| Patent | Date |
|---|
Fan-out Semiconductor Package
App 20220037259 - KANG; Myung Sam ; et al. | 2022-02-03 |
Semiconductor Package
App 20220005793 - KANG; Myung Sam ; et al. | 2022-01-06 |
Semiconductor Package
App 20210320058 - KANG; Myung Sam ; et al. | 2021-10-14 |
Semiconductor Package And Antenna Module Comprising The Same
App 20210313276 - LEE; Yong Koon ; et al. | 2021-10-07 |
Semiconductor package
Grant 11,075,152 - Kang , et al. July 27, 2 | 2021-07-27 |
Semiconductor package
Grant 11,075,193 - Kang , et al. July 27, 2 | 2021-07-27 |
Semiconductor package and antenna module comprising the same
Grant 11,062,999 - Lee , et al. July 13, 2 | 2021-07-13 |
Semiconductor package and antenna module including the same
Grant 11,037,880 - Kang , et al. June 15, 2 | 2021-06-15 |
Coil electronic component
Grant 11,017,936 - Kim , et al. May 25, 2 | 2021-05-25 |
Semiconductor Package
App 20200411460 - PARK; Yong Jin ; et al. | 2020-12-31 |
Semiconductor Package And Antenna Module Including The Same
App 20200373244 - KANG; Myung Sam ; et al. | 2020-11-26 |
Inductor and method of manufacturing the same
Grant 10,847,300 - Choi , et al. November 24, 2 | 2020-11-24 |
Fan-out Semiconductor Package
App 20200350262 - Moon; Seon Hee ; et al. | 2020-11-05 |
Semiconductor package integrating active and passive components with electromagnetic shielding
Grant 10,825,775 - Kang , et al. November 3, 2 | 2020-11-03 |
Semiconductor package
Grant 10,818,604 - Kang , et al. October 27, 2 | 2020-10-27 |
Semiconductor package
Grant 10,811,328 - Kang , et al. October 20, 2 | 2020-10-20 |
Semiconductor Package
App 20200321257 - KANG; Myung Sam ; et al. | 2020-10-08 |
Semiconductor Package
App 20200312757 - KANG; Myung Sam ; et al. | 2020-10-01 |
Semiconductor Package
App 20200303314 - KANG; Myung Sam ; et al. | 2020-09-24 |
Fan-out semiconductor package
Grant 10,748,856 - Moon , et al. A | 2020-08-18 |
Semiconductor package
Grant 10,727,212 - Moon , et al. | 2020-07-28 |
Multilayer Seed Pattern Inductor And Manufacturing Method Thereof
App 20200194158 - CHOI; Woon Chul ; et al. | 2020-06-18 |
Coil electronic component
Grant 10,650,958 - Jo , et al. | 2020-05-12 |
Semiconductor Package
App 20200144235 - Kang; Myung Sam ; et al. | 2020-05-07 |
Semiconductor Package And Antenna Module Comprising The Same
App 20200135654 - LEE; Yong Koon ; et al. | 2020-04-30 |
Coil electronic component and method of manufacturing the same
Grant 10,636,562 - Kim , et al. | 2020-04-28 |
Multilayer seed pattern inductor and manufacturing method thereof
Grant 10,614,943 - Choi , et al. | 2020-04-07 |
Fan-out semiconductor package
Grant 10,541,221 - Seol , et al. Ja | 2020-01-21 |
Coil electronic component and method of manufacturing the same
Grant 10,515,755 - Kim , et al. Dec | 2019-12-24 |
Semiconductor Package
App 20190371731 - KANG; Myung Sam ; et al. | 2019-12-05 |
Fan-out semiconductor package
Grant 10,475,748 - Lee , et al. Nov | 2019-11-12 |
Coil Electronic Component And Method Of Manufacturing The Same
App 20190333683 - KIM; Ki Seok ; et al. | 2019-10-31 |
Multilayered substrate and method for manufacturing the same
Grant 10,455,708 - Ahn , et al. Oc | 2019-10-22 |
Semiconductor Package
App 20190287953 - MOON; Seon Hee ; et al. | 2019-09-19 |
Fan-out Semiconductor Package
App 20190287924 - MOON; Seon Hee ; et al. | 2019-09-19 |
Fan-out semiconductor package
Grant 10,410,961 - Lee , et al. Sept | 2019-09-10 |
Coil Component
App 20190267182 - LEE; Sa Yong ; et al. | 2019-08-29 |
Coil electronic component and method of manufacturing the same
Grant 10,395,814 - Kim , et al. A | 2019-08-27 |
Circuit board and manufacturing method thereof
Grant 10,362,667 - Min , et al. | 2019-07-23 |
Printed circuit board with inner layer and outer layers and method of manufacturing the same
Grant 10,356,916 - Kim , et al. July 16, 2 | 2019-07-16 |
Fan-out Semiconductor Package
App 20190198429 - KANG; Myung Sam ; et al. | 2019-06-27 |
Fan-out Semiconductor Package
