U.S. patent application number 13/938491 was filed with the patent office on 2013-11-14 for wafer table having sensor for immersion lithography.
The applicant listed for this patent is NIKON CORPORATION. Invention is credited to Andrew J. HAZELTON, Hiroaki TAKAIWA.
Application Number | 20130301018 13/938491 |
Document ID | / |
Family ID | 34102667 |
Filed Date | 2013-11-14 |
United States Patent
Application |
20130301018 |
Kind Code |
A1 |
HAZELTON; Andrew J. ; et
al. |
November 14, 2013 |
WAFER TABLE HAVING SENSOR FOR IMMERSION LITHOGRAPHY
Abstract
A liquid immersion lithography apparatus and method exposes a
substrate with light via a projection system and liquid. A table
assembly has a top surface and is movable relative to the
projection system while supporting the substrate. The top surface
and the substrate are positionable opposite to the projection
system such that the liquid is maintained between the projection
system and a portion of one or both of the top surface and a
surface of the substrate. A sensor has a top surface arranged at
the top surface of the table assembly and is positionable opposite
to the projection system such that a gap, in which the liquid can
be maintained, is formed between the projection system and the top
surface of the sensor. The top surfaces of the table assembly and
of the sensor are apposed on a substantially same plane, or are
substantially co-planar.
Inventors: |
HAZELTON; Andrew J.; (Tokyo,
JP) ; TAKAIWA; Hiroaki; (Kumagaya-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
NIKON CORPORATION |
Tokyo |
|
JP |
|
|
Family ID: |
34102667 |
Appl. No.: |
13/938491 |
Filed: |
July 10, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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12318122 |
Dec 22, 2008 |
8508718 |
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13938491 |
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11606913 |
Dec 1, 2006 |
7486380 |
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12318122 |
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11319399 |
Dec 29, 2005 |
7301607 |
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11606913 |
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PCT/US04/17452 |
Jun 2, 2004 |
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11319399 |
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60485868 |
Jul 8, 2003 |
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Current U.S.
Class: |
355/30 |
Current CPC
Class: |
G03F 7/707 20130101;
G03F 7/70341 20130101; G03F 7/70716 20130101; G03F 7/70975
20130101; Y10T 29/49826 20150115 |
Class at
Publication: |
355/30 |
International
Class: |
G03F 7/20 20060101
G03F007/20 |
Claims
1. A liquid immersion lithography apparatus which exposes a
substrate with light via a projection optical system and a liquid,
the apparatus comprising: a table assembly that has a top surface
and is movable relative to the projection optical system while
supporting the substrate at a top surface side of the table
assembly, each of the top surface and the supported substrate being
positionable opposite to the projection optical system such that
the liquid is maintained between the projection optical system and
a portion of one of the top surface and a surface of the supported
substrate or both; and a sensor that has a top surface, the top
surface of the sensor being arranged at the top surface of the
table assembly and being positionable opposite to the projection
optical system such that a gap, in which the liquid is capable of
being maintained, is formed between the projection optical system
and the top surface of the sensor, wherein the top surface of the
table assembly and the top surface of the sensor are apposed on a
substantially same plane, or are substantially co-planar.
2. The apparatus according to claim 1, wherein the table assembly
has an opening portion at the top surface of the table assembly,
and the substrate is supported at an inside of the opening
portion.
3. The apparatus according to claim 2, wherein the substrate is
supported in the opening portion with a gap between edges of the
substrate and of the opening portion.
4. The apparatus according to claim 3, wherein the substrate, which
is supported by the table assembly, and the top surface of the
table assembly are apposed on the substantially same plane, or are
substantially co-planar.
5. The apparatus according to claim 4, further comprising; a mark
member arranged at the table assembly, that has a top surface,
wherein the top surface of the mark member and the top surface of
the table assembly are apposed on the substantially same plane, or
are substantially co-planar.
6. The apparatus according to claim 5, wherein the top surface of
the mark member is positionable opposite to the projection optical
system such that a gap, in which the liquid is capable of being
maintained, is formed between the projection optical system and the
top surface of the mark member.
7. The apparatus according to claim 5, wherein the table assembly
has a different opening portion from the opening portion at the top
surface of the table assembly, and the top surface of the mark
member is arranged inside of the different opening portion.
8. The apparatus according to claim 7, wherein the top surface of
the mark member is arranged in the different opening portion with a
gap between edges of the mark member and of the different opening
portion.
9. The apparatus according to claim 5, wherein the sensor is
viewable via the projection optical system and the liquid
maintained between the projection optical system and the top
surface of the sensor.
10. The apparatus according to claim 5, wherein the light is
detected by the sensor via the projection optical system and the
liquid maintained between the projection optical system and the top
surface of the sensor.
11. A liquid immersion lithography method of exposing a substrate
with light via a projection optical system and a liquid, the method
comprising: moving a table assembly that has a top surface and
supports the substrate at a top surface side of the table assembly
relative to the projection optical system, each of the top surface
and the supported substrate being positioned opposite to the
projection optical system such that the liquid is maintained
between the projection optical system and a portion of one of the
top surface and a surface of the supported substrate or both; and
positioning a top surface of a sensor opposite to the projection
optical system such that a gap, in which the liquid is capable of
being maintained, is formed between the projection optical system
and the top surface of the sensor, wherein the top surface of the
sensor is arranged at the top surface of the table assembly, and
wherein the top surface of the table assembly and the top surface
of the sensor are apposed on a substantially same plane, or are
substantially co-planar.
12. The method according to claim 11, wherein the table assembly
has an opening portion at the top surface of the table assembly,
and wherein the substrate is supported at an inside of the opening
portion.
13. The method according to claim 12, wherein the substrate is
supported in the opening portion with a gap between edges of the
substrate and of the opening portion.
14. The method according to claim 13, wherein the substrate, which
is supported by the table assembly, and the top surface of the
table assembly are apposed on the substantially same plane, or are
substantially co-planar.
15. The method according to claim 14, wherein a top surface of a
mark member arranged at the table assembly and the top surface of
the table assembly are apposed on the substantially same plane, or
are substantially co-planar.
