Chang; Wen-Yuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chang; Wen-Yuan.The latest application filed is for "chip package structure and chip package structure array".
Company Profile
7.43.51
- Chang; Wen-Yuan - New Taipei TW
- Chang; Wen-Yuan - New Taipei City TW
- Chang; Wen-Yuan - Taipei Hsien N/A TW
- Chang; Wen Yuan - Miaoli County N/A TW
- Chang; Wen-Yuan - Zhunan Township TW
- CHANG; WEN YUAN - MIAOLI COUNTY 351 TW
- Chang; Wen-Yuan - Hsinchu TW
- Chang; Wen-Yuan - Hsin-Chu TW
- Chang; Wen Yuan - Shindian TW
- Chang; Wen-Yuan - Taipei TW
- Chang; Wen-Yuan - Taipei City TW
- Chang; Wen-Yuan - Hsin-Tien TW
- Chang; Wen-Yuan - Hsinchu City TW
- Chang; Wen Yuan - Shindian City TW
- Chang; Wen-Yuan - Hsin-Tien City TW
- Chang, Wen-Yuan - Taipie Hsien TW
- Chang, Wen Yuan - Chia-Yi TW
Patent Activity
| Patent | Date |
|---|---|
| Chip package array, and chip package Grant 11,227,848 - Chang , et al. January 18, 2 | 2022-01-18 |
| Chip package process Grant 11,081,371 - Chang , et al. August 3, 2 | 2021-08-03 |
| Chip packaging method Grant 10,756,077 - Chang , et al. A | 2020-08-25 |
| Chip package structure and chip package structure array Grant 10,504,847 - Chang , et al. Dec | 2019-12-10 |
| Probe card Grant 10,459,007 - Kung , et al. Oc | 2019-10-29 |
| Chip Package Structure And Chip Package Structure Array App 20190139898 - Chang; Wen-Yuan ; et al. | 2019-05-09 |
| Chip Packaging Method App 20190139952 - Chang; Wen-Yuan ; et al. | 2019-05-09 |
| Probe Card App 20190120875 - Kung; Chen-Yueh ; et al. | 2019-04-25 |
| Probe card Grant 10,184,956 - Kung , et al. Ja | 2019-01-22 |
| Probe card Grant 10,119,995 - Kung , et al. November 6, 2 | 2018-11-06 |
| Probe Card App 20180267084 - Kung; Chen-Yueh ; et al. | 2018-09-20 |
| Electronic structure, and electronic structure array Grant 10,002,839 - Chang , et al. June 19, 2 | 2018-06-19 |
| Electronic Structure, And Electronic Structure Array App 20180061789 - Chang; Wen-Yuan ; et al. | 2018-03-01 |
| Chip Package Process App 20180061672 - Chang; Wen-Yuan ; et al. | 2018-03-01 |
| Electronic Structure Process App 20180061790 - Chang; Wen-Yuan ; et al. | 2018-03-01 |
| Chip Package Array, And Chip Package App 20180061788 - Chang; Wen-Yuan ; et al. | 2018-03-01 |
| Electronic structure process Grant 9,905,519 - Chang , et al. February 27, 2 | 2018-02-27 |
| Electronic package assembly Grant 9,788,425 - Chang , et al. October 10, 2 | 2017-10-10 |
| Electronic Package Assembly App 20160302306 - CHANG; Nai-Shung ; et al. | 2016-10-13 |
| Circuit substrate Grant 9,425,066 - Kung , et al. August 23, 2 | 2016-08-23 |
| Chip package structure Grant 9,418,964 - Chang , et al. August 16, 2 | 2016-08-16 |
| Process for fabricating a circuit substrate Grant 9,324,580 - Kung , et al. April 26, 2 | 2016-04-26 |
| Process For Fabricating The Same App 20150303074 - Kung; Chen-Yueh ; et al. | 2015-10-22 |
| Probe Card App 20150123690 - Kung; Chen-Yueh ; et al. | 2015-05-07 |
| Circuit board and chip package structure Grant 8,796,848 - Chang , et al. August 5, 2 | 2014-08-05 |
| Integrated circuit package and physical layer interface arrangement Grant 8,698,325 - Chang , et al. April 15, 2 | 2014-04-15 |
