U.S. patent application number 16/221631 was filed with the patent office on 2020-06-18 for measuring complex structures in semiconductor fabrication.
The applicant listed for this patent is GLOBALFOUNDRIES INC. NOVA MEASURING INSTRUMENTS LTD.. Invention is credited to TAHER KAGALWALA, SRIDHAR MAHENDRAKAR, MATTHEW SENDELBACH, ALOK VAID.
Application Number | 20200192987 16/221631 |
Document ID | / |
Family ID | 70775006 |
Filed Date | 2020-06-18 |
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United States Patent
Application |
20200192987 |
Kind Code |
A1 |
KAGALWALA; TAHER ; et
al. |
June 18, 2020 |
MEASURING COMPLEX STRUCTURES IN SEMICONDUCTOR FABRICATION
Abstract
Measuring SRAM structures having FinFET transistors by
obtaining, on a production semiconductor wafer, spectra of a SRAM
production structure including FinFET fins and gates, identifying
SRAM reference structure spectra corresponding to the spectra, the
reference structure from measuring, on a reference semiconductor
wafer, a reference structure including a layout of FinFET fins
having gates, injecting, into an OCD model of the production
structure, fin target parameter values, corresponding to the
identified reference structure spectra, from measuring, on the
reference wafer, a fin target including a layout of exposed FinFET
fins lacking gates similar or identical to the reference structure
layout, correspondence between the fin target parameter values and
the reference structure spectra previously identified by ML, and
determining measurement values for the FinFET gates of the
production structure by fitting reference spectra associated with
the production structure in the OCD model to the production
structure spectra.
Inventors: |
KAGALWALA; TAHER; (CLIFTON
PARK, NY) ; MAHENDRAKAR; SRIDHAR; (CLIFTON PARK,
NY) ; SENDELBACH; MATTHEW; (FISHKILL, NY) ;
VAID; ALOK; (CLIFTON PARK, NY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
GLOBALFOUNDRIES INC.
NOVA MEASURING INSTRUMENTS LTD. |
GRAND CAYMAN
REHOVOT |
|
KY
IL |
|
|
Family ID: |
70775006 |
Appl. No.: |
16/221631 |
Filed: |
December 17, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 21/823431 20130101;
G06F 2119/18 20200101; G06F 30/3323 20200101; G06F 2111/20
20200101; H01L 27/1104 20130101; H01L 29/785 20130101; H01L 22/00
20130101 |
International
Class: |
G06F 17/50 20060101
G06F017/50; H01L 29/78 20060101 H01L029/78; H01L 27/11 20060101
H01L027/11 |
Claims
1. A method for measuring Static Random Access Memory (SRAM)
structures having Fin Field-effect transistors (FinFET),
comprising: during a reference process of fabricating integrated
circuits, measuring in a fin target measuring step a fin target on
a reference semiconductor wafer, thereby obtaining fin target
parameter values, wherein the fin target includes a layout of
exposed FinFET fins lacking FinFET gates, measuring in a SRAM
reference structure measuring step a SRAM reference structure on
the reference semiconductor wafer, thereby obtaining SRAM reference
structure spectra, wherein the SRAM reference structure includes a
layout of FinFET fins having FinFET gates, and wherein the layout
of exposed FinFET fins of the fin target is substantially similar
to or identical to the layout of FinFET fins of the SRAM reference
structure, performing both of the measuring steps for a plurality
of different pairs of fin targets and SRAM reference structures,
and performing machine learning (ML) to identify correspondence
between the fin target parameter values and the SRAM reference
structure spectra, thereby producing an ML solution; and during a
high-volume manufacturing (HVM) process of fabricating integrated
circuits, obtaining a spectra associated with a SRAM production
structure on a production semiconductor wafer, wherein the SRAM
production structure includes a plurality of FinFET fins having
FinFET gates, identifying in the ML solution SRAM reference
structure spectra corresponding to the spectra associated with the
SRAM production structure, injecting, into an Optical Critical
Dimension (OCD) model of the SRAM production structure, fin target
parameter values corresponding to the identified SRAM reference
structure spectra in the ML solution, and determining measurement
values for the FinFET gates of the SRAM production structure by
fitting a reference spectra associated with the SRAM production
structure in the OCD model to the spectra associated with the SRAM
production structure.
