors.
[0002] Contacts may provide vertical electrical connections
extending to features of semiconductor devices, such as a gate
structure of a field-effect transistor. Gate contacts are formed in
contact openings that are constrained during etching by the
configuration of adjacent structures, such as sidewall spacers and
gate caps associated with the gate structures of the field-effect
transistor. Gate caps may be formed by recessing the gate
structure, depositing a dielectric material in the recess, and
polishing the deposited dielectric material with a
chemical-mechanical polishing process. Each gate contact is formed
in an opening that is patterned in the gate cap over the gate
structure.
[0003] Source/drain regions of the field-effect transistor are
arranged adjacent to each gate structure and, prior to forming
source/drain contacts, sections of an interlayer dielectric layer
are arranged over the source/drain regions. The gate cap is
typically composed of silicon nitride, and the interlayer
dielectric layer is typically composed of silicon dioxide. Because
of marginal selectivity of a chemical-mechanical polishing process
between silicon dioxide and silicon nitride, the polishing process
may exhibit marginal process control that can result in either
unwanted overpolishing of the gate caps or unwanted underpolishing
of the gate caps.
[0004] The formation of a gate contacts that requires the removal
of the gate cap to expose a gate electrode of the underlying gate
structure. The sidewall spacers may be composed of a low-k
dielectric material. Due to poor etch selectivity between the
silicon nitride of the gate cap and the low-k dielectric material
of the sidewall spacers, the removal of the gate cap may result in
unwanted pull-down of the sidewall spacers. The shortening of the
sidewall spacers may result in shorting between the gate contact
and source/drain regions or shorting between the gate contact and
source/drain contacts coupled with the source/drain regions.
[0005] Improved structures for field effect-transistors and methods
of forming field-effect transistors are needed.
SUMMARY
[0006] In an embodiment of the invention, a structure includes a
first sidewall spacer, a second sidewall spacer, and a gate
structure having a gate electrode and a gate dielectric layer that
are arranged between the first sidewall spacer and the second
sidewall spacer. The gate structure has a top surface that is
recessed relative to the first sidewall spacer and the second
sidewall spacer. A gate cap is arranged over a section of the gate
structure, the first sidewall spacer, and the second sidewall
spacer. The gate cap has a first section of a first width arranged
over the section of the gate structure and a second section of a
second width arranged over the first section of the gate cap, the
first sidewall spacer, and the second sidewall spacer. A dielectric
liner is arranged between the gate cap and the gate structure,
between the gate cap and the first sidewall spacer, and between the
gate cap and the second sidewall spacer.
[0007] In an embodiment of the invention, a method includes forming
a gate structure including a gate electrode and a gate dielectric
layer that are arranged between a first sidewall spacer and a
second sidewall spacer. The method further includes recessing the
first sidewall spacer and the second sidewall spacer relative to
the gate structure, and recessing the gate electrode and the gate
dielectric layer of the gate structure relative to the first
sidewall spacer and the second sidewall spacer to define a cavity
inside which a top surface of the gate structure is arranged below
the first sidewall spacer and the second sidewall spacer. A
dielectric liner is deposited inside the cavity and, after
depositing the dielectric liner, a gate cap is formed inside the
cavity. The dielectric liner is arranged between the gate cap and
the gate structure, between the gate cap and the first sidewall
spacer, and between the gate cap and the second sidewall spacer. A
first section of the gate cap is arranged over a first section of
the gate structure, and a second section of the gate cap is
arranged over the first section of the gate cap, the first sidewall
spacer, and the second sidewall spacer. The first section of the
gate cap has a first width, and the second section of the gate cap
has a second width.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] The accompanying drawings, which are incorporated in and
constitute a part of this specification, illustrate various
embodiments of the invention and, together with a general
description of the invention given above and the detailed
description of the embodiments given below, serve to explain the
embodiments of the invention. In the drawings, like reference
numerals are used to indicate like features in the various
views.
