U.S. patent application number 13/542458 was filed with the patent office on 2014-01-09 for extreme ultraviolet lithography process and mask.
This patent application is currently assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.. The applicant listed for this patent is Yen-Cheng Lu, Anthony Yen, Shinn-Sheng Yu. Invention is credited to Yen-Cheng Lu, Anthony Yen, Shinn-Sheng Yu.
Application Number | 20140011120 13/542458 |
Document ID | / |
Family ID | 49878766 |
Filed Date | 2014-01-09 |
United States Patent
Application |
20140011120 |
Kind Code |
A1 |
Lu; Yen-Cheng ; et
al. |
January 9, 2014 |
EXTREME ULTRAVIOLET LITHOGRAPHY PROCESS AND MASK
Abstract
A process of an extreme ultraviolet lithography (EUVL) is
disclosed. The process includes receiving an extreme ultraviolet
(EUV) mask with multiple states. Different states of the EUV mask
are assigned to adjacent polygons and adjacent sub-resolution
polygons. The EUV mask is exposed by a nearly on-axis illumination
(ONI) with partial coherence .sigma. less than 0.3 to produce
diffracted lights and non-diffracted lights. Most of the
non-diffracted lights are removed. The diffracted lights and the
not removed non-diffracted lights are collected and directed to
expose a target by a projection optics box.
Inventors: |
Lu; Yen-Cheng; (New Taipei
City, TW) ; Yu; Shinn-Sheng; (Hsinchu, TW) ;
Yen; Anthony; (Zhubei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Lu; Yen-Cheng
Yu; Shinn-Sheng
Yen; Anthony |
New Taipei City
Hsinchu
Zhubei City |
|
TW
TW
TW |
|
|
Assignee: |
TAIWAN SEMICONDUCTOR MANUFACTURING
COMPANY, LTD.
Hsin-Chu
TW
|
Family ID: |
49878766 |
Appl. No.: |
13/542458 |
Filed: |
July 5, 2012 |
Current U.S.
Class: |
430/5 ; 430/319;
430/322 |
Current CPC
Class: |
G03F 1/24 20130101 |
Class at
Publication: |
430/5 ; 430/322;
430/319 |
International
Class: |
G03F 1/24 20120101
G03F001/24; G03F 7/20 20060101 G03F007/20 |
Claims
1. An extreme ultraviolet lithography (EUVL) process, comprising:
receiving an extreme ultraviolet (EUV) mask, including: a first
main polygon; a second main polygon adjacent to the first main
polygon; a plurality of assist polygons; and a field (a region
without main polygons and assist polygons), wherein each of the
main polygons, the assist polygons, and the field has an associated
state, wherein the state assigned to the first main polygon is
different from the state assigned to the second main polygon, and
wherein the plurality of assist polygons are assigned the same
state, which is different from the state assigned to the field;
exposing the EUV mask by a nearly on-axis illumination (ONI) with
partial coherence .sigma. less than 0.3 to produce diffracted
lights and non-diffracted lights; removing a portion of the
non-diffracted lights; and collecting and directing the diffracted
lights and the not removed non-diffracted lights by a projection
optics box (POB) to expose a target.
2. The process of claim 1, wherein the EUV mask comprises: a low
thermal expansion material (LTEM) substrate; a reflective
multilayer (ML) above one surface of the LTEM substrate; a
conductive layer above an opposite surface of the LTEM substrate; a
capping layer above the reflective ML; a buffer layer above the
capping layer; an absorption layer above the buffer layer; and
multiple states formed on the absorption layer.
3. The process of claim 2, wherein the capping layer and the buffer
layer are a single layer.
4. The process of claim 1, wherein at least one assist polygon is a
sub-resolution polygon, at least one edge of the assist polygon has
a length smaller than .lamda./NA, where .lamda. is a wavelength of
a radiation source and NA is a numerical aperture of the projection
optics box.
5. The process of claim 1, wherein at least one assist polygon is a
sub-resolution polygon that includes a rectangle, at least one edge
of the rectangle has a length smaller than .lamda./NA, where
.lamda. is a wavelength of a radiation source and NA is a numerical
aperture of the projection optics box.
