U.S. patent application number 14/099714 was filed with the patent office on 2014-04-03 for method of manufacturing printed circuit board.
This patent application is currently assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD.. The applicant listed for this patent is SAMSUNG ELECTRO-MECHANICS CO., LTD.. Invention is credited to Min Jung CHO, Mi Sun HWANG, Myung Sam KANG, Seon Ha Kang, Ok Tae KIM, Gil Yong SHIN, Kil Yong YUN.
Application Number | 20140090245 14/099714 |
Document ID | / |
Family ID | 43729051 |
Filed Date | 2014-04-03 |
United States Patent
Application |
20140090245 |
Kind Code |
A1 |
HWANG; Mi Sun ; et
al. |
April 3, 2014 |
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
Abstract
In accordance with various embodiments, there is provided a
method of manufacturing a printed circuit board, the method
including the steps of preparing a first carrier including a first
pattern formed on one side thereof, preparing a second carrier
including a first solder resist layer and a second pattern
sequentially formed on one side thereof, pressing the first carrier
and the second carrier such that the first pattern is embedded in
one side of an insulation layer and the second pattern is embedded
in the other side of the insulation layer and then removing the
first carrier and the second carrier to fabricate two substrates,
attaching the two substrates to each other using an adhesion layer
such that the first solder resist layers face each other, and
forming a via for connecting the first pattern with the second
pattern in the insulation layer, forming a second solder resist on
the insulation layer provided with the first pattern, and then
removing the adhesion layer.
Inventors: |
HWANG; Mi Sun; (Gyunggi-do,
KR) ; KANG; Myung Sam; (Gyunggi-do, KR) ; KIM;
Ok Tae; (Gyunggi-do, KR) ; Kang; Seon Ha;
(Gyunggi-do, KR) ; SHIN; Gil Yong; (Jeollabuk-do,
KR) ; YUN; Kil Yong; (Gyunggi-do, KR) ; CHO;
Min Jung; (Gyunggi-do, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
Gyunggi-do |
|
KR |
|
|
Assignee: |
SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
Gyunggi-do
KR
|
Family ID: |
43729051 |
Appl. No.: |
14/099714 |
Filed: |
December 6, 2013 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
12631594 |
Dec 4, 2009 |
|
|
|
14099714 |
|
|
|
|
Current U.S.
Class: |
29/852 |
Current CPC
Class: |
Y10T 29/49128 20150115;
H05K 2203/1536 20130101; H05K 3/0097 20130101; H05K 2201/0376
20130101; Y10T 29/49156 20150115; Y10T 29/49155 20150115; H05K
3/4685 20130101; H05K 3/421 20130101; H05K 3/205 20130101; H05K
2203/0152 20130101; Y10T 29/49165 20150115; Y10T 29/49126
20150115 |
Class at
Publication: |
29/852 |
International
Class: |
H05K 3/46 20060101
H05K003/46 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 14, 2009 |
KR |
10-2009-0086445 |
Claims
1. A method of manufacturing a printed circuit board, comprising:
preparing a carrier including a first pattern formed on one side
thereof; sequentially forming a first solder resist layer and a
second pattern on both sides of an adhesion layer to prepare an
intermediate substrate; disposing the carriers on both sides of the
intermediate substrate such that an insulation layer faces the
first pattern and then thermally pressing the carriers; removing
the carriers, forming a via for connecting the first pattern with
the second pattern in the insulation layer, and then forming a
second solder resist layer on the insulation layer in which the
second pattern is formed; and removing the adhesion layer.
2. The method of manufacturing a printed circuit board according to
claim 1, wherein the preparing the carrier includes: sequentially
forming a copper foil layer and a metal barrier layer on one side
or both sides of a tape; forming a first pattern on the metal
barrier layer; and removing the tape to prepare a first carrier
including the copper foil layer and the metal barrier layer whose
one side is provided with the first pattern.
3. The method of manufacturing a printed circuit board according to
claim 1, wherein the preparing the intermediate substrate includes:
forming a first solder resist layer on an adhesion layer; forming a
seed layer on the first solder resist layer; and forming a plating
layer on the seed layer and then patterning the seed layer and the
plating layer to form a second pattern.
