Kung; Chen-Yueh
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kung; Chen-Yueh.The latest application filed is for "probe card".
Company Profile
3.24.27
- Kung; Chen-Yueh - New Taipei TW
- Kung; Chen-Yueh - New Taipei City TW
- Kung; Chen-Yueh - Taipei Hsien N/A TW
- Kung; Chen-Yueh - Taoyuan Hsien TW
Patent Activity
| Patent | Date |
|---|---|
| Process for fabricating a circuit substrate Grant 10,573,614 - Kung Feb | 2020-02-25 |
| Probe card Grant 10,459,007 - Kung , et al. Oc | 2019-10-29 |
| Probe Card App 20190120875 - Kung; Chen-Yueh ; et al. | 2019-04-25 |
| Circuit substrate and semiconductor package structure Grant 10,204,852 - Hsu , et al. Feb | 2019-02-12 |
| Probe card Grant 10,184,956 - Kung , et al. Ja | 2019-01-22 |
| Process For Fabricating A Circuit Substrate App 20190006302 - Kung; Chen-Yueh | 2019-01-03 |
| Probe card Grant 10,119,995 - Kung , et al. November 6, 2 | 2018-11-06 |
| Circuit substrate and semicondutor package structure Grant 10,103,115 - Kung October 16, 2 | 2018-10-16 |
| Probe Card App 20180267084 - Kung; Chen-Yueh ; et al. | 2018-09-20 |
| Circuit substrate, semiconductor package and process for fabricating the same Grant 10,014,246 - Kung July 3, 2 | 2018-07-03 |
| Electronic structure, and electronic structure array Grant 10,002,839 - Chang , et al. June 19, 2 | 2018-06-19 |
| Electronic Structure, And Electronic Structure Array App 20180061789 - Chang; Wen-Yuan ; et al. | 2018-03-01 |
| Electronic Structure Process App 20180061790 - Chang; Wen-Yuan ; et al. | 2018-03-01 |
| Electronic structure process Grant 9,905,519 - Chang , et al. February 27, 2 | 2018-02-27 |
| Circuit substrate and package structure Grant 9,786,588 - Kung , et al. October 10, 2 | 2017-10-10 |
| Circuit Substrate And Semiconductor Package Structure App 20170148720 - HSU; Yeh-Chi ; et al. | 2017-05-25 |
| Circuit substrate and semiconductor package structure Grant 9,601,425 - Hsu , et al. March 21, 2 | 2017-03-21 |
| Circuit Substrate, Semiconductor Package And Process For Fabricating The Same App 20170025343 - Kung; Chen-Yueh | 2017-01-26 |
| Circuit substrate Grant 9,532,467 - Kung December 27, 2 | 2016-12-27 |
| Circuit substrate, semiconductor package and process for fabricating the same Grant 9,497,864 - Kung November 15, 2 | 2016-11-15 |
| Circuit substrate Grant 9,425,066 - Kung , et al. August 23, 2 | 2016-08-23 |
| Circuit Substrate And Package Structure App 20160172289 - KUNG; Chen-Yueh ; et al. | 2016-06-16 |
| Circuit Substrate And Semiconductor Package Structure App 20160126175 - HSU; Yeh-Chi ; et al. | 2016-05-05 |
| Process for fabricating a circuit substrate Grant 9,324,580 - Kung , et al. April 26, 2 | 2016-04-26 |
| Process For Fabricating The Same App 20150303074 - Kung; Chen-Yueh ; et al. | 2015-10-22 |
| Fabricating method of circuit board and circuit board Grant 9,066,458 - Kung June 23, 2 | 2015-06-23 |
| Probe Card App 20150123690 - Kung; Chen-Yueh ; et al. | 2015-05-07 |
| Circuit Substrate, Semicondutor Package Structure And Process For Fabricating A Circuit Substrate App 20150061119 - Kung; Chen-Yueh | 2015-03-05 |
| Circuit Substrate, Semiconductor Package And Process For Fabricating The Same App 20140293547 - Kung; Chen-Yueh | 2014-10-02 |
| Circuit Substrate And Process For Fabricating The Same App 20140077357 - Kung; Chen-Yueh ; et al. | 2014-03-20 |
| Circuit Substrate App 20140000953 - Kung; Chen-Yueh | 2014-01-02 |
| Fabricating process of circuit substrate Grant 8,549,745 - Kung October 8, 2 | 2013-10-08 |
| Fabricating Method Of Circuit Board And Circuit Board App 20130213692 - Kung; Chen-Yueh | 2013-08-22 |
| Circuit Substrate App 20130025926 - Kung; Chen-Yueh ; et al. | 2013-01-31 |
| Process for fabricating circuit substrate Grant 8,302,298 - Kung , et al. November 6, 2 | 2012-11-06 |
| Circuit Substrate App 20120267155 - Kung; Chen-Yueh | 2012-10-25 |
| Fabricating process of circuit substrate Grant 8,261,436 - Kung September 11, 2 | 2012-09-11 |
| Circuit Substrate And Fabricating Process Of Circuit Substrate App 20120018207 - Kung; Chen-Yueh | 2012-01-26 |
| Circuit Substrate And Fabricating Process Thereof App 20110108313 - Kung; Chen-Yueh | 2011-05-12 |
| Process For Fabricating Circuit Substrate, And Circuit Substrate App 20110108315 - KUNG; CHEN-YUEH ; et al. | 2011-05-12 |
| Electronic Apparatus App 20090296330 - Ho; Kwun-Yao ; et al. | 2009-12-03 |
| Integrated circuit package and method of manufacture Grant 7,087,991 - Chen , et al. August 8, 2 | 2006-08-08 |
| High density laminated substrate structure and manufacture method thereof Grant 6,977,348 - Ho , et al. December 20, 2 | 2005-12-20 |
| Method and structure for tape ball grid array package Grant 6,779,783 - Kung , et al. August 24, 2 | 2004-08-24 |
| Under-bump metallugical structure App 20030222352 - Kung, Chen-Yueh ; et al. | 2003-12-04 |
| High density laminated substrate structure and manufacture method thereof App 20030223207 - Ho, Kwun-Yao ; et al. | 2003-12-04 |
| Integrated circuit package and method of manufacture App 20030133274 - Chen, Kuo-Tso ; et al. | 2003-07-17 |
| Method and structure for tape ball grid array package App 20030100212 - Kung, Chen-Yueh ; et al. | 2003-05-29 |
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