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Patent applications and USPTO patent grants for Dias; Rajendra.The latest application filed is for "electronic device packages with conformal emi shielding and related methods".
Patent | Date |
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Electronic device packages with conformal EMI shielding and related methods Grant 10,325,866 - Li , et al. | 2019-06-18 |
Electromagnetically shielded electronic devices and related systems and methods Grant 10,224,290 - Dias , et al. | 2019-03-05 |
Electronic Device Packages With Conformal Emi Shielding And Related Methods App 20180366421 - Li; Eric ;   et al. | 2018-12-20 |
Electronic device packages with conformal EMI shielding and related methods Grant 9,847,304 - Li , et al. December 19, 2 | 2017-12-19 |
Electronic device packages with conformal emi shielding and related methos App 20170186708 - Li; Eric ;   et al. | 2017-06-29 |
Electromagnetically shielded electronic devices and related systems and methods App 20170186697 - Dias; Rajendra ;   et al. | 2017-06-29 |
Pin grid array package substrate including slotted pins App 20080272481 - Dias; Rajendra ;   et al. | 2008-11-06 |
Electro-optic time domain reflectometry Grant 7,280,190 - Wang , et al. October 9, 2 | 2007-10-09 |
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