16. The method according to claim 15, wherein the top surface of
the mark member is positioned opposite to the projection optical
system such that a gap, in which the liquid is capable of being
maintained, is formed between the projection optical system and the
top surface of the mark member.
17. The method according to claim 15, wherein the top surface of
the mark member is arranged inside of a different opening portion
from the opening portion at the top surface of the table
assembly.
18. The method according to claim 17, wherein the top surface of
the mark member is arranged in the different opening portion with a
gap between edges of the mark member and of the different opening
portion.
19. The method according to claim 15, wherein the sensor is viewed
via the projection optical system and the liquid maintained between
the projection optical system and the top surface of the
sensor.
20. The method according to claim 15, wherein the light is detected
by the sensor via the projection optical system and the liquid
maintained between the projection optical system and the top
surface of the sensor.
21. A device manufacturing method comprising: exposing a substrate
using a liquid immersion lithography apparatus according to claim
1; and developing the exposed substrate.
22. A device manufacturing method comprising: exposing a substrate
using a liquid immersion lithography method according to claim 11;
and developing the exposed substrate.
23. A method of making a liquid immersion lithography apparatus
which exposes a substrate with light via a projection optical
system and a liquid, the method comprising: providing a table
assembly that has a top surface and is movable relative to the
projection optical system while supporting the substrate at a top
surface side of the table assembly, each of the top surface and the
supported substrate being positionable opposite to the projection
optical system such that the liquid is maintained between the
projection optical system and a portion of one of the top surface
and a surface of the supported substrate or both; and providing a
sensor that has a top surface, the top surface of the sensor being
arranged at the top surface of the table assembly and being
positionable opposite to the projection optical system such that a
gap, in which the liquid is capable of being maintained, is formed
between the projection optical system and the top surface of the
sensor, wherein the top surface of the table assembly and the top
surface of the sensor are apposed on a substantially same plane, or
are substantially co-planar.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is a Divisional of U.S. patent application Ser. No.
12/318,122 filed Dec. 22, 2008, which in turn is a continuation of
U.S. patent application Ser. No. 11/606,913 filed Dec. 1, 2006 (now
U.S. Pat. No. 7,486,380), which is a divisional of U.S. patent
application Ser. No. 11/319,399 filed Dec. 29, 2005 (now U.S. Pat.
No. 7,301,607), which in turn is a continuation of International
Application No. PCT/US2004/017452 filed Jun. 2, 2004, which claims
priority to U.S. Provisional Patent Application No. 60/485,868
filed Jul. 8, 2003. The disclosures of these applications are
incorporated herein by reference in their entireties.
BACKGROUND
[0002] The invention relates generally to semiconductor processing
equipment. More particularly, the invention relates to methods and
apparatus for enabling liquid in an immersion lithography system to
effectively be contained between a surface of a lens and a plane
that is moved relative to the lens.
[0003] For precision instruments such as photolithography machines
that are used in semiconductor processing, factors that affect the
performance, e.g., accuracy, of the precision instrument generally
must be dealt with and, insofar as possible, eliminated. When the
performance of a precision instrument such as an immersion
lithography exposure system is adversely affected, products formed
using the precision instrument may be improperly formed and, hence,
function improperly.
[0004] In an immersion lithography system, a liquid is provided
between a lens and the surface of a wafer in order to improve the
imaging performance of the lens. The use of liquid allows a
numerical aperture associated with the lens, i.e., an effective
numerical aperture of the lens, to essentially be increased
substantially without altering characteristics of the lens, since a
liquid such as water generally has a refractive index that is
greater than one. In general, a higher numerical aperture enables a
sharper image to be formed on the wafer. As will be appreciated by
those skilled in the art, a high refractive index liquid allows for
a high numerical aperture of the lens because an effective
numerical aperture of a lens system of an immersion lithography
system is generally defined to be approximately equal to the sine
of an angle of diffraction of light that passes through a lens and
reflects off a surface multiplied by the refractive index of the
liquid. Because the refractive index of the liquid is greater than
one, the use of liquid allows the effective numerical aperture of
the lens to be increased, thereby enabling the resolution
associated with the lens to essentially be improved.
[0005] Within most conventional lithography systems, air is present
between a lens and a surface that passes under the lens, e.g., the
surface of a wafer. In such systems, the numerical aperture
associated with the lens is often in the range of approximately 0.8
to 0.9. Increasing the numerical aperture of a lens to achieve an
improved resolution is generally impractical, because the diameter
of a lens generally must be increased, which adds significant
difficulty to a lens manufacturing process. In addition, the
numerical aperture of a lens in air is theoretically limited to
one, and, in practice, is limited to being somewhat less than one.
Hence, immersion lithography systems enable the effective numerical
aperture of a lens to be increased substantially beyond what is
possible with a lens in air.
[0006] FIG. 1 is a diagrammatic cross-sectional representation of a
portion of an immersion lithography apparatus. An immersion
lithography apparatus 100 includes a lens assembly 104 that is
positioned over a wafer table 112 that supports a wafer 108. Wafer
table 112 is arranged to be scanned or otherwise moved under lens
assembly 104. A liquid 116, which may be water in a typical
application that uses approximately 193 nanometers (nm) of
radiation, is present in a gap between lens assembly 104 and wafer
108. In order to effectively prevent liquid 116 from leaking out
from under lens assembly 104, i.e., to effectively laterally
contain liquid 116 between lens assembly 104 and wafer 108, a
retaining ring 120 may be positioned such that retaining ring 120
enables liquid 116 to remain between lens assembly 104 and wafer
108, and within an area defined by retaining ring 120.
[0007] While retaining ring 120 is generally effective in
containing liquid 116 when lens assembly 104 is positioned such
that a small gap between retaining ring 120 and a surface of wafer
108 is maintained, for a situation in which at least a part of
retaining ring 120 is above wafer 108, liquid 116 may leak out from
between lens assembly 104 and wafer 108. By way of example, when an
edge of wafer 108 is to be patterned, lens assembly 104 may be
substantially centered over the edge such that a portion of
retaining ring 120 fails to maintain the small gap under the bottom
surface of retaining ring 120, and liquid 116 is allowed to leak
out from between lens assembly 104 and wafer 108. As shown in FIG.