6. The process of claim 2, wherein the EUV mask includes two
states: a first state of which the reflection coefficient is r1 and
a second state of which the reflection coefficient is r2.
7. The process of claim 6, wherein the first state is configured by
the buffer layer, the capping layer, and the ML; the second state
is configured by the absorption layer, the buffer layer, the
capping layer, and the ML.
8. The process of claim 6, wherein two states are configured as
that the absolute value of r1 is larger than the absolute value of
r2.
9. The process of claim 6, wherein the first and the second states
are assigned to adjacent main polygons.
10. The process of claim 6, wherein the first state is assigned to
all assist polygons and the second state is assigned to the
field.
11. The process of claim 6, wherein the second state is assigned to
all assist polygons and the first state is assigned to the
field.
12. The process of claim 1, wherein main polygons and assist
polygons touch or overlap each other.
13. The process of claim 1, wherein more than 70% of the
non-diffracted lights are removed.
14. The process of claim 1, wherein collecting and directing the
diffracted lights includes collecting and directing lights of -1-st
and +1-st diffraction orders.
15. An extreme ultraviolet lithography (EUVL) process, comprising:
receiving an EUV mask, including: a plurality of main polygons; a
plurality of assist polygons; a field (a region without main
polygons and assist polygons); a first state having a first
reflection coefficient r1; and a second state having a second
reflection coefficient r2; assigning different states of the EUV
mask to adjacent main polygons; assigning to all assist polygons a
state of the EUV mask, which is different from the state assigned
to the field; exposing the EUV mask by a nearly on-axis
illumination (ONI) with partial coherence .sigma. less than 0.3 to
produce diffracted lights and non-diffracted lights; removing more
than 70% of the non-diffracted lights; and collecting and directing
the diffracted lights and the not removed non-diffracted lights by
a projection optics box (POB) to expose a semiconductor wafer.
16. The process of claim 15, wherein the two states are configured
such that an absolute value of r1 is larger than an absolute value
of r2.
17. The process of claim 15, wherein: the first state is configured
by a buffer layer, a capping layer, and an ML of the EUV mask; and
the second state is configured by an absorption layer, the buffer
layer, the capping layer, and the ML of the EUV mask.
18. The process of claim 15, wherein main polygons and assist
polygons touch or overlap each other.
19. The process of claim 17, wherein the capping layer and the
buffer layer are a single layer.
20. An extreme ultraviolet lithography (EUVL) mask, comprising: a
low thermal expansion material (LTEM) substrate; a reflective
multilayer (ML) above one surface of the LTEM substrate; a
conductive layer above an opposite surface of the LTEM substrate; a
capping layer above the reflective ML; a buffer layer above the
capping layer; and a patterned absorption layer above the buffer
layer, wherein the patterned absorption layer defines multiple
states, and further wherein different states are assigned to
adjacent main polygons and a state is assigned to all assist
polygons, the state being assigned to all assist polygons being
different from the state assigned to a field.
Description
BACKGROUND
[0001] The semiconductor integrated circuit (IC) industry has
experienced exponential growth. Technological advances in IC
materials and design have produced generations of ICs where each
generation has smaller and more complex circuits than the previous
generation. In the course of IC evolution, functional density
(i.e., the number of interconnected devices per chip area) has
generally increased while geometry size (i.e., the smallest
component (or line) that can be created using a fabrication
process) has decreased. This scaling down process generally
provides benefits by increasing production efficiency and lowering
associated costs. Such scaling down has also increased the
complexity of IC processing and manufacturing. For these advances
to be realized, similar developments in IC processing and
manufacturing are needed. For example, the need to perform higher
resolution lithography processes grows. One lithography technique
is extreme ultraviolet lithography (EUVL). Other techniques include
multiple electron beam maskless lithography, nanoimprint
lithography, and direct self-assembly.
[0002] The EUVL employs scanners using light in the extreme
ultraviolet (EUV) region, having a wavelength of about 1-100 nm.