App 20190164926 - Seol; Yong Jin ; et al. | 2019-05-30 |
Multilayer capacitor and manufacturing method thereof
Grant 10,304,628 - Hwang , et al. | 2019-05-28 |
Inductor Device And Method Of Manufacturing The Same
App 20190139696 - KIM; In-Seok ; et al. | 2019-05-09 |
Fan-out Semiconductor Package
App 20190131226 - LEE; Jeong Ho ; et al. | 2019-05-02 |
Fan-out Semiconductor Package
App 20190131253 - LEE; Jeong Ho ; et al. | 2019-05-02 |
Fan-out Semiconductor Package
App 20190131242 - LEE; Jeong Ho ; et al. | 2019-05-02 |
Fan-out semiconductor package
Grant 10,217,709 - Kang , et al. Feb | 2019-02-26 |
Circuit board and circuit board assembly
Grant 10,212,803 - Min , et al. Feb | 2019-02-19 |
Electronic component package and package-on-package structure including the same
Grant 10,109,588 - Jeong , et al. October 23, 2 | 2018-10-23 |
Coil electronic component and manufacturing method thereof
Grant 10,102,964 - Kim , et al. October 16, 2 | 2018-10-16 |
Circuit board and manufacturing method thereof
Grant 10,064,291 - Min , et al. August 28, 2 | 2018-08-28 |
Printed circuit board and method of manufacturing the same
Grant 10,021,785 - Kang , et al. July 10, 2 | 2018-07-10 |
Circuit board comprising heat transfer structure
Grant 10,015,877 - Min , et al. July 3, 2 | 2018-07-03 |
Circuit board and assembly thereof
Grant 9,992,865 - Min , et al. June 5, 2 | 2018-06-05 |
Inductor And Method Of Manufacturing The Same
App 20180130595 - Choi; Jung Woo ; et al. | 2018-05-10 |
Chip electronic component and manufacturing method thereof
Grant 9,966,178 - Seo , et al. May 8, 2 | 2018-05-08 |
Coil Electronic Component And Method Of Manufacturing The Same
App 20180122556 - KIM; Ki Seok ; et al. | 2018-05-03 |
Coil Electronic Component And Method Of Manufacturing The Same
App 20180122557 - KIM; Ki Seok ; et al. | 2018-05-03 |
Coil Electronic Component
App 20180122548 - KIM; Ye Jeong ; et al. | 2018-05-03 |
Multilayer Electronic Component And Method Of Manufacturing The Same
App 20180122555 - KIM; Ki Seok ; et al. | 2018-05-03 |
Fan-out Semiconductor Package
App 20180102322 - KANG; Seon Ha ; et al. | 2018-04-12 |
Multilayer Capacitor And Manufacturing Method Thereof
App 20180090273 - HWANG; Mi Sun ; et al. | 2018-03-29 |
Multi-layered Substrate And Method Of Manufacturing The Same
App 20180070458 - AHN; Seok-Hwan ; et al. | 2018-03-08 |
Coil component and method of manufacturing the same
Grant 9,899,136 - Lee , et al. February 20, 2 | 2018-02-20 |
Printed circuit board and method of manufacturing the same
Grant 9,839,126 - Kang , et al. December 5, 2 | 2017-12-05 |
Multilayered substrate and method of manufacturing the same
Grant 9,832,866 - Ahn , et al. November 28, 2 | 2017-11-28 |
Circuit board, electronic component and method of manufacturing circuit board
Grant 9,832,885 - Kang , et al. November 28, 2 | 2017-11-28 |
Circuit board
Grant 9,832,856 - Min , et al. November 28, 2 | 2017-11-28 |
Coil Component And Method Of Manufacturing The Same
App 20170330674 - LEE; Sa Yong ; et al. | 2017-11-16 |
Coil Electronic Component
App 20170301453 - JO; Dae Hui ; et al. | 2017-10-19 |
Package board, method for manufacturing the same and package on package having the same
Grant 9,793,250 - Kang , et al. October 17, 2 | 2017-10-17 |
Circuit Board And Manufacturing Method Thereof
App 20170251548 - MIN; Tae-Hong ; et al. | 2017-08-31 |
Circuit board including heat dissipation structure
Grant 9,699,885 - Min , et al. July 4, 2 | 2017-07-04 |
Coil Component
App 20170148562 - LEE; Sa Yong ; et al. | 2017-05-25 |
Circuit board
Grant 9,655,229 - Min , et al. May 16, 2 | 2017-05-16 |
Printed Circuit Board And Method For Manufacturing The Same
App 20170094773 - SEO; Il-Jong ; et al. | 2017-03-30 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20170086299 - KANG; Myung-Sam ; et al. | 2017-03-23 |
Printed circuit board and method of manufacturing the same
Grant 9,554,466 - Kang , et al. January 24, 2 | 2017-01-24 |
Multilayered Substrate And Method Of Manufacturing The Same