2, when lens assembly 104 is positioned such that at least part of
a bottom surface of retaining ring 120 is not in contact with wafer
108, liquid 116 may not be contained in an area defined by
retaining ring 120 between lens assembly 104 and wafer 108.
[0008] In an immersion lithography apparatus, a wafer table may
support sensors and other components, e.g., a reference flat that
is used to calibrate automatic focusing operations. Such sensors
and other components generally may be positioned beneath a lens at
some point. That is, sensors and other components associated with a
wafer table may be occasionally positioned beneath a lens during
the course of operating the lens and the wafer table. While the use
of a retaining ring may prevent liquid from leaking out of a gap
between a lens assembly and the top surface of the wafer, liquid
may leak out from between the lens assembly and top surfaces of
sensors and other components when the lens assembly is positioned
over the sensors or other components.
[0009] FIG. 3 is a block diagram representation of a wafer table
that supports a sensor and a wafer holder that holds a wafer. A
wafer table 312 supports a wafer holder 310 that is arranged to
hold a wafer (not shown), a sensor 350, and an interferometer
mirror 352. Sensor 350 may be used through a lens (not shown) with
liquid (not shown) between the lens and sensor 350. However, liquid
will often flow out of the gap between a lens (not shown) and
sensor 350 particularly when an edge of sensor 350 is positioned
substantially beneath a center of the lens. The effectiveness of
sensor 350 may be compromised when sensor 350 is designed and
calibrated to operate in a liquid, and there is insufficient liquid
present between a lens (not shown) and sensor 350. Further, when
liquid (not shown) flows out of the gap between a lens (not shown)
and sensor 350, the liquid that flowed out of the gap is
effectively lost such that when the lens is subsequently positioned
over a wafer (not shown) supported by wafer holder 310, the amount
of liquid between the lens and the wafer may not be sufficient to
enable the effective numerical aperture of the lens to be as high
as desired. Hence, when liquid is not successfully contained
between a lens (not shown) and sensor 350 while sensor 350 is at
least partially positioned under the lens, an overall lithography
process that involves the lens and sensor 350 may be
compromised.
[0010] Therefore, what is needed is a method and an apparatus for
allowing liquid to be maintained in a relatively small gap defined
between a surface of a lens and a surface of substantially any
sensors or components that are supported by a wafer table. That is,
what is desired is a system that is suitable for preventing liquid
positioned between a lens and substantially any surface on a wafer
table that is moved under the lens from leaking out from between
the lens and the surface.
[0011] The invention relates to a wafer table arrangement that is
suitable for use in an immersion lithography system. According to
one aspect of the invention, an exposure apparatus includes a lens
and a wafer table assembly. The wafer table assembly has a top
surface, and is arranged to support a wafer to be moved with
respect to the lens as well as at least one component. The top
surface of the wafer and the top surface of the component are each
at substantially a same height as the top surface of the wafer
table assembly. An overall top surface of the wafer table assembly
that includes the top surface of the wafer, the top surface of the
wafer table assembly, and the top surface of the at least one
component is substantially planar.
[0012] In one embodiment, the component may be at least one of a
reference flat, an aerial image sensor, a dose sensor, and a dose
uniformity sensor. In another embodiment, the wafer table assembly
is arranged to support a wafer holder that holds the wafer such
that the top surface of the wafer is at substantially the same
height as the top surface of the wafer table assembly.
[0013] A wafer table arrangement that is configured to enable
surfaces that are to be viewed through a lens to form a relatively
planar overall surface of substantially the same height facilitates
an immersion lithography process. When substantially all elements
carried on a wafer table have top surfaces that are substantially
level with the top surface of the wafer table, and any gaps between
the sides of the components and the sides of openings in the wafer
table are relatively small, the overall top surface of a wafer
table arrangement may traverse under a lens while a layer or a film
of liquid is effectively maintained between a surface of the lens
and the overall top surface. Hence, an immersion lithography
process may be performed substantially without the integrity of the
layer of liquid between the surface of the lens and the overall top
surface of the wafer table arrangement being compromised by the
loss of liquid from the layer of liquid between the surface of the
lens and the overall top surface of the wafer table
arrangement.
[0014] According to another aspect of the invention, an immersion
lithography apparatus includes a lens that has a first surface and
an associated effective numerical aperture. The apparatus also
includes a liquid that is suitable for enhancing the effective
numerical aperture of the lens, and a table arrangement. The table
arrangement has a substantially flat top surface that opposes the
first surface, and the liquid is arranged substantially between the
substantially flat top surface and the first surface. The
substantially flat top surface includes a top surface of an object
to be scanned and a top surface of at least one sensor.
[0015] These and other advantages of the invention will become
apparent upon reading the following detailed descriptions and
studying the various figures of the drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The invention will be described in conjunction with the
accompanying drawings of exemplary embodiments in which like
reference numerals designate like elements and in which:
[0017] FIG. 1 is a diagrammatic cross-sectional representation of a
portion of an immersion lithography apparatus in a first
orientation;
[0018] FIG. 2 is a diagrammatic cross-sectional representation of a
portion of an immersion lithography apparatus, i.e., apparatus 100
of FIG. 1, in a second orientation;
[0019] FIG. 3 is a block diagram representation of a wafer table
that supports a sensor and a wafer holder that holds a wafer;
[0020] FIG. 4 is a block diagram representation of a top view of a
wafer table assembly in accordance with an embodiment of the
invention;
[0021] FIG. 5 is a block diagram representation of a top view of
components that are supported by a wafer table assembly with a
substantially uniform, planar overall top surface in accordance
with an embodiment of the invention;
[0022] FIG. 6a is a diagrammatic cross-sectional representation of
a wafer table assembly that has a substantially uniform, planar
overall top surface in accordance with an embodiment of the
invention;
[0023] FIG. 6b is a diagrammatic representation of a wafer table
assembly, e.g., wafer table assembly 600 of FIG. 6a, with a lens
assembly positioned over a wafer holder in accordance with an
embodiment of the invention;
[0024] FIG. 6c is a diagrammatic representation of a wafer table
assembly, e.g., wafer table assembly 600 of FIG. 6a, with a lens
assembly positioned over a component in accordance with an
embodiment of the invention;
[0025] FIG. 7 is a diagrammatic representation of a
photolithography apparatus in accordance with an embodiment of the
invention;
[0026] FIG. 8 is a process flow diagram that illustrates the steps
associated with fabricating a semiconductor device in accordance
with an embodiment of the invention;
[0027] FIG. 9 is a process flow diagram that illustrates the steps
associated with processing a wafer, i.e., step 1304 of FIG. 8, in
accordance with an embodiment of the invention;
[0028] FIG. 10a is a diagrammatic representation of a wafer table
surface plate and a wafer table in accordance with an embodiment of
the invention;
[0029] FIG. 10b is a diagrammatic cross-sectional representation of
a wafer table assembly that includes a wafer table and a wafer
table surface plate in accordance with an embodiment of the
invention;
[0030] FIG. 11 a is a diagrammatic cross-sectional representation
of a wafer table and a wafer table surface plate with windows in
accordance with an embodiment of the invention; and
[0031] FIG. 11b is a diagrammatic cross-sectional representation of
a wafer table assembly that includes a wafer table and a wafer
table surface plate with windows, i.e., wafer table 904 and wafer
table surface plate 908 of FIG. 11a, in accordance with an
embodiment of the invention.