[0009] FIG. 1 is a top view of a structure at an initial
fabrication stage of a processing method in accordance with
embodiments of the invention.
[0010] FIG. 2 is a cross-sectional view taken generally along line
2-2 in FIG. 1.
[0011] FIG. 2A is a cross-sectional view taken generally along line
2A-2A in FIG. 1.
[0012] FIGS. 3-11 and 3A-11A are cross-sectional views of the
structure at successive fabrication stages of the processing method
respectively subsequent to FIGS. 2 and 2A.
[0013] FIG. 12 is a cross-sectional view of a structure in
accordance with alternative embodiments of the invention.
DETAILED DESCRIPTION
[0014] With reference to FIGS. 1, 2, 2A and in accordance with
embodiments of the invention, a fin 10 is formed that projects
upwardly from a top surface of a substrate 12. The fin 10 may be
formed by patterning the single-crystal semiconductor material
(e.g., single-crystal silicon) of the substrate 12 with lithography
and etching processes. A trench isolation region 14 may be formed
that surrounds a lower portion of the fin 10. An upper portion of
the fin 10 is arranged above a top surface of the trench isolation
region 14. The trench isolation region 14 may be formed by
depositing a layer composed of a dielectric material, such as
silicon dioxide, and recessing the deposited layer with an etching
process to expose an upper portion of the fin 10.
[0015] Gate structures 16, 18, 20 are formed that extend in part
over the fin 10 and in part over the trench isolation region 14.
Each of the gate structures 16, 18, 20 includes a gate electrode 22
and a gate dielectric layer 24 that is composed of a dielectric
material, such as a high-k dielectric material like hafnium oxide.
The gate electrode 22 may include one or more conformal barrier
metal layers and/or work function metal layers, such as layers
composed of titanium aluminum carbide and/or titanium nitride, and
a metal gate fill layer composed of a conductor, such as tungsten.
In an embodiment, the gate electrode 22 of the gate structures 16,
18, 20 may include conformal work function metal layers
characteristic of a p-type field-effect transistor. In an
embodiment, the gate electrode 22 of the gate structures 16, 18, 20
may include conformal work function metal layers characteristic of
an n-type field-effect transistor. The gate structure 18 is aligned
along a longitudinal axis 17, and the other gate structures 16 and
20 are similarly aligned along respective longitudinal axes that
may be arranged substantially parallel to the longitudinal axis
17.
[0016] The gate electrode 22 of each of the gate structures 16, 18,
20 includes a side surface or sidewall 28 and a side surface or
sidewall 29 that is opposite from the sidewall 28, as well as a top
surface 30 that extends from the sidewall 28 to the sidewall 29.
The sidewalls 28, 29 are covered by sections of the gate dielectric
layer 24, and the top surface 30 is not covered by the gate
dielectric layer 24. Sidewall spacers 32 are arranged adjacent to
the gate structures 16, 18, 20 at the opposite sidewalls 28, 29 of
the respective gate electrodes 22. The sidewall spacers 32 may be
may be composed of a low-k dielectric material, such as SiOCN, that
is deposited using the gate structures 16, 18, 20 as mandrels and
then etched with an anisotropic etching process, such as reactive
ion etching.
[0017] Semiconductor layers 34 are epitaxially grown from the fin
10 with an epitaxial growth process. In an embodiment, the
semiconductor layers 34 may contain silicon-germanium doped during
epitaxial growth with a p-type dopant (e.g., boron, aluminum,
gallium, and/or indium) that provides p-type electrical
conductivity. In an embodiment, the epitaxial semiconductor layers
34 may contain silicon doped during epitaxial growth with an n-type
dopant (e.g., phosphorus and/or arsenic) that provides n-type
electrical conductivity. Portions of the semiconductor layers 34
are arranged in cavities defined in the fin 10 between the gate
structures 16, 18, 20. The semiconductor layers 34 furnish
source/drain regions for one or more field-effect transistors
formed using the fin 10. As used herein, the term "source/drain
region" means a doped region of semiconductor material that can
function as either a source or a drain of a field-effect
transistor.
