U.S. patent application number 15/636648 was filed with the patent office on 2018-03-01 for electronic structure process.
This patent application is currently assigned to VIA Alliance Semiconductor Co., Ltd.. The applicant listed for this patent is VIA Alliance Semiconductor Co., Ltd.. Invention is credited to Wen-Yuan Chang, Wei-Cheng Chen, Chen-Yueh Kung.
Application Number | 20180061790 15/636648 |
Document ID | / |
Family ID | 60401962 |
Filed Date | 2018-03-01 |
United States Patent
Application |
20180061790 |
Kind Code |
A1 |
Chang; Wen-Yuan ; et
al. |
March 1, 2018 |
ELECTRONIC STRUCTURE PROCESS
Abstract
An electronic structure process includes the following steps. A
redistribution structure and a carrier plate are provided. A
plurality of first bonding protruding portions and a first
supporting structure are formed on the redistribution structure. A
first encapsulated material is formed and filled between a first
opening and the first bonding protruding portions. The carrier
plate is removed. A plurality of second bonding protruding portions
and a second supporting structure are formed on the redistribution
structure. A second encapsulated material is formed and filled
between a second opening and the second bonding protruding
portions.
Inventors: |
Chang; Wen-Yuan; (New Taipei
City, TW) ; Chen; Wei-Cheng; (New Taipei City,
TW) ; Kung; Chen-Yueh; (New Taipei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
VIA Alliance Semiconductor Co., Ltd. |
Shanghai |
|
CN |
|
|
Assignee: |
VIA Alliance Semiconductor Co.,
Ltd.
Shanghai
CN
|
Family ID: |
60401962 |
Appl. No.: |
15/636648 |
Filed: |
June 29, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62380960 |
Aug 29, 2016 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 24/04 20130101;
H01L 2224/16225 20130101; H01L 2924/15174 20130101; H01L 24/14
20130101; H01L 27/00 20130101; H01L 25/04 20130101 |
International
Class: |
H01L 23/00 20060101
H01L023/00; H01L 25/04 20060101 H01L025/04 |
Foreign Application Data
Date |
Code |
Application Number |
May 11, 2017 |
TW |
106115536 |
Claims
1. An electronic structure process, comprising: providing a
redistribution structure and a carrier plate, wherein the
redistribution structure is disposed on the carrier plate; forming
a plurality of first bonding protruding portions and a first
supporting structure on the redistribution structure, wherein the
first supporting structure has a plurality of first openings, and
the first bonding protruding portions are located in the first
openings; forming a first encapsulated material filled between the
first openings and the first bonding protruding portions; removing
the carrier plate; forming a plurality of second bonding protruding
portions and a second supporting structure on the redistribution
structure, wherein the second supporting structure has a plurality
of second openings, the second bonding protruding portions are
located in the second openings, and the redistribution structure is
located between the first supporting structure and the second
supporting structure; forming a second encapsulated material filled
between the second openings and the second bonding protruding
portions.
2. The electronic structure process of claim 1, further comprising:
cutting the first supporting structure, the second supporting
structure, and the redistribution structure along a plurality of
cutting lines between the first openings to faun a plurality of
electronic structures.
3. The electronic structure process of claim 2, wherein a portion
of the first supporting structure and a portion of the second
supporting structure are exposed on the redistribution
structure.
4. The electronic structure process of claim 1, wherein the first
supporting structure and the second supporting structure are
reticular structures.
5. The electronic structure process of claim 1, further comprising:
removing a portion of the first encapsulated material and a portion
of the second encapsulated material such that the first supporting
structure and the first bonding protruding portions are exposed on
the first encapsulated material, and the second supporting
structure and the second bonding protruding portions are exposed on
the second encapsulated material.
6. The electronic structure process of claim 1, wherein the first
bonding protruding portions and the second bonding protruding
portions are formed by electroplating, and an area of the second
bonding protruding portions exposed on the second encapsulated
material is less than an area of the first bonding protruding
portions exposed on the first encapsulated material.
7. The electronic structure process of claim 1, wherein the first
supporting structure and the first bonding protruding portions are
formed by electroplating at the same time.
8. The electronic structure process of claim 1, wherein the second
supporting structure and the second bonding protruding portions are
formed by electroplating at the same time.
9. The electronic structure process of claim 1, wherein the step of
forming the first supporting structure on the redistribution
structure further comprises: adhering the first supporting
structure on the redistribution structure via a first adhesive
layer.