DETAILED DESCRIPTION OF EMBODIMENTS
[0032] In immersion lithography systems, a wafer surface must
generally be viewed through a lens with a layer of liquid such as a
relatively thin film of liquid between the lens and the wafer
surface. Some components such as sensors and/or reference members
may often be viewed through the lens with a layer of liquid between
the lens and the surfaces of the components. Maintaining the layer
of liquid in a gap between the lens and the surface of the wafer,
even when the lens is arranged to view edge portions of the wafer,
allows the immersion lithography system to operate substantially as
desired. Similarly, maintaining the layer of liquid in a gap
between the lens and the surface of components such as sensors
and/or reference members also facilitates the efficient operation
of the immersion lithography system.
[0033] By utilizing the wafer table arrangement, surfaces that are
to be viewed through a lens and a top surface of the wafer table
arrangement form a relatively planar, substantially uniform overall
surface. When substantially all components associated with the
wafer table arrangement have a surface that is substantially level
with the top surface of a wafer and the top surface of a wafer
table, and any gaps between the sides of the components and the
sides of openings in the wafer table are relatively small, the
overall top surface of the wafer table arrangement may traverse
under a lens while a layer or a film of liquid is effectively
maintained between a surface of the lens and the overall top
surface. As a result, an immersion lithography process may be
performed substantially without having the integrity of the layer
of liquid, i.e., the layer of liquid between the surface of the
lens and the overall top surface of the wafer table arrangement,
compromised.
[0034] A wafer table that has a substantially raised, flat top
surface of a uniform height allows a wafer and other components,
e.g., sensors, to be installed such that a flat surface of the
wafer and flat surfaces of the components are at substantially the
same level or height as the raised, flat top surface of the wafer
table. In one embodiment, an overall wafer table assembly includes
openings within which a wafer, or a wafer holder on which the wafer
is supported, and sensors may be positioned. FIG. 4 is a block
diagram representation of a top view of a wafer table assembly in
accordance with an embodiment of the invention. A wafer table
assembly 402 includes openings 409, 452 that are sized to
effectively house a wafer 408 and components 450, respectively,
such that top surfaces of wafer 408 and components 450 are at
substantially the same level as a top surface 414 of wafer table
assembly 402. Typically, openings 409, 452 are sized to accommodate
wafer 408 and components 450, respectively, such that a spacing
between the outer edges of wafer 408 or components 450 and their
respective openings 409, 452 is relatively small, e.g., between
approximately ten and approximately 500 micrometers.
[0035] In general, the spacing between wafer 408, or in some cases,
a wafer holder (not shown) and opening 409, as well as the spacing
between components 450 and their corresponding openings 452 does
not significantly affect the overall planar quality of an overall
top surface of wafer table assembly 402. That is, an overall top
surface of wafer table assembly 402 which includes top surface 414,
the top surface of wafer 408, and the top surfaces of components
450 is substantially planar, with the planarity of the overall top
surface being substantially unaffected by the presence of the small
gaps between the sides of wafer 408 and opening 409, and the sides
of components 450 and openings 452.
[0036] Components 450 may include, but are not limited to, various
sensors and reference marks. With reference to FIG. 5, components
that are supported by a wafer table assembly with a substantially
uniform, planar overall top surface will be described in accordance
with an embodiment of the invention. A wafer table assembly 502
includes a raised, substantially uniform top surface 514 in which
openings 509, 552 are defined. Opening 509 is arranged to hold a
wafer 508 which may be supported by a wafer holder (not shown).
Openings 552 are arranged to support any number of components, In
the described embodiment, openings 552 are arranged to support a
dose sensor or a dose uniformity sensor 556, an aerial image sensor
558, a reference flat 560, and a fiducial mark 562, which each have
top surfaces that are arranged to be of substantially the same
height as top surface 514 such that an overall, substantially
uniform, planar top surface is formed. Examples of a suitable dose
sensor or dose uniformity sensor 556 are described in U.S. Pat. No.
4,465,368, U.S. Pat. No. 6,078,380, and U.S. Patent Publication No.
2002/0061469A1, which are each incorporated herein by reference in
their entireties. An example of an aerial image sensor 558 is
described in U.S. Patent Publication No. 2002/0041377A1, which is
incorporated herein by reference in its entirety. An example of a
reference flat 560 is described in U.S. Pat. No. 5,985,495, which
is incorporated herein by reference in its entirety, while an
example of a fiducial mark 562 is described in U.S. Pat. No.
5,243,195, which is incorporated herein by reference in its
entirety.
[0037] It should be appreciated that openings 552 are sized to
accommodate components such that gaps between the sides of
components, as for example dose sensor or dose uniformity sensor
556, aerial image sensor 558, reference flat 560, and fiducial mark
562, and edges of openings 552 are not large enough to
significantly affect the uniformity and planarity of the overall
top surface. In other words, components are relatively tightly fit
within openings 552.