4. The method of manufacturing a printed circuit board according to
claim 1, further comprising: after the removing the carriers,
forming an opening in the second solder resist layer; and forming a
protective layer on the first pattern exposed through the
opening.
5. The method of manufacturing a printed circuit board according to
claim 1, further comprising: after the removing the adhesion layer,
forming an opening in the first solder resist layer; and forming a
protective layer on the second pattern exposed through the
opening.
6. The method of manufacturing a printed circuit board according to
claim 1, wherein the adhesion layer is made of a thermal adhesive
exhibiting non-adhesiveness during heat treatment.
Description
RELATED APPLICATION
[0001] This application is a divisional application of U.S. patent
application Ser. No. 12/631,594, filed on Dec. 4, 2009, and claims
the benefit of and priority to Korean Patent Application No. KR
10-2009-0086445, filed on Sep. 14, 2009, all of which are
incorporated herein by reference in their entirety into this
application.
BACKGROUND
[0002] 1. Field of the Invention
[0003] The present invention relates to a method of manufacturing a
printed circuit board.
[0004] 2. Description of the Related Art
[0005] Generally, printed circuit boards (PCBs) are manufactured by
patterning one or both sides of a substrate, composed of various
thermosetting resins, using copper foil, and disposing and fixing
ICs or electronic parts on the substrate to form an electric
circuit.
[0006] Recently, with the advancement of the electronics industry,
electronic parts are increasingly required to be highly
functionalized, light, thin, short and small. Printed circuit
boards loaded with such electronic parts are also required to be
highly densified and thin.
[0007] In order to meet the above requirement, a circuit transfer
process is being proposed. FIGS. 1 to 7 are sectional views showing
a conventional method of manufacturing a printed circuit board
using the circuit transfer process. Hereinafter, the conventional
method of manufacturing a printed circuit board will be described
with reference to FIGS. 1 to 7.
[0008] First, as shown in FIG. 1, a first copper foil layer 14a is
adhered on one side of a tape 12, and then a first metal barrier
layer 16a is formed on the first copper foil layer 14a. Further, a
second copper foil layer 14b is adhered on the other side of the
tape 12, and then a second metal barrier layer 16b is formed on the
second copper foil layer 14b to prepare a carrier 10.
[0009] Subsequently, as shown in FIG. 2, a first pattern 18a is
formed on the first metal barrier layer 16a, and a second pattern
18b is formed on the second metal barrier layer 16b. Hereinafter,
for the convenience of explanation, the assembly of the first
copper foil layer 14a, the first metal barrier layer 16a and the
first pattern 18a is designated as a first carrier part, and the
assembly of the second copper foil layer 14b, second metal barrier
layer 16b and second pattern 18b is designated as a second carrier
part.
[0010] Subsequently, as shown in FIG. 3, the first carrier part and
the second carrier part are separated from the tape 12.
[0011] Subsequently, as shown in FIG. 4, the first and second
carrier parts are placed on both sides of an insulation layer 20
and then pressed to embed the first pattern 18a and the second
pattern 18b into the insulation layer 20.
[0012] Subsequently, as shown in FIG. 5, the first copper foil
layer 14a and the second copper foil layer 14b are removed, and
then a via hole 22 for interlayer connection is formed in the
insulation layer 20.
[0013] Subsequently, as shown in FIG. 6, the via hole 22 is plated
to form a plating layer, and then the plating layer formed on the
insulation layer 20 and the first and second barrier layers 16a and
16b are removed.
[0014] Finally, as shown in FIG. 7, first and second solder resist
layers 26a and 26b are formed on both sides of the insulation layer
20, and then first and second openings 28a and 28b for exposing pad
regions formed in the first and second solder resist layers 26a and
26b to manufacture a two-layered printed circuit board.
[0015] However, when a thin printed circuit board is manufactured
using the above conventional method, there is a problem in that the
thin printed circuit board is damaged (broken or rolled) and thus
processes are delayed. For example, a two-layered thin printed
circuit board having a thickness of about 80 .mu.m or less is
damaged during a process of forming a via hole 22 (refer to FIG. 5)
or a process of forming solder resist layers 26a and 26b. As the
thickness of a printed circuit board is decreased, it is difficult
to entirely apply the above conventional method.
