U.S. patent application number 13/708990 was filed with the patent office on 2014-03-20 for cooling device for electronic components.
This patent application is currently assigned to CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY, ARMAMENTS BUREAU, M. N. D. The applicant listed for this patent is CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY. Invention is credited to Chia-Yi Hsiang, Hung-Tai Ku, Yang-Kuo Kuo.
Application Number | 20140075960 13/708990 |
Document ID | / |
Family ID | 50273016 |
Filed Date | 2014-03-20 |
United States Patent
Application |
20140075960 |
Kind Code |
A1 |
Kuo; Yang-Kuo ; et
al. |
March 20, 2014 |
Cooling Device For Electronic Components
Abstract
A cooling device for electronic components is a combination of
substrate (aluminum nitride substrate--thermoelectric
elements--aluminum nitride substrate) and utilizing the temperature
difference generated by two top and bottom ends of the cooling
device to effectively remove the heat generated by the electronic
components. This cooling device not only can effectively reduce
temperature of the electronic components, but also store the power
generated by its thermoelectric effect.
Inventors: |
Kuo; Yang-Kuo; (Taoyuan
County, TW) ; Hsiang; Chia-Yi; (Taoyuan County,
TW) ; Ku; Hung-Tai; (Taoyuan County, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY |
Longtan Township |
|
TW |
|
|
Assignee: |
CHUNG SHAN INSTITUTE OF SCIENCE AND
TECHNOLOGY, ARMAMENTS BUREAU, M. N. D
Longtan Township
TW
|
Family ID: |
50273016 |
Appl. No.: |
13/708990 |
Filed: |
December 8, 2012 |
Current U.S.
Class: |
62/3.2 |
Current CPC
Class: |
F25B 21/02 20130101 |
Class at
Publication: |
62/3.2 |
International
Class: |
F25B 21/02 20060101
F25B021/02 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 19, 2012 |
TW |
101134226 |
Claims
1. A cooling device for electronic components, comprising: a first
substrate having a first surface and a second surface; at least one
electronic element configured on the first surface of the first
substrate; a thermoelectric element configured on the second
surface of the first substrate so as to conduct the heat generated
by the at least one electronic element; a second substrate having a
third surface and a fourth surface, the third surface of the second
substrate coupled to the thermoelectric element so as to conduct
the heat to the fourth surface; and a battery coupled between the
first substrate and the second substrate for storing energy
generated by the cooling device, wherein the first substrate and
the second substrate are made of an insulating ceramic material
selected from one of the following group consisting of: alumina and
aluminum nitride.
2. The cooling device as recited in claim 1, wherein the first
substrate is a metallized circuit.
3. The cooling device as recited in claim 1, wherein a greater a
temperature difference between the first substrate and the second
substrate is, a greater electric energy is so generated.
4. The cooling device as recited in claim 1, wherein the at least
one electronic element is one selected from the following group
consisting of: an LED, a CPU and a solar focusing device.
5. The cooling device as recited in claim 1, wherein the
thermoelectric element comprises: a first conductive layer
comprising a plurality of first electrodes, configured on the
second surface of the first substrate; a second conductive layer
comprising a plurality of second electrodes, configured on the
third surface of the second substrate; and a plurality of N-type
semiconductors and a plurality of P-type semiconductors, wherein
the plurality of N-type semiconductors and the plurality of P-type
semiconductors are alternatively configured between the plurality
of first electrodes and the plurality of second electrodes, and are
coupled to the plurality of first electrodes and the plurality of
second electrodes so as to form a current loop.
6. The cooling device as recited in claim 1, wherein the first
surface of the first substrate is a cooling surface.
7. The cooling device as recited in claim 1, wherein the first
surface of the first substrate is a heating surface.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to a cooling structure for
thermoelectric components, and more particularly to a cooling
device integrated a thermoelectric cooling element with
thermoelectric components.
[0003] 2. Description of Related Art
[0004] That all electronic components generate heat is a natural
phenomenon, which affects the lifespan and designed performance of
the components. Therefore a large number of solutions for this
phenomenon are emerged, in particular, to reuse the heat generated
by electronic components as a new energy, which becomes the
subjects the R & D staffs specialize in.
[0005] Take light emitting diode (LED) for example, which is a
daily use electronic component, having the advantages of
environmental friendly, energy-saving, small size, high efficiency,
long usage lifespan, etc. so that LED is widely used in daily life,
such as LCD backlight, mobile phone backlight, signal lights,
headlights, street lamps, art lighting, architectural lighting, and
stage lighting control, home lighting, etc.
