U.S. patent application number 13/759415 was filed with the patent office on 2014-05-01 for heat dissipation device and heat dissipation fins thereof.
This patent application is currently assigned to MSI Computer (Shenzhen) Co., Ltd.. The applicant listed for this patent is MSI COMPUTER (SHENZHEN) CO., LTD.. Invention is credited to Yi-Kun LIN, Shang-Chih YANG.
Application Number | 20140116659 13/759415 |
Document ID | / |
Family ID | 50489892 |
Filed Date | 2014-05-01 |
United States Patent
Application |
20140116659 |
Kind Code |
A1 |
LIN; Yi-Kun ; et
al. |
May 1, 2014 |
HEAT DISSIPATION DEVICE AND HEAT DISSIPATION FINS THEREOF
Abstract
A heat dissipation device for being in thermal contact with a
heat source includes multiple heat dissipation fins, a heat pipe
and a fan. Each of the heat dissipation fins includes a plate and
an air guiding body. The plate has a thermal contact side used for
being in thermal contact with the heat source. An acute angle is
formed between an extension side of the air guiding body and the
thermal contact side. The heat pipe penetrates through the plates.
The fan used for forming an air current is installed at a side of
the heat dissipation fin opposite to the thermal contact side. The
air guiding body and the heat pipe are disposed in a flowing path
of the air current. Thereby, the air current is guided toward the
heat pipe and the amount of air flowing through the heat pipe is
increased.
Inventors: |
LIN; Yi-Kun; (New Taipei
City, TW) ; YANG; Shang-Chih; (New Taipei City,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
MSI COMPUTER (SHENZHEN) CO., LTD. |
Shenzhen |
|
CN |
|
|
Assignee: |
MSI Computer (Shenzhen) Co.,
Ltd.
Shenzhen
CN
|
Family ID: |
50489892 |
Appl. No.: |
13/759415 |
Filed: |
February 5, 2013 |
Current U.S.
Class: |
165/121 |
Current CPC
Class: |
H01L 2924/0002 20130101;
H01L 23/3672 20130101; H01L 23/467 20130101; H01L 2924/0002
20130101; F28F 1/32 20130101; F28D 15/0275 20130101; H01L 2924/00
20130101; H01L 23/427 20130101 |
Class at
Publication: |
165/121 |
International
Class: |
F28F 3/02 20060101
F28F003/02 |
Foreign Application Data
Date |
Code |
Application Number |
Nov 1, 2012 |
CN |
201210442383.9 |
Claims
1. A heat dissipation device configured for being in thermal
contact with a heat source, the heat dissipation device comprising:
a plurality of heat dissipation fins, each of some of the heat
dissipation fins comprising a plate and an air guiding body, the
plate having an air outlet side configured for being in thermal
contact with the heat source, the air guiding body being protruded
from the plate, an acute angle being formed between an extension
side of the air guiding body and a surface of the air outlet side;
a heat pipe penetrating through the plates and the heat pipe being
kept away from the air guiding body at a distance; and a fan
installed at a side of the heat dissipation fins opposite to the
air outlet side, the fan being configured for forming an air
current, and the air guiding body as well as the heat pipe being
disposed in a flowing path of the air current to guide the air
current toward the heat pipe and to increase an amount of air
flowing through the heat pipe.
2. The heat dissipation device as claimed in claim 1, wherein the
acute angle is between 15 and 75 degrees.
3. The heat dissipation device as claimed in claim 1, wherein the
plate has an air inlet side and a side edge, the air current flows
from the air inlet side toward the air outlet side, the side edge
is connected with the air inlet side and the air outlet side, the
air guiding body has a first end and a second end disposed
oppositely to each other, the first end is close to the air inlet
side, the second end is close to the air outlet side, the heat pipe
is disposed between the side edge and the air guiding body, a
distance between the first end of the air guiding body and the side
edge is larger than that between the second end of the air guiding
body and the side edge.