Some EUV scanners provide 4.times. reduction projection printing,
similar to some optical scanners, except that the EUV scanners use
reflective rather than refractive optics, i.e., mirrors instead of
lenses. Currently, binary intensity masks (BIM) accompanied by
on-axis illumination (ONI) are employed in EUVL. In order to
achieve adequate aerial image contrast for future nodes, e.g.,
nodes with the minimum pitch of 32 nm and 22 nm, etc., several
techniques, e.g., the attenuated phase-shifting mask (AttPSM) and
the alternating phase-shifting mask (AltPSM), have been developed
to obtain resolution enhancement for EUVL. But each technique has
its limitation needed to be overcome. For example, for AltPSM, one
of the methods to generate a phase-shifting region without much
attenuation in reflectivity is to create a step of appropriate
height on a substrate and then form a multilayer (ML) over the
step. However, the ML tends to smooth out the step height, leading
to a large transition area between phase-shifting and
non-phase-shifting regions. This will limit the achievable
resolution limit. So it is desired to have further improvements in
this area.
BRIEF DESCRIPTION OF THE DRAWINGS
[0003] Aspects of the present disclosure are best understood from
the following detailed description when read with the accompanying
figures. It is noted that, in accordance with the standard practice
in the industry, various features are not drawn to scale. In fact,
the dimensions of the various features may be arbitrarily increased
or reduced for clarity of discussion.
[0004] FIG. 1 is a block diagram of a lithography process for
implementing one or more embodiments of the present invention.
[0005] FIG. 2 is a diagrammatic perspective view of a projection
optics box (POB) employed in the lithography process for
implementing one or more embodiments of the present invention.
Since a POB by reflective optics is difficult to sketch, the
equivalent refractive optics is used to illustrate the underlying
principle.
[0006] FIG. 3-4 are diagrammatic cross-sectional views of various
aspects of one embodiment of an EUV mask at various stages of a
lithography process constructed according to aspects of the present
disclosure.
[0007] FIG. 5 is a diagrammatic perspective view of an EUV mask
according to aspects of the present disclosure.
DETAILED DESCRIPTION
[0008] The following disclosure provides many different
embodiments, or examples, for implementing different features of
the invention. Specific examples of components and arrangements are
described below to simplify the present disclosure. These are, of
course, merely examples and are not intended to be limiting. For
example, the formation of a first feature over or on a second
feature in the description that follows may include embodiments in
which the first and second features are formed in direct contact,
and may also include embodiments in which additional features may
be formed between the first and second features, such that the
first and second features may not be in direct contact. In
addition, the present disclosure may repeat reference numerals
and/or letters in the various examples. This repetition is for the
purpose of simplicity and clarity and does not in itself dictate a
relationship between the various embodiments and/or configurations
discussed.
[0009] Further, spatially relative terms, such as "beneath,"
"below," "lower," "above," "upper" and the like, may be used herein
for ease of description to describe one element or feature's
relationship to another element(s) or feature(s) as illustrated in
the figures. The spatially relative terms are intended to encompass
different orientations of the device in use or operation in
addition to the orientation depicted in the figures. For example,
if the device in the figures is turned over, elements described as
being "below" or "beneath" other elements or features would then be
oriented "above" the other elements or features. Thus, the
exemplary term "below" can encompass both an orientation of above
and below. The apparatus may be otherwise oriented (rotated 90
degrees or at other orientations) and the spatially relative
descriptors used herein may likewise be interpreted
accordingly.
[0010] Referring to FIG. 1, an EUV lithography process 10 that may
benefit from one or more embodiments of the present invention is
disclosed. The EUV lithography process 10 employs an EUV radiation
source 20 having a wavelength of about 1-100 nm.