[0006] With the development of the LED industry and the increase of
user need, the LED gradually reaches high-power, high-brightness
and high-performance. However, a lot of heat generated by
high-power LED can not be effectively excluded, which results in
high the LED Junction Temperature, so that the LED brightness is
reduced or even extinguished.
[0007] Because only about 15 to 20% electrical energy of the LED
input power can be converted into light, nearly 80 to 85%
electrical energy is converted into heat. If the heat generated by
the LED light can not be exhausted, the LED Junction Temperature
will be higher, which causes a qualitative change to the LED
surrounding materials as phosphors and packaging plastic, and
influences the LED luminous efficiency, stability and service life.
Therefore effective control of LED products' byproduct, heat, is a
very significant issue.
[0008] Therefore in addition to the heat dissipating effect of the
heat sink is the primary design consideration, other factors such
as the weight, size, appearance, convenience and application
thereof and reuse of the energy released from the electronic
components are still factors the industry needs to take into
consideration.
[0009] In view of the drawbacks derived from the conventional
technology, the inventor has tried hard to transform the heat
energy generated by the electronic elements into a renewable
energy. And the appearance, volume and weight of the invention are
also considered at the same time. After years of research, a
cooling device for electronic components is proposed in the present
invention so as to solve the above-mentioned problems. The present
invention is described below.
[0010] The invention, as well as its many advantages, may be
further understood by the following detailed description and
drawings in which:
SUMMARY OF THE INVENTION
[0011] The primary objective of the present invention is to provide
a cooling device for electronic components, which effectively
resolves the heat dissipation problem encountered in the operation
of the conventional electronic components, and achieves the goal of
extending usage lifespan, weight and size reducing, and the
appearance aesthetic design.
[0012] A further objective of the present invention is to transform
the heat generated by the electronic components in operation into a
renewable energy by using the temperature difference of
thermoelectric effect, and the energy is to be stored in battery as
a spare power.
[0013] In order to achieve the above mentioned objective, the
present invention provides a cooling device for electronic
components, including: a first substrate configured as a metallized
circuit, having a first surface and a second surface; at least one
electronic element configured on the first surface of the first
substrate and coupled to the metallized circuit, a thermoelectric
element configured on the second surface of the first substrate so
as to conduct the heat generated by the at least one electronic
element, and a second substrate having a third surface and a fourth
surface, the third surface of the second substrate coupled to the
thermoelectric element, so as to conduct the heat to the fourth
surface, and a battery coupled between the first substrate and the
second substrate for storing energy generated by the cooling
device, wherein a thermoelectric effect is generated by thermal
temperature differences therebetween, wherein the first substrate
and the second substrate are made of an insulating ceramic material
selected from one of the following group consisting of: alumina and
aluminum nitride.
[0014] Preferably, the at least one electronic element is one
selected from the following group consisting of: an LED, a CPU and
a solar focusing device.
[0015] Preferably, the thermoelectric element includes: a first
conductive layer including a plurality of first electrodes,
configured on the second surface of the first substrate, a second
conductive layer comprising a plurality of second electrodes,
configured on the third surface of the second substrate; and a
plurality of N-type semiconductors and a plurality of P-type
semiconductors, wherein the plurality of N-type semiconductors and
the plurality of
[0016] P-type semiconductors are alternatively configured between
the plurality of first electrodes and the plurality of second
electrodes, and are coupled to the plurality of first electrodes
and the plurality of second electrodes so as to form a current
loop.
[0017] Preferably, the first surface of the first substrate is a
cooling surface.
[0018] Preferably, the first surface of the first substrate is a
heating surface.
[0019] The technical characteristics and operation processes of the
present invention will become apparent with the detailed
description of preferred embodiments and the illustration of
related drawings as follows.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] FIG. 1 is a structure diagram showing a preferred embodiment
of the present invention;
[0021] FIG. 2 is a perspective cross sectional view of a preferred
embodiment of the present invention; and
[0022] FIG. 3 is a schematic view showing a finished product of the
present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0023] With reference to FIG. 1, which is a structure diagram shows
a preferred embodiment of the present invention. The present
invention utilizes the heat temperature difference of the cooling
chip to be applied to the cooling device of the electronic
components. This embodiment uses an LED element as a light
component. The heat generated by the LED chip is sent to the
cooling chip to reduce the temperature of the LED. This design can
also be proven to greatly reduce the LED overall size and
weight.
