U.S. patent application number 15/847193 was filed with the patent office on 2018-12-20 for electronic device packages with conformal emi shielding and related methods.
This patent application is currently assigned to Intel Corporation. The applicant listed for this patent is Intel Corporation. Invention is credited to Rajendra Dias, Joshua Heppner, Eric Li, Mitul Modi.
Application Number | 20180366421 15/847193 |
Document ID | / |
Family ID | 57544557 |
Filed Date | 2018-12-20 |
United States Patent
Application |
20180366421 |
Kind Code |
A1 |
Li; Eric ; et al. |
December 20, 2018 |
ELECTRONIC DEVICE PACKAGES WITH CONFORMAL EMI SHIELDING AND RELATED
METHODS
Abstract
Electronic device package technology is disclosed. In one
example, an electronic device package can include a bottom surface
and a side surface extending from the bottom surface. The side
surface can be oriented at a non-perpendicular angle relative to
the bottom surface. In another example, an electronic device
package can include a top planar surface having a first area, a
bottom planar surface having a second area, and a side surface
extending between the top surface and the bottom surface. The
second area can be larger than the first area. In yet another
example, an electronic device package can include a substrate
defining a plane, an electronic component disposed on the
substrate, and a layer of material disposed about a lateral side of
the electronic component. The layer of material can be oriented at
an angle of less than 90 degrees relative to the plane.
Inventors: |
Li; Eric; (Chandler, AZ)
; Heppner; Joshua; (Chandler, AZ) ; Dias;
Rajendra; (Phoenix, AZ) ; Modi; Mitul;
(Phoenix, AZ) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Intel Corporation |
Santa Clara |
CA |
US |
|
|
Assignee: |
Intel Corporation
Santa Clara
CA
|
Family ID: |
57544557 |
Appl. No.: |
15/847193 |
Filed: |
December 19, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
14998292 |
Dec 24, 2015 |
9847304 |
|
|
15847193 |
|
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 23/3121 20130101;
H01L 23/3185 20130101; H01L 24/97 20130101; H01L 23/552 20130101;
H01L 21/561 20130101; H01L 2924/15159 20130101; H01L 2924/1815
20130101; H01L 21/78 20130101; H01L 21/565 20130101; H01L 2924/3025
20130101; H01L 23/3135 20130101; H01L 23/60 20130101 |
International
Class: |
H01L 23/60 20060101
H01L023/60; H01L 21/78 20060101 H01L021/78; H01L 23/31 20060101
H01L023/31; H01L 21/56 20060101 H01L021/56; H01L 23/552 20060101
H01L023/552; H01L 23/00 20060101 H01L023/00 |
Claims
1. A method for making an electronic device package, comprising:
disposing an electronic component on a substrate, the substrate
defining a plane; encapsulating the electronic component in a mold
compound; forming a side surface on the mold compound about a
lateral side of the electronic component, such that the side
surface is oriented at an angle of less than 90 degrees relative to
the plane; and forming a layer of material on the surface of the
mold compound.
2. The method of claim 1, wherein encapsulating the electronic
component comprises molding the mold compound about the electronic
component.
3. The method of claim 1, wherein the electronic component
comprises a plurality of electronic components.
4. The method of claim 1, wherein the side surface is formed by
molding the mold material.
5. The method of claim 1, wherein the side surface is formed by
removing a portion of the mold material.
6. The method of claim 4, wherein the electronic component is a
plurality of electronic components and further comprising dividing
the substrate between the electronic components in order to
separate the plurality of electronic components from one another
into discrete packages.
7. The method of claim 6, wherein dividing the substrate between
electronic components is accomplished by sawing with a beveled saw
blade and wherein the dividing forms a side surface of the
substrate at an angle of less than 90 degrees relative to the
plane.
8. The method of claim 7, wherein the angle of the substrate is
equal to the angle of the side surface of the mold material.
9. The method of claim 5, wherein the electronic component is a
plurality of electronic components and further comprising dividing
the substrate between the electronic components in order to
separate the plurality of electronic components from one another
into discrete packages.
10. The method of claim 9, wherein dividing the substrate between
electronic components is accomplished by sawing with a beveled saw
blade and wherein the dividing forms the side surface of the mold
compound.
11. The method of claim 1, wherein a portion of the layer of
material is formed on the surface of the substrate.
12. The method of claim 1, wherein a portion of the layer of
material is disposed about a top side of the electronic
component.
13. The method of claim 1, wherein forming the layer of material
comprises sputtering.
14. The method of claim 1, wherein the layer of material forms an
electromagnetic shield.
Description
PRIORITY DATA
[0001] This application is a continuation of U.S. patent
application Ser. No. 14/998,292, filed on Dec. 24, 2015, now issued
as U.S. Pat. No. 9,847,304, which is incorporated herein by
reference in its entirety.
TECHNICAL FIELD
[0002] Embodiments described herein relate generally to electronic
device packages.
BACKGROUND
[0003] Electromagnetic interference (EMI) shielding is routinely
used on electronic device packages with small form factors. EMI
shielding is important when electronic components are positioned
close together in order to reduce or prevent disturbances in
operation. One mechanism for creating EMI shielding is with a
conformal sputtering technique. In this case, the material of the
EMI shield is sputtered or deposited on an exposed outer surface of
the electronic device package to a desired thickness in order to
create an EMI shield layer.
