U.S. patent application number 13/641580 was filed with the patent office on 2013-05-23 for heat transporting unit, electronic circuit board and electronic device.
This patent application is currently assigned to MOLEX INCORPORATED. The applicant listed for this patent is Rinkou Fukunaga, Kenji Ohsawa, Katsuya Tsuruta. Invention is credited to Rinkou Fukunaga, Kenji Ohsawa, Katsuya Tsuruta.
Application Number | 20130126139 13/641580 |
Document ID | / |
Family ID | 44799380 |
Filed Date | 2013-05-23 |
United States Patent
Application |
20130126139 |
Kind Code |
A1 |
Tsuruta; Katsuya ; et
al. |
May 23, 2013 |
HEAT TRANSPORTING UNIT, ELECTRONIC CIRCUIT BOARD AND ELECTRONIC
DEVICE
Abstract
The heat transporting unit according to the Present Disclosure
comprises: an upper plate; a lower plate that faces the upper
plate; an interior space that is formed by the upper plate and the
lower plate and wherein a refrigerant can be sealed; a first
region, that is a region that is part of the interior space and
that is provided with a first column portion that forms a plurality
of first ducts that extend in the X-axis direction; and a second
region that is provided with a second column portion that forms a
plurality of second ducts that extend in the X-axis direction and
the Y-axis direction, that is a region that is other than the first
region within the interior space; wherein: the first ducts and
second ducts connect at a boundary between the first region and the
second region.
Inventors: |
Tsuruta; Katsuya; (Yamato,
JP) ; Ohsawa; Kenji; (Yamato, JP) ; Fukunaga;
Rinkou; (Yamato, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Tsuruta; Katsuya
Ohsawa; Kenji
Fukunaga; Rinkou |
Yamato
Yamato
Yamato |
|
JP
JP
JP |
|
|
Assignee: |
MOLEX INCORPORATED
Lisle
IL
|
Family ID: |
44799380 |
Appl. No.: |
13/641580 |
Filed: |
April 18, 2011 |
PCT Filed: |
April 18, 2011 |
PCT NO: |
PCT/US11/32919 |
371 Date: |
December 10, 2012 |
Current U.S.
Class: |
165/170 |
Current CPC
Class: |
F28F 3/12 20130101; F28D
15/0233 20130101; H01L 2924/0002 20130101; H01L 2924/00 20130101;
H01L 23/427 20130101; H01L 2924/0002 20130101; F28F 3/00
20130101 |
Class at
Publication: |
165/170 |
International
Class: |
F28F 3/12 20060101
F28F003/12 |
Foreign Application Data
Date |
Code |
Application Number |
Apr 17, 2010 |
JP |
2010-095565 |
Claims
1. A heat transporting unit having a space defined by mutually
orthogonal X, Y and Z axes, comprising: an upper plate; a lower
plate that faces the upper plate; an interior space that is formed
by the upper plate and the lower plate and wherein a refrigerant
can be sealed; a first region, that is a region that is part of the
interior space and that is provided with a first column portion
that forms a plurality of first ducts that extend in the X-axis
direction; and a second region that is provided with a second
column portion that forms a plurality of second ducts that extend
in the X-axis direction and the Y-axis direction, that is a region
that is other than the first region within the interior space;
wherein the first ducts and second ducts connect at a boundary
between the first region and the second region.
2. The heat transporting unit of claim 1, wherein, in the first
duct, not only does a vaporized refrigerant move in the X-axis
direction, but a condensed refrigerant also moves in the X-axis
direction.
3. The heat transporting unit of claim 2, wherein, in the second
duct, not only does the vaporized refrigerant move in the X-axis
direction and the Y-axis direction, but the condensed refrigerant
also moves in the X-axis direction and the Y-axis direction.
4. The heat transporting unit of claim 3, wherein not only does
vaporized refrigerant move mutually at the boundary between the
first duct and the second duct, but also the condensed refrigerant
moves mutually at the boundary between the first duct and the
second duct.
5. The heat transporting unit of claim 4, wherein a second region
is provided at at least one of the two end portions of the interior
space.
6. The heat transporting unit of claim 5, wherein a first region is
provided in a region other than the second region in the interior
space.
7. The heat transporting unit of claim 4, wherein a second region
is provided in the center portion of the interior space.
8. The heat transporting unit of claim 7, wherein a first region is
provided in a region other than the second region in the interior
space.
9. The heat transporting unit of claim 4, wherein a second region
not only diffuses heat received from a heat emitting object in the
X-axis direction and the Y-axis direction, but also moves it to the
first region.
10. The heat transporting unit of claim 9, wherein the first region
transports, in the X-axis direction, the heat moved from the second
region.
11. The heat transporting unit of claim 10, wherein, when the
second region is provided at a first end portion and at a second
end portion that is opposite from the first end portion, within the
interior space, the second region of the first end portion side not
only causes the diffusion, in the X-axis direction and the Y-axis
direction, of the heat received from the heat emitting object, but
also causes it to move to the first region.
12. The heat transporting unit of claim 11, wherein, when the
second region is provided at a first end portion and at a second
end portion that is opposite from the first end portion, within the
interior space, the first region transports, in the X-axis
direction, the heat moved from the second region on the first end
portion side.
13. The heat transporting unit of claim 12, wherein, when the
second region is provided at a first end portion and at a second
end portion that is opposite from the first end portion, within the
interior space, the second region on the second end portion side
diffuses, in the X-axis direction and the Y-axis direction, the
heat that has been transported by the first region.
14. The heat transporting unit of claim 10, wherein, when the
second region is provided in the center of the interior space, and
the first region is provided at a first end portion and at a second
end portion that is on the opposite side from the first end
portion, in the interior space, the second region not only diffuses
in the X-axis direction and the Y-axis direction the heat that is
received from the heat emitting object, but also moves it to the
first region.
15. The heat transporting unit of claim 14, wherein, when the
second region is provided in the center of the interior space, and
the first region is provided at a first end portion and at a second
end portion that is on the opposite side from the first end
portion, in the interior space, the first region transports, in the
X-direction, the heat moved from the second region.
16. The heat transporting unit of claim 10, wherein the upper plate
and/or the lower plate also has a heat receiving portion that
contacts the heat emitting object thermally.
17. The heat transporting unit of claim 16, wherein the heat
receiving portion is provided spanning the first region and the
second region.
18. The heat transporting unit of claim 17, wherein a first column
portion has a cutout to connect together adjacent first ducts
within a plurality of first ducts.
19. The heat transporting unit of claim 18, wherein the second
region has one or more intermediate plates layered in the Z-axis
direction.
20. The heat transporting unit of claim 19, wherein the
intermediate plates form the second column portion that is stacked
in the Z-axis direction.
21. The heat transporting unit of claim 20, wherein the second
column portion forms second ducts in the X-axis direction, the
Y-axis direction, and the Z-axis direction.
22. The heat transporting unit of claim 21, wherein the second
column portion comprises a large column member and a small column
member that is smaller than the large column member.
23. The heat transporting unit of claim 22, wherein at least a
portion of the first ducts and the second ducts have capillary
forces that move the condensed refrigerant.
24. The heat transporting unit of claim 23, wherein at least a
portion of the upper plate, the lower plate, the first column
portion, and/or the second column portion has a channel in a
surface that is exposed to the interior space.
25. The heat transporting unit of claim 24, wherein the upper plate
and/or the lower plate is further equipped with a heat radiating
portion for radiating the transported heat, in a region that faces
at least a portion of the first region and/or the second
region.
26. The heat transporting unit of claim 25, wherein at least a
portion of the upper plate, the lower plate, the first column
portion, and/or the second column portion has metal plating on a
surface that is exposed to the interior space.
27. The heat transporting unit of claim 26, wherein the width of
the first region in the Y-axis direction and the width of the
second region in the Y-axis direction are essentially identical.
Description
REFERENCE To RELATED APPLICATIONS
[0001] The Present Application claims priority to prior-filed
Japanese Patent Application No. 2010-095565, entitled "Heat
Transporting Unit, Electronic Circuit Board And Electronic Device,"
filed on 17 Apr. 2010 with the Japanese Patent Office. The contents
of the aforementioned Patent Application is fully incorporated in
its entirety herein.
BACKGROUND OF THE PRESENT DISCLOSURE
[0002] The Present Disclosure relates, generally, to a heat
transporting unit and an electronic device that efficiently
transports heat received from a heat emitting object such as a
semiconductor integrated circuit, an LED element, a power device or
an electronic component.
[0003] Electronic components such as semiconductor integrated
circuits, LED elements and power devices are used in electronic
devices, industrial devices, automobiles and the like. These
electronic components become heat emitting objects that emit heat
due to the electric currents that flow therein. When the heat
emitted from the heat emitting object rises above a specific
temperature, problems arise in that the operation of the electronic
component cannot be guaranteed, and the possibility of an adverse
effect on other components exists, and, as a result, the
possibility of causing a breakdown of performance of the electronic
device itself.
[0004] In order to cool such a heat emitting object, there has been
a proposal for a cooling device for diffusing a heat pipe that has
a cooling effect through the vaporization and condensation of a
sealed refrigerant. In a heat pipe, heat is removed from the heat
emitting object when the refrigerant sealed therein is vaporized.
The vaporized refrigerant is condensed through the radiation of
heat, and the condensed refrigerant moves back. The heat pipe cools
the heat emitting object through cycling of this vaporization and
condensation. That is, the heat pipe diffuses and transports heat.
Moreover, the heat that is diffused and transported by the heat
pipe is cooled through combination with a heat radiating member.
When compared to a metal heat diffusing member, a heat pipe is able
to diffuse and transport heat more efficiently using a
refrigerant.
[0005] In recent years, the electronic components that require
cooling have not been limited only to relatively large
semiconductor integrated circuits such as central processing units
(CPUs) or specialty ICs, but are often are extremely small
electronic components, such as light emitting devices (LEDs). This
type of small electronic component not only is small in terms of
its size, but also often a plurality of electronic components
together comprise a single set. Because of this, the cooling device
which diffuses the heat pipe must cool a plurality of electronic
components.