SUMMARY
[0016] Accordingly, the present invention has been made to solve
the above-mentioned problems, and the present invention seeks to
provide a method of manufacturing a thin printed circuit board,
which can prevent the thin printed circuit board from being damaged
during its manufacturing process.
[0017] A first aspect of the present invention provides a method of
manufacturing a printed circuit board, comprising: preparing a
first carrier including a first pattern formed on one side thereof;
preparing a second carrier including a first solder resist layer
and a second pattern sequentially formed on one side thereof;
pressing the first carrier and the second carrier such that the
first pattern is embedded in one side of an insulation layer and
the second pattern is embedded in the other side of the insulation
layer and then removing the first carrier and the second carrier to
fabricate two base substrates; attaching the two base substrates to
each other using an adhesion layer such that the first solder
resist layers face each other; and forming a via for connecting the
first pattern with the second pattern in the insulation layer,
forming a second solder resist on the insulation layer provided
with the first pattern, and then removing the adhesion layer.
[0018] In the method, the preparing of the first carrier may
include: sequentially forming a copper foil layer and a metal
barrier layer on one side or both sides of a tape; forming a first
pattern on the metal barrier layer; and removing the tape to
prepare a first carrier including the copper foil layer and the
metal barrier layer whose one side is provided with the first
pattern.
[0019] Further, the preparing of the second carrier may include:
sequentially forming a copper foil layer and a first solder resist
layer on one or both sides of a tape; forming a seed layer on the
first solder resist layer; forming a plating layer on the seed
layer and then patterning the seed layer and the plating layer to
form a second pattern; and removing the tape to prepare a second
carrier including the first solder resist layer and the plating
layer whose one side is provided with the second pattern.
[0020] Further, in the forming of the via, before removing the
adhesion layer, an opening may be formed in the second solder
resist layer, and then a protective layer may be formed on the
first pattern exposed through the opening.
[0021] Further, the method of manufacturing a printed circuit board
may further comprise: after the forming of the via, forming an
opening in the first solder resist layer; and forming a protective
layer on the second pattern exposed through the opening.
[0022] Further, the adhesion layer may be made of a thermal
adhesive exhibiting non-adhesiveness during heat treatment.
[0023] A second aspect of the present invention provides a method
of manufacturing a printed circuit board, comprising: preparing a
carrier including a first pattern formed on one side thereof;
sequentially forming a first solder resist layer and a second
pattern on both sides of an adhesion layer to prepare an
intermediate substrate; disposing the carriers on both sides of the
intermediate substrate such that an insulation layer faces the
first pattern and then thermally pressing the carriers; removing
the carriers, forming a via for connecting the first pattern with
the second pattern in the insulation layer, and then forming a
second solder resist layer on the insulation layer in which the
second pattern is formed; and removing the adhesion layer.
[0024] In the method, the preparing of the carrier may include:
sequentially forming a copper foil layer and a metal barrier layer
on one side or both sides of a tape; forming a first pattern on the
metal barrier layer; and removing the tape to prepare a first
carrier including the copper foil layer and the metal barrier layer
whose one side is provided with the first pattern.
[0025] Further, the preparing of the intermediate substrate may
include: forming a first solder resist layer on an adhesion layer;
forming a seed layer on the first solder resist layer; and forming
a plating layer on the seed layer and then patterning the seed
layer and the plating layer to form a second pattern.
[0026] Further, the method of manufacturing a printed circuit board
may further comprise: after the removing of the carriers, forming
an opening in the second solder resist layer; and forming a
protective layer on the first pattern exposed through the
opening.
[0027] Further, the method of manufacturing a printed circuit board
may further comprise: after the removing of the adhesion layer,
forming an opening in the first solder resist layer; and forming a
protective layer on the second pattern exposed through the
opening.
[0028] Further, the adhesion layer may be made of a thermal
adhesive exhibiting non-adhesiveness during heat treatment.
[0029] Various objects, advantages and features of the invention
will become apparent from the following description of embodiments
with reference to the accompanying drawings.