[0018] Sections of an interlayer dielectric layer 36 are disposed
in spaces over the epitaxial semiconductor layers 34. In
particular, a section of the interlayer dielectric layer 36 is
arranged adjacent to the sidewall 28 of the gate electrode 22 of
the gate structure 18, and another section of the interlayer
dielectric layer 36 is arranged adjacent to the opposite sidewall
29 of the gate electrode 22 of the gate structure 18. The
interlayer dielectric layer 36 may be composed of a dielectric
material, such as silicon dioxide, that is deposited and
planarized, and that differs in composition from the dielectric
material of the sidewall spacers 32.
[0019] With reference to FIGS. 3 and 3A in which like reference
numerals refer to like features in FIGS. 2 and 2A and at a
subsequent fabrication stage of the processing method, the sidewall
spacers 32 are recessed and pulled down with an etching process.
The etching process may include, for example, a reactive ion
etching process that removes the material of the sidewall spacers
32 selective to the materials of the gate structures 16, 18, 20 and
the interlayer dielectric layer 36. As used herein, the terms
"selective" and "selectivity" in reference to a material removal
process (e.g., etching) denotes that, with an appropriate etchant
choice, the material removal rate (i.e., etch rate) for the
targeted material is greater than the removal rate for at least
another material exposed to the material removal process. The
etching process is self-aligned during its performance due at least
in part to the etch selectivity. The partial removal of the
sidewall spacers 32 forms shallow recesses between the gate
structures 16, 18, 20 and the sections of the interlayer dielectric
layer 36. The shallow recesses over the pulled-down sidewall
spacers 32 have a given depth in a vertical direction and a given
width dimension in a lateral direction that is nominally equal to
the thickness of the sidewall spacers 32.
[0020] With reference to FIGS. 4 and 4A in which like reference
numerals refer to like features in FIGS. 3 and 3A and at a
subsequent fabrication stage of the processing method, the gate
electrode 22 and gate dielectric layer 24 of the gate structures
16, 18, 20 are recessed relative to the sidewall spacers 32 and the
interlayer dielectric layer 36 using one or more selective etching
processes. The one or more etching processes are self-aligned
during their performance due at least in part to the etch
selectivity. After the gate structures 16, 18, 20 are recessed,
portions of the sidewall spacers 32 project or extend above the top
surface 30 of the gate structures 16, 18, 20. A cavity 38 is
defined over each of the gate structures 16, 18, 20 that includes
the open space generated by the recessing of the gate structures
16, 18, 20 and the shallow recesses adjacent to the open space that
were previously generated by the prior recessing of the sidewall
spacers 32 and that merge into the cavity 38.
[0021] The gate structures 16, 18, 20 are recessed below the
sidewall spacers 32 such that each cavity 38 has sections of
multiple widths with a wider upper section arranged over a narrower
lower section. The narrower lower section of each cavity 38 has a
width dimension, W1, that is approximately equal to the width
dimension of the gate structures 16, 18, 20. The wider upper
section of each cavity 38 has a width dimension, W2, that is
approximately equal to a sum of the width dimension of the gate
structures 16, 18, 20 and twice the thickness of the sidewall
spacers 32.
[0022] In the representative embodiment, the sidewall spacers 32
are recessed before recessing the gate structures 16, 18, 20. In an
alternative embodiment, the order may be reversed, and the sidewall
spacers 32 may be recessed after recessing the gate structures 16,
18, 20.