[0011] The EUV lithography process 10 also employs an illuminator
30. The illuminator 30 may comprise refractive optics, such as a
single lens or a lens system having multiple lenses (zone plates)
or reflective optics, such as a single mirror or a mirror system
having multiple mirrors in order to direct light from the radiation
source 20 onto the mask 40. In the EUV wavelength range, reflective
optics is employed generally. Refractive optics, however, can also
be realized by e.g., zoneplates. In the present embodiment, the
illuminator 30 is set up to provide an on-axis illumination (ONI)
to illuminate the mask 40. In ONI, all incoming light rays incident
on the mask at the same angle of incidence (AOI), e.g.,
AOI=6.degree., same as that of the chief ray. In real situation,
there may be some angular spread of the incident light. For
example, if a disk illumination (i.e., the shape of the
illumination on the pupil plane being like a disk centered at the
pupil center) of a small partial coherence .sigma., e.g.,
.sigma.=0.3, is employed, the maximum angular deviation from the
chief ray is sin.sup.-1 [m.times..sigma..times.NA], where m and NA
are the magnification and numerical aperture, respectively, of the
imaging system (i.e., the projection optics box (POB) 50 to be
detailed below). Partial coherence .sigma. can also be used to
describe a point source which produces a plane wave illuminating
the mask 40. In this case, the distance from the pupil center to
the point source in the pupil plane is NA.times..sigma. and the
deviation of the AOI of the corresponding plane wave incident on
the mask 40 from the chief ray is sin.sup.-1
[m.times..sigma..times.NA]. In the present embodiment, it is
sufficient to employ a nearly ONI consists of point sources with
.sigma. less than 0.3.
[0012] The EUV lithography process 10 also employs a mask 40 (in
the present disclosure, the terms of mask, photomask, and reticle
are used to refer to the same item). The mask 40 can be a
transmissive mask or a reflective mask. In the present embodiment,
the mask 40 is a reflective mask such as described in further
detail below. The mask 40 may incorporate other resolution
enhancement techniques such as attenuated phase-shifting mask
(AttPSM) and sub-resolution assist features. Sub-resolution assist
features are not printed on a final target, e.g., a semiconductor
wafer. However, they help in increasing the exposure latitude (EL)
or depth of focus (DOF) of main features.
[0013] In the present embodiment, there are main polygons, which
represent circuit patterns, on the mask 40. There are also assist
polygons, which are of sub-resolution, i.e., they are not printed
on the wafer, or more specifically, on the field (the region
without main polygons and assist polygons). Whether a polygon is
printed or not depends not only on its size but also on the
environment it is situated. For example, for long rectangles of
width w and pitch 2w, if w is smaller than about .lamda./(2 NA),
they are not printed if ONI is employed. If the pitch is kept the
same, i.e., rectangles are kept in dense environment, and the width
is increased, they are still not printed even if the width is close
to the pitch. If long rectangles becomes squares of size w.times.w,
arranged like a checkerboard, the non-printable condition can be
relaxed to about w less than .lamda./(1.414 NA). Here, .lamda. is a
wavelength of the radiation source 20 and NA is a numerical
aperture of a projection optics box 50.
[0014] The EUV lithography process 10 also employs a POB 50. The
POB 50 may have refractive optics or reflective optics. The
radiation reflected from the mask 40 (e.g., a patterned radiation)
is collected by the POB 50. The POB 50 may include a magnification
of less than one (thereby reducing the patterned image included in
the radiation).
[0015] Referring to FIG. 2, an incident light ray 60, after being
reflected from the mask 40, is diffracted into various diffraction
orders due to presence of these mask patterns, such as a 0-th
diffraction order ray 61, a -1-st diffraction order ray 62 and a
+1-st diffraction order ray 63. For lithographic imaging, purely
coherent illumination is generally not employed. Disk illumination
with partial coherence .sigma. being at most 0.3 generated by the
illuminator 30 is employed. In the depicted embodiment, the
non-diffracted light rays 61 are mostly (e.g., more than 70%)
removed by, e.g., central obscuration in the pupil plane. The -1-st
and +1-st diffraction order rays, 62 and 63, are collected by the
POB 50 and directed to expose a target 70. Since the strength of
the -1-st and +1-st diffraction order rays, 62 and 63, are well
balanced, they interfere with each other and will generate a high
contrast aerial image. Also, the -1-st and +1-st diffraction order
rays, 62 and 63, are of the same distance from the pupil center in
the pupil plane, and depth of focus (DOF) is maximized.