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] Invention features and advantages will be apparent from the
detailed description which follows, taken in conjunction with the
accompanying drawings, which together illustrate, by way of
example, various invention embodiments; and, wherein:
[0005] FIG. 1 illustrates an electronic device package in
accordance with an example;
[0006] FIG. 2 illustrates a schematic representation of a top view
of the electronic device package of FIG. 1;
[0007] FIG. 3 illustrates a substrate with electronic components
disposed thereon in accordance with an example of a method for
making an electronic device package;
[0008] FIG. 4 illustrates positioning a mold chase to assist in
encapsulating electronic components on a substrate in a mold
compound in accordance with an example of a method for making an
electronic device package;
[0009] FIG. 5 illustrates encapsulating a mold compound over
electronic components on a substrate by molding the mold compound
about the electronic components in accordance with an example of a
method for making an electronic device package;
[0010] FIG. 6 illustrates a substrate with electronic components
thereon and a layer of mold compound encapsulating the electronic
components following removal of a mold chase in accordance with an
example of a method for making an electronic device package;
[0011] FIG. 7 illustrates dividing a substrate with a mold compound
thereon between electronic components in order to separate the
electronic components from one another into discrete packages in
accordance with an example of a method for making an electronic
device package;
[0012] FIG. 8 illustrates electronic device packages following
separation from a common substrate in accordance with an example of
a method for making an electronic device package;
[0013] FIG. 9 illustrates electronic device packages with an EMI
material layer formed thereon in accordance with an example of a
method for making an electronic device package;
[0014] FIG. 10 illustrates an electronic device package with an EMI
material layer formed thereon in accordance with another
example;
[0015] FIG. 11 illustrates a substrate with electronic components
disposed thereon accordance with an example of a method for making
an electronic device package;
[0016] FIG. 12 illustrates a mold compound encapsulating electronic
components on a substrate in accordance with an example of a method
for making an electronic device package;
[0017] FIG. 13 illustrates dividing the substrate with a mold
compound thereon between electronic components in order to separate
the electronic components from one another into discrete packages
in accordance with an example of a method for making an electronic
device package;
[0018] FIG. 14 illustrates electronic device packages after
separation in accordance with an example of a method for making an
electronic device package;
[0019] FIG. 15 illustrates electronic device packages with an EMI
layer formed thereon in accordance with an example of a method for
making an electronic device package; and
[0020] FIG. 16 is a schematic illustration of an exemplary
computing system.
[0021] Reference will now be made to the exemplary embodiments
illustrated, and specific language will be used herein to describe
the same. It will nevertheless be understood that no limitation of
the scope or to specific invention embodiments is thereby
intended.
DESCRIPTION OF EMBODIMENTS
[0022] Before invention embodiments are disclosed and described, it
is to be understood that no limitation to the particular
structures, process steps, or materials disclosed herein is
intended, but also includes equivalents thereof as would be
recognized by those ordinarily skilled in the relevant arts. It
should also be understood that terminology employed herein is used
for the purpose of describing particular examples only and is not
intended to be limiting. The same reference numerals in different
drawings represent the same element. Numbers provided in flow
charts and processes are provided for clarity in illustrating steps
and operations and do not necessarily indicate a particular order
or sequence. Unless defined otherwise, all technical and scientific
terms used herein have the same meaning as commonly understood by
one of ordinary skill in the art to which this disclosure
belongs.
[0023] As used in this specification and the appended claims, the
singular forms "a," "an" and "the" include plural referents unless
the context clearly dictates otherwise. Thus, for example,
reference to "a layer" includes a plurality of such layers.
[0024] In this disclosure, "comprises," "comprising," "containing"
and "having" and the like can have the meaning ascribed to them in
U.S. Patent law and can mean "includes," "including," and the like,
and are generally interpreted to be open ended terms. The terms
"consisting of" or "consists of" are closed terms, and include only
the components, structures, steps, or the like specifically listed
in conjunction with such terms, as well as that which is in
accordance with U.S. Patent law. "Consisting essentially of" or
"consists essentially of" have the meaning generally ascribed to
them by U.S. Patent law. In particular, such terms are generally
closed terms, with the exception of allowing inclusion of
additional items, materials, components, steps, or elements, that
do not materially affect the basic and novel characteristics or
function of the item(s) used in connection therewith. For example,
trace elements present in a composition, but not affecting the
composition's nature or characteristics would be permissible if
present under the "consisting essentially of" language, even though
not expressly recited in a list of items following such
terminology. When using an open ended term in the specification,
like "comprising" or "including," it is understood that direct
support should be afforded also to "consisting essentially of"
language as well as "consisting of" language as if stated
explicitly and vice versa.
[0025] The terms "first," "second," "third," "fourth," and the like
in the description and in the claims, if any, are used for
distinguishing between similar elements and not necessarily for
describing a particular sequential or chronological order. It is to
be understood that the terms so used are interchangeable under
appropriate circumstances such that the embodiments described
herein are, for example, capable of operation in sequences other
than those illustrated or otherwise described herein. Similarly, if
a method is described herein as comprising a series of steps, the
order of such steps as presented herein is not necessarily the only
order in which such steps may be performed, and certain of the
stated steps may possibly be omitted and/or certain other steps not
described herein may possibly be added to the method.
[0026] The terms "left," "right," "front," "back," "top," "bottom,"
"over," "under," and the like in the description and in the claims,
if any, are used for descriptive purposes and not necessarily for
describing permanent relative positions. It is to be understood
that the terms so used are interchangeable under appropriate
circumstances such that the embodiments described herein are, for
example, capable of operation in other orientations than those
illustrated or otherwise described herein. The term "coupled," as
used herein, is defined as directly or indirectly connected in an
electrical or nonelectrical manner. Objects described herein as
being "adjacent to" each other may be in physical contact with each
other, in close proximity to each other, or in the same general
region or area as each other, as appropriate for the context in
which the phrase is used. Occurrences of the phrase "in one
embodiment," or "in one aspect," herein do not necessarily all
refer to the same embodiment or aspect.
[0027] As used herein, the term "substantially" refers to the
complete or nearly complete extent or degree of an action,
characteristic, property, state, structure, item, or result. For
example, an object that is "substantially" enclosed would mean that
the object is either completely enclosed or nearly completely
enclosed. The exact allowable degree of deviation from absolute
completeness may in some cases depend on the specific context.
However, generally speaking the nearness of completion will be so
as to have the same overall result as if absolute and total
completion were obtained. The use of "substantially" is equally
applicable when used in a negative connotation to refer to the
complete or near complete lack of an action, characteristic,
property, state, structure, item, or result. For example, a
composition that is "substantially free of" particles would either
completely lack particles, or so nearly completely lack particles
that the effect would be the same as if it completely lacked
particles. In other words, a composition that is "substantially
free of" an ingredient or element may still actually contain such
item as long as there is no measurable effect thereof.
[0028] As used herein, the term "about" is used to provide
flexibility to a numerical range endpoint by providing that a given
value may be "a little above" or "a little below" the endpoint.
[0029] As used herein, a plurality of items, structural elements,
compositional elements, and/or materials may be presented in a
common list for convenience. However, these lists should be
construed as though each member of the list is individually
identified as a separate and unique member. Thus, no individual
member of such list should be construed as a de facto equivalent of
any other member of the same list solely based on their
presentation in a common group without indications to the
contrary.
