loadpatents
Patent applications and USPTO patent grants for Ku; Hung-Tai.The latest application filed is for "cooling device for electronic components".
Patent | Date |
---|---|
Cooling Device For Electronic Components App 20160148917 - Kuo; Yang-Kuo ;   et al. | 2016-05-26 |
Method for producing three-dimensional integrated circuit structure Grant 9,196,508 - Kuo , et al. November 24, 2 | 2015-11-24 |
Cooling Device For Electronic Components App 20140075960 - Kuo; Yang-Kuo ;   et al. | 2014-03-20 |
Three-dimensional Integrted Circuit Structure And Method Of Aluminum Nitride Interposer Substrate App 20140054790 - Kuo; Yang-Kuo ;   et al. | 2014-02-27 |
LED epitaxial Structure App 20140034948 - Kuo; Yang-Kuo ;   et al. | 2014-02-06 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.