[0023] With reference to FIGS. 5 and 5A in which like reference
numerals refer to like features in FIGS. 4 and 4A and at a
subsequent fabrication stage of the processing method, a dielectric
liner 40 is applied that conformally coats the multi-level contour
of the surfaces inside the cavities 38 provided by the gate
structures 16, 18, 20, the sections of the interlayer dielectric
layer 36, and the sidewall spacers 32. The dielectric liner 40
covers the uneven topography and, in particular, includes sections
that are arranged over the sections of the interlayer dielectric
layer 36. In an embodiment, the dielectric liner 40 may have
sections of approximately equal thickness that are arranged inside
each cavity 38 and over the sections of the interlayer dielectric
layer 36. The dielectric liner 40 may be composed of a layer of a
dielectric material, such as aluminum nitride, aluminum oxide, or
hafnium oxide, that is deposited by atomic layer deposition. The
dielectric material of the dielectric liner 40 may be selected to
be removable with an etching process selective to the dielectric
material of the sidewall spacers 32, and may be selected to operate
as a polish stop as subsequently described.
[0024] With reference to FIGS. 6 and 6A in which like reference
numerals refer to like features in FIGS. 5 and 5A and at a
subsequent fabrication stage of the processing method, self-aligned
contact caps 42 are formed as gate caps (i.e., dielectric caps) in
the widened cavities 38 over the gate structures 16, 18, 20. The
self-aligned contact caps 42 may be may be composed of a dielectric
material, such as silicon nitride, that is deposited by chemical
vapor deposition and then planarized with chemical-mechanical
polishing. The dielectric material of the self-aligned contact caps
42 may be selected to be removable with an etching process
selective to the dielectric material of the dielectric liner 40.
Horizontal sections 40e of the dielectric liner 40 are arranged
over the sections of the interlayer dielectric layer 36 and may
function as a polish stop during the chemical-mechanical polishing.
As a result, the sidewall spacers 32 and the gate structures 16,
18, 20 are protected during the planarization of the self-aligned
contact caps 42 and are not eroded by the chemical-mechanical
polishing providing the planarization, which contributes to
preventing a loss of gate height.
[0025] With reference to FIGS. 7 and 7A in which like reference
numerals refer to like features in FIGS. 6 and 6A and at a
subsequent fabrication stage of the processing method, an etch mask
44 is formed by applying a lithography stack and patterning the
lithography stack to expose the dielectric liner 40 over sections
of the interlayer dielectric layer 36 and self-aligned contact caps
42 that are located over the fin 10 and semiconductor layers 34.
The etch mask 44 may include an organic planarization layer (OPL)
material and an anti-reflection coating in the lithography stack
that are patterned with lithography and etching processes. The
sections of the interlayer dielectric layer 36 exposed by the etch
mask 44 and the sections of the dielectric liner 40 over these
exposed sections of the interlayer dielectric layer 36 are
sequentially removed with one or more etching processes, such as
one or more reactive ion etching processes, to form openings 46
that are arranged over the semiconductor layers 34. The etching
process removing the exposed sections of the interlayer dielectric
layer 36 is self-aligned by the self-aligned contact caps 42. The
openings 46 reveal the semiconductor layers 34 for the subsequent
formation of source/drain contacts.
[0026] The etching process may remove the sections of the
interlayer dielectric layer 36 selective to the materials of the
dielectric liner 40 and the self-aligned contact caps 42. The
vertical sections 40c of the dielectric liner 40 arranged over the
sidewall spacers 32 and adjacent to the self-aligned contact caps
42 may function, as part of the self-alignment of the etching
process, as a protective etch mask due to the etch selectivity. As
a result, portions of the sidewall spacers 32 and the self-aligned
contact caps 42 adjacent to the openings 46 are protected during
the etching process and are not eroded by the etching process. The
etch mask 44 is removed after the openings 46 are formed.
[0027] With reference to FIGS. 8 and 8A in which like reference
numerals refer to like features in FIGS. 7 and 7A and at a
subsequent fabrication stage of the processing method, an etch mask
48 is formed by applying a lithography stack and patterning the
lithography stack to define an opening 50 that exposes a section of
the self-aligned contact cap 42 over a section of the gate
structure 18. Portions of the etch mask 48 fill the
previously-formed openings 46 over the semiconductor layers 34. The
etch mask 48 may include an organic planarization layer (OPL)
material and an anti-reflection coating in the lithography stack
that are patterned with lithography and etching processes. The
section of the gate structure 18 that is exposed by the opening 50
is arranged over the trench isolation region 14, rather than over
the fin 10. The opening 50 may be wider than the self-aligned
contact cap 42 so as to overlap with the dielectric liner 40 over
the adjacent sections of the interlayer dielectric layer 36.