[0030] Concentrations, amounts, sizes, and other numerical data may
be expressed or presented herein in a range format. It is to be
understood that such a range format is used merely for convenience
and brevity and thus should be interpreted flexibly to include not
only the numerical values explicitly recited as the limits of the
range, but also to include all the individual numerical values or
sub-ranges encompassed within that range as if each numerical value
and sub-range is explicitly recited. As an illustration, a
numerical range of "about 1 to about 5" should be interpreted to
include not only the explicitly recited values of about 1 to about
5, but also include individual values and sub-ranges within the
indicated range. Thus, included in this numerical range are
individual values such as 2, 3, and 4 and sub-ranges such as from
1-3, from 2-4, and from 3-5, etc., as well as 1, 2, 3, 4, and 5,
individually.
[0031] This same principle applies to ranges reciting only one
numerical value as a minimum or a maximum. Furthermore, such an
interpretation should apply regardless of the breadth of the range
or the characteristics being described.
[0032] Reference throughout this specification to "an example"
means that a particular feature, structure, or characteristic
described in connection with the example is included in at least
one embodiment. Thus, appearances of the phrases "in an example" in
various places throughout this specification are not necessarily
all referring to the same embodiment.
[0033] Furthermore, the described features, structures, or
characteristics may be combined in any suitable manner in one or
more embodiments. In this description, numerous specific details
are provided, such as examples of layouts, distances, network
examples, etc. One skilled in the relevant art will recognize,
however, that many variations are possible without one or more of
the specific details, or with other methods, components, layouts,
measurements, etc. In other instances, well-known structures,
materials, or operations are not shown or described in detail but
are considered well within the scope of the disclosure.
EXAMPLE EMBODIMENTS
[0034] An initial overview of technology embodiments is provided
below and specific technology embodiments are then described in
further detail. This initial summary is intended to aid readers in
understanding the technology more quickly but is not intended to
identify key or essential features of the technology nor is it
intended to limit the scope of the claimed subject matter.
[0035] EMI shielding layers are often created using a deposition
technique, such as conformal sputtering. Such techniques typically
have a slow deposition rate which can limit the overall throughput
of the process. In addition, such processes are typically highly
directional processes where the deposition rate onto the sides of
an object can be significantly lower than the deposition rate onto
the top of an object (e.g., the side deposition rate can be about
50% of the top deposition rate). As a result, an EMI shielding
layer created by such a technique often has more material on a top
surface than is needed for an effective EMI shield, thus wasting
material and slowing throughput of the process.
[0036] Accordingly, electronic device packages are disclosed in
which the difference in sputtering deposition between the top and
sides of the package are reduced or minimized. In one example, an
electronic device package can include a bottom surface and a side
surface extending from the bottom surface. The side surface can be
oriented at a non-perpendicular angle relative to the bottom
surface. In another example, an electronic device package can
include a top planar surface having a first area, a bottom planar
surface having a second area, and a side surface extending between
the top surface and the bottom surface. The second area can be
larger than the first area. In yet another example, an electronic
device package can include a substrate defining a plane, an
electronic component disposed on the substrate, and a layer of
material disposed about a lateral side of the electronic component.
The layer of material can be oriented at an angle of less than 90
degrees relative to the plane.
[0037] Referring to FIG. 1, an exemplary electronic device package
100 is illustrated. In general, the electronic device package 100
can include a substrate 110 and an electronic component 120
disposed on the substrate 110, such as on a top surface 111 of the
substrate 110. The substrate 110 can include a grounding plane or
trace 115 that can extend between lateral side surfaces 112, 113 of
the substrate 110. The electronic component 120 can be any
electronic device or component that may be included in an
electronic device package, such as a semiconductor device (e.g., a
die, a chip, or a processor).
[0038] The electronic component 120 can be encapsulated, such as
with a mold compound or material 130 (e.g., an epoxy), to protect
the electronic component 120 as well as electrical traces (not
shown) or other electrical features or connections. The mold
compound 130 can envelope the electronic component 120 and overlay
the top surface 111 of the substrate 110. The mold compound 130 can
have any suitable shape or configuration. For example, a top
surface 131 and/or the side surfaces 132, 133 of the mold compound
130 can be planar surfaces, curved surfaces, etc.
[0039] From an exterior perspective, the electronic device package
100 can have a top surface 161, side surfaces 162, 163, and a
bottom surface 164. The side surfaces 162, 163 can extend from the
bottom surface 164, such as between the top surface 161 and the
bottom surface 164. The electronic device package 100 can also
include a layer 140 of material disposed about one or more sides of
the package. In one aspect, one or more of the surfaces 161-164 of
the electronic device package 100 can be formed by the layer 140 of
material. For example, as illustrated in FIG. 1, the top surface
161 and the side surfaces 162, 163 can be formed by the layer 140
of material. Thus, as shown in the figure, portions of the layer
140 of material can be disposed about a top side 151 and/or one or
more lateral sides 152, 153 of the electronic component 120.
Furthermore, a portion of the layer 140 of material can be disposed
about a portion of the substrate 110, such as about a lateral side
of the substrate 110. In one aspect, the layer 140 of material can
be a continuous layer or a discontinuous layer. In another aspect,
the layer 140 of material can be the same material on the top
surface 161 as on the side surface 162 and/or the side surface 163.
Some portion of the substrate 110 can remain uncovered by the layer
140 of material, such as a bottom surface 114 of the substrate 110.
In this case, the bottom surface 114 of the substrate 110 can form
the bottom surface 164 of the electronic device package 100.
[0040] The layer 140 of material as a whole, or individual portions
can be of any suitable shape or configuration. For example, the
portion of the layer 140 of material disposed about the top side
151 of the electronic component 120 can be planar, as illustrated.
Additionally, the portions of the layer 140 of material disposed
about the lateral side 152 and/or the lateral side 153 can be
planar. Typically, the layer 140 of material will have generally
the same shape or configuration as the surfaces 131-133 of the
underlying mold compound 130 and or the side surfaces 112, 113 of
the substrate 110.
[0041] In one aspect, the layer 140 of material can form at least a
portion of an EMI shield for the electronic component 120. For
example, the layer 140 of material forming the top surface 161 and
the side surfaces 162, 163 can form an EMI shield with the
grounding plane or trace 115 included in the substrate 110. Thus,
at least a portion of the layer 140 can be formed of an
electrically conductive material. When the layer 140 of material is
configured to form an EMI shield, the mold compound 130 can be a
dielectric or electrically insulating material disposed between the
electronic component 120 and the layer 140 of material. Any
suitable dielectric or insulating material can be utilized in the
mold compound 130. It should be recognized that the top surface
161, the side surface 162, and the side surface 163 can be formed
at least in part by the layer 140 of material and configured
individually or in any combination as an EMI shield.