BRIEF DESCRIPTION OF DRAWINGS
[0030] These and other features, aspects, and advantages of the
invention are better understood with regard to the following
Detailed Description, appended Claims, and accompanying Figures. It
is to be noted, however, that the Figures illustrate only various
embodiments of the invention and are therefore not to be considered
limiting of the invention's scope as it may include other effective
embodiments as well.
[0031] FIGS. 1 to 7 are sectional views showing a conventional
method of manufacturing a printed circuit board using a circuit
transfer process.
[0032] FIGS. 8 to 21 are sectional views showing a method of
manufacturing a printed circuit board according to a first
embodiment of the present invention.
[0033] FIGS. 22 to 25 are sectional views showing a method of
manufacturing a printed circuit board according to a second
embodiment of the present invention.
DETAILED DESCRIPTION
[0034] The present invention will now be described more fully
hereinafter with reference to the accompanying drawings, which
illustrate embodiments of the invention. This invention may,
however, be embodied in many different forms and should not be
construed as limited to the illustrated embodiments set forth
herein. Rather, these embodiments are provided so that this
disclosure will be thorough and complete, and will fully convey the
scope of the invention to those skilled in the art. Like numbers
refer to like elements throughout. Prime notation, if used,
indicates similar elements in alternative embodiments.
[0035] FIGS. 8 to 21 are sectional views showing a method of
manufacturing a printed circuit board according to a first
embodiment of the present invention. Hereinafter, the method of
manufacturing a printed circuit board according to this embodiment
of the present invention will be described with reference to FIGS.
8 to 21.
[0036] First, as shown in FIG. 8, copper foil layers 120 are
adhered on both sides of a tape 110, and then metal barrier layers
130 are formed on the copper foil layers 120 to prepare a carrier
100. Here, the tape 110 is a material on which the copper foil
layers 120 can be adhered because it has adhesivity.
[0037] Subsequently, as shown in FIG. 9, first patterns 140 are
formed on the metal barrier layers 130, and then each assembly of
the copper foil layer 120, metal barrier layer 130 and first
pattern 140 is separated from the tape 110. Here, each assembly of
the copper foil layer 120, metal barrier layer 130 and first
pattern 140 is designated as a first carrier.
[0038] In this case, the first pattern 140 is formed by applying a
photoresist, such as a dry film, on the metal barrier layer 130,
forming openings for exposing pattern forming regions in the
photoresist, plating the openings and then removing the
photoresist.
[0039] Subsequently, as shown in FIG. 10, copper foil layers 220
are adhered on both sides of a tape 210 to prepare a carrier
200.
[0040] Subsequently, as shown in FIG. 11, first solder resist
layers 230 are formed on the copper foil layers 220.
[0041] Subsequently, as shown in FIG. 12, seed layers 240 are
formed on the first solder resist layers 230.
[0042] In this case, the seed layers 240 are formed in order to
impart conductivity to the first solder resist layers 230 using a
surface treatment method of depositing metals on the surface of a
nonconductive material through a chemical reduction reaction to
impart conductivity thereto because electrolytic plating cannot be
directly performed on the surface of the first solder resist layers
230. For example, the seed layers are formed through an electroless
plating process using a general catalyst deposition method
including cleaning, soft etching, pre-catalysis, catalysis,
activation, electroless copper plating and antioxidation
procedures.
[0043] Subsequently, as shown in FIG. 13, photoresists 250 are
applied on the seed layers 240, and then the photoresists 250
corresponding to pattern forming regions are removed to from
openings 252. Here, the pattern forming regions are regions in
which second patterns are formed.
[0044] Specifically, this step is performed by exposing a dry film
or a photoresist 250, such as a positive liquid photoresist
(P-LPR), using a predetermined mask pattern (not shown) and then
removing the partially-exposed photoresist 250 using a
developer.
[0045] Subsequently, as shown in FIG. 14, electrolytic plating is
performed in the openings 252 to form plating layers, and then the
remaining photoresists 250 are removed using a stripper, such as
sodium hydroxide (NaOH), potassium hydroxide (KOH) or the like.
Here, each assembly of the seed layer 240 and the plating layer 260
is designated as a second pattern.