App 20160381794 - AHN; Seok-Hwan ; et al. | 2016-12-29 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20160381791 - KIM; Han ; et al. | 2016-12-29 |
Electronic Component Package And Package-on-package Structure Including The Same
App 20160336296 - JEONG; Sung Won ; et al. | 2016-11-17 |
Multilayer Seed Pattern Inductor And Manufacturing Method Thereof
App 20160336105 - CHOI; Woon Chul ; et al. | 2016-11-17 |
Circuit Board And Circuit Board Assembly
App 20160309575 - MIN; Tae Hong ; et al. | 2016-10-20 |
Circuit Board
App 20160302298 - MIN; Tae-Hong ; et al. | 2016-10-13 |
Inductor Device And Method Of Manufacturing The Same
App 20160293320 - Kim; In-Seok ; et al. | 2016-10-06 |
Chip Electronic Component And Manufacturing Method Thereof
App 20160247624 - SEO; Youn-Soo ; et al. | 2016-08-25 |
Circuit Board And Manufacturing Method Thereof
App 20160249450 - MIN; Tae-Hong ; et al. | 2016-08-25 |
Circuit Board And Assembly Thereof
App 20160249457 - MIN; Tae-Hong ; et al. | 2016-08-25 |
Circuit Board And Manufacturing Method Thereof
App 20160249445 - MIN; Tae-Hong ; et al. | 2016-08-25 |
Printed Circuit Board Having Metal Bumps
App 20160242284 - KANG; Myung Sam ; et al. | 2016-08-18 |
Coil Electronic Component And Manufacturing Method Thereof
App 20160240296 - KIM; Jin-Soo ; et al. | 2016-08-18 |
Coreless board for semiconductor package, method of manufacturing the same, and method of manufacturing semiconductor package using the same
Grant 9,420,709 - Lee , et al. August 16, 2 | 2016-08-16 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20160192490 - KANG; Myung-Sam ; et al. | 2016-06-30 |
Circuit Board And Manufacturing Method Thereof
App 20160192471 - MIN; Tae-Hong ; et al. | 2016-06-30 |
Circuit Board, Multilayered Substrate Having The Circuit Board And Method Of Manufacturing The Circuit Board
App 20160192488 - MIN; Tae-Hong ; et al. | 2016-06-30 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20160192491 - KANG; Myung-Sam ; et al. | 2016-06-30 |
Circuit Board
App 20160143129 - MIN; Tae-Hong ; et al. | 2016-05-19 |
Circuit Board And Method Of Manufacturing The Same
App 20160143132 - MIN; Tae-Hong ; et al. | 2016-05-19 |
Printed Circuit Board And Manufacturing Method Thereof
App 20160100485 - JUNG; Hye-Won ; et al. | 2016-04-07 |
Circuit Board And Manufacturing Method Thereof
App 20160095202 - MIN; Tae Hong ; et al. | 2016-03-31 |
Circuit Board Including Heat Dissipation Structure
App 20160095198 - MIN; Tae Hong ; et al. | 2016-03-31 |
Circuit Board Comprising Heat Transfer Structure
App 20160095201 - MIN; Tae Hong ; et al. | 2016-03-31 |
Circuit Board
App 20160095203 - MIN; Tae Hong ; et al. | 2016-03-31 |
Package Board, Method For Manufacturing The Same And Package On Package Having The Same
App 20160081182 - KANG; Myung Sam ; et al. | 2016-03-17 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20160050752 - KANG; Myung Sam ; et al. | 2016-02-18 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20160050755 - KANG; Myung Sam ; et al. | 2016-02-18 |
Printed Circuit Board And Manufacturing Method Thereof
App 20160037620 - KANG; Myung Sam ; et al. | 2016-02-04 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20160029488 - KANG; Myung Sam ; et al. | 2016-01-28 |
Package Board, Method Of Manufacturing The Same And Stack Type Package Using The Same
App 20160021749 - BONG; Kang Wook ; et al. | 2016-01-21 |
Chip Embedded Substrate And Method Of Manufacturing The Same
App 20160021755 - LEE; Jung Han ; et al. | 2016-01-21 |
Package Structure And Manufacturing Method Thereof
App 20160007467 - LEE; Seung-Eun ; et al. | 2016-01-07 |
Package Board And Package Using The Same
App 20150364407 - IM; Se Rang ; et al. | 2015-12-17 |
Circuit Board And Method Of Manufacturing The Same
App 20150366059 - LEE; Seung Eun ; et al. | 2015-12-17 |
Package Board And Package Using The Same
App 20150364539 - IM; Se Rang ; et al. | 2015-12-17 |
Package Substrate, Package, Package On Package And Manufacturing Method Of Package Substrate