[0006] Often small electronic components of this type are mounted
in one portion of an electronic circuit board, leaving no extra
room in the location of the mounting, so that the heat cannot
diffuse or escape therefrom. Because of this, after the heat has
been removed from the electronic components, it is necessary to
transport that heat at high speed, and then to perform cooling at
the transportation destination. That is, a heat transporting member
for transporting heat at a high speed in a specific direction,
being a heat transporting member diffuses the vaporization and
condensation of a refrigerant, is desirable. There have been
proposals for heat pipes that transport, in a specific direction,
heat that has been removed from a heat emitting object. See, for
example, Japanese Patent Application Nos. H11-101585; 2002-039693;
2010-007905; and 2007-113864.
[0007] In such a heat pipe, heat that has been removed from a heat
emitting object, a refrigerant is sealed in an interior space that
is formed from an upper plate and a lower plate that are joined
together, and the heat of the heat emitting object is transported
by the cycle of movement of this sealed refrigerant. In a cooling
device diffuses a heat pipe, it is important, in increasing the
cooling capability, to increase the heat transporting efficiency
(which is determined by the per-cycle speed of the movement of the
vaporized refrigerant and the movement of the condensed
refrigerant, and by the number of cycles per unit time).
[0008] At this time, the refrigerant that is sealed in the interior
space vaporizes due to the heat from the heat emitting object to
move within the interior space, and eventually cools and condenses,
and moves within the interior space. Because of this, the vaporized
refrigerant and the condensed refrigerant interfere with each other
while moving in mutually opposite directions within the interior
space. When the effects of this interference become large, there is
a problem in that this produces an adverse effect on the speed of
cycling of the movement of the vaporized refrigerant and the
movement of the condensed refrigerant, reducing the speed of
transport of the heat and reducing the transportation efficiency.
In order to prevent this interference between the movement of the
vaporized refrigerant and the movement of the condensed
refrigerant, it is desirable to increase the size of the interior
space and to have no obstructions.
[0009] On the other hand, in a structure wherein there are no
obstructions within the interior space, the heat pipe would be
nothing but the upper plate and the lower plate, and thus extremely
weak. Because in a heat pipe the heat emitting object is cooled
through the repetitive cycling of vaporizing and condensing the
refrigerant that is sealed therein, the heat pipe is subjected to
cycling of extremely high internal pressures. If the strength of
the heat pipe were weak in such a severe operating environment, the
heat pipe would break due to a "popcorn" phenomenon produced
through the vaporization of the refrigerant, so that there would be
a problem in that the refrigerant would leak out onto the
electronic components and the electronic circuit board. If the
refrigerant were to leak out, there would be a problem in that it
would damage the electronic components or electronic circuit board,
and could cause a malfunction of the electronic device.
[0010] Although it is necessary to increase the strength, if, for
example, the strength of the upper plate and lower plate themselves
were to be increased, this would engender an increase in cost and
an increase in thickness, which would be unsuitable for the Present
Disclosure, and would also be accompanied by difficulties in
assembly. This is because a heat pipe that is excessively thick is
not suited to the space wherein light emitting diodes, and the
like, are mounted, because of the lack of extra space.
[0011] Because of this, an increase in the strength of the heat
pipe necessitates the provision of reinforcing members, such as
columns or partitioning plates, within the interior space of the
heat pipe. However, the provision of a reinforcing member would
interfere with the freedom of movement of the vaporized refrigerant
and of the condensed refrigerant within the interior space. The
'585 Application and the '693 Application are intended to transport
heat from a heat emitting object in a specific direction while
increasing the strength of the heat pipe.
[0012] The heat pipe disclosed in the '585 Application discloses a
flat heat pipe wherein there is an array of pores (which are
actually more ducts then pores). In the heat pipe disclosed in the
'585 Application, the individual ducts perform the movement of the
vaporized refrigerant and the movement of the condensed
refrigerant. The heat pipe disclosed in the '585 Application is
able to transport the heat towards the specific direction through
these pores. That is, the vaporized refrigerant moves from a first
end to a second end of the pores, and the condensed refrigerant
moves from the second end to the first end of these pores. In the
technology disclosed in the '585 Application the strength of the
heat pipe as a whole is maintained by the layering of the ducts in
the crosswise direction.
[0013] However, in the heat pipe disclosed in the '585 Application,
adjacent ducts are completely separated from each other, so the
movement of the refrigerant only occurs in the lengthwise direction
of the heat pipe (the direction along the ducts). Because of this,
there is a problem in that there is no cooling effect in the
crosswise direction for a small heat emitting object. Moreover,
when the heat pipe disclosed in the '585 Application cools a small
heat emitting object, the cooling load is applied only to the heat
pipe that contacts the heat emitting object directly. That is, only
the refrigerant that is in the duct that contacts the heat emitting
object directly will be vaporized and move, and will condensed and
move. Because of this, the heat pipe disclosed in the '585
Application has a problem in that it is unable to achieve its full
performance.
[0014] The heat pipe disclosed in the '693 Application forms
movement paths for the vaporized refrigerant and movement paths for
the condensed refrigerant through mutually offsetted slits that are
provided in layered members. These slits are formed in a specific
direction, so that the movement of the refrigerant and the movement
will be performed in a specific direction. The result is that the
heat pipe disclosed in the '693 Application is able to transport
the heat in a specific direction.
[0015] The '693 Application has the same problem as in the '585
Application, in that, as with the '585 Application, the individual
ducts, which are formed by the slits, are independent of each
other.
[0016] In the '905 Application, a plurality of plate members are
stacked together, in a disclosure of a heat pipe that transports
heat through producing capillary forces through the stacking of
plate members provided with channels and plate members provided
with holes.
[0017] However, while the heat pipe disclosed in the '905
Application is able to transport heat in the long direction, it is
difficult for heat to diffuse in the short direction. Because of
this, when the heat emitting objects are small, it is possible to
transport, in the long direction, the heat of the heat emitting
object only in the vicinity that contacts the heat emitting object.
Additionally, heat can diffuse non-directionally from a heat
emitting object through holes that are provided across the entire
surface, making it difficult to transport heat in the specific
direction.
[0018] Not only is it not possible for any of the technologies in
the '585 Application through the '905 Application to achieve the
full performance of the heat pipe when transporting heat from one
end portion to the other end portion, but they also cannot achieve
their maximum heat pipe performance when transporting heat towards
one end portion from the center portion. This is because although
the cooling is only for heat that is transported through a specific
duct, the cooling will apply also to ducts that are not involved in
the transporting of the heat, and thus the cooling member for
cooling the heat that is transported by the heat pipe will not be
able to exhibit its maximum performance.
[0019] Additionally, the end portion of the heat pipe that
transports the heat must achieve either the function of receiving
heat from the heat emitting object, the function of cooling the
heat that is transported from the other end portion, for both.
Because of this, regardless of the size of the heat emitting object
and regardless of the size of the cooling member, it is desirable
for the heat that is received from the heat emitting object, and
the heat that is transported, to diffuse in the crosswise
direction.
[0020] However, the heat pipes disclosed in the '585 Application
through the '905 Application do not have such a function, so that
only heat from a specific location is received and cooled. Because
of this, the heat pipes in the '585 Application and the '693
Application have a problem in that they cannot be applied to
cooling small heat emitting objects.
[0021] The '864 Application discloses a heat pipe with stacked
plate members that are provided with channels in the short
direction at the end portions and plate members that are provided
with ducts in the lengthwise direction across the entirety. These
heat pipes allow the diffusion of heat in the short direction at
the end portions, and the movement of heat in the lengthwise
direction otherwise.
[0022] However, in the heat pipe disclosed in the '864 Application,
the refrigerant can move in the lengthwise direction only in an
extremely narrow width, reducing the heat transporting efficiency.
In addition, the ducts that are provided in the short direction
only partially overlap the ducts that are provided in the
lengthwise direction, so there is a problem in that the
transmission of heat between the ducts is poor. Furthermore,
because the ducts are formed unbalanced within the heat pipe, there
is also a problem in that the heat pipe is not strong. As a result,
the technology of the '864 Application also has a problem in that
it is unable to transport the heat of the heat emitting object
efficiently in the specific direction. In addition, the in the heat
pipe disclosed in the '864 Application, there are structural
limitations to the position of the contact with the heat emitting
object, and thus there is a problem in that it is difficult to use
this heat pipe in electronic devices or industrial devices wherein
there is high-density packaging.
[0023] As described above, the heat pipes for transporting heat
from a heat emitting object in a specific direction according to
the conventional technologies have problems in that they cannot
achieve the maximum performances thereof. In particular, they have
problems in that the cooling by transporting heat from small heat
emitting objects is inadequate. Furthermore, they cannot both
ensure the strength of the heat pipe and transport heat efficiently
while handling flexibly the sizes of the heat emitting objects and
the contact positions thereof.
[0024] In contemplation of the problem areas set forth above, the
object of the Present Disclosure is provided a heat transporting
unit able to transport efficiently heat from a small heat emitting
object, while achieving the maximum performance thereof, through:
(1) ensuring strength through column portions and reinforcing
portions, (2) minimizing obstructions to movement of the
refrigerant in the sealed space by the column portions and
reinforcing portions, (3) achieving movement of the refrigerant in
the required X-axis, Y-axis, and Z-axis directions while minimizing
impediments to the movement of the refrigerant, and (4) handling
flexibly the sizes of the heat emitting objects and the contact
positions thereof. In addition, a heat pipe is provided that can be
mounted easily, even in electronic devices and industrial devices
with high-density mounting.
[0025] Note that the heat transporting unit has a heat pipe
structure diffuses vaporization and condensation of a sealed
refrigerant.