[0042] In one aspect, the layer 140 of material can have a
thickness 105a on the top surface 161 that is equal to, or
substantially equal to, a thickness 105b on the at least one of the
side surfaces 162, 163. In another aspect, the thickness 105b of
the layer 140 of material on the side surface 162, 163 can be
within about 80% of the thickness 105a of the layer 140 of material
on the top surface 161. The thickness 105a and/or the thickness
105b of the layer 140 of material can be from about 0.5 .mu.m to
about 15 .mu.m. In a particular aspect, thickness 105a and/or the
thickness 105b can be from about 2 .mu.m to about 5 .mu.m. If the
layer 140 of material is configured as an EMI shield, the
thicknesses 105a, 105b can be increased if a less conductive
material is used, such as for cost savings.
[0043] With further reference to FIG. 1, the substrate 110 can
define a plane 116, such as with the top surface 111 of the
substrate 110. The substrate 110 can also define a plane 117, such
as with the bottom surface 114 of the substrate 110. In one aspect,
at least a portion of the layer 140 of material can be oriented at
an angle 102a, 102b of less than 90 degrees relative to the plane
116 and/or oriented at an angle 103a, 103b of less than 90 degrees
relative to the plane 117. Thus, each side surface 162, 163 can be
oriented at a non-perpendicular angle relative to the bottom
surface 164. In another aspect, each side surface 162, 163 can be
oriented at a non-perpendicular angle 104a, 104b, respectively,
relative to the top surface 161.
[0044] In one aspect, the side surfaces 162, 163 can each have a
first portion 166a, 167a extending from the bottom surface 164 and
oriented at the angle 103a, 103b relative to the bottom surface
164. The first portions 166a, 167a can be disposed about the
lateral sides of the substrate 110. In addition, the side surfaces
162, 163 can each have a second portion 166b, 167b extending from
the top surface 161 and oriented at the angle 104a, 104b relative
to the top surface 161. The second portions 166b, 167b can be
disposed on and/or about the lateral sides of the mold compound
130. The angle 103a and the angle 104a can be equal or different
from one another. Similarly, the angle 103b and the angle 104b can
be equal or different from one another. Thus, the angles on the
same side of the electronic device package 100 can be the same or
different from one another. Furthermore, the angle 103a and the
angle 103b can be equal or different from one another. In addition,
the angle 104a and the angle 104b can be equal or different from
one another. Thus, the angles on opposite sides of the electronic
device package 100 can be the same or different from one
another.
[0045] A component of the electronic device package 100 can include
the top side 151 and the lateral side 152 and/or the lateral side
153 of the layer 140 of a conductive material, where one or both of
the lateral side conductive layers is oriented at the
non-perpendicular angle 104a, 104b relative to the top conductive
layer.
[0046] In one aspect, schematically illustrated in the top view of
FIG. 2, an area 168 of the bottom surface 164 can be larger than an
area 169 of the top surface 161. The top and bottom surfaces 161,
164 can be planar in this example, although other configurations
are possible. Length 106a and width 107a dimensions of the bottom
surface 164 can be greater than corresponding length 106b and width
107b dimensions of the top surface 161.
[0047] FIGS. 3-9 illustrate an exemplary method or process for
making an electronic device package, such as the electronic device
package 100. FIG. 3 illustrates a substrate 109 with electronic
components 120, 120', 120'' disposed on the substrate 109. FIG. 4
illustrates a mold chase 170, which can be used to aid in
encapsulating the electronic components 120, 120', 120'', in a mold
compound, and FIG. 5 illustrates encapsulating the electronic
components 120, 120', 120'' in a mold compound 129 by molding the
mold compound 129 about the electronic components 120, 120', 120''.
Molding can include any suitable type of molding process, such as a
transfer molding process and/or a compression molding process. FIG.
5 shows mold compound portion 136 between the electronic components
120, 120', and mold compound portion 137 between the electronic
components 120', 120''. It should be recognized that the mold chase
170 can be configured and positioned relative to the substrate 109
to minimize or prevent the formation of the mold compound portions
136, 137.
[0048] As shown in FIG. 6, the side surface 132 about a lateral
side of the electronic component 120 can be formed on the mold
compound 129 such that the side surface 132 is oriented at the
angle 102a relative to the plane 116 defined by the substrate 109
and/or the angle 103a relative to the plane 117 defined by the
substrate 109. The side surface 133 about a lateral side of the
electronic component 120 can also be formed on the mold compound
129 such that the side surface 133 is oriented at the angle 102b
relative to the plane 116 and/or the angle 103b relative to the
plane 117. In addition, the side surface 132 can be oriented at the
angle 104a relative to the top surface 131 about a top side of the
electronic component 120. Similarly, the side surface 133 can be
oriented at the angle 104b relative to the top surface 131. The
angles 102a-b, 103a-b, 104a-b are less than 90 degrees. Similar
side surfaces can be formed in the mold compound 129 about the
electronic components 120', 120''.
[0049] FIG. 7 illustrates dividing the substrate 109 and the mold
compound 129 between the electronic components 120, 120', 120'' in
order to separate the electronic components from one another into
discrete packages. The substrate 109 can be subdivided into
substrates of individual packages, such as the substrate 110 (see
FIG. 8). Similarly, the mold compound 129 can be subdivided into
mold compounds of individual packages, such as the mold compound
130 (see FIG. 8). FIG. 7 illustrates dividing the substrate 109 and
the mold compound 129 by cutting, such as with a saw blade 180
(shown in two positions). Any suitable technique, including
mechanical and chemical techniques, can be utilized to divide or
separate the substrate 109 and/or the mold compound 129, such as
cutting (e.g., laser), sawing, shearing, milling, broaching,
etching, etc. Due to formation of the side surfaces 132, 133 of the
mold compound 130 by the mold chase 170 and the minimized size or
absence of the mold compound portions 136, 137, the thickness 106
of the material to be divided can be minimized, which can simplify
and the process of forming individual packages.