2. The method according to claim 1 and further comprising:
identifying a fabrication step performed on the reference
semiconductor wafer after which the fin target includes the layout
of exposed FinFET fins lacking FinFET gates; and performing the fin
target measuring step after the identified fabrication step and
before any other fabrication step is subsequently performed on the
reference semiconductor wafer.
3. The method according to claim 2 wherein the identified
fabrication step is an oxide etchback process during which oxide is
etched back selective to silicon material of the FinFET fins.
4. The method according to claim 1 and further comprising:
identifying a fabrication step performed on the reference
semiconductor wafer after which the SRAM reference structure
includes the layout of FinFET fins having FinFET gates; and
performing the SRAM reference structure measuring step after the
identified fabrication step and before any other fabrication step
is subsequently performed on the reference semiconductor wafer.
5. The method according to claim 4 wherein the identified
fabrication step is poly-open chemical-mechanical planarization
(CMP) of the reference semiconductor wafer.
6. The method according to claim 1 wherein the fin target measuring
step is performed using a Critical Dimension Scanning Electron
Microscope (CD-SEM), an Atomic Force Microscope (AFM), a Critical
Dimension Atomic Force Microscope (CD-AFM), or an OCD metrology
tool.
7. The method according to claim 1 wherein the different pairs of
fin targets and SRAM reference structures have varying physical
dimensions.
8. The method according to claim 1 and further comprising providing
any of the measurements and the OCD model to a semiconductor
fabrication tool that causes the semiconductor fabrication tool to
adjust one or more parameters of the HVM process implemented by the
semiconductor fabrication tool to achieve a desired manufacturing
output from the semiconductor fabrication tool.
9. A method for measuring Static Random Access Memory (SRAM)
structures having Fin Field-effect transistors (FinFET),
comprising: obtaining spectra associated with a SRAM production
structure on a production semiconductor wafer, wherein the SRAM
production structure includes a plurality of FinFET fins having
FinFET gates; identifying SRAM reference structure spectra
corresponding to the spectra associated with the SRAM production
structure, wherein the SRAM reference structure spectra were
previously obtained from a measurement of a SRAM reference
structure on a reference semiconductor wafer, the SRAM reference
structure including a layout of FinFET fins having FinFET gates;
injecting, into an Optical Critical Dimension (OCD) model of the
SRAM production structure, fin target parameter values
corresponding to the identified SRAM reference structure spectra,
wherein the fin target parameter values were previously obtained
from a measurement of a fin target on the reference semiconductor
wafer, the fin target including a layout of exposed FinFET fins
lacking FinFET gates, the layout of the FinFET fins of the fin
target being substantially similar to or identical to the layout of
the FinFET fins of the SRAM reference structure, and wherein
correspondence between the fin target parameter values and the SRAM
reference structure spectra was previously identified by machine
learning (ML); and determining measurement values for the FinFET
gates of the SRAM production structure by fitting reference spectra
associated with the SRAM production structure in the OCD model to
the spectra associated with the SRAM production structure.
10. The method according to claim 9 wherein the obtaining,
identifying, injecting, and determining are performed during a
high-volume manufacturing (HVM) process of fabricating integrated
circuits.
11. The method according to claim 9 and further comprising:
measuring in a fin target measuring step, the fin target on the
reference semiconductor wafer, thereby obtaining the fin target
parameter values; measuring in a SRAM reference structure measuring
step the SRAM reference structure on the reference semiconductor
wafer, thereby obtaining the SRAM reference structure spectra;
performing both of the measuring steps for a plurality of different
pairs of fin targets and SRAM reference structures; and performing
the ML to identify correspondence between the fin target parameter
values and the SRAM reference structure spectra.
12. The method according to claim 11 wherein the measuring steps
and the implementing are performed during a reference process of
fabricating integrated circuits prior to the obtaining,
identifying, injecting, and determining.
13. The method according to claim 12 and further comprising:
identifying a fabrication step performed on the reference
semiconductor wafer after which the fin target includes the layout
of exposed FinFET fins lacking FinFET gates; and performing the fin
target measuring step after the identified fabrication step and
before any other fabrication step is subsequently performed on the
reference semiconductor wafer.
14. The method according to claim 13 wherein the identified
fabrication step is an oxide etchback process during which oxide is
etched back selective to silicon material of the FinFET fins.