10. The electronic structure process of claim 1, wherein the step
of forming the second supporting structure on the redistribution
structure further comprises: adhering the second supporting
structure on the redistribution structure via a second adhesive
layer.
11. The electronic structure process of claim 1, further
comprising: forming a third supporting structure on the second
supporting structure, wherein the second supporting structure is
located between the first supporting structure and the third
supporting structure, and the third supporting structure has a
plurality of third openings; disposing at least one chip in each of
the third openings, wherein the at least one chip is connected to
the second bonding protruding portions in the corresponding second
opening; and forming a third encapsulated material on the second
encapsulated material, wherein the third encapsulated material is
filled between the second encapsulated material and each of the
corresponding at least one chip.
12. The electronic structure process of claim 11, wherein the third
supporting structure is a reticular structure.
13. The electronic structure process of claim 11, wherein the step
of forming the third supporting structure on the second supporting
structure further comprises: adhering the third supporting
structure on the second supporting structure via a third adhesive
layer.
14. The electronic structure process of claim 11, wherein the third
encapsulated material covers the third supporting structure and the
chips.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the priority benefits of U.S.
provisional application Ser. No. 62/380,960, filed on Aug. 29,
2016, and Taiwan application serial no. 106115536, filed on May 11,
2017. The entirety of each of the above-mentioned patent
applications is hereby incorporated by reference herein and made a
part of this specification.
BACKGROUND OF THE INVENTION
Field of the Invention
[0002] The invention relates to an electronic structure process,
and more particularly, to an electronic structure process for the
field of chip package.
Description of Related Art
[0003] In the field of semiconductor packaging technology, a chip
carrier is an electronic device connecting an IC chip to the next
level, such as a motherboard or module board. A circuit board
having high wiring density is often used as a chip carrier having a
high contact number. The circuit board is mainly formed by the
alternate stacking of a plurality of patterned conductive layers
and a plurality of dielectric layers, and two patterned conductive
layers can be electrically connected to each other via a conductive
via. However, in the current circuit board and chip packaging
process, the issue of warping and the issue of insufficient
structural strength of the product readily occur in the
manufacturing process.
SUMMARY OF THE INVENTION
[0004] The invention provides an electronic structure process that
can increase structural strength and lower production cost of the
process thereof.
[0005] The invention provides an electronic structure process
including the following steps. A redistribution structure and a
carrier plate are provided, wherein the redistribution structure is
disposed on the carrier plate. A plurality of first bonding
protruding portions and a first supporting structure are formed on
the redistribution structure. The first supporting structure has a
plurality of first openings, and the first bonding protruding
portions are located in the first openings. A first encapsulated
material is formed and filled between the first openings and the
first bonding protruding portions. The carrier plate is removed. A
plurality of second bonding protruding portions and a second
supporting structure are formed on the redistribution structure.
The second supporting structure has a plurality of second openings,
and the second bonding protruding portions are located in the
second openings. The redistribution structure is located between
the first supporting structure and the second supporting structure.
A second encapsulated material is formed and filled between the
second openings and the second bonding protruding portions.
[0006] Based on the above, in the electronic structure process of
the invention, since a supporting structure is disposed in the
peripheral region of each of the electronic structures of the
electronic structure array, warping occurring in the process can be
alleviated, and the structural strength of the electronic structure
array can be increased and production cost of the process thereof
can be reduced, such that the yield of the electronic structure is
increased. Moreover, the disposition of the supporting structure
can also improve the overall structural strength of each of the
electronic structures.
[0007] In order to make the aforementioned features and advantages
of the disclosure more comprehensible, embodiments accompanied with
figures are described in detail below.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention and, together with the description,
serve to explain the principles of the invention.
[0009] FIG. 1A to FIG. 1D are top views of the electronic structure
process of an embodiment of the invention in order.
[0010] FIG. 1E to FIG. 1G are bottom views of a subsequent process
of the electronic structure process of FIG. 1D in order.
[0011] FIG. 1H to FIG. 1I are bottom views of a subsequent process
of the electronic structure process of FIG. 1G in order.
[0012] FIG. 2A to FIG. 2I are respectively cross-sectional views of
the structures of FIG. 1A to FIG. 1I along line A-A' of FIG.
1A.
[0013] FIG. 3A and FIG. 3B are respectively top views of the
structures of FIG. 2H and FIG. 2I.