[0050] Dividing the substrate 109 can form the side surfaces 112,
113 of the substrate 110, as shown in FIG. 8. For example, the
substrate 109 can be divided to form the side surface 112 of the
substrate 110 oriented at the angle 102a relative to the plane 116
and/or the angle 103a relative to the plane 117. Similarly, the
substrate 109 can be divided to form the side surface 113 of the
substrate 110 oriented at the angle 102b relative to the plane 116
and/or the angle 103b relative to the plane 117. Similar side
surfaces can be formed from the substrate 109 on subdivided
substrates 110', 110''. In this example, the angles of the side
surfaces 112, 132 of the substrate 110 and the mold compound 130
relative to the plane 116 and/or the plane 117 are equal. In
addition, the angles of the side surfaces 113, 133 of the substrate
110 and the mold compound 130 relative to the plane 116 and/or the
plane 117 are equal. It should be recognized, however, that angles
of substrate and mold compound side surfaces of can be different.
The saw blade 180 can be beveled to provide the angled substrate
side surfaces 112, 113.
[0051] A component of the electronic device package 100 can include
the top molded surface 131 and the side molded surface 132 and/or
the side molded surface 133, where one or both of the side molded
surfaces is oriented at a non-perpendicular angle relative to the
top molded surface.
[0052] As shown in FIG. 9, the layer 140 of material can be formed
on the surfaces 131-133 of the mold compound 130 to form the
electronic device package 100.
[0053] Portions of the layer 140 of material can be disposed about
top and lateral sides of the electronic component 120. In addition,
a portion of the layer 140 of material can be formed on a surface
of the substrate 110, such as on the side surfaces 112, 113 of the
substrate. The layer 140 can be formed by depositing material on
the mold compound 130 and the substrate 110. Material can be
deposited in any suitable manner, such as by a sputtering
process.
[0054] Typically, as shown in FIG. 9, material will be deposited in
a direction perpendicular to the top surface 131 of the mold
compound 130, the top surface 111 of the substrate 110, and/or the
bottom surface 114 of the substrate 110. It should be recognized
that material can be deposited in any suitable direction relative
to such features in order to deposit material in a direction that
is non-parallel to the lateral side surfaces 132, 133 of the mold
compound 130 and the side surfaces 112, 113 of the substrate 110.
In one aspect, the orientation of the lateral side surfaces 132,
133 of the mold compound 130 and the side surfaces 112, 113 of the
substrate 110 can be configured based on the material deposition
direction such that the side surfaces are oriented non-parallel to
the deposition direction. The orientation of the top surface 131 of
the mold compound 130 can be perpendicular to the deposition
direction.
[0055] By configuring the angles of the side surfaces 112, 113,
132, 133 relative to the mold compound top surface 131, the
substrate top surface 111, and/or the substrate bottom surface 114
in a manner that maximizes the angle between the side surfaces and
the sputtering direction, the sputtering deposition rate onto the
side surfaces can be increased, thereby improving process
throughput speed and material usage efficiency. Increased
deposition rate onto the side surfaces can reduce the disparity in
layer 140 thickness between the top and side surfaces. Thus, layer
140 thickness uniformity can be maximized by minimizing a
perpendicular orientation of the side surfaces 162, 163 relative to
the top surface 161 of the electronic device package 100.
[0056] The angles 102a-b, 103a-b, 104a-b can range from less than
90 degrees to greater than 0 degrees, limited only by practical
considerations such as package size, which may be increased as
these angles decrease thereby "widening" the package 100. In one
aspect, a portion of the lateral side surface 162, 163 can extend
over or above a portion of the electronic component 120, which can
facilitate minimizing the angles 102a-b, 103a-b, 104a-b (e.g.,
minimizing the perpendicular orientation of the side surfaces 162,
163 relative to the top surface 161) while also minimizing the size
of the package 100 for given angles 102a-b, 103a-b, 104a-b.
[0057] In one aspect, the layer 140 of material can form an
electromagnetic shield as discussed above. A component of the
electronic device package 100 can include the layer 140 of material
deposited on the top and side molded surfaces 131-133. In one
aspect, the layer 140 of material can provide electromagnetic
interference shielding.
[0058] FIG. 10 illustrates an electronic device package 200 in
accordance with another example. The electronic device package 200
is similar in many respects to the electronic device package 100
discussed above. For example, the electronic device package 200
includes a substrate 210, an electronic component 220, a mold
compound 230, and a layer 240 of material, as discussed above.
Thus, the electronic component 220 can be disposed on a top surface
211 of the substrate 210, the mold compound 230 can encapsulate the
electronic component 220, and the layer 240 of material can form an
EMI shield about the electronic component 220, such with a
grounding plane or trace 215 in the substrate 210.
[0059] The electronic device package 200 can have a top surface
261, side surfaces 262, 263, and a bottom surface 264. The side
surfaces 262, 263 can extend from the bottom surface 264, such as
between the top surface 261 and the bottom surface 264. The layer
240 of material can be disposed about one or more sides of the
electronic device package 200. In one aspect, one or more of the
surfaces 261-264 of the electronic device package 200 can be formed
by the layer 240 of material. For example, as illustrated in FIG.
10, the top surface 261 and the side surfaces 262, 263 can be
formed by the layer 240 of material. Thus, as shown in the figure,
portions of the layer 240 of material can be disposed about a top
side 251 and/or one or more lateral sides 252, 253 of the
electronic component 220. Furthermore, a portion of the layer 240
of material can be disposed about a portion of the substrate 210,
such as about a lateral side of the substrate 210. A bottom surface
214 of the substrate 210 can form the bottom surface 264 of the
electronic device package 200.
[0060] In one aspect, the layer 240 of material can have a
thickness 205a on the top surface 261 that is equal to a thickness
205b on the side surface 262, 263. In another aspect, the thickness
205b of the layer 240 of material on the side surface 262, 263 can
be within about 80% of the thickness 205a of the layer 240 of
material on the top surface 261. The thickness 205a and/or the
thickness 205b of the layer 240 of material can be from about 0.5
.mu.m to about 15 .mu.m. In a particular aspect, thickness 205a
and/or the thickness 205b can be from about 2 .mu.m to about 5
.mu.m.
[0061] The substrate 210 can define a plane 216, such as with the
top surface 211 of the substrate 210. The substrate 210 can also
define a plane 217, such as with the bottom surface 214 of the
substrate 210. In one aspect, at least a portion of the layer 240
of material can be oriented at an angle 202a, 202b of less than 90
degrees relative to the plane 216 and/or oriented at an angle 203a,
203b of less than 90 degrees relative to the plane 217. Thus, each
side surface 262, 263 can be oriented at a non-perpendicular angle
relative to the bottom surface 264. In another aspect, each side
surface 262, 263 can be oriented at a non-perpendicular angle 204a,
204b, respectively, relative to the top surface 261. The angle 202a
and the angle 202b can be equal or different from one another.