[0016] The target 70 includes a semiconductor wafer with a
photosensitive layer (e.g., photoresist or resist), which is
sensitive to the EUV radiation. The target 70 may be held by a
target substrate stage. The target substrate stage provides control
of the target substrate position such that the image of the mask is
scanned onto the target substrate in a repetitive fashion (though
other lithography methods are possible).
[0017] The following description refers to the mask 40 and a mask
fabrication process. The mask fabrication process includes two
steps: a blank mask fabrication process and a mask patterning
process. During the blank mask fabrication process, a blank mask is
formed by depositing suitable layers (e.g., multiple reflective
layers) on a suitable substrate. The blank mask is patterned during
the mask patterning process to have a design of a layer of an
integrated circuit (IC) device (or chip). The patterned mask is
then used to transfer circuit patterns (e.g., the design of a layer
of an IC device) onto a semiconductor wafer. The patterns can be
transferred over and over onto multiple wafers through various
lithography processes. Several masks (for example, a set of 15 to
30 masks) may be used to construct a complete IC device.
[0018] In general, various masks are fabricated for being used in
various processes. Types of EUV masks include binary intensity mask
(BIM) and phase-shifting mask (PSM). An example BIM includes an
almost totally absorptive region (also referring to as an opaque
region) and a reflective region. In the opaque region, an absorber
is present and an incident light beam is almost fully absorbed by
the absorber. The absorber can be made of materials containing
chromium, chromium oxide, chromium nitride, aluminum-copper,
titanium, titanium nitride, tantalum, tantalum oxide, tantalum
nitride, and tantalum boron nitride. In the reflective region, the
absorber is removed and the incident light is reflected by a
multilayer (ML), which will be described in further detail below. A
PSM includes an absorptive region and a reflective region. A
portion of the incident light reflects from the absorptive region
with a proper phase difference with respect to a light reflected
from the reflective region to enhance the resolution and imaging
quality. The absorber of the PSM can be made by materials such as
tantalum nitride and tantalum boron nitride at a specific
thickness. The PSM can be attenuated PSM (AttPSM) or alternating
PSM (AltPSM). An AttPSM usually has 2%-15% of reflectivity from its
absorber, while an AltPSM usually has larger than 50% of
reflectivity from its absorber.
[0019] Referring to FIG. 3, a blank EUV mask 100 comprises a
substrate 110 made of low thermal expansion material (LTEM). The
LTEM material may include TiO2 doped SiO2, or other low thermal
expansion materials known in the art. The LTEM substrate 110 serves
to minimize image distortion due to mask heating. In the present
embodiment, the LTEM substrate includes materials with a low defect
level and a smooth surface. In addition, a conductive layer 105 may
be deposited under (as shown in the figure) the LTEM substrate 110
for the electrostatic chucking purpose. In an embodiment, the
conductive layer 105 includes chromium nitride (CrN), though other
compositions are possible.
[0020] A reflective multilayer (ML) 120 is deposited over the LTEM
substrate 110. According to Fresnel equations, light reflection
occurs when light propagates across the interface between two
materials of different refractive indices. The reflected light is
larger when the difference of refractive indices is larger. To
increase the reflected light, one may also increase the number of
interfaces by depositing a multilayer of alternating materials and
let lights reflected from different interfaces interfere
constructively by choosing appropriate thickness for each layer
inside the multilayer. However, the absorption of the employed
materials for the multilayer limits the highest reflectivity that
can be achieved. The ML 120 includes a plurality of layer pairs,
such as molybdenum-silicon (Mo/Si) layer pairs (e.g., a layer of
molybdenum above or below a layer of silicon in each layer pair).
Alternatively, the ML 120 may include molybdenum-beryllium (Mo/Be)
layer pairs, or any layer pairs consisting of two materials or two
material combinations with large difference in refractive indices
and with small extinction coefficients. The thickness of each layer
of the ML 120 depends on the EUV wavelength and the incident angle
(on the mask). For a specified incident angle, the thickness of
each layer of the ML 120 is adjusted to achieve maximal
constructive interference for lights reflected at different
interfaces of the ML 120. A typical number of layer pairs is 20-80,
however any number of layer pairs is possible. In an embodiment,
the ML 120 includes forty pairs of layers of Mo/Si. Each Mo/Si
layer pair has a thickness of about 7 nm, with a total thickness of
280 nm. In this case, a reflectivity of about 70% is achieved.