[0014] FIG. 4A is a perspective view of the structures of FIG. 1A
and FIG. 2A in complete state.
[0015] FIG. 4B is a perspective view of the structures of FIG. 1C
and FIG. 2C in complete state.
[0016] FIG. 4C is a perspective view of the structures of FIG. 1E
and FIG. 2E in complete state.
[0017] FIG. 4D is a perspective view of the structures of FIG. 1F
and FIG. 2F in complete state.
[0018] FIG. 4E is a perspective view of the structures of FIG. 1H,
FIG. 2H, and FIG. 3A in complete state.
[0019] FIG. 5 is a cross-sectional view of the electronic structure
of another embodiment of the invention.
[0020] FIG. 6 is a cross-sectional view of the electronic structure
of yet another embodiment of the invention.
[0021] FIG. 7 is a cross-sectional view of the electronic structure
of still yet another embodiment of the invention.
[0022] FIG. 8A to FIG. 8C are bottom views of a subsequent process
of the electronic structure process of FIG. 2H in order.
[0023] FIG. 9A to FIG. 9C are respectively cross-sectional views of
the structures of FIG. 8A to FIG. 8C along line A-A' of FIG.
1A.
[0024] FIG. 10A is a top view of a subsequent process of another
embodiment of the electronic structure process of FIG. 8B.
[0025] FIG. 10B is a cross-sectional view of the structure of FIG.
10A along line A-A' of FIG. 1A.
DESCRIPTION OF THE EMBODIMENTS
[0026] Referring to FIG. 1A, FIG. 2A, and FIG. 4A, the structures
of FIG. 1A and FIG. 2A in complete state are shown in FIG. 4A,
i.e., the structure of FIG. 4A is partially shown in FIG. 1A and
FIG. 2A. In the electronic structure process of the present
embodiment, a carrier plate 110 and a redistribution structure 120
are provided, wherein the redistribution structure 120 has a first
surface S1 and a second surface S2 opposite to each other, and the
redistribution structure 120 is disposed on the carrier plate 110.
Specifically, the second surface S2 of the redistribution structure
120 is connected to the carrier plate 110. The redistribution
structure 120 can be directly manufactured on the carrier plate 110
via a build-up process, and sufficient teaching, suggestion, and
implementation of the detailed manufacturing method thereof can be
obtained from the general knowledge of a relating field and are
therefore not repeated herein. For ease of explaining, FIG. 1A and
FIG. 4A only show a portion of the patterned circuit located on the
first surface S1 in FIG. 2A.
[0027] Please refer to FIG. 1B and FIG. 2B. After the above steps,
a plurality of first bonding protruding portions 130 is foil led on
the redistribution structure 120. Specifically, after the
redistribution structure 120 is manufactured, conductive columns
are formed on a portion of the patterned circuit of the first
surface S1 of the redistribution structure 120 via electroplating,
and the material of the conductive columns is, for instance, copper
or other types of metal. The arrangement method of the plurality of
first bonding protruding portions 130 is, for instance, an array
arrangement as shown in FIG. 1B, but in other embodiments, the
plurality of first bonding protruding portions 130 can be framed
into a different pattern via electroplating based on electrical
property requirements, and the invention is not limited
thereto.
[0028] Referring to FIG. 1C, FIG. 2C, and FIG. 4B, the structures
of FIG. 1C and FIG. 2C in complete state are shown in FIG. 4B,
i.e., the structure of FIG. 4B is partially shown in FIG. 1C and
FIG. 2C. After the above steps, a first supporting structure 150A
is formed on the redistribution structure 120, wherein the first
supporting structure 150A has a plurality of first openings Q1, and
the plurality of first bonding protruding portions 130 is located
in the first openings Q1. In the present embodiment, the step
further includes adhering the first supporting structure 150A on
the redistribution structure 120 via a first adhesive layer 140 to
fix the first supporting structure 150A on the redistribution
structure 120. Specifically, the first adhesive layer 140 is
disposed between the redistribution structure 120 and the first
supporting structure 150A. The first supporting structure 120 is
one reticular structure, such as one reticular reinforced
supporting member. As a result, the supporting structure having a
plurality of openings and the carrier plate can alleviate warping
occurring in the packaging process, in particular a larger package,
and the effect is more significant when the overall thickness is
smaller. Moreover, the first supporting structure 150A having the
plurality of first openings Q1 can increase the structural strength
of the electronic structure array 50 (refer to FIG. 4E) and reduce
the production cost of the manufacture thereof, and therefore the
yield of the electronic structure 100 (refer to FIGS. 1I and 2I and
FIG. 3B) can be increased.