| Circuit Substrate And Process For Fabricating The Same App 20140077357 - Kung; Chen-Yueh ; et al. | 2014-03-20 |
| Conveyor-belt linking apparatus of metallurgical furnace Grant 8,602,207 - Chang December 10, 2 | 2013-12-10 |
| Chip package structure and package substrate Grant 8,508,024 - Chang August 13, 2 | 2013-08-13 |
| Chip Package Structure App 20130175681 - Chang; Wen-Yuan ; et al. | 2013-07-11 |
| Crystal Growth Furnace And Moving Method Thereof App 20130055764 - Chang; Wen-Yuan | 2013-03-07 |
| Conveyor-belt Cooling Apparatus Of Metallurgical Furnace App 20130043108 - CHANG; WEN YUAN | 2013-02-21 |
| Conveyor-belt Linking Apparatus Of Metallurgical Furnace App 20130043109 - CHANG; WEN YUAN | 2013-02-21 |
| Automatic Continuous Feeding Device Of Metallurgical Furnace App 20130020745 - CHANG; WEN YUAN | 2013-01-24 |
| Separation Type Metallurgical Reduction Method And Apparatus Thereof App 20130009349 - CHANG; WEN YUAN | 2013-01-10 |
| Integrated Circuit Package And Physical Layer Interface Arrangement App 20120098125 - Chang; Wen-Yuan ; et al. | 2012-04-26 |
| Apparatus compensating a scanned object for optical characteristics according to light sources of different wavelengths Grant RE42,710 - Chang September 20, 2 | 2011-09-20 |
| Package Box Module App 20110215019 - Wu; Chung-Hsing ; et al. | 2011-09-08 |
| Chip Package Structure And Package Substrate App 20110169147 - Chang; Wen-Yuan | 2011-07-14 |
| Circuit Board And Chip Package Structure App 20110108984 - Chang; Wen-Yuan ; et al. | 2011-05-12 |
| Fabrication method of circuit board Grant 7,906,377 - Chang , et al. March 15, 2 | 2011-03-15 |
| Chip package and substrate thereof Grant 7,868,439 - Chang , et al. January 11, 2 | 2011-01-11 |
| Circuit Board And Fabrication Method Thereof And Chip Package Structure App 20100155939 - Chang; Wen-Yuan ; et al. | 2010-06-24 |
| Electronic Apparatus App 20090296330 - Ho; Kwun-Yao ; et al. | 2009-12-03 |
| Package structure for panel module and method using the same Grant 7,609,524 - Ting , et al. October 27, 2 | 2009-10-27 |
| Chip package and coreless package substrate thereof Grant 7,586,188 - Chang September 8, 2 | 2009-09-08 |
| Resistive memory device having enhanced resist ratio and method of manufacturing same Grant 7,579,612 - Tang , et al. August 25, 2 | 2009-08-25 |
| Operating method and changer for optical module/printer module system Grant 7,505,181 - Chang , et al. March 17, 2 | 2009-03-17 |
| Chip and manufacturing method and application thereof Grant 7,504,726 - Ho , et al. March 17, 2 | 2009-03-17 |
| Resistive memory device having enhanced resist ratio and method of manufacturing same App 20080266931 - Tang; Denny ; et al. | 2008-10-30 |
| Process for fabricating chip embedded package structure Grant 7,405,103 - Chang July 29, 2 | 2008-07-29 |
| Operating Method And Changer For Optical Module/printer Module System App 20080130020 - Chang; Wen-Yuan ; et al. | 2008-06-05 |
| Chip And Manufacturing Method And Application Thereof App 20080122077 - Ho; Kwun-Yao ; et al. | 2008-05-29 |
| Arrangement of conductive pads on grid array package and on circuit board Grant 7,372,169 - Chang May 13, 2 | 2008-05-13 |