SUMMARY OF THE PRESENT DISCLOSURE
[0026] In contemplation of the problem areas set forth above, in
the heat transporting unit according to the Present Disclosure, a
space is defined by the mutually orthogonal X axis, Y axis, and Z
axis, and comprises: an upper plate; a lower plate that faces the
upper plate; an interior space that is formed by the upper plate
and the lower plate and wherein a refrigerant can be sealed; a
first region, that is a region that is part of the interior space
and that is provided with a first column portion that forms a
plurality of first ducts that extend in the X-axis direction; and a
second region that is provided with a second column portion that
forms a plurality of second ducts that extend in the X-axis
direction and the Y-axis direction, that is a region that is other
than the first region within the interior space; wherein: the first
ducts and second ducts connect at a boundary between the first
region and the second region.
[0027] The heat transporting unit according to the Present
Disclosure is provided with column portions that are different in
the first region and the second region, in a sealed space wherein
refrigerant is sealed, to thereby not only ensure strength, but to
also achieve optimal diffusion and transportation of heat in the
X-axis, Y-axis, and Z-axis directions.
[0028] Additionally, by diffusing, in the long direction and in the
short direction, the heat that is received at the location of
thermal contact with the heat emitting object while transporting
the diffused heat in the long direction, the heat transporting unit
is able to transport efficiently the heat from the heat emitting
object while achieving the maximum performance as a heat pipe.
[0029] The result is that the heat transporting unit according to
the Present Disclosure is able to transport efficiently heat from a
small heat emitting object.
[0030] Additionally, the heat transporting unit according to the
Present Disclosure is also able to transport at high speeds the
heat from the heat emitting object while handling also changes in
the locations of disposition of the heat emitting objects.
BRIEF DESCRIPTION OF THE FIGURES
[0031] The organization and manner of the structure and operation
of the Present Disclosure, together with further objects and
advantages thereof, may best be understood by reference to the
following Detailed Description, taken in connection with the
accompanying Figures, wherein like reference numerals identify like
elements, and in which:
[0032] FIG. 1 is a perspective diagram of a heat transporting unit
according to a first form of embodiment according to the Present
Disclosure;
[0033] FIG. 2 is an interior perspective diagram of the heat
transporting unit according to the first form of embodiment
according to the Present Disclosure;
[0034] FIG. 3 is an explanatory diagram for the operation of the
heat transporting unit according to the first form of embodiment
according to the Present Disclosure;
[0035] FIG. 4 is a conceptual diagram for the operation of the heat
transporting unit according to the first form of embodiment
according to the Present Disclosure;
[0036] FIG. 5 is an interior perspective diagram of the heat
transporting unit according to a second form of embodiment
according to the Present Disclosure;
[0037] FIG. 6 is a cross-sectional diagram of the end portion of a
heat transporting unit according to a second form of embodiment
according to the Present Disclosure;
[0038] FIG. 7 is an interior schematic diagram of the heat
transporting unit according to a second form of embodiment
according to the Present Disclosure;
[0039] FIG. 8 is an enlarged diagram in the vicinity of the second
region in a heat transporting unit according to a second form of
embodiment according to the Present Disclosure;
[0040] FIG. 9 is a plan view diagram of a heat transporting unit
according to a second form of embodiment according to the Present
Disclosure;
[0041] FIG. 10 is a perspective diagram of a heat transporting unit
according to a second form of embodiment according to the Present
Disclosure;
[0042] FIG. 11 is an assembly perspective diagram of a heat
transporting unit according to a third form of embodiment according
to the Present Disclosure;
[0043] FIG. 12 is an explanatory diagram lining up an example of
embodiment and comparative examples;
[0044] FIG. 13 is a graph illustrating measurement results for the
example of embodiment and the comparative examples;
[0045] FIG. 14 is a side view diagram of a heat transporting unit
according to a forth example of embodiment according to the Present
Disclosure; and
[0046] FIG. 15 is a schematic diagram of an electronic device
according to a fifth form of embodiment according to the Present
Disclosure.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0047] While the Present Disclosure may be susceptible to
embodiment in different forms, there is shown in the Figures, and
will be described herein in detail, specific embodiments, with the
understanding that the disclosure is to be considered an
exemplification of the principles of the
[0048] Present Disclosure, and is not intended to limit the Present
Disclose to that as illustrated.
[0049] In the embodiments illustrated in the Figures,
representations of directions such as up, down, left, right, front
and rear, used for explaining the structure and movement of the
various elements of the Present Disclosure, are not absolute, but
relative. These representations are appropriate when the elements
are in the position shown in the Figures. If the description of the
position of the elements changes, however, these representations
are to be changed accordingly.
[0050] A heat transporting unit according to a first invention
according to the Present Disclosure is one wherein a space is
defined by the mutually orthogonal X axis, Y axis, and Z axis; and
comprises: an upper plate; a lower plate that faces the upper
plate; an interior space that is formed by the upper plate and the
lower plate and wherein a refrigerant can be sealed; a first
region, that is a region that is part of the interior space and
that is provided with a first column portion that forms a plurality
of first ducts that extend in the X-axis direction; and a second
region that is provided with a second column portion that forms a
plurality of second ducts that extend in the X-axis direction and
the Y-axis direction, that is a region that is other than the first
region within the interior space; wherein: the first ducts and
second ducts connect at a boundary between the first region and the
second region.
[0051] Given this structure, not only is the heat transporting unit
able to have improved strength, but is also able to transport, in
the lengthwise direction, the heat removed from the heat emitting
object using fully the short direction of the heat transporting
unit, even with a small heat emitting object.
[0052] In a heat transporting unit according to a second invention
according to the Present
[0053] Disclosure, in addition to the first invention, in a first
duct, not only does a vaporized refrigerant move in the X-axis
direction, but a condensed refrigerant also moves in the X-axis
direction, and in a second duct, not only does the vaporized
refrigerant move in the X-axis direction and the Y-axis direction,
but the condensed refrigerant also moves in the X-axis direction
and the Y-axis direction.
[0054] Given this structure, the heat transporting unit is able to
transport, in the long direction, the heat removed from the heat
emitting object, while using the short direction fully.
[0055] In a heat transporting unit according to a third invention
according to the Present Disclosure, in addition to the first and
second inventions, not only does vaporized refrigerant move
mutually in the first duct and the second, but also the condensed
refrigerant moves mutually in the first duct and the second
duct.
[0056] Given this structure, the heat transporting unit is able to
transport heat through using efficiently the first region and the
second region, which have different functions.
[0057] In a heat transporting unit according to a fourth invention
according to the Present Disclosure, in addition to any of the
first through third inventions, a second region is provided at at
least one of the two end portions of the interior space, and a
first region is provided in a region other than the second region
in the interior space.
[0058] Given this structure, the heat transporting unit is able to
transport heat from a heat emitting object that is disposed on one
end portion to the other end portion.
[0059] In a heat transporting unit according to a fifth invention
according to the Present Disclosure, in addition to any of the
first through fourth inventions, a second region is provided in the
center portion of the interior space, and a first region is
provided in a region other than the second region in the interior
space.
[0060] Given this structure, the heat transporting unit is able to
transport, towards both ends, heat of a heat emitting object that
is disposed at the middle thereof.
[0061] In a heat transporting unit according to a sixth invention
according to the Present Disclosure, in addition to the first
through fifth inventions, a second region not only diffuses heat
received from a heat emitting object in the X-axis direction and
the Y-axis direction, but also moves it to the first region, and
the first region transports, in the X-axis direction, the heat
moved from the second region.
[0062] Given this structure, the heat transporting unit is able to
use the Y-axis direction fully, upon diffusion of the heat removed
from the heat emitting object, to transport that heat in the X-axis
direction.
[0063] In a heat transporting unit according to a seventh invention
according to the Present Disclosure, in addition to the sixth
invention, when the second region is provided at a first end
portion and at a second end portion that is opposite from the first
end portion, within the interior space, the second region of the
first end portion side not only causes the diffusion, in the X-axis
direction and the Y-axis direction, of the heat received from the
heat emitting object, but also causes it to move to the first
region, and the first region transports, in the X-axis direction,
the heat moved from the second region on the first end portion
side, and the second region on the second end portion side
diffuses, in the X-axis direction and the Y-axis direction, the
heat that has been transported by the first region.
[0064] Given this structure, the heat transporting unit diffuses,
in the X-axis direction and the Y-axis direction, using the second
region, the heat removed from the heat emitting object, and
transports it in the X-axis direction using the first region.
Furthermore, the heat transporting unit radiates heat using the
second region wherein no heat emitting object is disposed. The
result is the ability of the heat transporting unit to cool the
heat emitting object.
[0065] In a heat transporting unit according to an eight invention
according to the Present Disclosure, in addition to the sixth
invention, the second region is provided in the center of the
interior space, and when the first region is provided at a first
end portion and at a second end portion that is on the opposite
side from the first end portion, in the interior space, the second
region not only diffuses in the X-axis direction and the Y-axis
direction the heat that is received from the heat emitting object,
but also moves it to the first region, and the first region
transports, in the X-direction, the heat moved from the second
region.
[0066] Given this structure, the heat transporting unit uses the
second region that is positioned at the center to diffuse, in the
X-axis direction and the Y-axis direction, the heat of the heat
emitting object, and uses the first region, positioned at both
ends, to transport it to both ends of the heat transporting unit
along the X-axis direction. This is used in a case wherein one
wishes to transport the heat of the heat emitting object in
multiple directions.
[0067] In a heat transporting device according to a ninth invention
according to the Present Disclosure, in addition to any of the
first through eighth inventions, additionally, the upper plate
and/or the lower plate also has a heat receiving portion that
contacts the heat emitting object thermally, and the heat receiving
portion is provided spanning the first region and the second
region.
[0068] Given the structure, the heat transporting unit receives the
heat efficiently from the heat emitting object, enabling
transportation in the specific direction. Additionally, this
increases the heat transportation efficiency of the heat
transporting unit.
[0069] In a heat transporting unit according to a 10th invention
according to the Present Disclosure, in addition to any of the
first through ninth inventions, a first column portion has a cutout
to connect together adjacent first ducts within a plurality of
first ducts.
[0070] Given this structure, the refrigerant can be exchanged
between first ducts.
[0071] In a heat transporting unit according to an 11th invention
according to the Present Disclosure, in addition to any of the
first through 10th inventions, the second region has one or more
intermediate plates layered in the Z-axis direction, where the
intermediate plates form a second column portion that is stacked in
the Z-axis direction, and the second column portion forms second
ducts in the X-axis direction, the Y-axis direction, and the Z-axis
direction.