[0046] Subsequently, as shown in FIG. 15, second carriers formed on
both sides of the tape 210 are separated from the tape 210. Here,
the copper foil layer 220 sequentially provided thereon with the
first solder resist layer 230 and the second pattern is designated
as the second carrier.
[0047] Subsequently, as shown in FIG. 16, the first carrier and the
second carrier are placed on both sides of an insulation layer 300
and then pressed to embed the first pattern 140 and the second
pattern 240 and 260 into the insulation layer 300.
[0048] Subsequently, as shown in FIG. 17, the copper foil layers
120 and 220 are removed through etching to fabricate a base
substrate.
[0049] Subsequently, as shown in FIG. 18, two base substrates are
attached to each other using an adhesion layer 400 such that the
first solder resist layers 230 face each other.
[0050] In this step, since the two base substrates are attached to
form a dual structure, the function of supporting is increased, and
thus the damage of a printed circuit board can be prevented despite
additional processes being performed. Further, since the two base
substrates are attached to each other through the adhesion layer
400 in a state in which the first solder resist layer 230 is
previously formed on the insulation layer 300 in which the second
pattern 240 and 260 is formed, an additional solder resist layer is
not required to be formed, thus minimizing the damage of a thin
printed circuit board.
[0051] Here, the adhesion layer 400 may be formed of a thermal
adhesive exhibiting non-adhesiveness at the time of heat treatment.
Many kinds of thermal adhesives well known in the art can be used
to form the adhesion layer 400 without limitation as long as they
maintain adhesiveness at room temperature and lose adhesiveness at
the time of heat treatment so that the adhesion layer is easy to
separate from the adherend. For example, a thermal adhesive
composed of an acrylic resin and a foaming agent exhibiting
non-adhesiveness at the time of heat treatment at a temperature of
about 100.about.150.degree. C. can be used, but the present
invention is not limited thereto.
[0052] Subsequently, as shown in FIG. 19, a via 500 for interlayer
connection is formed in the insulation layer 300, and the metal
barrier layer 130 is removed.
[0053] In this step, a via hole is formed in the insulation layer
300 through drilling work such as computer numerical controlled
(CNC) drilling, CO.sub.2 drilling or Yag laser drilling, and then
deburring and desmearing works are performed in order to remove the
burr and smear of copper foil produced by the drilling work.
Thereafter, plating is performed in the via hole, the plating layer
formed on the insulation layer 300 is removed, and then the metal
barrier layer 130 is removed.
[0054] Subsequently, as shown in FIG. 20, a second solder resist
layer 600 is formed on the insulation layer 300, openings for
exposing the pad regions of the first pattern 140 are formed in the
second solder resist layer 600, and then a protective layer 610 for
protecting the exposed first pattern 140 from the external
environment is formed.
[0055] Finally, as shown in FIG. 21, the adhesion layer 400 is
removed to manufacture a two-layered printed circuit board. In this
case, when a thermal adhesive is used, the two-layered printed
circuit board is divided into two single-layered printed circuit
boards by applying heat to the thermal adhesive. Thereafter,
openings for exposing the pad regions of the second pattern 240 and
260 are formed in the first solder resist layer 230, and then a
protective layer 232 for protecting the exposed second pattern 240
and 260 from the external environment is formed.
[0056] FIGS. 22 to 25 are sectional views showing a method of
manufacturing a printed circuit board according to a second
embodiment of the present invention. In the description of the
method of manufacturing a printed circuit board according to the
second embodiment of the present invention, the same reference
numerals are used to designate the components the same as or
similar to those of the above first embodiment, and redundant
descriptions thereof will be omitted. Hereinafter, the method of
manufacturing a printed circuit board according to this embodiment
of the present invention will be described with reference to FIGS.
22 to 25.
[0057] First, as shown in FIG. 22, carriers, each including a first
pattern 140 formed on one side thereof, are formed, and a first
solder resist layer 230 and a second pattern 240 and 260 are
sequentially formed on both sides of an adhesion layer 400 to
prepare an intermediate substrate, and then the carriers are
disposed on both sides of the intermediate substrate such that an
insulation layer 300 faces the first pattern 140.