15. The method according to claim 12 and further comprising:
identifying a fabrication step performed on the reference
semiconductor wafer after which the fin target includes the layout
of exposed FinFET fins having FinFET gates; and performing the SRAM
reference structure measuring step after the identified fabrication
step and before any other fabrication step is subsequently
performed on the reference semiconductor wafer.
16. The method according to claim 15 wherein the identified
fabrication step is poly-open chemical-mechanical planarization
(CMP) of the reference semiconductor wafer.
17. The method according to claim 11 wherein the fin target
measuring step is performed using a Critical Dimension Scanning
Electron Microscope (CD-SEM), an Atomic Force Microscope (AFM), a
Critical Dimension Atomic Force Microscope (CD-AFM), or an OCD
metrology tool.
18. The method according to claim 11 wherein the different pairs of
fin targets and SRAM reference structures have varying physical
dimensions.
19. The method according to claim 10 and further comprising
providing any of the measurement values and the OCD model to a
semiconductor fabrication tool that causes the semiconductor
fabrication tool to adjust one or more parameters of the HVM
process implemented by the semiconductor fabrication tool to
achieve a desired manufacturing output from the semiconductor
fabrication tool.
20. A system for measuring Static Random Access Memory (SRAM)
structures having Fin Field-effect transistors (FinFET),
comprising: a reference tool; a spectrum acquisition tool; a
reference process control unit configured to process fin target
parameter values and SRAM reference structure spectra for a
plurality of different pairs of fin targets and SRAM reference
structures on a reference semiconductor wafer by performing machine
learning (ML) to identify correspondence between the fin target
parameter values and the SRAM reference structure spectra, thereby
producing an ML solution, wherein the fin target parameter values
are obtained from the fin targets by the reference tool, wherein
the SRAM reference structure spectra are obtained from the SRAM
reference structures by the spectrum acquisition tool, and wherein
in each of the pairs of fin targets and SRAM reference structures
the fin target includes a layout of exposed FinFET fins lacking
FinFET gates, the SRAM reference structure includes a layout of
FinFET fins having FinFET gates, and the layout of exposed FinFET
fins of the fin target is substantially similar to or identical to
the layout of FinFET fins of the SRAM reference structure; and an
OCD metrology tool configured to obtain spectra associated with a
SRAM production structure on a production semiconductor wafer
during an HVM process of fabricating integrated circuits, wherein
the SRAM production structure includes a plurality of FinFET fins
having FinFET gates, identify in the ML solution SRAM reference
structure spectra corresponding to the spectra associated with the
SRAM production structure, inject, into an OCD model of the SRAM
production structure, fin target parameter values corresponding to
the identified SRAM reference structure spectra in the ML solution,
and determine measurement values for the FinFET gates of the SRAM
production structure by fitting reference spectra associated with
the SRAM production structure in the OCD model to the spectra
associated with the SRAM production structure.
21. The system according to claim 20 wherein the fin target
parameter values are obtained after a given fabrication step is
performed on the reference semiconductor wafer after which the fin
target includes the layout of exposed FinFET fins lacking FinFET
gates and before any other fabrication step is subsequently
performed on the reference semiconductor wafer.
22. The system according to claim 20 wherein the reference tool is
a Critical Dimension Scanning Electron Microscope (CD-SEM), an
Atomic Force Microscope (AFM), a Critical Dimension Atomic Force
Microscope (CD-AFM), or an OCD metrology tool.
23. The system according to claim 20 wherein the OCD metrology tool
is configured to provide any of the measurement values and the OCD
model to a semiconductor fabrication tool that causes the
semiconductor fabrication tool to adjust one or more parameters of
the HVM process implemented by the semiconductor fabrication tool
to achieve a desired manufacturing output from the semiconductor
fabrication tool.
Description
BACKGROUND
[0001] Advanced semiconductor technology introduces many complex
structures that need to be measured in order to monitor and control
the structures and the semiconductor manufacturing processes that
make the structures, and adjust these processes to reduce defects
and promote higher yield. As structure complexity increases, more
parameters are needed to properly characterize the structures in
OCD (Optical Critical Dimension) models. Unfortunately, having too
many parameters in an OCD model can lead to undesirable
correlations between the parameters and/or low sensitivity to
changes in the parameters, often resulting in unacceptable OCD
metrology measurement error. Methods for reducing the number of
these parameters without worsening such measurement error would be
advantageous.