[0072] Given this structure, the second region can diffuse heat
three-dimensionally.
[0073] In a heat transporting unit according to a 12 invention
according to the Present Disclosure, in addition to any of the
first through 11th inventions, the second column portion comprises
a large column member and a small column member that is smaller
than the large column member.
[0074] Given this structure, the second ducts have a more complex
structure, and produce strong capillary forces. As a result, the
second ducts diffuse the vaporized refrigerant and move the
condensed refrigerant efficiently.
[0075] In a heat transporting unit according to a 13th invention
according to the Present Disclosure, in addition to any of the
first through 12th inventions, at least a portion of the first
ducts and the second ducts have capillary forces that move the
condensed refrigerant.
[0076] Given this structure, the heat transporting unit is able to
move the condensed refrigerant, enabling transportation of the heat
of the heat emitting object through a cycle of transporting the
vaporized refrigerant and moving the condensed refrigerant.
[0077] In a heat transporting unit according to a 14th invention
according to the Present
[0078] Disclosure, in addition to any of the first through 13th
inventions, at least a portion of the upper plate, the lower plate,
the first column portion, and/or the second column portion has a
channel in a surface that is exposed to the interior space.
[0079] The capillary forces of the first duct and the second duct
are increased given this structure.
[0080] In a heat transporting unit according to a 15th invention
according to the Present Disclosure, in addition to any of the
first through 14 inventions, the upper plate and/or the lower plate
is further equipped with a heat radiating portion for radiating the
transported heat, in a region that faces at least a portion of the
first region and/or the second region.
[0081] Given this structure, the heat transporting unit is able to
cool the transported heat quickly. As a result, it is possible to
increase the efficiency of the cycle for transporting the vaporized
refrigerant and moving the condensed refrigerant, enabling the heat
transporting unit to transport the heat with high efficiency.
[0082] In a heat transporting unit according to a 16th invention
according to the Present Disclosure, in addition to any of the
first through 15th inventions, at least a portion of the upper
plate, the lower plate, the first column portion, and/or the second
column portion has metal plating on a surface that is exposed to
the interior space.
[0083] In a heat transporting unit according to a 17th invention
according to the Present Disclosure, in addition to any of the
first through 16th inventions, the width of the first region in the
Y-axis direction and the width of the second region in the Y-axis
direction are essentially identical.
[0084] Given this structure, the heat transporting unit is able to
transport the heat using the short direction maximally as well.
Because of this, the heat transporting unit does not require
excessive mounting space.
[0085] Forms of embodiment according to the Present Disclosure will
be explained below in reference to the drawings.
[0086] Note that a heat pipe is a member, component, apparatus, or
device that achieves a function of cooling a heat emitting object
by repetitively vaporizing a refrigerant that is sealed within an
interior space, by receiving heat from the heat emitting object,
and cooling and condensing the vaporized refrigerant. The heat
transporting unit in the present specification refers to a member,
component, device, or apparatus for transmitting heat from a heat
emitting unit through the movement of a refrigerant.
[0087] Because the heat transporting unit according to the Present
Disclosure uses the function and operation of a heat pipe, the
concept of the heat pipe will be explained first.
[0088] The heat pipe has a refrigerant sealed into the interior
thereof, where a surface that is a heat receiving surface contacts
a heat emitting object, such as an electronic component. The
refrigerant in the interior receives the heat from the heat
emitting object, to be vaporized, where the heat of the heat
emitting object is removed at the time of the vaporization. The
vaporized refrigerant moves within the heat pipe. The vaporized
refrigerant that has moved then is cooled at a heat radiating
surface (or due to a secondary cooling member such as a heat sink
or a cooling fan, or the like) to thus condense. The refrigerant,
which has become a liquid through condensation, moves within the
heat pipe to again move to the heat receiving surface. The
refrigerant that has moved to the heat receiving surface is
vaporized again to remove the heat of the heat emitting object.
[0089] Through the repetition of the vaporization and condensation
of the refrigerant in this way, the heat pipe transports the heat
from the heat emitting object, to thereby cool the heat emitting
object. In particular, the heat pipe causes the vaporized
refrigerant to move and causes the condensed refrigerant to move
within the interior space wherein the refrigerant is sealed, doing
so along a specific direction, so that the heat pipe is able to
transport, in a specific direction, the heat removed from the heat
emitting object.
[0090] An overall summary of a heat transporting unit according to
a first form of embodiment will be explained using FIG. 1 and FIG.
2.
[0091] FIG. 1 is a perspective view of a heat transporting unit
according to a first form of embodiment according to the Present
Disclosure. FIG. 2 is an interior perspective view of the heat
transporting unit in the first form of embodiment according to the
Present Disclosure, shown in a prospective cross-sectional diagram
enabling viewing of the interior of the unit during the
transportation of heat.
[0092] First, as illustrated in FIG. 1 and FIG. 2, a
three-dimensional space is defined by the mutually orthogonal X
axis, Y axis, and Z axis. The structure of the heat transporting
unit 1 will be explained using the X axis, Y axis, and Z axis.
Additionally, while the heat transporting unit 1 has a variety of
structures therein, it has, when viewed from the outside, a flat
rectangular shape, as in the example illustrated in FIG. 1. Of
course, a variety of treatments may also be performed on the
surface.
[0093] The heat transporting unit 1 is provided with an upper plate
2, a lower plate 3 that faces the upper plate 2, and an interior
space 4, wherein a refrigerant can be sealed, formed by the upper
plate 2 and the lower plate 3. The interior space 4 has a first
region 5 in a region in a portion thereof, and second regions 6 and
7 in regions that form the remaining portion that is not the first
region 5. In FIG. 2, the first region is provided in the vicinity
of the center in the long direction (the X-axis direction) of the
heat transporting unit 1, and the second regions 6 and 7 are
provided at both ends in the long direction (the X-axis direction)
of the heat transporting unit 1. The first region 5 is provided
with a first column portion 8 wherein a plurality of first ducts 9
is formed along the X-axis direction. The first column portion 8 is
a three-dimensional member having a long direction along the X-axis
direction in the first region 5, and regions that are interposed
between a plurality of first column portions 8 form the first ducts
9. In this way, each of a plurality of first column portions 8,
which are three-dimensional members having a long direction, is
disposed lined up along the X-axis direction, to form a plurality
of first ducts 9 that extend in the X-axis direction.
[0094] On the other hand, the second regions 6 and 7 are provided
with second column portions 10 that form a plurality of second
ducts 11 that run in the X-axis direction and the Y-axis direction.
The second column portions 8 are a plurality of three-dimensional
members that are lined up in the X-axis direction and the Y-axis
direction in the second regions 6 and 7. The regions that are
interposed between the plurality of second column portions 10 that
are lined up in the X-axis direction form ducts that run in the
Y-axis direction, and the regions that are interposed between the
plurality of second column portions 10 that are lined up in the
Y-axis direction form ducts that run in the X-axis direction, where
the ducts that run in the X-axis direction and the ducts that run
in the Y-axis direction combine into a grid shape. These
grid-shaped ducts form the second ducts 11.
[0095] A refrigerant is sealed within the interior space 4, and
heat from the heat emitting object is transported in a specific
direction by repeated vaporization and condensation of the sealed
refrigerant. However, if the interior space 4 were the entirety of
the space, then there would be the possibility that the heat
transporting unit 1 would be damaged or would break due to the
expansion and contraction thereof due to the loads of increasing
and decreasing pressure, produced by the vaporization and
condensation of the refrigerant. The first column portions 8 and
the second column portions 10 not only ensure the strength of the
heat transporting unit 1, but also form the first ducts 9 and the
second ducts 11 that are able to diffuse and transport the heat
well in the X-axis direction and the Y-axis direction.
[0096] The first ducts 9 and the second ducts 11 connect at a
boundary 12 between the first region 5 and the second region 6, and
at a boundary 13 between the first region 5 and the second region
7. These connections enable the refrigerant that moves from the
second ducts 11 (the vaporized refrigerant and/or the condensed
refrigerant) to move into the first ducts 9, to then move through
the first ducts 9. Additionally, the Y-axis direction width of the
first region 5 in the interior space 4 and the Y-axis direction
widths of the second regions 6 and 7 (that is, the widths in the
short direction) are essentially identical. Being essentially
identical causes the respective widths of the first region 5, for
transporting the heat in the X-axis direction, and of the second
regions 6 and 7, for diffusing the heat in the X-axis direction and
the Y-axis direction, to be identical, so that the entirety of the
interior space 4 that can be formed by the dimensions of the heat
transporting unit 1 can be used for transporting the heat.
[0097] Note that in FIG. 2, codes are assigned to only a portion of
the elements, for preserving clarity in the diagram, in regards to
the first column portions 8, the second column portions 10, the
first ducts 9, and the second ducts 11; however, those elements
that are not labeled with codes correspond, respectively, to the
first column portions 8, the second column portions 10, the first
ducts 9, and the second ducts 11. For example, the standing members
that have shapes identical to those of the first column portions 8,
unless specified especially otherwise, are all also first column
portions 8. This is true in FIG. 3 and beyond as well.
[0098] FIG. 3 will be used next to explain the operation of the
heat transporting unit 1.
[0099] FIG. 3 is an operation explanatory diagram for the heat
transporting unit in the first form of embodiment according to the
Present Disclosure. While the schematic structure of the interior
of the heat transporting unit 1 is illustrated in FIG. 3, the
movement of the refrigerant that is sealed in the interior space 4
(that is, the diffusion and transportation of heat) will be
explained by the arrows.
[0100] The upper plate 2 and the lower plate 3 have a flat plate
shape having a long direction and a short direction, where the
X-axis direction is along the long direction and the Y-axis
direction is along the short direction. This type of shape for the
upper plate 2 and the lower plate 3 causes the heat transporting
unit 1 to have a flat shape having a long direction and a short
direction.