App 20150348918 - PARK; Jin Seon ; et al. | 2015-12-03 |
Circuit Board And Method Of Manufacturing Circuit Board
App 20150351231 - LEE; Young Kwan ; et al. | 2015-12-03 |
Package Board And Method For Manufacturing The Same
App 20150351247 - KWON; Kwang Hee ; et al. | 2015-12-03 |
Package Board And Method For Manufacturing The Same
App 20150351228 - PARK; Jin Seon ; et al. | 2015-12-03 |
Circuit Board, Electronic Component And Method Of Manufacturing Circuit Board
App 20150342047 - KANG; Myung Sam ; et al. | 2015-11-26 |
Printed Circuit Board, Method For Maufacturing The Same And Package On Package Having The Same
App 20150342046 - KIM; Hye Jin ; et al. | 2015-11-26 |
Package Board, Method Of Manufacturing The Same, And Semiconductor Package Using The Same
App 20150195905 - KANG; Myung Sam ; et al. | 2015-07-09 |
Package Substrate And Method For Manufacturing The Same
App 20150179594 - HWANG; Jun-Oh ; et al. | 2015-06-25 |
Printed Circuit Board And Manufacturing Method Thereof
App 20150156891 - SUNG; Ki Jung ; et al. | 2015-06-04 |
Coreless Board For Semiconductor Package, Method Of Manufacturing The Same, And Method Of Manufacturing Semiconductor Package Using The Same
App 20150156865 - LEE; Young Kwan ; et al. | 2015-06-04 |
Method of manufacturing printed circuit board having buried solder bump
Grant 9,021,690 - Kang May 5, 2 | 2015-05-05 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20150068793 - Kang; Myung Sam ; et al. | 2015-03-12 |
Method of manufacturing a ball grid array substrate or a semiconductor chip package
Grant 8,945,993 - Park , et al. February 3, 2 | 2015-02-03 |
Semiconductor Package Board And Method For Manufacturing The Same
App 20140360768 - KANG; Myung Sam | 2014-12-11 |
Method of manufacturing printed circuit board
Grant 8,881,381 - Hwang , et al. November 11, 2 | 2014-11-11 |
Printed Circuit Board Having Metal Bumps
App 20140202748 - KANG; Myung Sam ; et al. | 2014-07-24 |
Method of manufacturing a printed circuit board
Grant 8,720,048 - Hwang , et al. May 13, 2 | 2014-05-13 |
Multi-layer Type Coreless Substrate And Method Of Manufacturing The Same
App 20140102766 - Kim; Da Hee ; et al. | 2014-04-17 |
Multi-layer Type Printed Circuit Board And Method Of Manufacturing The Same
App 20140102767 - Kang; Myung Sam ; et al. | 2014-04-17 |
Method Of Manufacturing Printed Circuit Board
App 20140090245 - HWANG; Mi Sun ; et al. | 2014-04-03 |
Method of manufacturing substrate using a carrier
Grant 8,677,618 - Kim , et al. March 25, 2 | 2014-03-25 |
Multilayer Type Coreless Substrate And Method Of Manufacturing The Same
App 20140027156 - Kim; Ki Hwan ; et al. | 2014-01-30 |
Circuit board with high-density circuit patterns
Grant 8,633,392 - Okabe , et al. January 21, 2 | 2014-01-21 |
Method Of Manufacturing A Ball Grid Array Substrate Or A Semiconductor Chip Package
App 20140017855 - PARK; Jung Hyun ; et al. | 2014-01-16 |
Coreless Subtrate And Method Of Manufacturing The Same
App 20140014398 - Kim; Ki Hwan ; et al. | 2014-01-16 |
Method Of Manufacturing A Printed Circuit Board
App 20140017397 - HWANG; Mi Sun ; et al. | 2014-01-16 |
Ball grid array substrate with insulating layer and semiconductor chip package
Grant 8,546,943 - Park , et al. October 1, 2 | 2013-10-01 |
Printed circuit board and method of manufacturing the same
Grant 8,541,096 - Hwang , et al. September 24, 2 | 2013-09-24 |
Method of manufacturing a printed circuit board having metal bumps
Grant 8,464,423 - Kang , et al. June 18, 2 | 2013-06-18 |
Method for manufacturing semiconductor package
Grant 8,415,200 - Hwang , et al. April 9, 2 | 2013-04-09 |
Method Of Manufacturing A Printed Circuit Board Having Embedded Electronic Components
App 20130042472 - LEE; Doo-Hwan ; et al. | 2013-02-21 |
Conductive paste, printed circuit board, and manufacturing method thereof
Grant 8,298,447 - Kim , et al. October 30, 2 | 2012-10-30 |
Board On Chip Package Substrate And Manufacturing Method Thereof
App 20120225521 - Hwang; Mi-Sun ; et al. | 2012-09-06 |