4. The heat dissipation device as claimed in claim 1, wherein the
plate has an air inlet side and a side edge, the air current flows
from the air inlet side toward the air outlet side, the side edge
is connected with the air inlet side and the air outlet side, the
air guiding body has a first end and a second end disposed
oppositely to each other, the first end is close to the air inlet
side, the second end is close to the air outlet side, the air
guiding body is disposed between the side edge and the heat pipe, a
distance between the first end of the air guiding body and the side
edge is shorter than that between the second end of the air guiding
body and the side edge.
5. The heat dissipation device as claimed in claim 1, wherein a
connection line between a center of the air guiding body and a
center of the heat pipe intersects with a flowing direction of the
air current.
6. A heat dissipation fin configured for installing a fan and a
heat pipe, the fan producing an air current, the heat dissipation
fin comprising: a plate having a through hole configured for
accommodating the heat pipe, the heat pipe being in thermal contact
with the plate, the plate having an air outlet side; and an air
guiding body protruded from the plate, the air guiding body being
disposed in a flowing path of the air current, and an acute angle
being disposed between an extension side of the air guiding body as
well as a surface of the air outlet side in order to guide the air
current toward the heat pipe and to increase an amount of air
flowing through the heat pipe.
7. The heat dissipation fin as claimed in claim 6, wherein the
acute angle is between 15 and 75 degrees.
8. The heat dissipation fin as claimed in claim 6, wherein the
plate has an air inlet side and a side edge, the air current flows
from the air inlet side toward the air outlet side, the side edge
is connected with the air inlet side and the air outlet side, the
air guiding body has a first end and a second end disposed
oppositely to each other, the first end is close to the air inlet
side, the second end is close to the air outlet side, the heat pipe
is disposed between the side edge and the air guiding body, a
distance between the first end of the air guiding body and the side
edge is longer than that between the second end of the air guiding
body and the side edge.
9. The heat dissipation fin as claimed in claim 6, wherein the
plate has an air inlet side and a side edge, the air current flows
from the air inlet side toward the air outlet side, the side edge
is connected with the air inlet side and the air outlet side, the
air guiding body has a first end and a second end disposed
oppositely to each other, the first end is close to the air inlet
side, the second end is close to the air outlet side, the air
guiding body is disposed between the side edge and the heat pipe, a
distance between the first end of the air guiding body and the side
edge is shorter than that between the second end of the air guiding
body and the side edge.
Description
[0001] This non-provisional application claims priority under 35
U.S.C. .sctn.119(a) on Patent Application No(s) 201210442383.9.
filed in China, P.R.C. on Nov. 1, 2012, the entire contents of
which are hereby incorporated by reference.
TECHNICAL FIELD
[0002] The disclosure relates to a heat dissipation device, and
more particularly to a fan structure and its blades.
BACKGROUND
[0003] As the technology in electronic field evolves, the
efficiency of electronic components improves. However, the
enhancement on the efficiency of electronic components causes the
amount of heat produced to increase. The heat keeps accumulating in
the electronic components and causes the temperatures of the
electronic components to increase. The electronic components may
crash or even burn up when the heat may not be removed effectively
from the electronic components to lower the temperatures.
Therefore, instead of working on enhancing the efficiency of
electronic components, the problem the electronic industry faces is
how to remove the heat generated from electronic components
effectively.
[0004] Generally speaking, water-cooled heat dissipation device and
air-cooled heat dissipation device are used to remove the heat
produced by electronic components in the industry. The heat
dissipation principle of water-cooled heat dissipation device
refers to using air compressor or pump to drive the cooling fluid
in the cooling pipe to exchange heat with the electronic
components. Thereby, the heat of the electronic components may be
removed. The heat dissipation principle of air-cooled heat
dissipation device refers to using fan to guide cold air to flow
through the electronic components in order to exchange heat and to
remove the heat of the electronic components. Comparing to the
water-cooled type, the air-cooled heat dissipation device is more
cost-effective because air compressor, pump and cooling fluid are
not required. Therefore, the air-cooled heat dissipation device is
widely used in the industry to remove the heat of electronic
components.