[0101] A heat emitting object 20 is disposed at the bottom surface
of the heat transporting unit 1 (the bottom surface of the lower
plate 3). Additionally, the heat emitting object 20 is disposed at
a position facing the second region 6 of the bottom surface. Note
that the heat emitting object 20 is an element that produces heat,
such as an electronic component, an electronic element, a
semiconductor integrated circuit, a light emitting element, an
electronic circuit board, a mechanical component, a mechanical
element, or the like. Additionally, the heat emitting object 20 is
disposed in a position facing the second region 6 at the bottom
surface. The first region 5 has first ducts 9 that run in the
X-axis direction, as described above, and the second regions 6 and
7 have second ducts 11 that run in the X-axis direction and the
Y-axis direction.
[0102] The heat transporting unit 1 in the second region 6 removes
heat from the heat emitting object 20, because refrigerant is
sealed within the interior space 4, the heat from the heat emitting
object 20 vaporizes the refrigerant. The evaporating refrigerant
moves in the X-axis direction and the Y-axis direction in the
second ducts 11 of the second region 6. That is, in the second
region 6, the heat removed from the heat emitting object 20 uses
the second ducts 11 to diffuse along the direction of Arrow A (the
X-axis direction) and the direction of Arrow B (the Y-axis
direction). Of course, in the heat transporting unit 1, a
three-dimensional interior space 4 is formed, structured with an
X-axis, a Y-axis, and a Z-axis, and thus the vaporized refrigerant
moves, and the heat diffuses, also in the Z-axis direction;
however, in the first form of embodiment according to the Present
Disclosure, the explanation will use the X-axis direction and
Y-axis direction, the directions in which the refrigerant moves
primarily.
[0103] Next, at the boundary 12 between the second region 6 and the
first region 5, the second ducts 11 connect to the first ducts 9.
Because of this, the vaporized refrigerant moves from the second
ducts 11 into the first ducts 9.
[0104] The first ducts 9 are formed along the X-axis direction in
the first region 5, and the vaporized refrigerant moves in the
direction indicated by the Arrow C in the first ducts 9. Here, in
FIG. 3, the Arrow C is drawn for only one of the first ducts 9;
however, the vaporized refrigerant moves similarly in the direction
of the Arrow C in the other first ducts 9 as well. The result of
the movement is that the heat of the heat emitting object 20 is
transported from the second region 6, which is one end portion of
the heat transporting unit 1, to the second region 7, which is the
other end portion thereof.
[0105] The first ducts 9 and the second ducts 11 connect at the
boundary 13 between the first region 5 and the second region 7.
Because of this, as illustrated by Arrow C, the vaporized
refrigerant that has moved along the first duct 9 moves into the
second ducts 11 of the second region 7.
[0106] The second ducts 11 run along the X-axis direction and the
Y-axis direction, and thus the vaporized refrigerant that has moved
from the first ducts 9 moves along the Arrow D (the X-axis
direction) and the Arrow E (the Y-axis direction). That is, in the
second ducts 11 of the second region 7, the vaporized refrigerant
moves broadly in the short direction and the long direction.
[0107] In the second region 7, the second ducts 11 are used to move
the vaporized refrigerant broadly in the X-axis direction and the
Y-axis direction, enabling the vaporized refrigerant to cool. This
is because the vaporized refrigerant moving broadly through the
second region 7, wherein the heat emitting object 20 is not
disposed causes the heat that is included therein to escape.
[0108] The vaporized refrigerant that moves through the second
region 7 in this way condenses due to the cooling, changing into a
refrigerant that is a liquid. The result is that the condensed
refrigerant moves in the X-axis direction and the Y-axis direction
along the second ducts 11 in the second region 7. Here the flow is
as indicated by the Arrow D and the Arrow E.
[0109] Here the second ducts 11 of the second region 7 are
extremely narrow ducts, and thus can exhibit capillary forces
wherein the liquid is moved through capillary action.
[0110] The condensed refrigerant, after moving in the X-axis
direction and the Y-axis direction within the second region 7
through the plurality of second ducts 11, arrives at the boundary
13 between the first region 5 and the second region 7. Because the
second ducts 11 of the second region 7 are connected to the first
ducts 9 of the first region 5, the condensed refrigerant moves from
the second ducts 11 into the first ducts 9, as indicated by the
Arrow F. At this time, the condensed refrigerant moves in the
second ducts 11 not only in the X-axis direction, but in the Y-axis
direction as well, and thus the condensed refrigerant spreads in
the short direction in the interior space 4 as well. Because of
this, at the boundary 13, the condensed refrigerant is able to move
within each of the plurality of the first ducts 9 that are lined up
in the short direction within the interior space 4.
[0111] The condensed refrigerant that has moved into the first
ducts 9 moves along the X-axis direction through the first ducts 9,
as indicated by the Arrow G. That is, the condensed refrigerant
moves through the first ducts 9 from the end portion positioned
within the second region 7 towards the end portion positioned
within the second region 6. The first ducts 9 are fine ducts with
closed peripheries, and thus the first ducts 9 can exhibit
capillary forces. The first ducts 9 cause the condensed refrigerant
to move in the X-axis direction through these capillary forces.
[0112] The condensed refrigerant that has moved through the first
ducts 9 in the X-axis direction arrives at the second region 6
wherein there are extremely fine ducts, and, in this second region
6, receives heat from the heat emitting object 20, to be vaporized
again. The vaporized refrigerant moves again through the second
ducts 11 in the X-axis direction and the Y-axis direction. In this
way, the cycling of the movement of the vaporized refrigerant and
the movement of the condensed refrigerant enables the heat
transporting unit 1 to transport the heat from the heat emitting
object 20 from the end portion positioned in the second region 6 to
the end portion positioned in the second region 7. At this time,
the heat of the heat emitting object 20 diffuses in the long
direction and the short direction of the heat transporting unit 1
within the second region 6, and the first region 5 transports the
heat in the long direction of the heat transporting unit 1. Because
of this, the heat transporting unit 1 is able to transport the heat
of the heat emitting object 20 using the entirety of the interior
space 4, while maintaining the strength of the heat transporting
unit 1 by the first column portions 8 and the second column
portions 10.
[0113] The benefits and features of the heat transportation by the
heat transporting unit 1 will be explained in further detail
next.
[0114] Depending on the shape and size of the heat emitting object
20, the heat transporting unit 1, even when transporting heat in
the long direction, must be able to move the refrigerant using
maximally both the long direction and the short direction of the
interior space 4 (and other words, of the heat transporting unit
1).
[0115] The refrigerant that has been vaporized by the heat from the
heat emitting object 20 that is disposed at the second region 6 is
moved not just in the X-axis direction, but in the Y-axis direction
as well, by the second ducts 11 of the second region 6. The
plurality of first ducts 9 is lined up in the short direction
within the interior space 4. The movement of the vaporized
refrigerant in the Y-axis direction through the second ducts 11 in
the second region 6 enables the vaporized refrigerant, at the
boundary 12, to move into each of the plurality of first ducts 9
(while it may be all of them or a portion of them, still it is a
plurality of first ducts 9 corresponding to a width that is wider
than that of the heat emitting object 20). The vaporized
refrigerant that has so move moves using the plurality of first
ducts 9 fully.
[0116] As a result, in the first region 5, the plurality of first
ducts 9 is used fully to transport the heat in the X-axis direction
(that is, from the end portion positioned at the second region 6 to
the end portion positioned at the second region 7).
[0117] Additionally, at the second region 7, the second ducts 11
can move the vaporized refrigerant, that has been moved from the
first ducts 9, three-dimensionally in the X-axis direction and the
Y-axis direction. Because of this, in the second region 7, the
vaporized refrigerant can move through a wide space in a short
time. As a result, the second region 7 enables the rapid cooling
and condensation of the vaporized refrigerant.
[0118] In the second region 7, the condensed refrigerant moves
along the X-axis direction and the Y-axis direction in the second
ducts 11. Because of this, the condensed refrigerant can move from
a plurality of second ducts 11 to a plurality of first ducts 9 at
the boundary 13 between the second region 7 and the first region 5.
That is, at the boundary 13, the condensed refrigerant moves in the
plurality of individual first ducts 9 (either through all of them
or part of them), which are lined up in the short direction of the
interior space 4. Additionally, of the plurality of the first ducts
9, only a little of the condensed refrigerant enters into those
first ducts 9 wherein there exists primarily a large amount of the
vaporized refrigerant, and a large amount of the condensed
refrigerant enters into the other first ducts 9 wherein there is
not a large amount of the vaporized refrigerant.
[0119] In this way, it is possible to move the condensed
refrigerant in the X-axis direction (that is, from the end portion
positioned at the second region 7 towards the end portion
positioned at the second region 6) through fully using the
plurality of first ducts 9 in the first region 5.
[0120] This cycle of movement of the vaporized refrigerant and
movement of the condensed refrigerant is the function of heat
transportation achieved by the heat transporting unit 1. In other
words, the heat transporting unit 1 is able to transport the heat
of the heat emitting object in the specific direction (which here
is the X-axis direction), efficiently, using fully the heat
transporting unit 1, regardless of the size or shape of the heat
emitting object 20.
[0121] Note that "using fully" here refers not to the use of all of
the plurality of first ducts 9, but rather refers to the use of
those first ducts, among the plurality of individual first ducts 9,
that fulfill conditions for easy movement of vaporized refrigerant
or easy movement of condensed refrigerant (temperature, flow speed,
flow rate, pressure, etc.).
[0122] The transportation of heat in the heat transporting unit 1
is illustrated schematically in FIG. 4. FIG. 4 is a diagram
illustrating schematically the operation of the heat transporting
unit in the first form of embodiment according to the Present
Disclosure.
[0123] The heat emitting object 20 is disposed at the bottom
surface of the second region 6, which is the bottom surface of the
lower plate 3. The heat emitting object 20 and the bottom surface
are in thermal contact, so the second region 6 removes heat from
the heat emitting object 20. In the second region 6, the
refrigerant, which is a liquid, is vaporized by this heat, and the
vaporized refrigerant moves in the X-axis direction through the
first region 5 following the Arrow H.