[0029] Please refer to FIG. 1D and FIG. 2D. After the above steps,
a first encapsulated material 160, such as molding compound, is
formed to cover the first supporting structure 150A and the first
bonding protruding portions 130, and the first encapsulated
material 160 is filled between the first openings Q1 and the first
bonding protruding portions 130. In other words, in the present
step, the first encapsulated material 160 is filled on the first
supporting structure 150A and completely covers the first
supporting structure 150A and the first bonding protruding portions
130 such that the first encapsulated material 160 is completely
filled in each of the first openings Q1 in the first supporting
structure 150A to fix the first supporting structure 150A and the
first bonding protruding portions 130. In other embodiments, the
first encapsulated material 160 can also be filled between the
first openings Q1 and the first bonding protruding portions 130 and
not cover the first supporting structure 150A and the first bonding
protruding portions 130, and the invention is not limited
thereto.
[0030] Referring to FIG. 1E, FIG. 2E, and FIG. 4C, the structures
of FIG. 1E and FIG. 2E in complete state are shown in FIG. 4C,
i.e., the structure of FIG. 4C is partially shown in FIG. 1E and
FIG. 2E. After the steps above, the carrier plate 110 is removed.
Since the first encapsulated material 160 is completely filled in
each of the openings Q1, the first supporting structure 150A and
the redistribution structure 120 are fixedly connected to each
other via the first encapsulated material 160 and do not separate.
For ease of explaining, FIG. 1E only shows a portion of the
patterned circuit located on the second surface S2 in FIG. 2E.
[0031] Referring to FIG. 1F, FIG. 2F, and FIG. 4D, the structures
of FIG. 1F and FIG. 2F in complete state are shown in FIG. 4D,
i.e., the structure of FIG. 4D is partially shown in FIG. 1F and
FIG. 2F. After the above steps, a plurality of second bonding
protruding portions 132 and a second supporting structure 152B are
formed on the redistribution structure 120, wherein the second
supporting structure 152B has a plurality of second openings Q2,
the second bonding protruding portions 132 are located in the
second openings Q2, and the redistribution structure 120 is located
between the first supporting structure 150A and the second
supporting structure 152B. Specifically, after the above steps,
conductive columns are formed on a portion of the patterned circuit
of the second surface S2 of the redistribution structure 120 via
electroplating. In the present embodiment, the material and
arrangement method of the conductive columns can be the same as or
different from the first bonding protruding portions 130 based on
electric property requirements, and the invention is not limited
thereto. At the same time, in the step of forming the conductive
columns via electroplating, the second supporting structure 152B is
also formed via electroplating. In other words, in the present
embodiment, the second supporting structure 152B and the plurality
of second bonding protruding portions 132 can be formed on the
redistribution structure 120 at the same time via electroplating,
that is, the second supporting structure 152B and the second
bonding protruding portions 132 are integrally formed. As a result,
the material for forming the second supporting structure 152B can
be reduced. The second supporting structure 152B is one reticular
structure similar to the first supporting structure 150A, such as
one reticular reinforced supporting member. As a result, warping
occurring in the packaging process can be alleviated, in particular
at locations of the redistribution structure 120 having a smaller
thickness (refer to FIG. 2E). Moreover, the second supporting
structure 152B having the plurality of second openings Q2 can
increase the structural strength of the electronic structure array
50 (refer to FIG. 4E) and reduce the production cost of the
manufacture thereof, and therefore the yield of the electronic
structure 100 (refer to FIGS. 1I and 2I and FIG. 3B) can be
increased.
[0032] Please refer to FIG. 1G and FIG. 2G. After the above steps,
a second encapsulated material 162, such as molding compound, is
formed to cover the second supporting structure 152B and the second
bonding protruding portions 132, and the second encapsulated
material 162 is filled between the second openings Q2 and the
second bonding protruding portions 132. In other words, in the
present step, the second encapsulated material 162 is filled on the
second supporting structure 152B and completely covers the second
supporting structure 152B and the second bonding protruding
portions 132 such that the second encapsulated material 162 is
completely filled in each of the second openings Q2 in the second
supporting structure 152B to fix the second supporting structure
152B and the second bonding protruding portions 132. In other
embodiments, the second encapsulated material 162 can also be
filled between the second openings Q2 and the second bonding
protruding portions 132 and not cover the second supporting
structure 152B and the second bonding protruding portions 132, and
the invention is not limited thereto.