[0038] Dose sensor or a dose uniformity sensor 556, one or both of
which may be included in openings 552, is/are arranged to be used
to determine a strength of a light source associated with a lens
assembly (not shown) by studying light energy at the level of the
top surface of wafer 508. In one embodiment, only a dose uniformity
sensor is typically included. A dose sensor generally measures
absolute illumination intensity, while a dose uniformity sensor
typically measures variations over an area. As such, dose sensor or
does uniformity sensor 556 is positioned in the same plane as the
top surface of wafer 508. Aerial image sensor 558 is arranged to
effectively measure an aerial image that is to be projected onto
the surface of wafer 508 and, hence, exposed on photoresist. In
order for aerial image sensor to accurately measure an aerial
image, aerial image sensor 558 is essentially positioned at the
same level or plane as the top surface of wafer 508.
[0039] Reference flat 560 is generally used to calibrate the
automatic focus functionality of a lens assembly (not shown), while
fiducial mark 562 is a pattern that is used to enable wafer 508 to
be aligned with respect to the lens assembly and reticle, as will
be understood by those skilled in the art. Both reference flat 560
and fiducial mark 562 are positioned in the same plane as wafer
508.
[0040] FIG. 6a is a diagrammatic cross-sectional representation of
a wafer table assembly that has a substantially uniform, planar
overall top surface in accordance with an embodiment of the
invention. An overall wafer table assembly 600 includes a wafer
table 602 that is arranged to support a wafer holder 608 that holds
a wafer (not shown) such that a top surface of the wafer is
substantially flush with an overall top surface 614 of wafer table
assembly 600. Wafer table 602 also supports components 650, which
may include sensors and reference marks, such that top surfaces of
components 650 are also substantially flush with overall top
surface 614, as discussed above. In other words, top surfaces of
components 650, wafer holder 608 when supporting a wafer (not
shown), and wafer table 602 effectively form a substantially flat
overall top surface 614 of relatively uniform height. Wafer holder
608 and components 650 are arranged to be relatively tightly fit
into openings defined within wafer table 602 such that a gap
between the side of wafer holder 608 and the sides of an associated
opening within wafer table 602, as well as gaps between components
650 and the sides of associated openings within wafer table 602,
are each relatively small, and do not have a significant effect on
the uniformity of overall top surface 614.
[0041] Wafer table 602 may support additional components or
elements in addition to wafer holder 608, a wafer (not shown), and
components 650. By way of example, wafer table 602 may support an
interferometer mirror 670. It should be appreciated that a top
surface of interferometer mirror 670 may also be substantially
level with overall top surface 614. Hence, in one embodiment,
overall top surface 614 may include interferometer mirror 670.
[0042] Overall top surface 614 enables liquid to be maintained in a
gap between a lens assembly and overall top surface 614 when a
component 650 or wafer holder 608 traverses beneath the lens. FIG.
6b is a diagrammatic representation of a wafer table assembly,
e.g., wafer table assembly 600 of FIG. 6a, that is arranged to scan
beneath a lens assembly in accordance with an embodiment of the
invention. A lens assembly 684, which is arranged to be positioned
over overall top surface 614 is effectively separated from overall
top surface 614 along a z-axis 690a by a layer of liquid 682. The
size of the immersion area covered by liquid 682 is relatively
small, e.g., the size of the immersion area may be smaller than
that of the wafer (not shown). Local fill methods that are used to
provide the liquid of the immersion area are described in PCT
International Patent Application No. PCT/US04/10055 (filed Mar. 29,
2004), PCT International Patent Application No. PCT/US04/09994
(filed Apr. 1, 2004), and PCT International Patent Application No.
PCT/US04/10071 (filed Apr. 1, 2004), which are each incorporated
herein by reference in their entireties. Layer of liquid 682 is
effectively held between overall top surface 614 and lens assembly
684 with respect to an x-axis 690b and a y-axis 690c by a retaining
ring 680, although substantially any suitable arrangement may be
used to effectively hold layer of liquid 682 in place relative to
x-axis 690b and y-axis 690c. Retaining ring 680 is arranged as a
ring-like structure with respect to x-axis 690b and y-axis 690c
which contains liquid 682 in an area defined by the edges of
retaining ring 680. That is, retaining ring 680 forms a ring-like
shape about z-axis 690a.
[0043] In another embodiment, retaining ring 680 may not be
necessary. If the gap between lens assembly 684 and overall top
surface 614 (or wafer surface) is relatively small, e.g., between
approximately 0.5 mm and approximately 5 mm, layer of liquid 682
may be effectively held in the gap with surface tension of liquid
682.
[0044] In general, liquid 682 may be substantially any suitable
liquid that fills a gap or a space between a surface of lens
assembly 684 and overall top surface 614 within an area defined by
retaining ring 680 that allows an effective numerical aperture of a
lens included in lens assembly 684 to be increased for the same
wavelength of light and the same physical size of the lens. Liquids
including various oils, e.g., Fomblin.TM. oil, may be suitable for
use as liquid 682. In one embodiment, as for example within an
overall system that uses approximately 193 nanometers (nm) of
radiation, liquid 682 is water. However, for shorter wavelengths,
liquid 682 may be an oil.
[0045] Because overall top surface 614 is substantially flat and
uniform, when lens assembly 684 is positioned over wafer holder
608, liquid 682 does not leak out from between overall top surface
614 and lens assembly 684, because retaining ring 680 remains in
contact or in close proximity with overall top surface 614, even
when lens assembly 684 is positioned over an edge of wafer holder
608. The uniformity and planarity of overall top surface 614 also
allows liquid 682 to remain between lens assembly 684 and overall
top surface 614 when lens assembly 684 is oriented over a component
650, as shown in FIG. 6e.
[0046] While a wafer table arrangement may include a wafer table in
which openings have been defined to house a wafer or a wafer holder
and any number of components, a wafer table arrangement may instead
include a wafer table that has no openings to house a wafer or a
wafer holder and any number of components and structures that may
cooperate with the wafer table to effectively form openings in
which a wafer or a wafer holder and any number of components may be
placed. In other words, a substantially planar wafer table
arrangement may either include openings formed within a wafer table
as discussed above, or openings defined by a structure or
structures positioned atop a wafer table.