[0005] However, the conventional air-cooled heat dissipation device
still cannot effectively remove the heat produced by high-end
electronic components in the market. Therefore, considering
cost-effectiveness and heat dissipation effect, it is highly
demanded to develop air-cooled heat dissipation device with higher
heat dissipation effect.
SUMMARY
[0006] An embodiment of the disclosure provides a heat dissipation
device configured for being in thermal contact with a heat source.
The heat dissipation device comprises a plurality of heat
dissipation fins, a heat pipe and a fan. Each of the heat
dissipation fins comprises a plate and an air guiding body. The
plate has a thermal contact side configured for being in thermal
contact with the heat source. The air guiding body is protruded
from the plate. An acute angle is formed between an extension side
of the air guiding body and the thermal contact side. The heat pipe
penetrates through the plates and is kept away from the air guiding
body at a distance. The fan is installed at a side of the heat
dissipation fin opposite to the thermal contact side. The fan is
configured for forming an air current. The air guiding body and the
heat pipe are disposed in a flowing path of the air current.
Thereby, the air current is guided toward the heat pipe and the
amount of air flowing through the heat pipe is increased.
[0007] Another embodiment of the disclosure provides a heat
dissipation fins configured for installing a fan and a heat pipe.
The fan produces an air current. The heat dissipation fin comprises
a plate and an air guiding body. The plate has a through hole for
accommodating the heat pipe. The heat pipe is in thermal contact
with the plate. The plate has an air outlet side. The air guiding
body is protruded from the plate. The air guiding body is disposed
in a flowing path of the air current, and an acute angle is formed
between an extension side of the air guiding body and the thermal
contact side. Thereby, the air current is guided toward the heat
pipe and the amount of air flowing through the heat pipe is
increased.
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] In the following detailed description, for purposes of
explanation, numerous specific details are set forth in order to
provide a thorough understanding of the disclosed embodiments. It
will be apparent, however, that one or more embodiments may be
practiced without these specific details. In other instances,
well-known structures and devices are schematically shown in order
to simplify the drawing.
[0009] FIG. 1 is a perspective view of a heat dissipation device
according to an embodiment of the disclosure;
[0010] FIG. 2 is an exploded view of FIG. 1;
[0011] FIG. 3A is a plan view of a part of a heat dissipation fin
in FIG. 1;
[0012] FIG. 3B is a plan view of a part of the heat dissipation fin
according to another embodiment of the disclosure; and
[0013] FIG. 4 is an illustration of an air current of the heat
dissipation device in FIG. 1.
DETAILED DESCRIPTION
[0014] In the following detailed description, for purposes of
explanation, numerous specific details are set forth in order to
provide a thorough understanding of the disclosed embodiments. It
will be apparent, however, that one or more embodiments may be
practiced without these specific details. In other instances,
well-known structures and devices are schematically shown in order
to simplify the drawing.
[0015] Please refer to FIGS. 1 to 3B. FIG. 1 is a perspective view
of a heat dissipation device according to an embodiment of the
disclosure. FIG. 2 is an exploded view of FIG. 1. FIG. 3A is a plan
view of a part of a heat dissipation fin in FIG. 1. FIG. 3B is a
plan view of a part of the heat dissipation fin according to
another embodiment of the disclosure. A heat dissipation device 10
of this embodiment is in thermal contact with a heat source 30
through a heat conductive piece 20. In other words, the heat
conductive piece 20 is disposed between the heat dissipation device
10 and the heat source 30. Moreover, the heat conductive piece 20
is in thermal contact with the heat dissipation device 10 and the
heat source 30. In this embodiment and other embodiments, a layer
of heat conductive adhesive 40 is further disposed between the heat
conductive piece 20 and the heat source 30 for speeding up the
transfer of the heat of the heat source 30 to the heat dissipation
device 10. The heat conductive adhesive 40 is disposed between the
heat conductive piece 20 and the heat source 30 in this embodiment.
However, it should not be construed as a limitation to the
disclosure. In other embodiments, heat conductive paste may be used
in the heat dissipation device.