SUMMARY
[0002] In one aspect of the invention a method is provided for
measuring Static Random Access Memory (SRAM) structures having Fin
Field-effect transistors (FinFET), including during a reference
process of fabricating integrated circuits, measuring in a fin
target measuring step a fin target on a reference semiconductor
wafer, thereby obtaining fin target parameter values, where the fin
target includes a layout of exposed FinFET fins lacking FinFET
gates, measuring in a SRAM reference structure measuring step a
SRAM reference structure on the reference semiconductor wafer,
thereby obtaining SRAM reference structure spectra, where the SRAM
reference structure includes a layout of FinFET fins having FinFET
gates, and where the layout of exposed FinFET fins of the fin
target is substantially similar to or identical to the layout of
FinFET fins of the SRAM reference structure, performing both of the
measuring steps for a plurality of different pairs of fin targets
and SRAM reference structures, and performing machine learning (ML)
to identify correspondence between the fin target parameter values
and the SRAM reference structure spectra, thereby producing an ML
solution, and during a high-volume manufacturing (HVM) process of
fabricating integrated circuits, obtaining a spectra associated
with a SRAM production structure on a production semiconductor
wafer, where the SRAM production structure includes a plurality of
FinFET fins having FinFET gates, identifying in the ML solution
SRAM reference structure spectra corresponding to the spectra
associated with the SRAM production structure, injecting, into an
Optical Critical Dimension (OCD) model of the SRAM production
structure, fin target parameter values corresponding to the
identified SRAM reference structure spectra in the ML solution, and
determining measurement values for the FinFET gates of the SRAM
production structure by fitting a reference spectra associated with
the SRAM production structure in the OCD model to the spectra
associated with the SRAM production structure.
[0003] In another aspect of the invention the method further
includes identifying a fabrication step performed on the reference
semiconductor wafer after which the fin target includes the layout
of exposed FinFET fins lacking FinFET gates, and performing the fin
target measuring step after the identified fabrication step and
before any other fabrication step is subsequently performed on the
reference semiconductor wafer.
[0004] In another aspect of the invention the identified
fabrication step is an oxide etchback process during which oxide is
etched back selective to silicon material of the FinFET fins.
[0005] In another aspect of the invention the method further
includes identifying a fabrication step performed on the reference
semiconductor wafer after which the SRAM reference structure
includes the layout of FinFET fins having FinFET gates, and
performing the SRAM reference structure measuring step after the
identified fabrication step and before any other fabrication step
is subsequently performed on the reference semiconductor wafer.
[0006] In another aspect of the invention the identified
fabrication step is poly-open chemical-mechanical planarization
(CMP) of the reference semiconductor wafer.
[0007] In another aspect of the invention the fin target measuring
step is performed using a Critical Dimension Scanning Electron
Microscope (CD-SEM), an Atomic Force Microscope (AFM), a Critical
Dimension Atomic Force Microscope (CD-AFM), or an OCD metrology
tool.
[0008] In another aspect of the invention the different pairs of
fin targets and SRAM reference structures have varying physical
dimensions.
[0009] In another aspect of the invention the method further
includes providing any of the measurements and the OCD model to a
semiconductor fabrication tool that causes the semiconductor
fabrication tool to adjust one or more parameters of the HVM
process implemented by the semiconductor fabrication tool to
achieve a desired manufacturing output from the semiconductor
fabrication tool.
[0010] In another aspect of the invention a method is provided for
measuring Static Random Access Memory (SRAM) structures having Fin
Field-effect transistors (FinFET), including obtaining spectra
associated with a SRAM production structure on a production
semiconductor wafer, where the SRAM production structure includes a
plurality of FinFET fins having FinFET gates, identifying SRAM
reference structure spectra corresponding to the spectra associated
with the SRAM production structure, where the SRAM reference
structure spectra were previously obtained from a measurement of a
SRAM reference structure on a reference semiconductor wafer, the
SRAM reference structure including a layout of FinFET fins having
FinFET gates, injecting, into an Optical Critical Dimension (OCD)
model of the SRAM production structure, fin target parameter values
corresponding to the identified SRAM reference structure spectra,
where the fin target parameter values were previously obtained from
a measurement of a fin target on the reference semiconductor wafer,
the fin target including a layout of exposed FinFET fins lacking
FinFET gates, the layout of the FinFET fins of the fin target being
substantially similar to or identical to the layout of the FinFET
fins of the SRAM reference structure, and where correspondence
between the fin target parameter values and the SRAM reference
structure spectra was previously identified by machine learning
(ML), and determining measurement values for the FinFET gates of
the SRAM production structure by fitting reference spectra
associated with the SRAM production structure in the OCD model to
the spectra associated with the SRAM production structure.