[0047] When a wafer table arrangement includes a structure that
defines openings that may effectively house a wafer and components
and provides a substantially planar top surface for the wafer table
arrangement, the structure may generally be a plate-like structure
within which openings are formed. With reference to FIG. 10a, a
wafer table arrangement that includes a wafer table and a wafer
table surface plate will be described in accordance with an
embodiment of the invention. A wafer table arrangement 700 includes
a wafer table 704 and a wafer table surface plate 708. Wafer table
704 supports a wafer 712 and one or more components 716 which may
include various sensors, a fiducial mark, or a reference flat.
Wafer table surface plate 708, which may be formed from any
suitable material, e.g., Teflon, includes an opening 720 within
which wafer 712, may be positioned when wafer table surface plate
708 is positioned atop wafer table 704. Openings 724, which are
also defined in wafer table surface plate 708, are arranged to fit
around components 716 when wafer table surface plate 708 is
positioned atop wafer table 704.
[0048] Wafer table surface plate 708 includes a top surface which,
when wafer table surface plate 708 is positioned atop wafer table
704 such that wafer 712 is positioned within opening 720 and
components 716 are positioned within openings 724, cooperates with
a top surface of wafer 712 and top surfaces of components 716 to
create a substantially uniform, planar overall top surface. As
shown in FIG. 10b, when a wafer table surface plate 808 is
positioned over a wafer table 804, a top surface of components 816,
e.g., sensors, and a top surface of a wafer 812 are at
substantially the same height as a top surface of wafer table
surface plate 808. In the embodiment as shown, an interferometer
mirror 814 also has a top surface that is at substantially the same
height as the top surface of wafer table surface plate 808. Hence,
an overall wafer table arrangement that includes wafer table 804
and wafer table surface plate 808 has an overall top surface that
is relatively uniform and planar.
[0049] While a wafer table arrangement may include a wafer table in
which openings have been defined to house a wafer or a wafer holder
and any number of components, a wafer table arrangement may instead
include a wafer table that has no openings to house a wafer or a
wafer holder and any number of components and structures that may
cooperate with the wafer table to effectively form openings in
which a wafer or a wafer holder and any number of components may be
placed. In other words, a substantially planar wafer table
arrangement may either include openings formed within a wafer table
as discussed above, or openings defined by a structure or
structures positioned atop a wafer table.
[0050] A plate-like structure that enables a substantially planar
overall surface of a wafer table arrangement to be achieved may
vary widely. In one embodiment, sensors or components may be
integral to the plate-like structure. By way of example, a
reference flat or a fiducial mark may be etched or otherwise formed
directly onto the plate-like structure. In another embodiment, the
plate-like structure may include an opening within which a wafer
supported by a wafer holder may be held, and openings topped by
windows that may protect sensors while allowing sensors to
function, With reference to FIGS. 11a and 11b, a wafer table
arrangement that includes a wafer table and a wafer table surface
plate with windows will be described in accordance with an
embodiment of the invention. A wafer table arrangement 900 includes
a wafer table 904 and a wafer table surface plate 908 that includes
windows 960 that are arranged to be positioned over one or more
components 916 such as sensors, as shown in FIG. 11b. Wafer table
904 supports a wafer 912, which is arranged to fit into an opening
in plate 908.
[0051] Plate 908 may be formed from any suitable material, e.g.,
Teflon, with windows 960 being formed from a clear material.
Alternatively, plate 908 may be a clear cover plate with windows
960 being relatively thin portions of plate 908 positioned over
openings 924 that are arranged to fit around components 916 when
wafer table surface plate 908 is positioned atop wafer table 904. A
top surface of plate 908 cooperates with a top surface of wafer 912
to form a substantially planar top surface for arrangement 900. As
with the other embodiments, an interferometer mirror 914 also may
be provided.
[0052] With reference to FIG. 7, a photolithography apparatus that
may be part of an immersion lithography exposure system that
includes a wafer table assembly with a flat surface of
substantially uniform height will be described in accordance with
an embodiment of the invention. A photolithography apparatus
(exposure apparatus) 40 includes a wafer positioning stage 52 that
may be driven by a planar motor (not shown), as well as a wafer
table 51 that is magnetically coupled to wafer positioning stage 52
by utilizing an EI-core actuator, e.g., an EI-core actuator with a
top coil and a bottom coil that are substantially independently
controlled. The planar motor that drives wafer positioning stage 52
generally uses an electromagnetic force generated by magnets and
corresponding armature coils arranged in two dimensions. A wafer 64
is held in place on a wafer holder or chuck 74 that is coupled to
wafer table 51. Wafer positioning stage 52 is arranged to move in
multiple degrees of freedom, e.g., between three to six degrees of
freedom, under the control of a control unit 60 and a system
controller 62. In one embodiment, wafer positioning stage 52 may
include a plurality of actuators that are coupled to a common
magnet track. The movement of wafer positioning stage 52 allows
wafer 64 to be positioned at a desired position and orientation
relative to a projection optical system 46.
[0053] Wafer table 51 may be levitated in a z-direction 10b by any
number of voice coil motors (not shown), e.g., three voice coil
motors. In the described embodiment, at least three magnetic
bearings (not shown) couple and move wafer table 51 along a y-axis
10a. The motor array of wafer positioning stage 52 is typically
supported by a base 70. Base 70 is supported to a ground via
isolators 54. Reaction forces generated by motion of wafer stage 52
may be mechanically released to a ground surface through a frame
66. One suitable frame 66 is described in JP Hei 8-166475 and U.S.
Pat. No. 5,528,118, which are each herein incorporated by reference
in their entireties.
[0054] An illumination system 42 is supported by a frame 72. Frame
72 is supported to the ground via isolators 54. Illumination system
42 includes an illumination source, and is arranged to project a
radiant energy, e.g., light, through a mask pattern on a reticle 68
that is supported by and scanned using a reticle stage 44 that
includes a coarse stage and a fine stage, and that is supported on
frame 48. The radiant energy is focused through projection optical
system 46, which is supported on a projection optics frame 50 and
may be supported by the ground through isolators 54. Suitable
isolators 54 include those described in JP Hei 8-330224 and U.S.