Method of manufacturing high density printed circuit board
Grant 8,256,112 - Kang September 4, 2 | 2012-09-04 |
Method Of Manufacturing A Metal Clad Laminate
App 20120192417 - KANG; Myung-Sam | 2012-08-02 |
Manufacturing method of printed circuit board
Grant 8,197,702 - Kang , et al. June 12, 2 | 2012-06-12 |
Manufacturing method of printed circuit board
Grant 8,187,479 - Kang May 29, 2 | 2012-05-29 |
Circuit Board With High-density Circuit Patterns
App 20120111607 - OKABE; Shuhichi ; et al. | 2012-05-10 |
Method For Manufacturing Semiconductor Package
App 20120088334 - HWANG; Mi Sun ; et al. | 2012-04-12 |
Carrier Member For Transmitting Circuits, Coreless Printed Circuit Board Using The Carrier Member, And Method Of Manufacturing The Same
App 20120073865 - Kang; Myung Sam ; et al. | 2012-03-29 |
Method of manufacturing a printed circuit board having metal bumps
Grant 8,141,241 - Kang , et al. March 27, 2 | 2012-03-27 |
Printed circuit board having metal bumps
App 20120061132 - Kang; Myung Sam ; et al. | 2012-03-15 |
Method of manufacturing a printed circuit board having metal bumps
App 20120060365 - Kang; Myung Sam ; et al. | 2012-03-15 |
Circuit board and method for manufacturing thereof
Grant 8,124,880 - Okabe , et al. February 28, 2 | 2012-02-28 |
Method of manufacturing printed circuit board having buried solder bump
App 20120005886 - Kang; Myung Sam | 2012-01-12 |
Method of manufacturing substrate using a carrier
App 20110318480 - Kim; Ki Hwan ; et al. | 2011-12-29 |
Printed circuit board
Grant 8,080,741 - Kang , et al. December 20, 2 | 2011-12-20 |
Method of manufacturing mounting substrate
App 20110303636 - Ahn; Jin-Yong ; et al. | 2011-12-15 |
Circuit board with buried circuit pattern
App 20110259627 - Jung; Hoe-Ku ; et al. | 2011-10-27 |
Printed circuit board having a buried solder bump and a circuit layer flush with an insulating layer
Grant 8,039,762 - Kang October 18, 2 | 2011-10-18 |
Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same
Grant 8,022,311 - Kim , et al. September 20, 2 | 2011-09-20 |
Mounting substrate and manufacturing method thereof
Grant 8,022,553 - Ahn , et al. September 20, 2 | 2011-09-20 |
Board on chip package
App 20110221074 - Kang; Myung-Sam ; et al. | 2011-09-15 |
Board on chip package and manufacturing method thereof
Grant 8,003,439 - Kang , et al. August 23, 2 | 2011-08-23 |
Method of manufacturing a circuit board
Grant 7,992,291 - Jung , et al. August 9, 2 | 2011-08-09 |
Board On Chip Package Substrate And Manufacturing Method Thereof
App 20110186997 - HWANG; Mi-Sun ; et al. | 2011-08-04 |
Electromagnetic Bandgap Structure And Circuit Board
App 20110163823 - PARK; Dae-Hyun ; et al. | 2011-07-07 |
Method of manufacturing printed circuit board
Grant 7,972,460 - Kang , et al. July 5, 2 | 2011-07-05 |
Method of manufacturing circuit board
Grant 7,937,833 - Jung , et al. May 10, 2 | 2011-05-10 |
Ball grid array substrate, semiconductor chip package and method of manufacturing the same
App 20110095425 - Park; Jung Hyun ; et al. | 2011-04-28 |
Method of fabricating printed circuit board
App 20110067233 - Kang; Seon Ha ; et al. | 2011-03-24 |
Printed circuit board and manufacturing method thereof
App 20110061912 - Kang; Myung Sam ; et al. | 2011-03-17 |
Printed circuit board and method of manufacturing the same
App 20110061905 - Hwang; Mi Sun ; et al. | 2011-03-17 |
Printed circuit board and fabrication method thereof
App 20110061906 - Cho; Min Jung ; et al. | 2011-03-17 |
Method Of Manufacturing Printed Circuit Board
App 20110061231 - HWANG; Mi Sun ; et al. | 2011-03-17 |
Printed circuit board and method of manufacturing the same
App 20110061907 - Kang; Myung Sam ; et al. | 2011-03-17 |
Method of manufacturing a metal clad laminate
App 20110036486 - Kang; Myung-Sam | 2011-02-17 |
Method for manufacturing a substrate with cavity
Grant 7,858,437 - Jung , et al. December 28, 2 | 2010-12-28 |
Printed Circuit Board, Semiconductor Device Comprising The Same, And Method Of Manufacturing The Same