[0011] In another aspect of the invention the obtaining,
identifying, injecting, and determining are performed during a
high-volume manufacturing (HVM) process of fabricating integrated
circuits.
[0012] In another aspect of the invention the method further
includes measuring in a fin target measuring step, the fin target
on the reference semiconductor wafer, thereby obtaining the fin
target parameter values, measuring in a SRAM reference structure
measuring step the SRAM reference structure on the reference
semiconductor wafer, thereby obtaining the SRAM reference structure
spectra, performing both of the measuring steps for a plurality of
different pairs of fin targets and SRAM reference structures, and
performing the ML to identify correspondence between the fin target
parameter values and the SRAM reference structure spectra.
[0013] In another aspect of the invention the measuring steps and
the implementing are performed during a reference process of
fabricating integrated circuits prior to the obtaining,
identifying, injecting, and determining.
[0014] In another aspect of the invention the method further
includes identifying a fabrication step performed on the reference
semiconductor wafer after which the fin target includes the layout
of exposed FinFET fins lacking FinFET gates, and performing the fin
target measuring step after the identified fabrication step and
before any other fabrication step is subsequently performed on the
reference semiconductor wafer.
[0015] In another aspect of the invention the identified
fabrication step is an oxide etchback process during which oxide is
etched back selective to silicon material of the FinFET fins.
[0016] In another aspect of the invention the method further
includes identifying a fabrication step performed on the reference
semiconductor wafer after which the fin target includes the layout
of exposed FinFET fins having FinFET gates, and performing the SRAM
reference structure measuring step after the identified fabrication
step and before any other fabrication step is subsequently
performed on the reference semiconductor wafer.
[0017] In another aspect of the invention the identified
fabrication step is poly-open chemical-mechanical planarization
(CMP) of the reference semiconductor wafer.
[0018] In another aspect of the invention the fin target measuring
step is performed using a Critical Dimension Scanning Electron
Microscope (CD-SEM), an Atomic Force Microscope (AFM), a Critical
Dimension Atomic Force Microscope (CD-AFM), or an OCD metrology
tool.
[0019] In another aspect of the invention the different pairs of
fin targets and SRAM reference structures have varying physical
dimensions.
[0020] In another aspect of the invention the method further
includes providing any of the measurement values and the OCD model
to a semiconductor fabrication tool that causes the semiconductor
fabrication tool to adjust one or more parameters of the HVM
process implemented by the semiconductor fabrication tool to
achieve a desired manufacturing output from the semiconductor
fabrication tool.
[0021] In another aspect of the invention a system is provided for
measuring Static Random Access Memory (SRAM) structures having Fin
Field-effect transistors (FinFET), including a reference tool, a
spectrum acquisition tool, a reference process control unit
configured to process fin target parameter values and SRAM
reference structure spectra for a plurality of different pairs of
fin targets and SRAM reference structures on a reference
semiconductor wafer by performing machine learning (ML) to identify
correspondence between the fin target parameter values and the SRAM
reference structure spectra, thereby producing an ML solution,
where the fin target parameter values are obtained from the fin
targets by the reference tool, where the SRAM reference structure
spectra are obtained from the SRAM reference structures by the
spectrum acquisition tool, and where in each of the pairs of fin
targets and SRAM reference structures the fin target includes a
layout of exposed FinFET fins lacking FinFET gates, the SRAM
reference structure includes a layout of FinFET fins having FinFET
gates, and the layout of exposed FinFET fins of the fin target is
substantially similar to or identical to the layout of FinFET fins
of the SRAM reference structure, and an OCD metrology tool
configured to obtain spectra associated with a SRAM production
structure on a production semiconductor wafer during an HVM process
of fabricating integrated circuits, where the SRAM production
structure includes a plurality of FinFET fins having FinFET gates,
identify in the ML solution SRAM reference structure spectra
corresponding to the spectra associated with the SRAM production
structure, inject, into an OCD model of the SRAM production
structure, fin target parameter values corresponding to the
identified SRAM reference structure spectra in the ML solution, and
determine measurement values for the FinFET gates of the SRAM
production structure by fitting reference spectra associated with
the SRAM production structure in the OCD model to the spectra
associated with the SRAM production structure.