[0028] With reference to FIGS. 9 and 9A in which like reference
numerals refer to like features in FIGS. 8 and 8A and at a
subsequent fabrication stage of the processing method, the section
of the self-aligned contact cap 42 over the section of the gate
structure 18, which is exposed by the opening 50 in the etch mask
48, is removed by an etching process, such as a reactive ion
etching process. The removal of the section of the self-aligned
contact cap 42 defines an opening 52 over the section of the gate
structure 18. The dielectric liner 40 masks and protects the
sidewall spacers 32 and the sections of the interlayer dielectric
layer 36 that are located adjacent to the removed section of the
gate structure 18. The etching process removes the dielectric
material of the self-aligned contact cap 42 selective to the
dielectric materials of the sidewall spacers 32 and the interlayer
dielectric layer 36. Due to the presence of the sections of the
dielectric liner 40, the sidewall spacers 32 and the sections of
the interlayer dielectric layer 36 are not etched, and thereby
recessed or beveled, during removal of the section of the
self-aligned contact cap 42.
[0029] With reference to FIGS. 10 and 10A in which like reference
numerals refer to like features in FIGS. 9 and 9A and at a
subsequent fabrication stage of the processing method, the
dielectric liner 40 is removed from inside the opening 52, which
exposes the section of the gate structure 18, as well as the
sidewall spacers 32 and sections of the interlayer dielectric layer
36 adjacent to the sidewall spacers 32 and the exposed section of
the gate structure 18.
[0030] With reference to FIGS. 11 and 11A in which like reference
numerals refer to like features in FIGS. 10 and 10A and at a
subsequent fabrication stage of the processing method, the etch
mask 48 is removed, which reopens the previously-formed openings 46
over the semiconductor layers 34. A gate contact 60 may be formed
in the opening 52 over the section of the gate structure 18 exposed
by the partial removal of the self-aligned contact cap 42. The gate
contact 60 may contain a metal fill layer (e.g., tungsten)
deposited by chemical vapor deposition or atomic layer deposition
and then planarized by a chemical-mechanical planarization process.
Source/drain contacts 62 may be formed in the reopened openings 46
over the semiconductor layers 34. The source/drain contacts 62 may
contain a metal silicide layer and a metal fill layer (e.g.,
tungsten) deposited by chemical vapor deposition or atomic layer
deposition and then planarized by a chemical-mechanical
planarization process.
[0031] The opening 52 is a reopened portion of the cavity 38 (FIGS.
4, 4A), and inherits the multiple widths of the cavity 38 in which
a wider upper section is arranged over a narrower lower section.
The gate contact 60 conforms to the shape of the opening 52. As a
result of the dual widths of the opening 52, the gate contact 60
has a T-shape with a narrower lower section that adopts the shape
of the lower section of opening 52 and a wider upper section that
adopts the shape of the upper section of the opening 52. The upper
section of the gate contact 60 has a width dimension, W3, and the
lower section of the gate contact 60 has a width dimension, W4,
that is less than the width dimension, W3. In an embodiment, the
width dimension, W3, of the gate contact 60 may be approximately
equal to the width dimension, W1, of the self-aligned contact cap
42. In an embodiment, the width dimension, W4, of the gate contact
60 may be approximately equal to the width dimension, W2, of the
self-aligned contact cap 42.