[0016] In this embodiment, the heat dissipation device 10 comprises
a plurality of heat dissipation fins 100, a heat pipe 200 and a fan
300. Each of the heat dissipation fins 100 comprises a plate 110
and an air guiding body 120. The plate 110 has an air inlet side
111 and an air outlet side 112 disposed oppositely to each other as
well as a side edge 113. The side edge 113 is connected with the
air inlet side 111 and the air outlet side 112. The heat conductive
piece 20 is disposed at the air outlet side 112 in order that the
heat dissipation fins 100 are in thermal contact with the heat
source 30 through the heat conductive piece 20. The plate 110 has a
through hole 114. The heat pipe 200 is disposed inside the through
hole 114 and is in thermal contact with the heat dissipation fin
100. The air guiding body 120 is protruded from the plate 110. An
acute angle .theta. is formed between an extension side of the air
guiding body 120 and a surface of the air outlet side 112. Thereby,
the air guiding body 120 has the function for guiding air and the
air guiding body 120 may also increase the heat dissipation area of
the heat dissipation fins 100. Therefore, the heat dissipation
effect of the heat dissipation fins 100 may be enhanced.
Furthermore, the air guiding body 120 may be in an arc shape. That
is, the air guiding body 120 may have a corner radius.
[0017] Furthermore, each of the heat dissipation fins 100 in this
embodiment comprises the air guiding body 120. But it should not be
construed as a limitation to the disclosure. In other embodiments,
the heat dissipation fins 100 with and without the air guiding body
120 may be partially used in the heat dissipation device 10. For
example, the heat dissipation fins 100 without the air guiding body
120 and the heat dissipation fins 100 with the air guiding body 120
are arranged alternatively.
[0018] The fan 300 is installed at the air inlet sides 111 of the
heat dissipation fins 100. The fan 300 is used for forming an air
current. The air current flows from the air inlet side 111 toward
the air outlet side 112 of the plate 110. The air guiding body 120
and the heat pipe 200 are disposed in a flowing path of the air
current. Therefore, the air guiding body 120 may guide the air
current partially toward the heat pipe 200 and increase the amount
of air flowing through the heat pipe 200. Thereby, the heat
dissipation effect of the heat dissipation device 10 may be
enhanced.
[0019] However, the heat dissipation effect of the heat dissipation
device 10 may not be enhanced by protruding the air guiding body
120 at any location of the plate 110. Practically, the air guiding
body 120 is required to dispose at a specific location. Thereby,
the heat dissipation effect of the heat dissipation device 10 may
be effectively enhanced.
[0020] Specifically, the heat pipe 200 and the air guiding body 120
in this embodiment are separated by a distance D. A connection line
between a center of the heat pipe 200 and the center of the air
guiding body 120 intersects with a flowing direction of the air
current produced by the fan 300. Therefore, the air guiding body
120 may guide the air current by the heat pipe 200 to the heat pipe
200. Furthermore, the heat pipe 200 is disposed between the side
edge 113 and the air guiding body 120. The air guiding body 120 has
a first end 121 and a second end 122 disposed oppositely to each
other as well as an air receiving side 123. The first end 121 is
closed to the air inlet side 111. The second end 122 is closed to
the air outlet side 112. A distance between the first end 121 of
the air guiding body 120 and the side edge 113 is larger than that
between the second end 122 of the air guiding body 120 and the side
edge 113. Therefore, the acute angle .theta. is formed between the
extension side of the air guiding body 120 and the surface of the
air outlet side 112 as shown in FIG. 3A. Thereby, the air receiving
side 123 of the air guiding body 120 faces the air inlet side 111
and the heat pipe 200. The distance mentioned herein between the
heat pipe 200 and the air guiding body 120 refers to the distance D
between the center of the heat pipe 200 and the first end 121 of
the air guiding body 120. The distance D is preferably to be
between 5 mm and 30 mm. Additionally, the acute angle .theta.
mentioned herein is preferably to be between 15 and 75 degrees.