[0022] In another aspect of the invention the fin target parameter
values are obtained after a given fabrication step is performed on
the reference semiconductor wafer after which the fin target
includes the layout of exposed FinFET fins lacking FinFET gates and
before any other fabrication step is subsequently performed on the
reference semiconductor wafer.
[0023] In another aspect of the invention the reference tool is a
Critical Dimension Scanning Electron Microscope (CD-SEM), an Atomic
Force Microscope (AFM), a Critical Dimension Atomic Force
Microscope (CD-AFM), or an OCD metrology tool.
[0024] In another aspect of the invention the OCD metrology tool is
configured to provide any of the measurement values and the OCD
model to a semiconductor fabrication tool that causes the
semiconductor fabrication tool to adjust one or more parameters of
the HVM process implemented by the semiconductor fabrication tool
to achieve a desired manufacturing output from the semiconductor
fabrication tool.
[0025] In another aspect of the invention, any of the measurement
values and the OCD model described herein are used to provide
active feedback to a semiconductor manufacturing tool (e.g.,
lithography tool, etch tool, deposition tool, etc.) for controlling
operation of the tool during manufacturing of semiconductors.
BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Aspects of the invention will be understood and appreciated
more fully from the following detailed description taken in
conjunction with the appended drawings in which:
[0027] FIGS. 1A-1D are simplified conceptual illustrations useful
in understanding the invention, where FIGS. 1A-1D show integrated
circuit structures on a semiconductor wafer at various stages
during their fabrication;
[0028] FIGS. 2A and 2B, taken together, is a simplified conceptual
illustration of a system for measuring Static Random Access Memory
(SRAM) structures having Fin Field-effect transistors (FinFET),
constructed and operative in accordance with an embodiment of the
invention; and
[0029] FIG. 3 is a simplified flowchart illustration of an
exemplary method of operation of the system of FIGS. 2A and 2B,
operative in accordance with an embodiment of the invention.
DETAILED DESCRIPTION
[0030] Reference is now made to FIGS. 1A-1D which are simplified
conceptual illustrations useful in understanding the invention,
where FIGS. 1A-1D show integrated circuit structures on a
semiconductor wafer at various stages during their fabrication. In
FIG. 1A several silicon fins 100, 102, 104, 106, and 108 are shown,
which will become fins of Fin Field-effect transistors (FinFET) in
a Static Random Access Memory (SRAM) structure. Fins 100-108 are
shown on a silicon substrate 110 of a semiconductor wafer, where an
oxide layer 112 separates between fins 100-108. FIG. 1B shows a
gate 114 deposited on top of, and perpendicular to, fins 100-108.
FIG. 1C shows an additional oxide layer 116 deposited over fins
100-108 after each of fins 100-108 acquire additional epitaxial
silicon above oxide layer 112 as shown at 118 with reference to fin
100. In FIG. 1C the geometry of each of fins 100-108 on either side
of gate 114 appears as shown in dashed lines at 120, and the top of
gate 114 is not covered by oxide layer 116. FIG. 1D shows the
geometry of each of fins 100-108 within gate 114 after the same
fabrication step as shown in FIG. 1C, at 100', 102', 104', 106',
and 108' respectively. A fin side wall angle is indicated as dotted
line 122, and a fin width critical dimension is indicated as dotted
line 124.