App 20100314755 - KANG; Myung Sam ; et al. | 2010-12-16 |
Manufacturing method of bottom substrate of package
App 20100255634 - Park; Jung-Hyun ; et al. | 2010-10-07 |
Rigid-flexible printed circuit board manufacturing method for package on package
Grant 7,802,358 - Jung , et al. September 28, 2 | 2010-09-28 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20100193232 - Kang; Myung Sam ; et al. | 2010-08-05 |
Method of manufacturing a printed circuit board having embedded electronic components
App 20100154210 - Lee; Doo-Hwan ; et al. | 2010-06-24 |
Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrier
App 20100147559 - Kim; Ki Hwan ; et al. | 2010-06-17 |
Printed circuit board having metal bump and method of manufacring the same
App 20100132985 - Kang; Myung Sam ; et al. | 2010-06-03 |
Manufacturing Method Of Printed Circuit Board
App 20100132876 - Kang; Myung-Sam ; et al. | 2010-06-03 |
Printed circuit board having buried solder bump and manufacturing method thereof
App 20100116536 - Kang; Myung Sam | 2010-05-13 |
Electronic component package and manufacturing method thereof
App 20100108372 - Kang; Myung-Sam | 2010-05-06 |
Method of fabricating multilayer printed circuit board
Grant 7,707,715 - Okabe , et al. May 4, 2 | 2010-05-04 |
Printed circuit board having embedded electronic components and manufacturing method thereof
Grant 7,697,301 - Lee , et al. April 13, 2 | 2010-04-13 |
Method of fabricating multilayer printed circuit board
App 20100024212 - Okabe; Shuhichi ; et al. | 2010-02-04 |
Method Of Manufacturing Printed Circuit Board
App 20100018633 - KANG; Myung-Sam ; et al. | 2010-01-28 |
Metal clad laminate and manufacturing method thereof
App 20090324992 - Kang; Myung-Sam | 2009-12-31 |
Manufacturing Method Of Printed Circuit Board
App 20090321387 - KANG; Myung-Sam | 2009-12-31 |
Method of manufacturing an electronic component package
Grant 7,607,222 - Kang October 27, 2 | 2009-10-27 |
High density circuit board and manufacturing method thereof
App 20090250260 - Kang; Myung Sam | 2009-10-08 |
Buried pattern substrate
App 20090242238 - Okabe; Shuhichi ; et al. | 2009-10-01 |
Rigid-flexible printed circuit board manufacturing method for package on package
App 20090233400 - Jung; Hoe-Ku ; et al. | 2009-09-17 |
Printed circuit board including embedded passive component
Grant 7,583,512 - Ryu , et al. September 1, 2 | 2009-09-01 |
Board on chip package and manufacturing method thereof
App 20090206468 - Kang; Myung-Sam ; et al. | 2009-08-20 |
Method for manufacturing substrate with cavity
Grant 7,562,446 - Jung , et al. July 21, 2 | 2009-07-21 |
Board on chip package and manufacturing method thereof
Grant 7,550,316 - Kang , et al. June 23, 2 | 2009-06-23 |
High density printed circuit board and method of manufacturing the same
App 20090101510 - Kang; Myung Sam | 2009-04-23 |
Printed circuit board and method for manufacturing the same
App 20090095508 - Park; Jung-Hyun ; et al. | 2009-04-16 |
Method of manufacturing printed circuit board having landless via hole
Grant 7,516,545 - Kang , et al. April 14, 2 | 2009-04-14 |
Method of fabricating multilayer printed circuit board
App 20090056119 - Okabe; Shuhichi ; et al. | 2009-03-05 |
Method for manufacturing substrate with cavity
Grant 7,498,205 - Jung , et al. March 3, 2 | 2009-03-03 |
Method for manufacturing substrate with cavity
Grant 7,494,844 - Jung , et al. February 24, 2 | 2009-02-24 |
Printed circuit board including embedded chips and method of fabricating the same
Grant 7,485,569 - Ryu , et al. February 3, 2 | 2009-02-03 |
Board having buried patterns and manufacturing method thereof
App 20090008143 - Ahn; Jin-Yong ; et al. | 2009-01-08 |
Carrier and method for manufacturing printed circuit board
App 20090011220 - Park; Jung-Hyun ; et al. | 2009-01-08 |
Printed circuit board
App 20080314633 - Kang; Myung Sam ; et al. | 2008-12-25 |
Conductive paste, printed circuit board, and manufacturing method thereof