Similarly, the angle 203a and the angle 203b can be equal or
different from one another. In addition, the angle 204a and the
angle 204b can be equal or different from one another. Thus, the
angles on opposite sides of the electronic device package 200 can
be the same or different from one another.
[0062] FIGS. 11-15 illustrate a method for making an electronic
device package, such as the electronic device package 200. FIG. 11
illustrates a substrate 209 with electronic components 220, 220',
220'' disposed on the substrate 209. FIG. 12 illustrates
encapsulating the electronic components 220, 220', 220'' in a mold
compound 229 by molding the mold compound 229 about the electronic
components 220, 220', 220''. Molding can include any suitable type
of molding process, such as a transfer molding process and/or a
compression molding process.
[0063] FIG. 13 illustrates dividing the substrate 209 and the mold
compound 229 between the electronic components 220, 220', 220'' in
order to separate the electronic components from one another into
discrete packages. The substrate 209 can be subdivided into
substrates of individual packages, such as the substrate 210 (see
FIG. 14). Similarly, the mold compound 229 can be subdivided into
mold compounds of individual packages, such as the mold compound
230 (see FIG. 14). FIG. 13 illustrates dividing the substrate 209
and the mold compound 229 by cutting, such as with a saw blade 280
(shown in two positions). Any suitable technique can be utilized to
divide or separate the substrate 209 and/or the mold compound 229,
such as cutting (e.g., laser), sawing, shearing, milling,
broaching, etc.
[0064] Dividing the substrate 209 can form the side surfaces 232,
223 of the mold compound 230 and the side surfaces 212, 213 of the
substrate 210, as shown in FIG. 14. For example, the mold compound
229 can be divided to form the side surface 232 of the mold
compound 230 oriented at the angle 202a relative to the plane 216
and/or the angle 203a relative to the plane 217. Similarly, the
mold compound 229 can be divided to form the side surface 233 of
the mold compound 230 oriented at the angle 202b relative to the
plane 216 and/or the angle 203b relative to the plane 217. The side
surface 232 of the mold compound 230 can be oriented at the angle
204a relative to the top surface 231 of the mold compound 230.
Similarly, the side surface 233 of the mold compound 230 can be
oriented at the angle 204b relative to the top surface 231 of the
mold compound 230. Similar side surfaces can be formed from the
mold compound 229 about the electronic components 220', 220''.
Thus, the side surfaces 232, 233 can be formed by removing a
portion of the mold compound material 229. In addition, the
substrate 209 can be divided to form the side surface 212 of the
substrate 210 oriented at the angle 202a relative to the plane 216
and/or the angle 203a relative to the plane 217. Similarly, the
substrate 209 can be divided to form the side surface 213 of the
substrate 210 oriented at the angle 202b relative to the plane 216
and/or the angle 203b relative to the plane 217. The angles 202a-b,
203a-b, 204a-b are less than 90 degrees. Similar side surfaces can
be formed from the substrate 209 on subdivided substrates 210',
210''. The saw blade 280 can be beveled to provide the angled mold
compound side surfaces 232, 233 and the angled substrate side
surfaces 212, 213.
[0065] A component of the electronic device package 200 can include
the top mold compound surface 231 and the side mold compound
surface 232 and/or the side mold compound surface 233, where one or
both of the side mold compound surfaces is oriented at a
non-perpendicular angle relative to the top mold compound
surface.
[0066] As shown in FIG. 15, the layer 240 of material can be formed
on the surfaces 231-233 of the mold compound 230 to form the
electronic device package 200. Portions of the layer 240 of
material can be disposed about top and lateral sides of the
electronic component 220. In addition, a portion of the layer 240
of material can be formed on a surface of the substrate 210, such
as on the side surfaces 212, 213 of the substrate. The layer 240
can be formed by depositing material on the mold compound 230 and
the substrate 210. Material can be deposited in any suitable
manner, such as by a sputtering process.
[0067] Material typically will be deposited in a direction
perpendicular to the top surface 231 of the mold compound 230, the
top surface 211 of the substrate 210, and/or the bottom surface 214
of the substrate 210, as shown in FIG. 15. It should be recognized
that material can be deposited in any suitable direction relative
to such features in order to deposit material in a direction that
is non-parallel to the lateral side surfaces 232, 233 of the mold
compound 230 and the lateral side surfaces 212, 213 of the
substrate 210. In one aspect, the orientation of the lateral side
surfaces 232, 233 of the mold compound 230 and the side surfaces
212, 213 of the substrate 210 can be configured based on the
material deposition direction such that the side surfaces are
oriented non-parallel to the deposition direction. The orientation
of the top surface 231 of the mold compound 230 can be
perpendicular to the deposition direction.
[0068] By configuring the angles of the side surfaces 212, 213,
232, 233 relative to the mold compound top surface 231, the
substrate top surface 211, and/or the substrate bottom surface 214
in a manner that maximizes the angle between the side surfaces and
the sputtering direction, the sputtering deposition rate onto the
side surfaces can be increased, thereby improving process
throughput speed and material usage efficiency. Increased
deposition rate onto the side surfaces can reduce the disparity in
layer 240 thickness between the top and side surfaces. Thus, layer
240 thickness uniformity can be maximized by minimizing a
perpendicular orientation of the side surfaces 262, 263 relative to
the top surface 261 of the electronic device package 200.
[0069] The angles 202a-b, 203a-b, 204a-b can range from less than
90 to degrees to greater than 0 degrees, limited only by practical
considerations such as package size, which may be increased as
these angles decrease thereby "widening" the package 200. In one
aspect, a portion of the lateral side surface 262, 263 can extend
over or above a portion of the electronic component 220, which can
facilitate minimizing the angles 202a-b, 203a-b, 204a-b (e.g.,
minimizing the perpendicular orientation of the side surfaces 262,
263 relative to the top surface 261) while also minimizing the size
of the package 200 for given angles 202a-b, 203a-b, 204a-b.
[0070] FIG. 16 illustrates an example computing system 301. The
computing system 301 can include an electronic device package 300
as disclosed herein, coupled to a motherboard 360. In one aspect,
the computing system 301 can also include a processor 381, a memory
device 382, a radio 383, a heat sink 384, a port 385, a slot, or
any other suitable device or component, which can be operably
coupled to the motherboard 360. The computing system 301 can
comprise any type of computing system, such as a desktop computer,
a laptop computer, a tablet computer, a smartphone, a server,
etc.
