Lin; Yi Kun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Yi Kun.The latest application filed is for "heat dissipation fin and heat dissipation module".
- Lin; Yi Kun - Taipei City TW
- Lin; Yi-Kun - New Taipei N/A TW
- LIN; Yi-Kun - New Taipei City TW
| Patent | Date |
|---|---|
| Heat Dissipation Fin And Heat Dissipation Module App 20220136784 - Lin; Yi Kun | 2022-05-05 |
| Cooling device Grant 8,854,819 - Chen , et al. October 7, 2 | 2014-10-07 |
| Heat Dissipation Device And Heat Dissipation Fins Thereof App 20140116659 - LIN; Yi-Kun ; et al. | 2014-05-01 |
| Cooling Device App 20140009884 - CHEN; Hong-Long ; et al. | 2014-01-09 |
| Heat Sink Fabrication Method App 20130319064 - LIN; Yi-Kun | 2013-12-05 |
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