[0021] A capping layer 130 is formed above the ML 120 to prevent
oxidation of the ML. In the present embodiment, the capping layer
130 includes silicon with about 4-7 nm thickness. A buffer layer
140 is formed above the capping layer 130 to act as an etching stop
layer in a patterning or repairing process of an absorption layer,
which will be described later. The buffer layer 140 has different
etching characteristics from the absorption layer. The buffer layer
140 includes ruthenium (Ru), Ru compounds such as RuB, RuSi,
chromium (Cr), Cr oxide, and Cr nitride. A low temperature
deposition process is often chosen for the buffer layer to prevent
inter-diffusion of the ML 120. In the present embodiment, the
buffer layer 140 contains ruthenium (Ru) and is of the thickness of
2-5 nm. In one embodiment, the capping layer and the buffer layer
is a single layer.
[0022] An absorption layer 150 is formed above the buffer layer
140. The absorption layer 150 preferably absorbs radiation in the
EUV wavelength range projected onto a patterned EUV mask 200. The
absorption layer 150 includes multiple film layers from a group of
chromium, chromium oxide, titanium nitride, tantalum nitride,
tantalum, titanium, or aluminum-copper, palladium, tantalum
nitride, aluminum oxide, molybdenum (Mo), or other suitable
materials. With a proper configuration of multiple film layers, the
absorption layer 150 will provide process flexibility in a
subsequent etching process by different etch characteristics of
each film. In the present embodiment, the absorption layer 150
includes 83-nm of tantalum nitride.
[0023] One or more of the layers 105, 120, 130, 140 and 150 may be
formed by various methods, including physical vapor deposition
(PVD) process such as evaporation and DC magnetron sputtering, a
plating process such as electrode-less plating or electroplating, a
chemical vapor deposition (CVD) process such as atmospheric
pressure CVD (APCVD), low pressure CVD (LPCVD), plasma enhanced CVD
(PECVD), or high density plasma CVD (HDP CVD), ion beam deposition,
spin-on coating, metal-organic decomposition (MOD), and/or other
methods known in the art. The MOD is a deposition technique by
using a liquid-based method in a non-vacuum environment. By using
MOD, a metal-organic precursor, dissolved in a solvent, is
spin-coated onto a substrate and the solvent is evaporated. A
vacuum ultraviolet (VUV) source is used to convert the
metal-organic precursors to constituent metal elements.
[0024] Referring to FIG. 4, in one of the present embodiments, the
absorption layer 150 is patterned to form the design layout pattern
EUV mask 200 with two states on the blank mask 100. The absorption
layer 150 is patterned to form the state 210 by a patterning
technique. A patterning process may include resist coating (e.g.,
spin-on coating), soft baking, mask aligning, exposure,
post-exposure baking, developing the resist, rinsing, drying (e.g.,
hard baking), other suitable processes, and/or combinations
thereof.
[0025] An etching process is followed to remove a portion of the
patterned absorption layer 150 to form a first state 210. The
etching process may include dry (plasma) etching, wet etching,
and/or other etching methods. In the meantime, a region, where the
absorption layer 150 remains, is defined as a second state 220.
[0026] Still referring to FIG. 4, now the EUV mask 200 comprises
two states, 210, and 220. The reflection coefficients of state 210
and state 220 are r1 and r2, respectively. The two states are
configured such that the absolute value of r1 is larger than the
absolute value of r2.
[0027] Referring to FIG. 5, there are main polygons (for circuit
patterns) and assist polygons on the EUV mask 200. The assist
polygons are so small that they are of sub-resolution to achieve
for the field a quasi-uniform reflection coefficient, of which the
absolute value is between those of r1 and r2. In the present
embodiment, states 210 and 220 of the EUV mask 200 are assigned to
a first main polygon 310 and a second main polygon 320, which is
adjacent to the first main polygon, to reduce their spatial
frequencies. All assist polygons 330 are assigned the same state,
which is different from the state assigned to the field 340. That
is, if all assist polygons 330 are assigned state 210, then the
field 340 is assigned state 220. If all assist polygons 330 are
assigned state 220, then the field 340 is assigned state 210. Main
polygons 310 and 320, and assist polygons 330 may touch or overlap
each other.
