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Patent applications and USPTO patent grants for Hsiang; Chia-Yi.The latest application filed is for "cooling device for electronic components".
Patent | Date |
---|---|
Cooling Device For Electronic Components App 20160148917 - Kuo; Yang-Kuo ;   et al. | 2016-05-26 |
Method for producing three-dimensional integrated circuit structure Grant 9,196,508 - Kuo , et al. November 24, 2 | 2015-11-24 |
Method for hot isostatic pressing a substrate Grant 08920706 - | 2014-12-30 |
Method for hot isostatic pressing a substrate Grant 8,920,706 - Kuo , et al. December 30, 2 | 2014-12-30 |
Cooling Device For Electronic Components App 20140075960 - Kuo; Yang-Kuo ;   et al. | 2014-03-20 |
Three-dimensional Integrted Circuit Structure And Method Of Aluminum Nitride Interposer Substrate App 20140054790 - Kuo; Yang-Kuo ;   et al. | 2014-02-27 |
Method for protecting aluminum nitride from moisture Grant 8,646,706 - Kuo , et al. February 11, 2 | 2014-02-11 |
LED epitaxial Structure App 20140034948 - Kuo; Yang-Kuo ;   et al. | 2014-02-06 |
Method for Protecting Aluminum Nitride from Moisture App 20130032649 - Kuo; Yang-Kuao ;   et al. | 2013-02-07 |
Method for Hot Isostatic Pressing a Substrate App 20130032965 - Kuo; Yang-Kuao ;   et al. | 2013-02-07 |
Method For Removing Oxygen From Aluminum Nitride By Carbon App 20130034488 - Kuo; Yang-Kuao ;   et al. | 2013-02-07 |
Method for Making an Aluminum Nitride Substrate App 20130035224 - Kuo; Yang-Kuao ;   et al. | 2013-02-07 |
Method for removing oxygen from aluminum nitride by carbon Grant 8,357,345 - Kuo , et al. January 22, 2 | 2013-01-22 |
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