Examples
[0071] The following examples pertain to further embodiments.
[0072] In one example there is provided, an electronic device
package comprising a bottom surface, and a side surface extending
from the bottom surface, wherein the side surface is oriented at a
non-perpendicular angle relative to the bottom surface.
[0073] In one example of an electronic device package, the side
surface is formed by a layer of material.
[0074] In one example of an electronic device package, the layer of
material forms an electromagnetic shield.
[0075] In one example of an electronic device package, the
electronic device package further comprises a top surface, wherein
the side surface is oriented at a non-perpendicular angle relative
to the top surface.
[0076] In one example of an electronic device package, the top
surface is formed by the layer of material.
[0077] In one example of an electronic device package, the layer of
material is a continuous layer.
[0078] In one example of an electronic device package, the layer of
material is a discontinuous layer.
[0079] In one example of an electronic device package, the layer of
material is the same material on the top surface as on the side
surface.
[0080] In one example of an electronic device package, a thickness
of the layer of material on the side surface is within about 80% of
a thickness of the layer of material on the top surface.
[0081] In one example of an electronic device package, the layer of
material on the top surface and the side surface is equal in
thickness.
[0082] In one example of an electronic device package, the layer of
material has a thickness of from about 0.5 .mu.m to about 15
.mu.m.
[0083] In one example of an electronic device package, the layer of
material of the top surface forms an electromagnetic shield.
[0084] In one example of an electronic device package, the side
surface comprises a first portion extending from the bottom surface
and oriented at a first angle relative to the bottom surface, and a
second portion extending from the top surface and oriented at a
second angle relative to the top surface.
[0085] In one example of an electronic device package, the first
angle is equal to the second angle.
[0086] In one example of an electronic device package, the layer of
material of the second portion is disposed on a mold compound.
[0087] In one example of an electronic device package, the first
portion and the second portion of the side surface are located on a
same side of the electronic device package.
[0088] In one example there is provided, an electronic device
package comprising a top planar surface having a first area, a
bottom planar surface having a second area, wherein the second area
is larger than the first area, and a side surface extending between
the top surface and the bottom surface.
[0089] In one example of an electronic device package, the side
surface is formed by a layer of material.
[0090] In one example of an electronic device package, the layer of
material forms an electromagnetic shield.
[0091] In one example of an electronic device package, the side
surface is oriented at a non-perpendicular angle relative to the
top planar surface.
[0092] In one example of an electronic device package, the top
planar surface is formed by the layer of material.
[0093] In one example of an electronic device package, the layer of
material is a continuous layer.
[0094] In one example of an electronic device package, the layer of
material is a discontinuous layer.
[0095] In one example of an electronic device package, the layer of
material is the same material on the top surface as on the side
surface.
[0096] In one example of an electronic device package, a thickness
of the layer of material on the side surface is within about 80% of
a thickness of the layer of material on the top planar surface.
[0097] In one example of an electronic device package, the layer of
material on the top planar surface and the side surface is equal in
thickness.
[0098] In one example of an electronic device package, the layer of
material has a thickness of from about 0.5 .mu.m to about 15
.mu.m.
[0099] In one example of an electronic device package, the layer of
material of the top planar surface forms an electromagnetic
shield.
[0100] In one example of an electronic device package, the side
surface comprises a first portion extending from the bottom planar
surface and oriented at the first angle relative to the bottom
planar surface, and a second portion extending from the top planar
surface and oriented at a second angle relative to the top planar
surface.
[0101] In one example of an electronic device package, the first
angle is equal to the second angle.
[0102] In one example of an electronic device package, the layer of
material of the second portion is disposed on a mold compound.
[0103] In one example of an electronic device package, the first
portion and the second portion of the side surface are located on a
same side of the electronic device package.
[0104] In one example of an electronic device package, length and
width dimensions of the bottom planar surface are greater than
corresponding length and width dimensions of the top planar
surface.
[0105] In one example of an electronic device package, the
electronic device package comprises a substrate defining a plane,
an electronic component disposed on the substrate, and a layer of
material disposed about a lateral side of the electronic component,
wherein the layer of material is oriented at an angle of less than
90 degrees relative to the plane.
[0106] In one example of an electronic device package, the layer of
material has a thickness of from about 0.5 .mu.m to about 15
.mu.m.
[0107] In one example of an electronic device package, the layer of
material forms an electromagnetic shield.
[0108] In one example of an electronic device package, the
electronic component comprises a semiconductor device.
[0109] In one example of an electronic device package, the
electronic device package comprises a mold compound disposed
between the electronic component and the layer of material.
[0110] In one example of an electronic device package, a portion of
the layer of material is disposed about a top side of the
electronic component.
[0111] In one example of an electronic device package, a thickness
of the layer of material on the lateral side is within about 80% of
a thickness of the layer of material on the top side.
[0112] In one example of an electronic device package, the layer of
material on the top side and the lateral side is equal in
thickness.
[0113] In one example of an electronic device package, the portion
of the layer of material disposed about the top side of the
electronic component is planar.
[0114] In one example of an electronic device package, a portion of
the layer of material is disposed about a portion of the
substrate.
[0115] In one example of an electronic device package, the portion
of the layer of material is disposed about a lateral side of the
substrate.
[0116] In one example of an electronic device package, the portion
of the layer of material disposed about the lateral side of the
substrate is oriented at a second angle less than 90 degrees
relative to the plane.
[0117] In one example of an electronic device package, the first
angle is equal to the second angle.
[0118] In one example of an electronic device package, the
substrate includes a ground plane.
[0119] In one example of an electronic device package, the mold
material envelops the electronic component.
[0120] In one example of an electronic device package, the mold
material overlays a top surface of the substrate.
[0121] In one example there is provided a computing system
comprising a motherboard, and an electronic device package operably
coupled to the motherboard, the electronic device package including
a bottom surface, and a side surface extending from the bottom
surface, wherein the side surface is oriented at a
non-perpendicular angle relative to the bottom surface.
[0122] In one example of a computing system, the computing system
comprises a desktop computer, a laptop, a tablet, a smartphone, a
server, or a combination thereof.
[0123] In one example of a computing system, the computing system
further comprises a processor, a memory device, a heat sink, a
radio, a slot, a port, or a combination thereof operably coupled to
the motherboard.