[0021] In this embodiment, the heat pipe 200 is disposed between
the side edge 113 and the air guiding body 120. However, it should
not be construed as a limitation to the disclosure. In other
embodiments, the air guiding body 120 may be disposed between the
heat pipe 200 and the side edge 113. Specifically, in this
embodiment, a distance between the first end 121 of the air guiding
body 120 and the side edge 113 is shorter than that between the
second end 122 of the air guiding body 120 and the side edge 113.
Therefore, the acute angle .theta. is formed between the extension
side of the air guiding body 120 and the surface of the air outlet
side 112 as shown in FIG. 3B. Thereby, the air receiving side 123
of the air guiding body 120 faces the air inlet side 111 and the
heat pipe 200.
[0022] Please refer to FIG. 4. FIG. 4 is an illustration of the air
current of the heat dissipation device in FIG. 1. When the air
current produced by the fan 300 flows along an air entering
direction a from the air inlet side 111 of the plate 110 to the air
outlet side 112 in contact with the heat source 30, the air current
flows through the heat pipe 200 and the air guiding body 120.
Specifically, the air current flows through the heat pipe 200 and
the air guiding body 120 because the arranged directions of the
heat pipe 200 and the air guiding body 120 are roughly
perpendicular to the air entering direction a. However, since the
air current is partially blocked by the air receiving side 123 of
the air guiding body 120, the air current is guided to the heat
pipe 200 disposed by the air guiding body 120. Thereby, the amount
of air flowing through the heat pipe 200 in a unit of time is
increased substantially. Specifically, the temperature of the heat
pipe 200 should be higher than that of the nearby heat dissipation
fins 100. Thus, the disposition of the air guiding body 120 guides
the air current near the heat pipe 200 to intensively flow toward
the heat pipe 200 with a higher temperature. Therefore, the heat
pipe 200 may exchange heat with a large amount of air current first
which helps to remove the heat earlier. Thereby, the heat
dissipation efficiency of the heat dissipation device 10 may be
enhanced.
[0023] Please refer to List 1. List 1 shows results of tests under
the conditions that the rotation speed of the fan 300 is at 4300
rpm, the voltage of the fan is 12V, and the thermal power produced
by the heat source 30 is 150 watts. List 1 shows that the measured
temperatures of the heat source 30 when the heat dissipation fins
100 are equipped with the air guiding body 120 are lower than the
measured temperatures of the heat source 30 when the heat
dissipation fins 100 are not equipped with the air guiding body
120. In this embodiment, the highest dissipation temperature
(namely, the most amount of the temperature dropped in this
embodiment) is measured when the acute angle .theta. between the
extension side of the air guiding body 120 and the surface of the
air outlet side 112 is 30 degrees.
[0024] List 1 shows the relationship between the acute angle
.theta. (between the extension side of the air guiding body 120 and
the surface of the air outlet side 112) and the dissipated
temperature (namely, temperature dropped).
TABLE-US-00001 Temp- erature of Heat Ratio of Temperature of Source
Dissipated Increased Heat Source with Air Temperature Dissipation
without Air Guiding (temperature Area Guiding Body Body dropped)
.theta. = 30 degrees 3.24% 88.1.degree. C. 81.4.degree. C.
6.7.degree. C. .theta. = 45 degrees 4.84% 86.1.degree. C.
82.5.degree. C. 3.6.degree. C. .theta. = 30 degrees 1.7%
95.5.degree. C. 90.6.degree. C. 4.9.degree. C. and corner radius =
20
[0025] According to the heat dissipation device and its heat
dissipation fins disclosed in the disclosure, by disposing an acute
angle between the extension side of the air guiding body and the
surface of the air outlet side, the air receiving side of the air
guiding body may face the air inlet side and the heat pipe.
Therefore, when the air current flows from the air inlet side, the
air current is guided by the air guiding body and will flow
intensively toward the heat pipe. Thereby, the amount of air
flowing through the heat pipe in a unit of time is increased, and
thus improves the heat dissipation efficiency of the heat
dissipation device.
* * * * *