[0033] Referring to FIG. 1H, FIG. 2H, FIG. 3A, and FIG. 4E, the
structures of FIG. 1H, FIG. 2H, and FIG. 3A in complete state are
shown in FIG. 4E, i.e., the structure of FIG. 4E is partially shown
in FIG. 1H, FIG. 2H, and FIG. 3A. After the above steps, a portion
of the first encapsulated material 160 and a portion of the second
encapsulated material 162 can further be removed such that the
first supporting structure 150A and the first bonding protruding
portions 130 are exposed on the first encapsulated material 160,
and the second supporting structure 152B and the second bonding
protruding portions 132 are exposed on the second encapsulated
material 162 such that the first bonding protruding portions 130
and the second bonding protruding portions 132 are used for the
subsequent bonding of other devices or apparatuses. Specifically,
in the present embodiment, a portion of the first encapsulated
material 160 protruding beyond the first bonding protruding
portions 130 and a portion of the second encapsulated material 162
protruding beyond the second bonding protruding portions 132 can be
removed via a process method such as etching, sandblasting, or
polishing, such that the first bonding protruding portions 130 and
the second bonding protruding portions 132 can respectively expose
the first encapsulated material 160 and the second encapsulated
material 162. Moreover, in the present embodiment, the area of the
second bonding protruding portions 132 exposed on the second
encapsulated material 162 is less than the area of the first
bonding protruding portions 130 exposed on the first encapsulated
material 160 to achieve the object of a fan-out signal to a circuit
to be subsequently bonded with a target. Moreover, the exposed
portions of the first bonding protruding portions 130 and the
second bonding protruding portions 132 protruding beyond the first
encapsulated material 160 and the second encapsulated material 162
can be decided based on the change in the target to be bonded, and
the invention is not limited thereto. At this point, the electronic
structure array 50 is complete, and the electronic structure array
50 contains a plurality of uncut electronic structures 100 as shown
in FIG. 4E.
[0034] Please refer to FIG. 1I, FIGS. 2I, and 3B. After the above
steps, the first supporting structure 150A, the second supporting
structure 152B, and the redistribution structure 120 are cut along
a plurality of cutting lines L between the first openings Q1 (refer
to FIG. 1H, FIG. 2H, FIG. 3A, and FIG. 4E) to form a plurality of
electronic structures 100. In other words, each of the electronic
structures 100 formed by cutting the first supporting structure
150A and the second supporting structure 152B along the cutting
lines L has a portion of the first supporting structure 150A and a
portion of the second supporting structure 152B, and the portion of
the first supporting structure 150A and the portion of the second
supporting structure 152B are two annular reinforced supporting
members for a single electronic structure 100, and can increase the
overall structural strength of the electronic structure 100, in
particular at locations having a smaller overall structural
thickness. More specifically, since the two annular reinforced
supporting members are formed by cutting along the cutting lines L,
the two reinforced supporting members are both exposed at a side
102 of a single electronic structure 100, and therefore better
protection is provided to the peripheral region of the electronic
structure 100. Similarly, the redistribution structure 120 is also
cut along the cutting lines L such that a portion of the
redistribution structure 120 is exposed at the side 102 of a single
electronic structure 100.
[0035] Referring further to FIG. 1H, FIG. 2H, FIG. 3A, and FIG. 4E,
specifically, in the present embodiment, the electronic structure
array 50 includes a plurality of electronic structures 100, and the
electronic structures 100 are suitable for array arrangement to
form the electronic structure array 50 as shown in FIG. 4E. Each of
the electronic structures 100 includes a redistribution structure
120, a first supporting structure 150A, a second supporting
structure 152B, a plurality of first bonding protruding portions
130, a plurality of second bonding protruding portions 132, a first
encapsulated material 160, and a second encapsulated material 162.
The first supporting structure 150A has a first opening Q1 and is
disposed on a first surface Si of the redistribution structure 120.
The second supporting structure 152B has a second opening Q2
disposed on a second surface S2 of the redistribution structure 120
opposite to the first surface S1. The plurality of first bonding
protruding portions 130 is disposed on the first surface S1 of the
redistribution structure 120 and located in the first opening Q1.