[0124] In one example there is provided, a component of an
electronic device package comprising a top molded surface, and a
side molded surface, wherein the side molded surface is oriented at
a non-perpendicular angle relative to the top molded surface.
[0125] In one example of a component of an electronic device
package, the component of the electronic device package further
comprises a layer deposited on the top and side molded
surfaces.
[0126] In one example of a computing system, the layer provides
electromagnetic interference shielding.
[0127] In one example there is provided, a component of an
electronic device package comprising a top conductive layer, and a
side conductive layer, wherein the side conductive layer is
oriented at a non-perpendicular angle relative to the top
conductive layer.
[0128] In one example of a component of an electronic device
package, a thickness of the side conductive layer is within about
80% of a thickness of the top conductive layer.
[0129] In one example of a component of an electronic device
package, the top conductive layer and the side conductive layer are
equal in thickness.
[0130] In one example of a component of an electronic device
package, each of the top conductive layer and the side conductive
layer has a thickness of from about 0.5 .mu.m to about 15
.mu.m.
[0131] In one example of a component of an electronic device
package, the side conductive layer comprises a first portion
extending from the top conductive layer and oriented at the first
angle, and a second portion extending from a bottom surface and
oriented at a second angle relative to the bottom surface.
[0132] In one example of a component of an electronic device
package, the first angle is equal to the second angle.
[0133] In one example of a component of an electronic device
package, the first portion is disposed on a mold compound.
[0134] In one example of a component of an electronic device
package, the first portion and the second portion of the side
conductive layer are located on a same side of the electronic
device package.
[0135] In one example there is provided, a method for making an
electronic device package comprising disposing an electronic
component on a substrate, the substrate defining a plane,
encapsulating the electronic component in a mold compound, forming
a side surface on the mold compound about a lateral side of the
electronic component, such that the side surface is oriented at an
angle of less than 90 degrees relative to the plane, and forming a
layer of material on the surface of the mold compound.
[0136] In one example of a method for making an electronic device
package, encapsulating the electronic component comprises molding
the mold compound about the electronic component.
[0137] In one example of a method for making an electronic device
package, molding comprises transfer molding.
[0138] In one embodiment, molding comprises compression
molding.
[0139] In one example of a method for making an electronic device
package, the electronic component comprises a plurality of
electronic components.
[0140] In one example of a method for making an electronic device
package, the side surface is formed by molding the mold
material.
[0141] In one example of a method for making an electronic device
package, the side surface is formed by removing a portion of the
mold material.
[0142] In one example of a method for making an electronic device
package, the electronic component is a plurality of electronic
components and further comprising dividing the substrate between
the electronic components in order to separate the plurality of
electronic components from one another into discrete packages.
[0143] In one example of a method for making an electronic device
package, dividing the substrate between electronic components is
accomplished by sawing with a beveled saw blade and wherein the
dividing forms a side surface of the substrate at an angle of less
than 90 degrees relative to the plane.
[0144] In one example of a method for making an electronic device
package, the angle of the substrate is equal to the angle of the
side surface of the mold material.
[0145] In one example of a method for making an electronic device
package, the electronic component is a plurality of electronic
components and further comprising dividing the substrate between
the electronic components in order to separate the plurality of
electronic components from one another into discrete packages.
[0146] In one example of a method for making an electronic device
package, dividing the substrate between electronic components is
accomplished by sawing with a beveled saw blade and wherein the
dividing forms the side surface of the mold compound.
[0147] In one example of a method for making an electronic device
package, a portion of the layer of material is formed on the
surface of the substrate.
[0148] In one example of a method for making an electronic device
package, a portion of the layer of material is disposed about a top
side of the electronic component.
[0149] In one example of a method for making an electronic device
package, forming the layer of material comprises sputtering.
[0150] In one example of a method for making an electronic device
package, the layer of material forms an electromagnetic shield.
[0151] In one example there is provided, a method of maximizing
thickness uniformity of a layer deposited on a top and side surface
of an electronic device package comprises minimizing a
perpendicular orientation of the side surface relative to a top
surface of the electronic device package, and depositing material
on the top surface and the side surface.
[0152] In one example of a method of maximizing thickness
uniformity of a layer, depositing material comprises
sputtering.
[0153] In one example of a method of maximizing thickness
uniformity of a layer, material is deposited in a direction
perpendicular to the top surface.
[0154] In one example of a method of maximizing thickness
uniformity of a layer, a method of making a computing system
comprises obtaining a motherboard, obtaining an electronic device
package including a bottom surface, and a side surface extending
from the bottom surface, wherein the side surface is oriented at a
non-perpendicular angle relative to the bottom surface, and
coupling the electronic device package to the motherboard.
[0155] In one example of a method of maximizing thickness
uniformity of a layer, the computing system comprises a desktop
computer, a laptop, a tablet, a smartphone, a server, or a
combination thereof.
[0156] In one example of a method of maximizing thickness
uniformity of a layer, the method further comprises coupling a
processor, a memory device, a heat sink, a radio, a slot, a port,
or a combination thereof to the motherboard.
[0157] Circuitry used in electronic components or devices (e.g. a
die) of an electronic device package can include hardware,
firmware, program code, executable code, computer instructions,
and/or software. Electronic components and devices can include a
non-transitory computer readable storage medium which can be a
computer readable storage medium that does not include signal. In
the case of program code execution on programmable computers, the
computing devices recited herein may include a processor, a storage
medium readable by the processor (including volatile and
non-volatile memory and/or storage elements), at least one input
device, and at least one output device. Volatile and non-volatile
memory and/or storage elements may be a RAM, EPROM, flash drive,
optical drive, magnetic hard drive, solid state drive, or other
medium for storing electronic data. Node and wireless devices may
also include a transceiver module, a counter module, a processing
module, and/or a clock module or timer module. One or more programs
that may implement or utilize any techniques described herein may
use an application programming interface (API), reusable controls,
and the like. Such programs may be implemented in a high level
procedural or object oriented programming language to communicate
with a computer system. However, the program(s) may be implemented
in assembly or machine language, if desired. In any case, the
language may be a compiled or interpreted language, and combined
with hardware implementations.
[0158] While the forgoing examples are illustrative of the specific
embodiments in one or more particular applications, it will be
apparent to those of ordinary skill in the art that numerous
modifications in form, usage and details of implementation can be
made without departing from the principles and concepts articulated
herein.
* * * * *