[0028] The present disclosure is directed towards lithography
systems and processes. In one embodiment, an extreme ultraviolet
lithography (EUVL) process includes receiving an extreme
ultraviolet (EUV) mask with multiple states. The EUV mask includes
a first main polygon, a second main polygon adjacent to the first
main polygon, and a plurality of assist polygons in a field (a
region without main polygons and assist polygons). All of the main
polygons, the assist polygons, and the field each have an
associated state. The first main polygon has a state different from
the state of the second main polygon. All of the assist polygons
have a state different from the state of the field. The EUVL
process also includes exposing the EUV mask by a nearly on-axis
illumination (ONI) with partial coherence .sigma. less than 0.3 to
produce diffracted lights and non-diffracted lights, removing most
of the non-diffracted lights, collecting and directing the
diffracted lights and the not removed non-diffracted lights by a
projection optics box (POB) to expose a target.
[0029] In another embodiment, an EUVL process includes receiving an
EUV mask. The EUV mask includes a plurality of main polygons, a
plurality of assist polygons in a field (a region without main
polygons and assist polygons), a first state having a first
reflection coefficient r1, a second state having a second
reflection coefficient r2. The EUVL process also includes assigning
different states of the EUV mask to adjacent main polygons and
assigning a state to all assist polygons, which is different from
the state of the field. The EUVL process also includes exposing the
EUV mask by a nearly on-axis illumination (ONI) with partial
coherence .sigma. less than 0.3 to produce diffracted lights and
non-diffracted lights, removing more than 70% of the non-diffracted
lights, collecting and directing the diffracted lights and the not
removed non-diffracted lights by a projection optics box (POB) to
expose a semiconductor wafer.
[0030] The present disclosure is also directed towards masks. In
one embodiment, an EUV mask includes a low thermal expansion
material (LTEM) substrate, a reflective multilayer (ML) above one
surface of the LTEM substrate, a conductive layer above an opposite
surface of the LTEM substrate, a capping layer above the reflective
ML, a buffer layer above the capping layer and a patterned
absorption layer above the buffer layer. The patterned absorption
layer defines multiple states in the EUV mask. Different states are
assigned to adjacent main polygons and a state is assigned to all
assist polygons, which is different from the state of the field
[0031] Based on the above, it can be seen that the present
disclosure offers the EUV lithography process 10. The EUV
lithography process 10 employs a nearly ONI, e.g., a disk
illumination with partial coherence .sigma. smaller than 0.3 to
expose an EUV mask to produce diffracted lights and non-diffracted
lights. The EUV lithography process 10 removes more than 70% of the
non-diffracted lights and utilizes mainly the diffracted lights
from two symmetrically located (on the pupil plane) and intensity
balanced -1-st and +1-st diffraction orders to expose a
semiconductor wafer. The EUV lithography process 10 also employs an
EUV mask with two states with pre-specified reflection
coefficients. Adjacent main polygons are of different states and
all assist polygons are of the same state, which is different from
the state of the field. The EUV lithography process 10 demonstrates
an enhancement of aerial image contrast for both line/space and
end-end patterns, and achieves a high depth of focus (DOF) in a
large pitch range. The EUV lithography process 10 provides a
resolution enhancement technique for future nodes.
[0032] The foregoing outlines features of several embodiments so
that those skilled in the art may better understand the aspects of
the present disclosure. Those skilled in the art should appreciate
that they may readily use the present disclosure as a basis for
designing or modifying other processes and structures for carrying
out the same purposes and/or achieving the same advantages of the
embodiments introduced herein. Those skilled in the art should also
realize that such equivalent constructions do not depart from the
spirit and scope of the present disclosure, and that they may make
various changes, substitutions, and alterations herein without
departing from the spirit and scope of the present disclosure.
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