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Patent applications and USPTO patent grants for Yang; Shang-Chih.The latest application filed is for "heat dissipation device and heat dissipation fins thereof".
Patent | Date |
---|---|
Fan device and vane thereof Grant 9,062,681 - Lee , et al. June 23, 2 | 2015-06-23 |
Heat Dissipation Device And Heat Dissipation Fins Thereof App 20140116659 - LIN; Yi-Kun ;   et al. | 2014-05-01 |
Fan Device And Vane Thereof App 20140030104 - Lee; Lin-Yu ;   et al. | 2014-01-30 |
Fixing mechanism for fixing a thermal module on a base and related electronic device Grant 8,437,137 - Lee , et al. May 7, 2 | 2013-05-07 |
Fixing mechanism for fixing a circuit board Grant D680,965 - Yang , et al. April 30, 2 | 2013-04-30 |
Fixing Mechanism For Fixing A Thermal Module On A Base And Related Electronic Device App 20120044648 - Lee; Lin-Yu ;   et al. | 2012-02-23 |
Fan blade Grant D645,134 - Lee , et al. September 13, 2 | 2011-09-13 |
Circuit board with a perforated structure for disposing a heat pipe Grant 7,511,947 - Leng , et al. March 31, 2 | 2009-03-31 |
Circuit Board With A Perforated Structure For Disposing A Heat Pipe App 20080062649 - Leng; Yao-Shih ;   et al. | 2008-03-13 |
Method and device for monitoring Grant 6,999,894 - Lin , et al. February 14, 2 | 2006-02-14 |
Heat dissipation method for microprocessors App 20050068730 - Lin, Yao-Nan ;   et al. | 2005-03-31 |
Method and device for monitoring App 20050060122 - Lin, Yao-Nan ;   et al. | 2005-03-17 |
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