Modi; Mitul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Modi; Mitul.The latest application filed is for "stacked die cavity package".

Company Profile

13.12.27

Modi; Mitul - Phoenix AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ultra-thin, hyper-density semiconductor packages Grant 11,430,724 - Mallik , et al. August 30, 2	2022-08-30
Stacked Die Cavity Package App 20220238402 - MODI; Mitul ; et al.	2022-07-28
Stacked die cavity package Grant 11,328,968 - Modi , et al. May 10, 2	2022-05-10
Dummy Die In A Recessed Mold Structure Of A Packaged Integrated Circuit Device App 20220102231 - Modi; Mitul ; et al.	2022-03-31
Dummy Die Structures Of A Packaged Integrated Circuit Device App 20220102242 - Modi; Mitul ; et al.	2022-03-31
Chip-scale Package Architectures Containing A Die Back Side Metal And A Solder Thermal Interface Material App 20220102234 - Das Mahapatra; Susmriti ; et al.	2022-03-31
Thermally coupled package-on-package semiconductor packages Grant 11,222,877 - Karhade , et al. January 11, 2	2022-01-11
Open Cavity Bridge Power Delivery Architectures And Processes App 20210305133 - KARHADE; Omkar ; et al.	2021-09-30
Open Cavity Bridge Co-planar Placement Architectures And Processes App 20210305132 - KARHADE; Omkar ; et al.	2021-09-30
Substrate With Thermal Insulation App 20210242107 - LI; Wei ; et al.	2021-08-05
Keep Out Zone With Hydrophobic Surface For Integrated Circuit (ic) Package App 20210233867 - ZIADEH; Bassam ; et al.	2021-07-29
Semiconductor package with electromagnetic interference shielding structures Grant 11,024,559 - Heppner , et al. June 1, 2	2021-06-01
No Mold Shelf Package Design And Process Flow For Advanced Package Architectures App 20210104490 - LI; Wei ; et al.	2021-04-08
Wideband Multi-pin Edge Connector For Radio Frequency Front End Module App 20200412041 - Jiang; Zhenguo ; et al.	2020-12-31
Ultra-thin, Hyper-density Semiconductor Packages App 20200273784 - MALLIK; Debendra ; et al.	2020-08-27
Crystalline Carbon Heat Spreading Materials For Ic Die Hot Spot Reduction App 20200273768 - Karhade; Omkar ; et al.	2020-08-27
Ic Die Package Thermal Spreader And Emi Shield Comprising Graphite App 20200273811 - Mallik; Debendra ; et al.	2020-08-27
Active Package Cooling Structures Using Molded Substrate Packaging Technology App 20200273775 - Karhade; Omkar ; et al.	2020-08-27
Coupled Cooling Fins In Ultra-small Systems App 20200273772 - Uppal; Aastha ; et al.	2020-08-27
Thermal Management Solutions For Integrated Circuit Packages App 20200227332 - Singh; Kumar Abhishek ; et al.	2020-07-16
Stacked Die Cavity Package App 20200185289 - MODI; Mitul ; et al.	2020-06-11
Electronic device packages with conformal EMI shielding and related methods Grant 10,325,866 - Li , et al.	2019-06-18
Thermally Coupled Package-on-package Semiconductor App 20190103385 - KARHADE; OMKAR ; et al.	2019-04-04
Electromagnetically shielded electronic devices and related systems and methods Grant 10,224,290 - Dias , et al.	2019-03-05
Die sidewall interconnects for 3D chip assemblies Grant 10,199,354 - Modi , et al. Fe	2019-02-05
Electronic Device Packages With Conformal Emi Shielding And Related Methods App 20180366421 - Li; Eric ; et al.	2018-12-20
Die Sidewall Interconnects For 3d Chip Assemblies App 20180174999 - MODI; Mitul ; et al.	2018-06-21
Electronic device packages with conformal EMI shielding and related methods Grant 9,847,304 - Li , et al. December 19, 2	2017-12-19
Electromagnetically shielded electronic devices and related systems and methods App 20170186697 - Dias; Rajendra ; et al.	2017-06-29
Electronic device packages with conformal emi shielding and related methos App 20170186708 - Li; Eric ; et al.	2017-06-29
Compliant integrated circuit package substrate Grant 7,745,917 - Chandran , et al. June 29, 2	2010-06-29
Compliant Integrated Circuit Package Substrate App 20100133679 - Chandran; Biju ; et al.	2010-06-03
Embedded capacitors for reducing package cracking Grant 7,719,109 - Modi , et al. May 18, 2	2010-05-18
Compliant integrated circuit package substrate Grant 7,691,667 - Chandran , et al. April 6, 2	2010-04-06
Compliant structure for an electronic device, method of manufacturing same, and system containing same Grant 7,692,307 - Rangaraj , et al. April 6, 2	2010-04-06
Compliant structure for an electronic device, method of manufacturing same, and system containing same App 20080137318 - Rangaraj; Sudarshan ; et al.	2008-06-12
Embedded capacitors for reducing package cracking App 20080096310 - Modi; Mitul ; et al.	2008-04-24
Microelectronic assembly having a periphery seal around a thermal interface material App 20080001282 - Modi; Mitul ; et al.	2008-01-03
Compliant integrated circuit package substrate App 20070296072 - Chandran; Biju ; et al.	2007-12-27

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