| Scanner carrier Grant 7,342,692 - Chang March 11, 2 | 2008-03-11 |
| Package Structure For Panel Module And Method Using The Same App 20070285904 - Ting; Chung-Kuan ; et al. | 2007-12-13 |
| [Operating method and changer for optical module/printer module system] Grant 7,289,250 - Chang , et al. October 30, 2 | 2007-10-30 |
| Semiconductor packaging substrate and method of producing the same Grant 7,253,526 - Hsu , et al. August 7, 2 | 2007-08-07 |
| Chip Package And Coreless Package Substrate Thereof App 20070132072 - Chang; Wen-Yuan | 2007-06-14 |
| Shock absorbent packaging structure Grant 7,225,925 - Chen , et al. June 5, 2 | 2007-06-05 |
| Optical scanner Grant 7,225,985 - Chang , et al. June 5, 2 | 2007-06-05 |
| Arrangement of conductive pads on grid array package and on circuit board App 20070080456 - Chang; Wen-Yuan | 2007-04-12 |
| Chip package and substrate thereof App 20070069361 - Chang; Wen Yuan ; et al. | 2007-03-29 |
| Chip embedded package structure Grant 7,170,162 - Chang January 30, 2 | 2007-01-30 |
| Optical scanner App 20060283951 - Chang; Wen-Yuan ; et al. | 2006-12-21 |
| Process for fabricating chip embedded package structure App 20060105500 - Chang; Wen-Yuan | 2006-05-18 |
| Scanner carrier App 20060039042 - Chang; Wen-Yuan | 2006-02-23 |
| Chip embedded package structure App 20050253244 - Chang, Wen-Yuan | 2005-11-17 |
| Semiconductor packaging substrate and method of producing the same App 20050230814 - Hsu, Chi-Hsing ; et al. | 2005-10-20 |
| Scanner carrier Grant 6,947,186 - Chang September 20, 2 | 2005-09-20 |
| Semiconductor packaging substrate and method of producing the same Grant 6,946,738 - Hsu , et al. September 20, 2 | 2005-09-20 |
| Shock absorbent packaging structure App 20050173294 - Chen, Chiu-Chun ; et al. | 2005-08-11 |
| [optical Scanner] App 20050011951 - Chang, Wen-Yuan ; et al. | 2005-01-20 |
| Grid array packaged integrated circuit Grant 6,798,075 - Liaw , et al. September 28, 2 | 2004-09-28 |
| Semiconductor packaging substrate and method of producing the same App 20040183213 - Hsu, Chi-Hsing ; et al. | 2004-09-23 |
| [operating Method And Changer For Optical Module/printer Module System] App 20040105110 - CHANG, WEN-YUAN ; et al. | 2004-06-03 |
| Apparatus compensating a scanned object for optical characteristics according to light sources of different wavelengths Grant 6,650,444 - Chang November 18, 2 | 2003-11-18 |
| Semiconductor packaging substrate and method of producing the same App 20030122213 - Hsu, Chi-Hsing ; et al. | 2003-07-03 |
| Flip chip die Grant 6,586,844 - Chang July 1, 2 | 2003-07-01 |
| Scanner carrier App 20030099003 - Chang, Wen-Yuan | 2003-05-29 |
| Grid array packaged integrated circuit App 20030015784 - Liaw, Yuang-Tsang ; et al. | 2003-01-23 |
| Grid array package with increased electrical grounding routes and method of fabrication App 20020093079 - Chang, Wen-Yuan | 2002-07-18 |
| Foldable chair App 20020070588 - Chang, Wen Yuan | 2002-06-13 |
| Incorrect-placement preventing directional IC tray for carrying IC packages App 20020070435 - Chang, Wen-Yuan ; et al. | 2002-06-13 |
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