[0031] Reference is now made to FIGS. 2A and 2B, which, taken
together, is a simplified conceptual illustration of a system for
measuring Static Random Access Memory (SRAM) structures having Fin
Field-effect transistors (FinFET), constructed and operative in
accordance with an embodiment of the invention. In FIG. 2A, a
reference tool 200, such as a Critical Dimension Scanning Electron
Microscope (CD-SEM), an Atomic Force Microscope (AFM), a Critical
Dimension Atomic Force Microscope (CD-AFM), or an OCD metrology
tool, such as spectral ellipsometer (SE), Spectral Reflectometer
(SR), Polarized Spectral Reflectometer, etc., is employed during a
reference process, such as a Design of Experiment (DOE) process,
during which one or more reference semiconductor wafers are
fabricated under various conditions to produce integrated circuit
structures for study prior to high-volume manufacturing of such
wafers and structures. During the reference process, reference tool
200 is used to measure a fin target 202 on a reference
semiconductor wafer 204. Fin target 202 is preferably selected such
that it includes a layout of exposed FinFET fins lacking FinFET
gates. In accordance with conventional techniques, reference tool
200 measures fin target 202 to produce a predefined set of fin
target parameter values corresponding to various geometric
parameters of the exposed FinFET fins of fin target 202.
[0032] A spectrum acquisition tool 206 is also employed during the
reference process to measure a SRAM reference structure 208 on
reference semiconductor wafer 204 by recording spectra associated
with SRAM reference structure 208, such as by performing spectrum
photometry on SRAM reference structure 208. SRAM reference
structure 208 is preferably selected such that it includes a layout
of FinFET fins having FinFET gates, where the layout of the exposed
FinFET fins of fin target 202 is substantially similar to or
identical to the layout of FinFET fins of SRAM reference structure
208.
[0033] Reference tool 200 and spectrum acquisition tool 206
preferably perform the above measurements for multiple pairs of fin
targets 202 and SRAM reference structures 208 on one or more
reference semiconductor wafers 204 to obtain multiple fin target
parameter values and SRAM reference structure spectra, preferably
where the different pairs of fin targets and SRAM reference
structures have varying physical dimensions. In one embodiment, fin
target 202 and SRAM reference structure 208 in any of the pairs are
located at different locations on the same semiconductor wafers
204, and are measured after the same fabrication step is performed
or after different fabrication steps are performed. In one
embodiment, fin target 202 and SRAM reference structure 208 in any
of the pairs are located at the same location, or at substantially
the same location, on the same semiconductor wafers 204 and are
measured after different fabrication steps are performed. In one
embodiment, fin target 202 is measured after an oxide etch-back
process is performed (during which oxide is etched back selective
to the silicon material of the fin) and before any other
fabrication step is subsequently performed, and SRAM reference
structure 208 is measured after poly-open chemical-mechanical
planarization (CMP) is performed and before any other fabrication
step is subsequently performed.
[0034] A reference process control unit 210 is configured to
process fin target parameter values and SRAM reference structure
spectra, such as those obtained for different pairs of fin targets
202 and SRAM reference structures 208 on reference semiconductor
wafer 204 in the manner described above, by performing machine
learning (ML) to identify correspondence between the fin target
parameter values and the SRAM reference structure spectra, the
results of which are represented as an ML solution 212. Such
machine learning may employ any known ML technique suitable for
identifying correspondence between fin target parameter values and
SRAM reference structure spectra.
[0035] In FIG. 2B, an OCD model 214 is provided, where OCD model
214 is created in accordance with conventional techniques to model
one or more SRAM production structures, such as a SRAM production
structure 208', to be produced on production semiconductor wafers,
such as a production semiconductor wafer 218, during a high-volume
manufacturing (HVM) process of fabricating integrated circuits. An
OCD metrology tool 220 is configured to obtain spectra associated
with SRAM production structure 208' on production semiconductor
wafer 218 during an HVM process, where SRAM production structure
208' includes FinFETs having both FinFET fins and FinFET gates. The
spectra associated with SRAM production structure 208' are obtained
in accordance with conventional techniques, such as using a
spectrum acquisition tool 206', which may be spectrum acquisition
tool 206 or another spectrum acquisition tool, and in the manner
described above with reference to spectrum acquisition tool 206 in
FIG. 2A. OCD metrology tool 220 identifies in ML solution 212 SRAM
reference structure spectra corresponding to the spectra associated
with SRAM production structure 208', and injects into OCD model 214
fin target parameter values from ML solution 212 corresponding to
the identified SRAM reference structure spectra in ML solution 212.