App 20080314619 - Kim; Ki-Hwan ; et al. | 2008-12-25 |
Mounting substrate and manufacturing method thereof
App 20080315431 - Ahn; Jin-Yong ; et al. | 2008-12-25 |
Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same
App 20080264684 - Kang; Myung Sam ; et al. | 2008-10-30 |
Circuit board and method for manufaturing thereof
App 20080264676 - Okabe; Shuhichi ; et al. | 2008-10-30 |
Method for manufacturing circuit board
App 20080251494 - Park; Jung-Hyun ; et al. | 2008-10-16 |
Printed circuit board manufacturing method
App 20080241361 - Jo; Ji-Hong ; et al. | 2008-10-02 |
Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same
App 20080212299 - Kim; Tae Eui ; et al. | 2008-09-04 |
Fluxgate sensor integrated in printed circuit board and method for manufacturing the same
Grant 7,407,596 - Choi , et al. August 5, 2 | 2008-08-05 |
Printed circuit board with weak magnetic field sensor
Grant 7,394,249 - Kang , et al. July 1, 2 | 2008-07-01 |
Printed Circuit Board Including Embedded Passive Component And Method Of Fabricating Same
App 20080123308 - Ryu; Chang Sup ; et al. | 2008-05-29 |
Method of manufacturing printed circuit board
App 20080115355 - Park; Jung-Hyun ; et al. | 2008-05-22 |
Printed circuit board integrated with a two-axis fluxgate sensor and method for manufacturing the same
Grant 7,372,261 - Choi , et al. May 13, 2 | 2008-05-13 |
Printed Circuit Board Including Embedded Chips And Method Of Fabricating The Same
App 20080106879 - Ryu; Chang Sup ; et al. | 2008-05-08 |
Substrate for mounting flip chip and the manufacturing method thereof
App 20080105458 - Kang; Myung-Sam ; et al. | 2008-05-08 |
Method of manufacturing circuit board
App 20080098597 - Jung; Hoe-Ku ; et al. | 2008-05-01 |
Circuit board and manufacturing method thereof
App 20080101045 - Jung; Hoe-Ku ; et al. | 2008-05-01 |
Method of manufacturing printed circuit board
App 20080102410 - Kim; Ji-Eun ; et al. | 2008-05-01 |
Method of fabricating a printed circuit board including an embedded passive component
Grant 7,350,296 - Ryu , et al. April 1, 2 | 2008-04-01 |
Printed circuit board having weak magnetic field sensor and method of manufacturing the same
Grant 7,348,772 - Kang , et al. March 25, 2 | 2008-03-25 |
Actuator employing a bobbin incorporating a winding coil and a manufacturing method thereof
Grant 7,337,453 - Kang , et al. February 26, 2 | 2008-02-26 |
Bottom substrate of package on package and manufacturing method thereof
App 20080006942 - Park; Jung-Hyun ; et al. | 2008-01-10 |
Buried pattern substrate and manufacturing method thereof
App 20080009128 - Okabe; Shuhichi ; et al. | 2008-01-10 |
Printed circuit board for package of electronic components and manufacturing method thereof
App 20070290344 - Kang; Myung-Sam ; et al. | 2007-12-20 |
Manufacturing method of a package substrate
App 20070281390 - Kang; Myung-Sam ; et al. | 2007-12-06 |
Electronic component package and manufacturing method thereof
App 20070278651 - Kang; Myung-Sam | 2007-12-06 |
Printed circuit board including embedded resistor and method of fabricating the same
Grant 7,277,005 - Kang , et al. October 2, 2 | 2007-10-02 |
Board on chip package and manufacturing method thereof
App 20070210439 - Kang; Myung-Sam ; et al. | 2007-09-13 |
Method for manufacturing a substrate with cavity
App 20070190764 - Jung; Hoe-Ku ; et al. | 2007-08-16 |
Fluxgate sensor integrated in printed circuit board and method for manufacturing the same
App 20070151943 - Choi; Won-youl ; et al. | 2007-07-05 |
Method of manufacturing printed circuit board having landless via hole
App 20070130761 - Kang; Myung Sam ; et al. | 2007-06-14 |
Printed circuit board having embedded electronic components and manufacturing method thereof
App 20070132536 - Lee; Doo-Hwan ; et al. | 2007-06-14 |
High density printed circuit board and method of manufacturing the same
App 20070114203 - Kang; Myung Sam | 2007-05-24 |
Fluxgate sensor integrated having pick-up coil mounted on excitation coil in printed circuit board and method for manufacturing the same