The plurality of second bonding protruding portions 132 is disposed
on the second surface S2 of the redistribution structure 120 and
located in the second opening Q2. The first encapsulated material
160 is filled between the first opening Q1 and the first bonding
protruding portions 130. The second encapsulated material 162 is
filled between the second opening Q2 and the second bonding
protruding portions 132. In other words, the electronic structures
100 are formed by cutting the electronic structure array 50, and
therefore the redistribution structure 120, the first supporting
structure 150A, and the second supporting structure 152B are also
formed in each of the electronic structures 100 by cutting. Since
the first supporting structure 150A and the second supporting
structure 152B are disposed in the peripheral region of each of the
electronic structures 100 of the electronic structure array 50,
warping occurring in the packaging process of the electronic
structure array 50 can be alleviated, and the structural strength
of the electronic structure array 50 can be increased and
production cost of the manufacture thereof can be reduced, such
that the yield of the electronic structure 100 is increased.
Moreover, the disposition of the first supporting structure 150A
and the second supporting structure 152B can also improve the
overall structural strength of each of the electronic structures
100.
[0036] Referring further to FIG. 1I, FIG. 2I, and FIG. 3B,
specifically, in the present embodiment, the electronic structures
100 include a redistribution structure 120, a first supporting
structure 150A, a second supporting structure 152B, a plurality of
first bonding protruding portions 130, a plurality of second
bonding protruding portions 132, a first encapsulated material 160,
and a second encapsulated material 162. The first supporting
structure 150A has a first opening Q1 and is disposed on a first
surface S1 of the redistribution structure 120. The second
supporting structure 152B has a second opening Q2 and is disposed
on a second surface S2 of the redistribution structure 120 opposite
to the first surface S1. The plurality of first bonding protruding
portions 130 is disposed on the first surface S1 of the
redistribution structure 120 and located in the first opening Q1.
The plurality of second bonding protruding portions 132 is disposed
on the second surface S2 of the redistribution structure 120 and
located in the second opening Q2. The first encapsulated material
160 is filled between the first opening Q1 and the first bonding
protruding portions 130. The second encapsulated material 162 is
filled between the second opening Q2 and the second bonding
protruding portions 132. In particular, the electronic structures
100 are formed by cutting the electronic structure array 50 (refer
to FIG. 4E), and therefore the redistribution structure 120, the
first supporting structure 150A, and the second supporting
structure 152B are also formed in each of the electronic structures
100 by cutting. Since the first supporting structure 150A and the
second supporting structure 152B are disposed in the peripheral
region of the electronic structures 100, the overall structural
strength of the electronic structures 100 can be improved, in
particular at locations having a smaller overall structural
thickness.
[0037] Referring to FIG. 5, electronic structures 100A of the
present embodiment are similar to the electronic structures 100 of
FIG. 2I, and the main difference between the two is that, in the
step of forming the plurality of first bonding protruding portions
130 on the redistribution structure 120 (refer to FIG. 2B), the
first supporting structure 150B and the first bonding protruding
portions 130 are formed on the redistribution structure 120 via
electroplating at the same time, that is, the first supporting
structure 150B and the first bonding protruding portions 130 are
integrally formed. As a result, the material for forming the first
supporting structure 150B can be reduced.
[0038] Referring to FIG. 6, electronic structures 100B of the
present embodiment are similar to the electronic structures 100A of
FIG. 5, and the main difference between the two is that, in the
step of foaming the plurality of second bonding protruding portions
132 on the redistribution structure 120, the second supporting
structure 152A is adhered on the redistribution structure 120 via a
second adhesive layer 142 such that the second supporting structure
152A is fixed on the redistribution structure 120. Specifically,
the second adhesive layer 142 is disposed between the
redistribution structure 120 and the second supporting structure
152A. As a result, the supporting structure having a plurality of
openings can alleviate warping occurring in the packaging process,
in particular at locations having a smaller overall structural
thickness.
[0039] Referring to FIG. 7, electronic structures 100C of the
present embodiment are similar to the electronic structures 100 of
FIG. 2I, and the main difference between the two is that, in the
step of forming the plurality of second bonding protruding portions
132 on the redistribution structure 120 (refer to FIG. 2F), the
second supporting structure 152A is adhered on the redistribution
structure 120 via the second adhesive layer 142 such that the
second supporting structure 152A is fixed on the redistribution
structure 120. Specifically, the second adhesive layer 142 is
disposed between the redistribution structure 120 and the second
supporting structure 152A. As a result, the supporting structure
having a plurality of openings can alleviate warping occurring in
the packaging process, in particular at locations having a smaller
overall structural thickness.
