HWANG; Mi Sun
Patent Applications and Registrations
Patent applications and USPTO patent grants for HWANG; Mi Sun.The latest application filed is for "printed circuit board".
Company Profile
15.24.42
- HWANG; Mi Sun - Suwon-si KR
- Hwang; Mi Sun - Daegu KR
- Hwang; Mi Sun - Seoul N/A KR
- Hwang; Mi Sun - Gyunggi-do KR
- Hwang; Mi Sun - Suwon KR
Patent Activity
| Patent | Date |
|---|---|
| Printed Circuit Board App 20220104345 - YOO; Ga Young ; et al. | 2022-03-31 |
| Printed Circuit Board And Substrate Including Electronic Component Embedded Therein App 20220078905 - BYUN; Dae Jung ; et al. | 2022-03-10 |
| Printed Circuit Board, Electronic Component-embedded Substrate, And Manufacturing Method Thereof App 20220039261 - HWANG; Mi Sun ; et al. | 2022-02-03 |
| Substrate With Electronic Component Embedded Therein App 20220030710 - Kim; Song I ; et al. | 2022-01-27 |
| Substrate having electronic component embedded therein Grant 11,183,462 - Hwang , et al. November 23, 2 | 2021-11-23 |
| Electronic component embedded substrate Grant 11,076,487 - Hwang , et al. July 27, 2 | 2021-07-27 |
| Electronic Component Embedded Substrate App 20210193609 - Hwang; Mi Sun ; et al. | 2021-06-24 |
| Substrate Having Electronic Component Embedded Therein App 20210183784 - HWANG; Mi Sun ; et al. | 2021-06-17 |
| Substrate Embedded Electronic Component Package App 20210183774 - BYUN; Dae Jung ; et al. | 2021-06-17 |
| Electronic Component Embedded Substrate App 20210185819 - HWANG; Mi Sun ; et al. | 2021-06-17 |
| Inductor Grant 11,017,930 - Hwang , et al. May 25, 2 | 2021-05-25 |
| Printed circuit board Grant 11,013,114 - Kang , et al. May 18, 2 | 2021-05-18 |
| Printed circuit board and method of manufacturing the same Grant 10,887,986 - Hwang , et al. January 5, 2 | 2021-01-05 |
| Printed circuit board and method of manufacturing the same Grant 10,849,226 - Hwang , et al. November 24, 2 | 2020-11-24 |
| Printed circuit board Grant 10,779,409 - Na , et al. Sept | 2020-09-15 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20200178390 - HWANG; Mi-Sun ; et al. | 2020-06-04 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20200178392 - HWANG; Mi-Sun ; et al. | 2020-06-04 |
| Printed Circuit Board App 20200170110 - KANG; Seon-Ha ; et al. | 2020-05-28 |
| Printed Circuit Board App 20200154568 - NA; Byung-Duk ; et al. | 2020-05-14 |
| Coil electronic component Grant 10,650,958 - Jo , et al. | 2020-05-12 |
| Multilayered substrate and method for manufacturing the same Grant 10,455,708 - Ahn , et al. Oc | 2019-10-22 |
| Inductor And Manufacturing Method Thereof App 20190318867 - LEE; Sa Yong ; et al. | 2019-10-17 |
| Inductor App 20190244739 - HWANG; Mi Sun ; et al. | 2019-08-08 |
| Multilayer capacitor and manufacturing method thereof Grant 10,304,628 - Hwang , et al. | 2019-05-28 |
| Bio-ink Composition Having Improved Physical And Biological Properties App 20180280578 - Hwang; Mi Sun | 2018-10-04 |
| Multilayer Capacitor And Manufacturing Method Thereof App 20180090273 - HWANG; Mi Sun ; et al. | 2018-03-29 |
| Multi-layered Substrate And Method Of Manufacturing The Same App 20180070458 - AHN; Seok-Hwan ; et al. | 2018-03-08 |
| Coil component and method of manufacturing the same Grant 9,899,136 - Lee , et al. February 20, 2 | 2018-02-20 |
| Multilayered substrate and method of manufacturing the same Grant 9,832,866 - Ahn , et al. November 28, 2 | 2017-11-28 |
| Coil Component And Method Of Manufacturing The Same App 20170330674 - LEE; Sa Yong ; et al. | 2017-11-16 |
| Coil Electronic Component App 20170301453 - JO; Dae Hui ; et al. | 2017-10-19 |