[0124] The vaporized refrigerant that arrives at the second region
7 from the first region 5, is cooled and condenses in the second
region 7. This cooled refrigerant moves towards the second region 6
from the second region 7 through capillary forces that are produced
by the first ducts 9 and the second ducts 11. This is as indicated
by the Arrow I. In this way, as can be understood by viewing the
heat transporting unit 1 from the side, the heat transporting unit
1 can transport the heat of the heat emitting object 20 efficiently
along the X-axis direction.
[0125] The details of each portion will be explained below.
[0126] The upper plate 2 will be explained next. The upper plate 2
is illustrated in a perspective state in FIG. 2. The upper plate 2
has a flat shape, and preferably is a rectangle having a short
direction and a long direction. Of course, it may have a shape that
differs from a rectangle in parts, or may have a curved shape or an
indented shape. However, having the upper plate 2 be a rectangle
having a short direction and a long direction causes the heat
transporting unit 1 to be a rectangle having a short direction and
a long direction, thus making it possible for the heat transporting
unit 1 to transport heat in a specific direction from a heat
emitting object that is disposed at the end portion thereof. The
upper plate 2 has a structure that matches the outer dimensional
shape of the heat transporting unit 1.
[0127] The upper plate 2 is formed out of metal, plastic, or the
like, but preferably is formed out of a metal with high thermal
conductivity or high resistance to corrosion (or durability
thereto), such as copper, aluminum, silver, aluminum alloy, iron,
iron alloy, stainless steel, or the like.
[0128] The upper plate 2, together with the lower plate 3, forms
the interior space 4. For example, the upper plate 2 or the lower
plate 3 has raised portions or wall members, for forming the
interior space 4, at the peripheral edges thereof, where the upper
plate 2 and the lower plate 3 form the interior space 4 between the
upper plate 2 and the lower plate 3 through being joined together
through these raised portions or wall members. When joined together
with the lower plate 3, these raised portions or wall members
become the side walls encompassing the interior space 4. Of course,
these raised portions or wall members may be either different
members or the same member as the upper plate 2.
[0129] Additionally, the upper plate 2 preferably has metal plating
on at least the surface that contacts the interior space 4 (the
surface that contacts the vaporized refrigerant and/or the
condensed refrigerant). This is because the provision of the metal
plating modifies the state of the surface, expediting the movement
of the vaporized refrigerant. A metal such as gold, silver, copper,
aluminum, nickel, cobalt, or an alloy thereof, or the like, may be
selected as this metal plating. Of course, it may be a single layer
plating, a multilayer plating, electrolytic plating, or
non-electrolytic plating.
[0130] While the upper plate 2 is nominally "upper," physically it
need not necessarily be disposed at the top, but rather this is a
term for convenience. The heat emitting object may be in contact
with the upper plate 2, or may be in contact with the lower plate
3.
[0131] Additionally, the upper plate 2 preferably is provided also
with a filling opening, not shown, for filling the refrigerant.
This is because it is necessary to seal the refrigerant into the
interior space 4 when the upper plate 2 and the lower plate 3 are
joined together to form the interior space 4. The filling opening
is sealed after the filling of the refrigerant.
[0132] Note that the refrigerant may be filled from the filling
opening after the joining together of the upper plate 2 and the
lower plate 3, or may be filled at the time of joining. Moreover,
the filling of the refrigerant preferably is performed under a
vacuum or at a reduced pressure. Performing the filling under a
vacuum or at a reduced pressure causes the refrigerant to be sealed
within the interior space 4 in a vacuum or low-pressure state. When
under a reduced pressure, there is the benefit of a reduction in
the vaporization/condensation temperature of the refrigerant,
causing greater activity in the cycling of the
vaporization/condensation of the refrigerant.
[0133] Furthermore, the upper plate 2 and/or the lower plate 3 is
provided with the first column portions 8 and the second column
portions 10. Because the interior space 4 is formed from the upper
plate 2 and the lower plate 3, the provision of the first column
portions 8 and the second column portions 10 on the upper plate 2
and/or the lower plate 3 makes it possible to provide the interior
space 4 with the first column portions 8 and the second column
portions 10, or in other words, the first ducts 9 and the second
ducts 11, through joining together the upper plate 2 and the lower
plate 3. The same is true for the lower plate 3, described
below.
[0134] The lower plate 3 will be explained next. The lower plate 3
is a member that is symmetrical to the upper plate 2, and has the
same structure and shape as the upper plate 2, and, in FIG. 2, is
shown in an oblique state.
[0135] The lower plate 3 has a flat shape, and preferably is a
rectangle having a short direction and a long direction. In
particular, because the lower plate 3 faces the upper plate 2 and
is joined thereto, preferably it has the identical shape and area
of the upper plate 2. However, insofar as the lower plate 3 can
form the interior space 4 with the upper plate 2, it may have an
area or shape that is different from that of the upper plate 2. Of
course, it may have a shape that differs from a rectangle in parts,
or may have a curved shape or an indented shape. Note that, as with
upper plate 2, having the lower plate 3 be a rectangle having a
short direction and a long direction causes the heat transporting
unit 1 to be a rectangle having a short direction and a long
direction, thus making it possible for the heat transporting unit 1
to transport heat in a specific direction from a heat emitting
object that is disposed at the end portion thereof.
[0136] The lower plate 3 is formed out of metal, plastic, or the
like, but preferably is formed out of a metal with high thermal
conductivity or high resistance to corrosion (or durability
thereto), such as copper, aluminum, silver, aluminum alloy, iron,
iron alloy, stainless steel, or the like.
[0137] The lower plate 3 is joined to the upper plate 2 perform the
interior space, and may have raised portions or wall members for
forming the interior space 4 around the periphery edges thereof.
When joined to the upper plate 2, these raised portions or wall
members form the side walls surrounding the interior space 4. Of
course, these raised portions or wall members may be either
different members or the same member as the lower plate 3. Note
that both the upper plate 2 and the lower plate 3 may have the
raised portions or wall members, or only either the upper plate 2
or the lower plate 3 may have the raised portions or wall
members.
[0138] As with the upper plate 2, the lower plate 3 may be provided
with a refrigerant filling opening.
[0139] The lower plate 3 is joined together facing the upper plate
2 to form the interior space 4.
[0140] Additionally, the lower plate 3 preferably has metal plating
on at least the surface that contacts the interior space 4 (the
surface that contacts the vaporized refrigerant and/or the
condensed refrigerant). This is because the provision of the metal
plating modifies the state of the surface, expediting the movement
of the vaporized refrigerant. A metal such as gold, silver, copper,
aluminum, nickel, cobalt, or an alloy thereof, or the like, may be
selected as this metal plating. Of course, it may be a single layer
plating, a multilayer plating, electrolytic plating, or
non-electrolytic plating.
[0141] While the lower plate 3 is nominally "lower," physically it
need not necessarily be disposed at the bottom, but rather this is
a term for convenience. The heat emitting object may be in contact
with the lower plate 3, or may be in contact with the upper plate
2.
[0142] Additionally, when it comes to the provision of the first
column portions 8 and the second column portions 10, the same is
true as for the upper plate 2.
[0143] The interior space is formed by the upper plate 2 and the
lower plate 3.
[0144] The upper plate 2 and the lower plate 3 have protrusions or
columns around the peripheral edges, and the upper plate 2 and the
lower plate 3 are joined together facing each other to form the
interior space 4. Additionally, when joining together the upper
plate 2 and the lower plate 3, the first column portions 8 and
second column portions 10 that are provided on the upper plate 2
and/or the lower plate 3 contact the facing upper plate 2 or lower
plate 3. The result is that the first column portions 8 or the
second column portions 10 connect between the upper plate 2 and the
lower plate 3. The first column portions 8 and second column
portions 10 are columns that reach from the upper plate 2 to the
lower plate 3 within the interior space 4.
[0145] The refrigerant is sealed within the interior space 4. The
refrigerant uses antifreeze, alcohol, pure water, or the like.
[0146] Additionally, the interior space 4 has a first region 5 and
second regions 6 and 7. In other words, the interior space 4 is
divided into the first region 5 and the second regions 6 and 7. The
Y-axis direction widths of the first region 5 and the second
regions 6 and 7 are essentially identical, and thus the first
region 5 and the second regions 6 and 7 are connected, at the
boundaries 12 and 13, across the entire width in the Y-axis
direction. That is, the first ducts 9 and boundaries 12 connect
across the entirety of the width in the Y-axis direction.
[0147] In the interior space 4, the heat of the heat emitting
object is transported in a specific direction through the filled
refrigerant the vaporizing and condensing. At this time, the
interior space 4 is able to transport the heat of the heat emitting
object efficiently through the provision of the first region 5 and
the second regions 6 and 7 that have different functions depending
on the direction of transportation of the heat (the direction of
movement of the refrigerant).
[0148] The region 5 is provided with a plurality of first column
portions 8 that form a plurality of first ducts 9 along the X-axis
direction. The plurality of first column portions 8 are provided
along the X-axis direction. The first column portions 8 are
standing members with protruding shapes that are provided on the
upper plate 2 and/or the lower plate 3, and when the upper plate 2
and the lower plate 3 are thermally joined, they are joined to the
facing member (either the upper plate 2 or the lower plate 3), so
that, within the interior space 4, they become standing members
that reach from the upper plate 2 to the lower plate 3. The result
is that they become reinforcing portions for reinforcing the
interior space 4.
[0149] Note that as another structure, the first column portions 8
may be provided on either the upper plate 2 or the lower plate 3,
and may be standing members that reach from the upper plate 2 to
the lower plate 3 within the interior space 4 when the upper plate
2 and the lower plate 3 are jointed together. Conversely, only
portions of the required first column portions 8 may be provided on
the upper plate 2 and on the lower plate 3, so that when the upper
plate 2 and the lower plate 3 are joined together, all of the
required first column portions 8 will be provided within the
interior space 4. Conversely, facing portions of the first column
portions 8 may be provided at identical positions on both the upper
plate 2 and the lower plate 3, so that the portions of the first
column portions 8 that are provided on the upper plate 2 and the
portions of the first column portions 8 that are provided on the
lower plate 3 contact each other to form, together, the required
first column portions 8.