[0024] The cooling device of this embodiment includes: a first
substrate 11 configured as a metallized circuit, having a first
surface 111 and a second surface 112, at least one electronic
element 14, 15 being LED chip 14 and LED lens 15 respectively,
configured on the first surface 111 of the first substrate 11 and
coupled to the metallized circuit; a thermoelectric element 13
configured on the second surface 112 of the first substrate 11 so
as to conduct the heat generated by the at least one electronic
element 14, 15, and a second substrate 12 having a third surface
121 and a fourth surface 122, the third surface 121 of the second
substrate 12 coupled to the thermoelectric element 13, so as to
conduct the heat to the fourth surface; and a battery coupled
between the first substrate and the second substrate for storing
energy generated by the cooling device, wherein a thermoelectric
effect is generated by thermal temperature differences
therebetween, wherein the first substrate 11 and the second
substrate 12 are made of an insulating ceramic material and
selected from one of the following group consisting of: alumina and
aluminum nitride.
[0025] Wherein the thermoelectric element 13 includes: a first
conductive layer including a plurality of first electrodes 131,
configured on the second surface 112 of the first substrate 11, a
second conductive layer including a plurality of second electrodes
132, configured on the third surface 121 of the second substrate
12, a plurality of N-type semiconductors 134 and a plurality of
P-type semiconductors 133, wherein the plurality of N-type
semiconductors 134 and the plurality of P-type semiconductors 133
are alternatively configured between the plurality of first
electrodes 131 and the plurality of second electrodes 132, and are
coupled to the plurality of first electrodes 131 and the plurality
of second electrodes 132 so as to form a current loop.
[0026] The technical idea of the present embodiment is to combine a
thermoelectric cooling chip (Bi2-Te3) with the semiconductor
elements 133, 134, conductors 131,132 and the ceramic material as a
cooling device by using the principle of thermoelectric effect.
[0027] When the current is input into the cooling device, heat can
be transferred by the cooling device from one end (N.fwdarw.P
endothermic, cold end, as the third surface 121 on the first
substrate 11) to the other end (P.fwdarw.N exothermic, hot end, as
the fourth surface 122 on the second substrate 12, to form a
temperature difference phenomenon between a hot side and a cold
side of the cooling device. The greater the input current is, the
greater the temperature difference will be. The maximum temperature
difference of the best finished product has been up to 74.degree.
C.
[0028] The greater the temperature difference between the hot side
and the cold side of the cooling device is, the greater the
electric energy generated by the thermoelectric effect is. So that
the cooling device further has a battery 17 used to store the
electric energy of thermoelectric effect generated by the
temperature difference between the first substrate 11 and the
second substrate 12 of the cooling device.
[0029] With reference to FIG. 2, this figure is a perspective cross
sectional view of a preferred embodiment of the present invention.
It is to be noted that a dielectric substrate 22 is coated on the
upper and lower layers of the cooling device 21. Between the
dielectric substrate 22, a plurality of N-type semiconductors 24
and P-type semiconductors 25 are coated by two layers of plural
conductors 23, wherein the plurality of N-type semiconductors 25
and the plurality of P-type semiconductors 24 are alternatively
configured between the two layers of plural conductors 23, and
coupled to the upper and lower electrodes formed by the two layers
of plural conductors 23, so as to form a current loop.
[0030] So, the direction of current applied to the cooling device
21 can be controlled to cause a cold end on the upper side of the
cooling device 21 and to cause a hot end on the lower side of the
cooling device 21, so as to conduct the heat.
[0031] With reference to FIG. 3, which is a schematic view showing
a finished product of the present invention. As shown in the
figure, it is to be noted that the finished size of the cooling
device 31 of the present invention is small, which is equivalent to
a coin of NT ten dollars 30. Each cooling device includes a cathode
pin 32 and a negative pin 33 to connect the power source 16 as
shown in FIG. 1.
[0032] In summary, the cooling device of the present invention has
high cooling efficiency to indirectly extend the lifespan of the
configured components, it also has the characteristics of small
size, light weight, long life, high reliability, environmentally
friendly (without using refrigerant), easy maintenance, and energy
reuse. Therefore the cooling device of the present invention is
extremely suitable for electronic components and capable of high
value in market demand.
[0033] Many changes and modifications in the above described
embodiment of the invention can, of course, be carried out without
departing from the scope thereof. Accordingly, to promote the
progress in science and the useful arts, the invention is disclosed
and is intended to be limited only by the scope of the appended
claims.
* * * * *