Grant 7,212,001 - Choi , et al. May 1, 2 | 2007-05-01 |
Method of manufacturing high density printed circuit boad
App 20070070613 - Kang; Myung Sam | 2007-03-29 |
Method for manufacturing substrate with cavity
App 20070066045 - Jung; Hoe Ku ; et al. | 2007-03-22 |
Method for manufacturing substrate with cavity
App 20070065986 - Jung; Hoe-Ku ; et al. | 2007-03-22 |
Method for manufacturing substrate with cavity
App 20070065988 - Jung; Hoe-Ku ; et al. | 2007-03-22 |
Rigid-flexible printed circuit board for package on package and manufacturing method
App 20070059918 - Jung; Hoe-Ku ; et al. | 2007-03-15 |
Eccentric rotor and vibration motor having the rotor
App 20060255670 - Ki; Hyun-Seung ; et al. | 2006-11-16 |
Fabricating method for a fluxgate sensor integrated in printed circuit board
Grant 7,087,450 - Choi , et al. August 8, 2 | 2006-08-08 |
Printed circuit board including embedded chips and method of fabricating the same
App 20060157832 - Ryu; Chang Sup ; et al. | 2006-07-20 |
Weak-magnetic field sensor using printed circuit board technology and method of manufacturing the same
Grant 7,015,691 - Kang , et al. March 21, 2 | 2006-03-21 |
Printed circuit board including embedded passive component and method of fabricating same
App 20060054352 - Ryu; Chang Sup ; et al. | 2006-03-16 |
Printed circuit board including embedded resistor and method of fabricating the same
App 20060049913 - Kang; Myung Sam ; et al. | 2006-03-09 |
Fluxgate sensor integrated having stacked magnetic cores in printed circuit board and method for manufacturing the same
Grant 6,998,840 - Choi , et al. February 14, 2 | 2006-02-14 |
Printed circuit board having weak magnetic field sensor and method of manufacturing the same
App 20060017435 - Kang; Myung-Sam ; et al. | 2006-01-26 |
Printed circuit board with weak magnetic field sensor and method of fabricating the same
App 20060001422 - kang; Myung-Sam ; et al. | 2006-01-05 |
A Fabricating Method For A Fluxgate Sensor Integrated In Printed Circuit Board
App 20050172480 - Choi, Won-youl ; et al. | 2005-08-11 |
Actuator employing a bobbin incorporating a winding coil and a manufacturing method thereof
App 20050060732 - Kang, Myung-Sam ; et al. | 2005-03-17 |
Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same
Grant 6,759,845 - Kang , et al. July 6, 2 | 2004-07-06 |
Weak-magnetic field sensor using printed circuit board technology and method of manufacturing the same
App 20040124836 - Kang, Myung-Sam ; et al. | 2004-07-01 |
Method for preparing high performance ball grid array board and jig applicable to said method
Grant 6,755,229 - Kang , et al. June 29, 2 | 2004-06-29 |
Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same
Grant 6,753,682 - Kang , et al. June 22, 2 | 2004-06-22 |
Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same
Grant 6,747,450 - Kang , et al. June 8, 2 | 2004-06-08 |
Printed circuit board integrated with a two-axis fluxgate sensor and method for manufacturing the same
App 20040027121 - Choi, Won-Youl ; et al. | 2004-02-12 |
Fluxgate sensor integrated in printed circuit board and method for manufacturing the same
App 20030173962 - Choi, Won-youl ; et al. | 2003-09-18 |
Fluxgate sensor integrated in printed circuit board and method for manufacturing the same
App 20030173961 - Choi, Won-Youl ; et al. | 2003-09-18 |
Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same
App 20030169038 - Kang, Myung-Sam ; et al. | 2003-09-11 |
Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same
App 20030169039 - Kang, Myung-Sam ; et al. | 2003-09-11 |
Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same
App 20030169037 - Kang, Myung-Sam ; et al. | 2003-09-11 |
Method for preparing ball grid array board
App 20030042224 - Kang, Myung-Sam ; et al. | 2003-03-06 |
Method for preparing high performance ball grid array board and jig applicable to said method
App 20030019574 - Kang, Myung-Sam ; et al. | 2003-01-30 |
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