[0150] As illustrated in FIG. 2 and FIG. 3, a plurality of first
column portions 8 is provided along the X-axis direction, and thus
a plurality of first ducts 9 is formed, along the X-axis direction,
by adjacent first column portions 8. The plurality of first ducts 9
are the gaps formed by the first column portions 8.
[0151] Additionally, the first ducts 9 run in the X-axis direction
in the first region 5, and thus preferably have lengths that are
about the same as the X-axis direction lengths of the first region
5. Doing so enables the first region 5 to move the refrigerant
along the X-axis direction within the first region 5.
[0152] Additionally, as with the upper plate 2 and the lower plate
3, the first column portions 8 are formed out of metal, plastic, or
the like, but preferably are formed out of a metal with high
thermal conductivity or high resistance to corrosion (or durability
thereto), such as copper, aluminum, silver, aluminum alloy, iron,
iron alloy, stainless steel, or the like. Additionally, preferably
the metal plating is performed on at least a portion of the
surfaces of the first column portions 8 (and, in particular, on a
portion or all of the surfaces that are exposed to the interior
space 4). This is because the provision of the metal plating
modifies the state of the surface, expediting the movement of the
vaporized refrigerant. A metal such as gold, silver, copper,
aluminum, nickel, cobalt, or an alloy thereof, or the like, may be
selected as this metal plating. Of course, it may be a single layer
plating, a multilayer plating, electrolytic plating, or
non-electrolytic plating.
[0153] The provision of a plurality of first ducts 9 in the first
region 5 in this way causes the refrigerant to move while dividing
the refrigerant (the vaporized refrigerant or condensed
refrigerant) between the plurality of pathways between the boundary
12 and the boundary 13. That is, the first region 5 is able to
transport the heat of the heat emitting object 20 between the
boundary 12 and the boundary 13. The first region 5 has the
function of transporting, in the X-axis direction, the heat from
the heat emitting object 20 through using efficiently the entire
width in the Y-axis direction.
[0154] The second regions will be explained next.
[0155] The second regions 6 and 7 are provided in the remainder of
the interior space 4 that is not the first region 5. Because of
this, the interior space 4 has the first region 5 and the second
regions 6 and 7. Note that region 5 and second regions 6 and 7 are
spaces having mutually differing functions, and this does not
exclude the interior space 4 from including other regions that are
unrelated to the first region 5 and to the second regions 6 and 7.
The first region and the second regions are elements that indicate
that they are regions within the interior space 4 that exhibit
their own respective functions, and these are not terms that
indicate that the interior space 4 is physically partitioned.
[0156] The second regions 6 and 7 are provided with a plurality of
second column portions 10 that form a plurality of second ducts 11
that run in the X-axis direction and the Y-axis direction. The
plurality of second column portions 10 is provided along the X-axis
direction. At this time, in the second regions 6 and 7, the
plurality of second column portions 10 is provided in a given line
in the X-axis direction. For example, in FIG. 2, in the second
region 6, two second column portions 10 are lined up along the
X-axis direction. Additionally, in the second region 7, four second
column portions 10 are lined up in the X-axis direction. Moreover,
the plurality of second column portions 10 that is provided in a
line in the X-axis direction in this way is lined up in a plurality
along the Y-axis direction.
[0157] The provision of the plurality of second column portions 10
in both the X-axis direction and the Y-axis direction enables the
plurality of second column portions 10 to form gaps in both the
X-axis direction and the Y-axis direction. The respective gaps in
the X-axis direction and the Y-axis direction form a plurality of
second ducts 11 that run in the X-axis direction and the Y-axis
direction. In these second ducts 11, the vaporized refrigerant and
condensed refrigerant move along the X-axis direction and the
Y-axis direction in accordance with the gaps in the second column
portions 10.
[0158] The second column portions 10 are standing members with
protruding shapes that are provided on the upper plate 2 and/or the
lower plate 3, and when the upper plate 2 and the lower plate 3 are
thermally joined, they are joined to the facing member (either the
upper plate 2 or the lower plate 3), so that, within the interior
space 4, they become standing members that reach from the upper
plate 2 to the lower plate 3. The result is that they become
reinforcing portions for reinforcing the interior space 4.
[0159] Note that as another structure, the second column portions
10 may be provided on either the upper plate 2 or the lower plate
3, and may be standing members that reach from the upper plate 2 to
the lower plate 3 within the interior space 4 when the upper plate
2 and the lower plate 3 are jointed together. Conversely, only
portions of the required second column portions 10 may be provided
on the upper plate 2 and on the lower plate 3, so that when the
upper plate 2 and the lower plate 3 are joined together, all of the
required second column portions 10 will be provided within the
interior space 4. Conversely, facing portions of the second column
portions 10 may be provided at identical positions on both the
upper plate 2 and the lower plate 3, so that the portions of the
second column portions 10 that are provided on the upper plate 2
and the portions of the second column portions 10 that are provided
on the lower plate 3 contact each other to form, together, the
required second column portions 10.
[0160] Additionally, as with the upper plate 2 and the lower plate
3, the second column portions 10 are formed out of metal, plastic,
or the like, but preferably are formed out of a metal with high
thermal conductivity or high resistance to corrosion (or durability
thereto), such as copper, aluminum, silver, aluminum alloy, iron,
iron alloy, stainless steel, or the like. Additionally, preferably
the metal plating is performed on at least a portion of the
surfaces of the second column portions 10 (and, in particular, on a
portion or all of the surfaces that are exposed to the interior
space 4). This is because the provision of the metal plating
modifies the state of the surface, expediting the movement of the
vaporized refrigerant. A metal such as gold, silver, copper,
aluminum, nickel, cobalt, or an alloy thereof, or the like, may be
selected as this metal plating. Of course, it may be a single layer
plating, a multilayer plating, electrolytic plating, or
non-electrolytic plating.
[0161] The provision of the plurality of second ducts 11 in this
way in the second regions 6 and 7 causes the vaporized refrigerant
and the condensed refrigerant to be divided, to be moved through
fully using the plurality of the first ducts 9, which are lined up
in the Y-axis direction, at the boundary 12 and the boundary
13.
[0162] In this way, the second regions 6 and 7 achieve the function
of exchanging the refrigerant, while using fully the plurality of
individual first ducts 9 that are lined up in the Y-axis direction,
while achieving the function of moving the vaporized refrigerant
and the condensed refrigerant in the X-axis direction and Y-axis
direction in the second regions 6 and 7. Of course, the second
column portions 10 that are provided in the second regions 6 and 7
achieve the function of reinforcing the interior space 4.
[0163] As described above, the heat transporting unit 1 in the
first form of embodiment is able to diffuse the heat from the heat
emitting object 20 in the X-axis direction and the Y-axis
direction, and is able to transport the heat from the heat emitting
object 20 in the X-axis direction. While the object is for the heat
transporting unit 1 to transport the heat from the heat emitting
object 20 along the X-axis direction (that is, to transport heat
along the X-axis direction towards the far end from the position
wherein the heat from the heat emitting object 20 is received), it
is desirable to transport in the X-axis direction while using the
entire width of the Y-axis direction of the heat transporting unit
1. Because of this, the second region 6 that is in thermal contact
with the heat emitting object 20 diffuses, in the X-axis direction
and the Y-axis direction, the heat from the heat emitting object
20, to use the entire width in the Y-axis direction to move the
heat to the first region 5. The first region 5 is able to transport
the heat along the X-axis direction, so that, as a result, the heat
transporting unit 1 is able to transport the heat from the heat
emitting object 20 along the X-axis direction while using the
entire width thereof in the Y-axis direction.
[0164] At this time, the first column portions 8 and the second
column portions 10 are able to ensure the strength of the interior
space 4 (or in other words, of the heat transporting unit 1).
[0165] In this way, by innovating the structure of the column
portions for reinforcing the interior space 4 in the regions in
interior space 4 it is possible to have the heat transporting unit
1 in the first form of embodiment secure increases in both strength
and in heat transportation efficiency.
[0166] Second forms of embodiment will be explained next.
[0167] Various examples of modifications of the heat transporting
unit 1 will be explained in the second forms of embodiment.
[0168] FIG. 5 is an interior perspective view of a heat
transporting unit according to a second form of embodiment
according to the Present Disclosure. FIG. 5 shows a state wherein a
portion of the interior of the heat transporting unit 1 is visible.
Second region 6 is provided with second column portions 10, where
gaps along the X-axis direction and the Y-axis direction are
produced by the second column portions 10, where these gaps form
second ducts 11. The vaporized refrigerant moves in the X-axis
direction and the Y-axis direction in these second ducts 11, and
the condensed refrigerant moves in the X-axis direction and in the
Y-axis direction in these second ducts 11.
[0169] Here, as illustrated in FIG. 5, the second column portions
10 are preferably provided with large column members 30 and small
column members 31 that are smaller than the large column members
30. As illustrated in FIG. 5, the large column members 30 are
disposed within the second region 6, and the small column members
31 are provided in locations other than those of the large column
members 30. The large column members 30 may have a size that is
larger than that of the small column members 31, and the large
column members 30 and the small column members 31 may be lined up
in a line, or may be lined up randomly.
[0170] Having the second column portions 10 be structured from a
mixture of the large column members 30 and the small column members
31 in this way, makes the shape of the second ducts 11 more
complex. In particular, the multiple second ducts 11 are adjacent
to each other with respective gaps in the X-axis direction and the
Y-axis direction. Because a plurality of gaps is formed through the
mixture of the large column members 30 and the small column members
31, the adjacent distances between gaps is made smaller, and the
intersections between the gaps is made larger. The second ducts 11,
which are formed through the combination of these complex gaps, has
strong capillary forces.
[0171] The second ducts 11 are able to move the condensed
refrigerant efficiently and rapidly through these strong capillary
forces.