| Printed circuit board and manufacturing method thereof Grant 9,706,644 - Kim , et al. July 11, 2 | 2017-07-11 |
| Printed Circuit Board And Manufacturing Method Thereof App 20170055345 - KIM; Sung-Han ; et al. | 2017-02-23 |
| Multilayered Substrate And Method Of Manufacturing The Same App 20160381794 - AHN; Seok-Hwan ; et al. | 2016-12-29 |
| Printed Circuit Board App 20150136446 - RYU; Joung Gul ; et al. | 2015-05-21 |
| Lighting apparatus Grant 8,928,234 - Kim , et al. January 6, 2 | 2015-01-06 |
| Method of manufacturing printed circuit board Grant 8,881,381 - Hwang , et al. November 11, 2 | 2014-11-11 |
| Method of manufacturing a printed circuit board Grant 8,720,048 - Hwang , et al. May 13, 2 | 2014-05-13 |
| Method Of Manufacturing Printed Circuit Board App 20140090245 - HWANG; Mi Sun ; et al. | 2014-04-03 |
| Device And Method For Providing Application Interface Based On Writing Input App 20140089841 - KIM; Jong Gon ; et al. | 2014-03-27 |
| Method And Device For Executing A Specific Operation Based On Writing App 20140089855 - KIM; Jong-Gon ; et al. | 2014-03-27 |
| Method Of Manufacturing A Printed Circuit Board App 20140017397 - HWANG; Mi Sun ; et al. | 2014-01-16 |
| Printed circuit board and method of manufacturing the same Grant 8,541,096 - Hwang , et al. September 24, 2 | 2013-09-24 |
| Method of manufacturing printed circuit board having landless via hole Grant 8,418,361 - Lee , et al. April 16, 2 | 2013-04-16 |
| Method for manufacturing semiconductor package Grant 8,415,200 - Hwang , et al. April 9, 2 | 2013-04-09 |
| Board On Chip Package Substrate And Manufacturing Method Thereof App 20120225521 - Hwang; Mi-Sun ; et al. | 2012-09-06 |
| Printed Circuit Board And Method For Manufacturing The Same App 20120103671 - LEE; Eung Suek ; et al. | 2012-05-03 |
| Method For Manufacturing Semiconductor Package App 20120088334 - HWANG; Mi Sun ; et al. | 2012-04-12 |
| Method Of Manufacturing Printed Circuit Board Having Landless Via Hole App 20120060369 - LEE; Suk Won ; et al. | 2012-03-15 |
| Method of manufacturing printed circuit board including outmost fine circuit pattern App 20120011716 - Kim; Han ; et al. | 2012-01-19 |
| Board On Chip Package Substrate And Manufacturing Method Thereof App 20110186997 - HWANG; Mi-Sun ; et al. | 2011-08-04 |
| Lighting Apparatus App 20110138905 - KIM; Ji Young ; et al. | 2011-06-16 |
| Method of fabricating printed circuit board App 20110067233 - Kang; Seon Ha ; et al. | 2011-03-24 |
| Printed circuit board and method of manufacturing the same App 20110061905 - Hwang; Mi Sun ; et al. | 2011-03-17 |
| Printed circuit board and fabrication method thereof App 20110061906 - Cho; Min Jung ; et al. | 2011-03-17 |
| Printed circuit board and manufacturing method thereof App 20110061912 - Kang; Myung Sam ; et al. | 2011-03-17 |
| Method Of Manufacturing Printed Circuit Board App 20110061231 - HWANG; Mi Sun ; et al. | 2011-03-17 |
| Printed Circuit Board, Semiconductor Device Comprising The Same, And Method Of Manufacturing The Same App 20100314755 - KANG; Myung Sam ; et al. | 2010-12-16 |
| Printed circuit board including outmost fine circuit pattern and method of manufacturing the same App 20090288872 - Kim; Han ; et al. | 2009-11-26 |
| Printed circuit board and method of manufacturing the same App 20090260868 - Oh; Chang Gun ; et al. | 2009-10-22 |
| Printed circuit board having landless via hole and method of manufacturing the same App 20090255722 - Lee; Suk Won ; et al. | 2009-10-15 |
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