[0040] Please refer to FIG. 8A and FIG. 9A. After the step of
removing a portion of the first encapsulated material 160 and a
portion of the second encapsulated material 162, a third supporting
structure 154A is formed on the second supporting structure 152A,
wherein the second supporting structure 152A is located between the
first supporting structure 150B and the third supporting structure
154A, and the third supporting structure 154A has a plurality of
third openings Q3. In the step of forming the third supporting
structure 154A on the second supporting structure 152A, the third
supporting structure 154A is adhered on the second supporting
structure 152A via a third adhesive layer 144, wherein the third
supporting structure 154A is a reticular structure such as one
reticular reinforced supporting member. As a result, warping
occurring to the target subsequently to be bonded on the second
bonding protruding portions 132 in the packaging process thereof
can be alleviated and the overall structural strength can be
improved, in particular at locations having a smaller overall
structural thickness.
[0041] Please refer to FIG. 8B and FIG. 9B. After the above steps,
a chip 170 is disposed in each of the third openings Q3, and the
chips 170 are connected to the plurality of second bonding
protruding portions 132 in the corresponding second opening Q2. In
other words, one chip 170 is disposed on the plurality of second
bonding protruding portions 132 in each of the second openings Q2,
but in other embodiments, two or more chips can also be disposed,
and the invention is not limited thereto. Specifically, the chips
170 are disposed and directly connected to the second bonding
protruding portions 132, and via the disposition of the
redistribution structure 120, the signal on the chips 170 can be
fanned-out to outside the projection region of the chips 170 of the
redistribution structure 120 to improve the flexibility of signal
disposition of the chips 170. Moreover, the second bonding
protruding portions 132 can be directly electrically connected to a
pad 170a on the chips 170 without the addition of bumps. Moreover,
a plurality of solder balls (not shown) can be further disposed on
the first bonding protruding portions 130, and the redistribution
structure 120 is located between the chips 170 and the solder
balls.
[0042] Please refer to FIG. 8C and FIG. 9C. After the above steps,
a third encapsulated material 164A is formed on the second
encapsulated material 162, and the third encapsulated material 164A
is filled between the second encapsulated material 162 and the
corresponding chip 170 to complete a chip package array 50A. In
other words, in the present step, the third encapsulated material
164A is filled on the second encapsulated material 162 and
completely covers the third supporting structure 154A and the chips
170 such that the third encapsulated material 164A is completely
filled in each of the third openings Q3 in the third supporting
structure 154A to fix the third supporting structure 154A and the
chips 170.
[0043] Please refer to FIG. 10A and FIG. 10B. The electronic
structure process steps of the present embodiment are similar to
the electronic structure process steps of FIG. 8C and FIG. 9C, and
the main difference between the two is the disposition of the third
encapsulated material 164B. Specifically, in the above steps, the
third encapsulated material 164B can only be filled between the
second encapsulated material 162 and the corresponding chip 170, or
a portion of the third encapsulated material 164A is removed (refer
to FIG. 8C and FIG. 9C) to form the third encapsulated material
164B to expose the chips 170 to complete a chip package array 50B.
As a result, the chips 170 can be exposed outside the electronic
structure array 50B to be in contact with a thermal conductor such
that a single subsequently cut electronic structure can have better
heat dissipation.
[0044] Based on the above, in the electronic structure process of
the invention, since a supporting structure is disposed in the
peripheral region of each of the electronic structures of the
electronic structure array, warping occurring in the process can be
alleviated, in particular at locations having a smaller overall
structural thickness, and the structural strength of the electronic
structure array can be increased and production cost of the process
thereof can be reduced, such that the yield of the electronic
structure is increased. Moreover, the disposition of the supporting
structure can also improve the overall structural strength of each
of the electronic structures.
[0045] Although the invention has been described with reference to
the above embodiments, it will be apparent to one of ordinary skill
in the art that modifications to the described embodiments may be
made without departing from the spirit of the invention.
Accordingly, the scope of the invention is defined by the attached
claims not by the above detailed descriptions.
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