Pat. No. 5,874,820, which are each incorporated herein by reference
in their entireties.
[0055] A first interferometer 56 is supported on projection optics
frame 50, and functions to detect the position of wafer table 51.
Interferometer 56 outputs information on the position of wafer
table 51 to system controller 62. In one embodiment, wafer table 51
has a force damper that reduces vibrations associated with wafer
table 51 such that interferometer 56 may accurately detect the
position of wafer table 51. A second interferometer 58 is supported
on projection optical system 46, and detects the position of
reticle stage 44 which supports a reticle 68. Interferometer 58
also outputs position information to system controller 62.
[0056] It should be appreciated that there are a number of
different types of photolithographic apparatus or devices. For
example, photolithography apparatus 40, or an exposure apparatus,
may be used as a scanning type photolithography system that exposes
the pattern from reticle 68 onto wafer 64 with reticle 68 and wafer
64 moving substantially synchronously. In a scanning type
lithographic device, reticle 68 is moved perpendicularly with
respect to an optical axis of a lens assembly (projection optical
system 46) or illumination system 42 by reticle stage 44. Wafer 64
is moved perpendicularly to the optical axis of projection optical
system 46 by a wafer stage 52. Scanning of reticle 68 and wafer 64
generally occurs while reticle 68 and wafer 64 are moving
substantially synchronously.
[0057] Alternatively, photolithography apparatus or exposure
apparatus 40 may be a step-and-repeat type photolithography system
that exposes reticle 68 while reticle 68 and wafer 64 are
stationary, i.e., at a substantially constant velocity of
approximately zero meters per second. In one step and repeat
process, wafer 64 is in a substantially constant position relative
to reticle 68 and projection optical system 46 during the exposure
of an individual field. Subsequently, between consecutive exposure
steps, wafer 64 is consecutively moved by wafer positioning stage
52 perpendicularly to the optical axis of projection optical system
46 and reticle 68 for exposure. Following this process, the images
on reticle 68 may be sequentially exposed onto the fields of wafer
64 so that the next field of semiconductor wafer 64 is brought into
position relative to illumination system 42, reticle 68, and
projection optical system 46.
[0058] It should be understood that the use of photolithography
apparatus or exposure apparatus 40, as described above, is not
limited to being used in a photolithography system for
semiconductor manufacturing. For example, photolithography
apparatus 40 may be used as a part of a liquid crystal display
(LCD) photolithography system that exposes an LCD device pattern
onto a rectangular glass plate or a photolithography system for
manufacturing a thin film magnetic head. The illumination source of
illumination system 42 may be g-line (436 nanometers (nm)), i-line
(365 nm), a KrF excimer laser (248 nm), an ArF excimer laser (193
nm), or an F.sub.2-type laser (157 nm).
[0059] With respect to projection optical system 46, when far
ultraviolet rays such as an excimer laser is used, glass materials
such as quartz and fluorite that transmit far ultraviolet rays is
preferably used. When either an F.sub.2-type laser or an x-ray is
used, projection optical system 46 may be either catadioptric or
refractive (a reticle may be of a corresponding reflective type),
and when an electron beam is used, electron optics may comprise
electron lenses and deflectors. As will be appreciated by those
skilled in the art, the optical path for the electron beams is
generally in a vacuum.
[0060] In addition, with an exposure device that employs vacuum
ultraviolet (VUV) radiation of a wavelength that is approximately
200 nm or lower, use of a catadioptric type optical system may be
considered. Examples of a catadioptric type of optical system
include, but are not limited to, those described in Japanese
Laid-Open Patent Application No. 8-171054 and its counterpart U.S.
Pat. No. 5,668,672, as well as in Japanese Laid-Open Patent
Application No. 10-20195 and its counterpart U.S. Pat. No.
5,835,275, which are all incorporated herein by reference in their
entireties. In these examples, the reflecting optical device may be
a catadioptric optical system incorporating a beam splitter and a
concave mirror. Japanese Laid-Open Patent Application No. 8-334695
and its counterpart U.S. Pat. No. 5,689,377, as well as Japanese
Laid-Open Patent Application No. 10-3039 and its counterpart U.S.
Pat. No. 5,892,117, which are all incorporated herein by reference
in their entireties. These examples describe a
reflecting-refracting type of optical system that incorporates a
concave minor, but without a beam splitter, and may also be
suitable for use with the invention.
[0061] Further, in photolithography systems, when linear motors
(see U.S. Pat. Nos. 5,623,853 or 5,528,118, which are each
incorporated herein by reference in their entireties) are used in a
wafer stage or a reticle stage, the linear motors may be either an
air levitation type that employs air bearings or a magnetic
levitation type that uses Lorentz forces or reactance forces.
Additionally, the stage may also move along a guide, or may be a
guideless type stage that uses no guide.
[0062] Alternatively, a wafer stage or a reticle stage may be
driven by a planar motor that drives a stage through the use of
electromagnetic forces generated by a magnet unit that has magnets
arranged in two dimensions and an armature coil unit that has coils
in facing positions in two dimensions. With this type of drive
system, one of the magnet unit or the armature coil unit is
connected to the stage, while the other is mounted on the moving
plane side of the stage.
[0063] Movement of the stages as described above generates reaction
forces that may affect performance of an overall photolithography
system. Reaction forces generated by the wafer (substrate) stage
motion may be mechanically released to the floor or ground by use
of a frame member as described above, as well as in U.S. Pat. No.
5,528,118 and Japanese Laid-Open Patent Application No. 8-166475.
Additionally, reaction forces generated by the reticle (mask) stage
motion may be mechanically released to the floor (ground) by use of
a frame member as described in U.S. Pat. No. 5,874,820 and Japanese
Laid-Open Patent Application No. 8-330224, which are each
incorporated herein by reference in their entireties.
[0064] Isolators such as isolators 54 may generally be associated
with an active vibration isolation system (AVIS). An AVIS generally
controls vibrations associated with forces, i.e., vibrational
forces, that are experienced by a stage assembly or, more
generally, by a photolithography machine such as photolithography
apparatus 40 that includes a stage assembly.