OCD metrology tool 220 then determines measurement values for the
FinFET gates of SRAM production structure 208' by fitting a
reference spectra associated with SRAM production structure 208' in
OCD model 214 to the spectra associated with SRAM production
structure 208'. OCD metrology tool 220 and spectrum acquisition
tool 206' preferably operate as described above with respect to
multiple SRAM production structures during fabrication of multiple
production semiconductor wafers. OCD metrology tool 220 is
preferably configured to provide any of the measurement values and
OCD model 214 to a semiconductor fabrication tool 222 that causes
semiconductor fabrication tool 222 to adjust one or more parameters
of the HVM process implemented by semiconductor fabrication tool
222 to achieve a desired manufacturing output from semiconductor
fabrication tool 222.
[0036] Reference is now made to FIG. 3 which is a simplified
flowchart illustration of an exemplary method of operation of the
system of FIGS. 2A and 2B, operative in accordance with an
embodiment of the invention. In the method of FIG. 3, a reference
tool is used during a reference process to measure a fin target of
exposed FinFET fins lacking FinFET gates on a reference
semiconductor wafer (step 300), and produce a predefined set of fin
target parameter values corresponding to various geometric
parameters of the exposed FinFET fins of the fin target (step 302).
A spectrum acquisition tool is employed during the reference
process to measure a SRAM reference structure on a reference
semiconductor wafer by recording spectra associated with the SRAM
reference structure, where the SRAM reference structure includes
FinFET fins having FinFET gates, where the FinFET fin layouts of
the fin target and of the SRAM reference structure are
substantially similar or identical (step 304). Steps 300-304 are
performed for multiple pairs of fin targets and SRAM reference
structures of varying physical dimensions on one or more reference
semiconductor wafers (step 306). Machine learning (ML) is performed
to identify correspondence between the fin target parameter values
and the SRAM reference structure spectra, the results of which are
represented as an ML solution (step 308). An OCD metrology tool is
used during a high-volume manufacturing (HVM) process of
fabricating integrated circuits to obtain spectra associated with a
SRAM production structure, having both FinFET fins and FinFET
gates, on a production semiconductor wafer (step 310). SRAM
reference structure spectra corresponding to the spectra associated
with the SRAM production structure are identified in the ML
solution (step 312). Fin target parameter values from the ML
solution corresponding to the identified SRAM reference structure
spectra are injected into an OCD model of SRAM production
structures (step 314). Measurement values for the FinFET gates of
the SRAM production structure are then determined by fitting
reference spectra associated with the SRAM production structure in
the OCD model to the obtained spectra associated with the SRAM
production structure (step 316). Any of the measurement values and
the OCD model are preferably provided to a semiconductor
fabrication tool that causes the semiconductor fabrication tool to
adjust one or more parameters of the HVM process implemented by the
semiconductor fabrication tool to achieve a desired manufacturing
output from the semiconductor fabrication tool.
[0037] The flowchart and block diagrams in the drawing figures
illustrate the architecture, functionality, and operation of
possible implementations of systems, methods, and computer program
products according to various embodiments of the invention. In this
regard, each block in the flowchart or block diagrams may represent
a module, segment, or portion of instructions, which comprises one
or more executable instructions for implementing the specified
logical function(s). In some alternative implementations, the
functions noted in the block may occur out of the order noted in
the drawing figures. For example, two blocks shown in succession
may, in fact, be executed substantially concurrently, or the blocks
may sometimes be executed in the reverse order, depending upon the
functionality involved. It will also be noted that each block of
the block diagrams and/or flowchart illustration, and combinations
of blocks in the block diagrams and/or flowchart illustration, can
be implemented by special purpose hardware-based systems that
perform the specified functions or acts or carry out combinations
of special purpose hardware and computer instructions.
[0038] The descriptions of the various embodiments of the invention
have been presented for purposes of illustration, but are not
intended to be exhaustive or limited to the embodiments disclosed.
Many modifications and variations will be apparent to those of
ordinary skill in the art without departing from the scope and
spirit of the described embodiments. For example, the methods
described herein can be employed on other types of structures on
semiconductor wafers and are not limited to poly-open CMP SRAM
measurement. The terminology used herein was chosen to best explain
the principles of the embodiments, the practical application or
technical improvement over technologies found in the marketplace,
or to enable others of ordinary skill in the art to understand the
embodiments disclosed herein.
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