[0032] The dielectric liner 40 includes a section 40a arranged
between the sidewall spacer 32 and the narrow lower section of the
self-aligned contact cap 42, a section 40b arranged between the
sidewall spacer 32 and the wide upper section of the self-aligned
contact cap 42, a section 40c that is also arranged between the
source/drain contact 62 and the wide upper section of the
self-aligned contact cap 42, and a section 40d that is arranged
between the gate structure 18 and the self-aligned contact cap 42.
The section 40b connects the section 40a with the section 40c, the
sections 40a and 40c are oriented in a vertical direction, and the
sections 40a and 40d are oriented in a horizontal direction. The
different sections 40a-40d (and the removed sections 40e) of the
dielectric liner 40 have approximately equal thicknesses.
[0033] The gate contact 60 is coupled with a section of the gate
structure 18 that is arranged over the trench isolation region 14.
The source/drain contacts 62 are arranged over the fin 10 and the
epitaxial semiconductor layers 34 adjacent to a different section
of the gate structure 18, and the source/drain contacts 62 are
displaced along the length (i.e., the longitudinal axis 17 (FIG.
1)) of the gate structure 18 from the gate contact 60. No portion
of the gate contact 60 is in direct contact with the dielectric
liner 40 due to its removal before forming the gate contact 60.
[0034] With reference to FIG. 12 in which like reference numerals
refer to like features in FIG. 11A and at a subsequent fabrication
stage of the processing method, the vertical sections 40c of the
dielectric liner 40 adjacent to the openings 46 may be removed
before forming the source/drain contacts 62. The removal of these
sections of the dielectric layer widens the upper portion of each
source/drain contact 62, while the lower portion of each
source/drain contact 62 retains the original narrower width to
provide a T-shape with an enlarged head.
[0035] The methods as described above are used in the fabrication
of integrated circuit chips. The resulting integrated circuit chips
can be distributed by the fabricator in raw wafer form (e.g., as a
single wafer that has multiple unpackaged chips), as a bare die, or
in a packaged form. The chip may be integrated with other chips,
discrete circuit elements, and/or other signal processing devices
as part of either an intermediate product or an end product. The
end product can be any product that includes integrated circuit
chips, such as computer products having a central processor or
smartphones.
[0036] References herein to terms modified by language of
approximation, such as "about", "approximately", and
"substantially", are not to be limited to the precise value
specified. The language of approximation may correspond to the
precision of an instrument used to measure the value and, unless
otherwise dependent on the precision of the instrument, may
indicate +/-10% of the stated value(s).
[0037] References herein to terms such as "vertical", "horizontal",
etc. are made by way of example, and not by way of limitation, to
establish a frame of reference. The term "horizontal" as used
herein is defined as a plane parallel to a conventional plane of a
semiconductor substrate, regardless of its actual three-dimensional
spatial orientation. The terms "vertical" and "normal" refer to a
direction perpendicular to the horizontal, as just defined. The
term "lateral" refers to a direction within the horizontal
plane.
[0038] A feature "connected" or "coupled" to or with another
feature may be directly connected or coupled to or with the other
feature or, instead, one or more intervening features may be
present. A feature may be "directly connected" or "directly
coupled" to or with another feature if intervening features are
absent. A feature may be "indirectly connected" or "indirectly
coupled" to or with another feature if at least one intervening
feature is present. A feature "on" or "contacting" another feature
may be directly on or in direct contact with the other feature or,
instead, one or more intervening features may be present. A feature
may be "directly" on or in "direct contact" with another feature if
intervening features are absent. A feature may be "indirectly" on
or in "indirect contact" with another feature if at least one
intervening feature is present.
[0039] The descriptions of the various embodiments of the present
invention have been presented for purposes of illustration, but are
not intended to be exhaustive or limited to the embodiments
disclosed. Many modifications and variations will be apparent to
those of ordinary skill in the art without departing from the scope
and spirit of the described embodiments. The terminology used
herein was chosen to best explain the principles of the
embodiments, the practical application or technical improvement
over technologies found in the marketplace, or to enable others of
ordinary skill in the art to understand the embodiments disclosed
herein.
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