[0065] A photolithography system according to the above-described
embodiments, e.g., a photolithography apparatus that may include
one or more dual force actuators, may be built by assembling
various subsystems in such a manner that prescribed mechanical
accuracy, electrical accuracy, and optical accuracy are maintained.
In order to maintain the various accuracies, prior to and following
assembly, substantially every optical system may be adjusted to
achieve its optical accuracy. Similarly, substantially every
mechanical system and substantially every electrical system may be
adjusted to achieve their respective desired mechanical and
electrical accuracies. The process of assembling each subsystem
into a photolithography system includes, but is not limited to,
developing mechanical interfaces, electrical circuit wiring
connections, and air pressure plumbing connections between each
subsystem. There is also a process where each subsystem is
assembled prior to assembling a photolithography system from the
various subsystems. Once a photolithography system is assembled
using the various subsystems, an overall adjustment is generally
performed to ensure that substantially every desired accuracy is
maintained within the overall photolithography system.
Additionally, it may be desirable to manufacture an exposure system
in a clean room where the temperature and humidity are
controlled.
[0066] Further, semiconductor devices may be fabricated using
systems described above, as will be discussed with reference to
FIG. 8. The process begins at step 1301 in which the function and
performance characteristics of a semiconductor device are designed
or otherwise determined. Next, in step 1302, a reticle (mask) that
has a pattern is designed based upon the design of the
semiconductor device. It should be appreciated that in a parallel
step 1303, a wafer is made from a silicon material. The mask
pattern designed in step 1302 is exposed onto the wafer fabricated
in step 1303 in step 1304 by a photolithography system. One process
of exposing a mask pattern onto a wafer will be described below
with respect to FIG. 9. In step 1305, the semiconductor device is
assembled. The assembly of the semiconductor device generally
includes, but is not limited to, wafer dicing processes, bonding
processes, and packaging processes. Finally, the completed device
is inspected in step 1306.
[0067] FIG. 9 is a process flow diagram that illustrates the steps
associated with wafer processing in the case of fabricating
semiconductor devices in accordance with an embodiment of the
invention. In step 1311, the surface of a wafer is oxidized. Then,
in step 1312, which is a chemical vapor deposition (CVD) step, an
insulation film may be formed on the wafer surface. Once the
insulation film is formed, in step 1313, electrodes are formed on
the wafer by vapor deposition. Then, ions may be implanted in the
wafer using substantially any suitable method in step 1314. As will
be appreciated by those skilled in the art, steps 1311-1314 are
generally considered to be preprocessing steps for wafers during
wafer processing. Further, it should be understood that selections
made in each step, e.g., the concentration of various chemicals to
use in forming an insulation film in step 1312, may be made based
upon processing requirements.
[0068] At each stage of wafer processing, when preprocessing steps
have been completed, post-processing steps may be implemented.
During post-processing, initially, in step 1315, photoresist is
applied to a wafer. Then, in step 1316, an exposure device may be
used to transfer the circuit pattern of a reticle to a wafer.
Transferring the circuit pattern of the reticle to the wafer
generally includes scanning a reticle scanning stage which may, in
one embodiment, include a force damper to dampen vibrations.
[0069] After the circuit pattern on a reticle is transferred to a
wafer, the exposed wafer is developed in step 1317. Once the
exposed wafer is developed, parts other than residual photoresist,
e.g., the exposed material surface, may be removed by etching in
step 1318. Finally, in step 1319, any unnecessary photoresist that
remains after etching may be removed. As will be appreciated by
those skilled in the art, multiple circuit patterns may be formed
through the repetition of the preprocessing and post-processing
steps.
[0070] Although only a few embodiments of the invention have been
described, it should be understood that the invention may be
embodied in many other specific forms without departing from the
spirit or the scope of the invention. By way of example, although
the use of a wafer table arrangement with a substantially flat
overall planar surface of a uniform height has been described as
being suitable for use in an immersion lithography system to enable
a small liquid-filled or fluid-filled gap to be maintained between
a projection lens and the surface of the wafer table, such a wafer
table is not limited to use as a part of an immersion lithography
system.
[0071] A table that supports an object to be scanned and has a
relatively planar, substantially uniform top surface has generally
been described as being a wafer table. Such a table is not limited
to being a wafer table. For instance, a reticle table may also have
a relatively planar, substantially uniform top surface.
Alternatively, a substrate table supporting, for example, a glass
plate for LCD manufacturing, a microscope specimen, or the like may
also have a substantially flat planar surface.
[0072] Components that are supported within a wafer table
arrangement such that top surfaces of the components are at
substantially the same height as a top surface of a wafer table
have been described as including dose sensors, dose uniformity
sensors, aerial image sensors, reference flats, and fiducial marks.
It should be appreciated, however, that any suitable additional
components may be supported within the wafer table arrangement such
that the top surfaces of the additional components are
substantially flush with the top surface of the wafer table.
Further, while a wafer table arrangement may include a dose sensor
or a dose uniformity sensor, an aerial image sensor, a reference
flat, and a fiducial mark, a wafer table arrangement may not
necessarily include a dose sensor or a dose uniformity sensor, an
aerial image sensor, a reference flat, and a fiducial mark. That
is, a wafer table arrangement may include as little as one
component that has a top surface that is substantially flush with
the overall top surface of the wafer table arrangement.
[0073] It should be appreciated that for substantially all
components supported on a wafer table to have top surfaces that are
substantially flush with the overall top surface of the a wafer
table arrangement, the wafer table arrangement may need to support
a bottom surface of each component at different heights. That is,
the bottom surfaces of the components may need to be supported at
different heights in order to enable the top surfaces of the
components to be oriented such that the top surfaces are all
substantially flush with the overall top surface of the wafer table
arrangement.
[0074] The materials used to form a wafer table arrangement, e.g.,
a wafer table and a plate that is positioned atop the wafer table,
may be widely varied. Although a plate has been described as being
formed from Teflon, it should be appreciated that the plate may be
formed from substantially any suitable material. Therefore, the
present examples are to be considered as illustrative and not
restrictive, and the invention is not to be limited to the details
given herein, but may be modified.
* * * * *