[0058] In this case, since the carriers, each including a first
pattern 140 formed on one side thereof, are formed using the method
shown in FIGS. 8 and 9 and have the same structure as those shown
in FIGS. 8 and 9, detailed description thereof will be omitted.
[0059] Further, the intermediate substrate is formed by
sequentially forming the first solder resist layer 230 and a seed
layer 240 on the adhesion layer 400, forming a plating layer 260 on
the seed layer 240 and then patterning the seed layer 240 and the
plating layer 260. Here, an assembly of the seed layer 240 and the
plating layer 260 is designated as a second pattern 240 and
260.
[0060] Subsequently, as shown in FIG. 23, the insulation layers 300
and carriers are layered in both sides of the intermediate
substrate through a thermal pressing process. A dual-structure
substrate is fabricated by performing the thermal pressing process
once.
[0061] Subsequently, as shown in FIG. 24, a copper foil layer 120,
which is a carrier, is removed, a via 500 for connecting the first
pattern 140 with the second pattern 240 and 260 is formed in the
insulation layer 300, and then a second solder resist layer 600 is
formed on the insulation layer 300 in which the second pattern 240
and 260 is embedded.
[0062] Here, a metal barrier 130 is removed while forming the via
500.
[0063] In this case, openings for exposing the pad regions of the
first pattern 140 are formed in the second solder resist layer 600,
and then a protective layer 610 for protecting the exposed first
pattern 140 from the external environment is formed.
[0064] Finally, as shown in FIG. 25, the adhesion layer 400 is
removed to manufacture a two-layered printed circuit board.
Thereafter, openings for exposing the pad regions of the second
pattern 240 and 260 are formed in the first solder resist layer
230, and then a protective layer 232 for protecting the exposed
second pattern 240 and 260 from the external environment is
formed.
[0065] As described above, the printed circuit boards according to
the first and second embodiments of the present invention have the
structures shown in FIGS. 21 and 25, respectively. That is, each of
the printed circuit boards has a structure in which the first
pattern 140 composed of a plating layer formed through electrolytic
plating is embedded in one side of the insulation layer 300 and the
second pattern 240 and 260 composed of the seed layer 240 and the
plating layer 260 formed through electrolytic plating is embedded
in the other side of the insulation layer 300. In this case, the
second solder resist layer 600 is formed on one side of the
insulation layer 300, and the first solder resist layer 230 is
formed on the other side thereof.
[0066] According to the present invention, since additional
processes are performed in a state in which two substrates are
attached to form a dual structure, the damage of a printed circuit
board, occurring during the manufacturing process thereof, can be
minimized. Specifically, the damage of a thin printed circuit board
can be minimized during the via forming process and the second
solder resist layer forming process performed after the formation
of the dual-structured substrate. Therefore, it is possible to
manufacture thin printed circuit boards which are less damaged.
[0067] Embodiments of the present invention may suitably comprise,
consist or consist essentially of the elements disclosed and may be
practiced in the absence of an element not disclosed. For example,
it can be recognized by those skilled in the art that certain steps
can be combined into a single step.
[0068] The terms and words used in the present specification and
claims should not be interpreted as being limited to typical
meanings or dictionary definitions, but should be interpreted as
having meanings and concepts relevant to the technical scope of the
present invention based on the rule according to which an inventor
can appropriately define the concept of the term to describe the
best method he or she knows for carrying out the invention.
[0069] The singular forms "a," "an," and "the" include plural
referents, unless the context clearly dictates otherwise.
[0070] As used herein and in the appended claims, the words
"comprise," "has," and "include" and all grammatical variations
thereof are each intended to have an open, non-limiting meaning
that does not exclude additional elements or steps.
[0071] Ranges may be expressed herein as from about one particular
value, and/or to about another particular value. When such a range
is expressed, it is to be understood that another embodiment is
from the one particular value and/or to the other particular value,
along with all combinations within said range.
[0072] Although the present invention has been described in detail,
it should be understood that various changes, substitutions, and
alterations can be made hereupon without departing from the
principle and scope of the invention. Accordingly, the scope of the
present invention should be determined by the following claims and
their appropriate legal equivalents.
* * * * *