[0172] Additionally, the second ducts 11 that are formed by the
combination of the complex gaps together are able to retain, across
a broad range, the refrigerant that is a liquid in the second
region 6. Because of this, it becomes easier for the second region
6, which receives the heat from the heat emitting object 20, to
vaporize the refrigerant quickly. Of course, the vaporized
refrigerant can move quickly and in a broad range within the second
ducts 11.
[0173] Additionally, structuring the second column portions 10 from
the large column members 30 and the small column members 31 further
increases the strength of the second regions 6. Because of the
thermal contact with the heat emitting object 20, the expansion and
contraction of the second region 6 due to temperature variations is
large. Because of this, a greater degree of strength is required,
and thus increased strength is desirable.
[0174] Note that the difference in size between the large column
members 30 and the small column members 31 is defined by the
differences in the size of the cross-sectional areas in the
vertical direction relative to the standing direction. Because of
this, the "large" and "small" terminology for the large column
members 30 and the small column members 31 can be defined for both
the cases wherein there are differences in the cross-sectional
areas through different shapes, and differences in the
cross-sectional areas with identical shapes.
[0175] Preferably channels are provided on the surfaces that are
exposed to the interior space 4 in at least a portion of the first
column portions 8, second column portions 10, and the upper plate 2
and the lower plate 3.
[0176] FIG. 6 is a cross-sectional diagram of an end portion of a
heat transporting unit in a second form of embodiment according to
the Present Disclosure. FIG. 6 illustrates a state wherein surfaces
that are exposed to the interior space 4 of the heat transporting
unit 1 are provided with channels 40 through 42. Note that while
FIG. 6, for convenience in illustrating in a cross-section, shows
only the second region 6, similarly channels are provided also in
the first region 5 and the first column portions 8.
[0177] The second column portions 10 are provided with channels 41
on the surfaces that are exposed to the interior space 4. The
channels 41 may be formed through cutting or milling the surfaces
of the second column portions 10, or the channels 41 may be formed
in advance when the second column portions 10 are formed. Note that
although not shown in FIG. 6, channels are formed similarly also in
the surfaces of the first column portions 8 that are exposed to the
interior space 4.
[0178] The formation of channels in this way in at least a portion
of the upper plate 2, the lower plate 3, the first column portions
8, and the second column portions 10 provides the first ducts 9 and
the second ducts 11 with channels. The provision of the first ducts
9 and the second ducts 11 with channels makes it possible to
increase the capillary forces, thereby facilitating the movement of
the condensed refrigerant along the channels. The condensed
refrigerant and the vaporized refrigerant are moved by the first
ducts 9 and the second ducts 11, respectively, and thus when it is
possible to move the condensed refrigerant along the channels, the
first ducts 9 and the second ducts 11 use the space other than the
channels to facilitate the movement of the vaporized
refrigerant.
[0179] The result is that the first ducts 9 and the second ducts 11
are able to move the vaporized refrigerant and the condensed
refrigerant while preventing interference between the respective
refrigerants. That is, the first ducts 9 move the vaporized
refrigerant along the X-axis direction from the second region 6 to
the second region 7. On the other hand, the first ducts 9 move the
condensed refrigerant along the X-axis direction from the second
region 7 to the second region 6. At this time, the channels are
able to reduce the interference between the vaporized refrigerant
and the condensed refrigerant in the first ducts 9.
[0180] As described above, at least a portion of the upper plate 2,
the lower plate 3, the first column portions 8, and the second
column portions 10 are provided with channels, thus making it
possible for the heat transporting unit 1 to accelerate the cycle
of the movement of the vaporized refrigerant and the movement of
the condensed refrigerant, enabling the heat to be transported more
quickly.
[0181] A modified example wherein the first column portions 8 are
provided with cutouts will be explained next.
[0182] The plurality of first column portions 8 form a plurality of
first ducts 9 through the gaps that are formed between adjacent
first column portions 8. Because the refrigerant moves in the
X-axis direction in each of the plurality of first ducts 9, ducts
are formed along the X-axis direction in the range of the first
region 5. This will be explained using FIG. 7. In FIG. 7, a cutout
35 that connects between adjacent first ducts 9 are provided part
way through the first column portions 8. FIG. 7 is an interior
schematic diagram of the heat transporting unit 1 in the second
form of embodiment according to the Present Disclosure.
[0183] The cutout 35 connects between adjacent first ducts 9, thus
making it possible for the vaporized refrigerant or condensed
refrigerant that is passing through the first duct 9 to pass
through the cutout 35 to move to another first duct 9.
[0184] If, for example, the heat emitting object 20 is extremely
small (to take one example, the heat emitting object 20 may be a
light-emitting diode element (hereinafter termed an "LED")), then
there may be cases where, in the second region 6, the diffusion
will be inadequate even when the heat from the heat emitting object
20 is diffused by the second ducts 11. It in such a case, it would
be necessary to transport a large amount of heat through those
first ducts 9 that are positioned near to the position wherein the
heat emitting object 20 is disposed, from among the plurality of
first ducts 9, where the other first ducts 9 would not have to
transport a large amount of heat. In this case, the first ducts 9
that are positioned near to the heat emitting object 20 would
require more refrigerant, requiring movement of refrigerant beyond
the capability thereof.
[0185] When one first duct 9 and another first duct 9 are connected
through a cutout 35, the one first duct 9 and the other first duct
9 are able to exchange the needed refrigerant and the unneeded
refrigerant through the cutout 35.
[0186] FIG. 7 further illustrates a state wherein one first duct 9A
and another first duct 9 exchange refrigerant. In FIG. 7, an
extremely small heat emitting object 20 is disposed in essentially
the center, in the Y-axis direction, of the bottom surface of the
second regions 6. The second region 6 removes heat from the heat
emitting object 20, the refrigerant is vaporized, and the vaporized
refrigerant moves through the second ducts 11 in the X-axis
direction and the Y-axis direction. Here the heat emitting object
20 is extremely small, and thus the ability of the vaporized
refrigerant to diffuse in the Y-axis direction in the second ducts
11 tends to be smaller than the ability to diffuse in the X-axis
direction. Because of this, the vaporized refrigerant tends to move
in the first duct 9A that is near to the position at which the heat
emitting object 20 is disposed, when moving from the second region
6 to the first region 5.
[0187] On the other hand, in order to transport larger amounts of
heat, it is necessary to have a greater amount of refrigerant. In
the state in FIG. 7, the first duct 9A has the primary
responsibility in the transportation of heat (noting that this is
not to say that the other first ducts 9 do not transport heat, but
rather the heat that diffuses in the Y-axis direction through the
second ducts 11 is transported in the X-axis direction through most
of the plurality of first ducts 9, where saying that the first duct
9A has the primary responsibility is just stating a comparative
level), and thus the first duct 9A requires more refrigerant than
in the other first ducts 9. Because the vaporized refrigerant moves
to the plurality of individual first ducts 9 from the second ducts
11, if the first duct 9A is able to obtain vaporized refrigerant
from the other first ducts 9, then the first duct 9A will be able
to transport a greater amount of heat. The first duct 9A transports
vaporized refrigerant (heat) in the X-axis direction, as
illustrated by the Arrow N. Here refrigerant can be received
through the cutouts 35 from the other first ducts 9, as with Arrow
K and Arrow M. The reception of the refrigerant makes it possible
for the first duct 9A to transport heat using a greater amount of
refrigerant. Additionally, the first duct 9A must transport a
greater amount of vaporized refrigerant in order to transport a
greater amount of heat. However, because the area of the first duct
9A is limited, there is a limit to the transportation capacity of
the vaporized refrigerant in the first duct 9A. In this case, as
indicated by Arrow J and Arrow L, the first duct 9A is able to move
vaporized refrigerant to other first ducts 9 through the cutouts
35. The result is that the vaporized refrigerant that transports
the heat is moved efficiently in the X-axis direction through the
plurality of first ducts 9.
[0188] Moreover, in order to hold a greater amount of the condensed
refrigerant in the vicinity of the heat emitting object 20, it is
necessary to move the condensed refrigerant into the vicinity of
the heat emitting object 20. Because the refrigerant is vaporized
by the heat of the heat emitting object 20, there will always be a
state wherein the amount of condensed refrigerant in the vicinity
of the heat emitting object 20 will be small. Because of this, a
greater amount of condensed refrigerant, when compared to the other
first ducts 9 will move into the vicinity of the heat emitting
object 20 along the first duct 9A through capillary forces. At this
time, there will be a tendency for the refrigerant that is in the
vicinity of the heat emitting object 20, which produces a greater
amount of heat than in the other regions, to be vaporized, meaning
that there will be a high likelihood that the amount of condensed
refrigerant will be inadequate. Here the provision of the cutouts
35 makes it possible for the first duct 9A to receive, through the
cutout 35, the deficient amount of condensed refrigerant from the
other first ducts 9. By receiving this refrigerant, the first duct
9A becomes able to move a greater amount of refrigerant to the
vicinity of the heat emitting object 20, resulting in the ability
to transport a great amount of heat.
[0189] As described above, the provision of the cutouts 35 makes it
possible to further increase the efficiency with which the heat
transporting unit 1 transports the heat of the heat emitting object
20.
[0190] An example of modification of the second ducts will be
explained next.
[0191] The heat transporting unit 1 is provided further with an
intermediate plate that is stacked between the upper plate 2 and
the lower plate 3, where the second regions 6 and 7 are stacked in
different positions in the Z-axis direction, where, preferably, the
second ducts are provided with a structure along the Z-axis
direction as well.
[0192] FIG. 8 is an enlargement of the vicinity of the second
region of a heat transporting unit according to a second form of
embodiment according to the Present Disclosure. In FIG. 8, the heat
transporting unit 1 is stacked with an intermediate plate 50
between the upper plate 2 and the lower plate 3.
[0193] The lower plate 3 is provided with large column members 30
and small column members 31 that structure the second column
portions 10. Moreover, the upper plate 2 is provided with large
column members 51 and small column members 52 that structure second
column portions 54. Furthermore, the intermediate plate 50 is
provided with opening portions 53 for connecting between the gaps
that are formed, respectively, between the second column portions
10 that are formed on the lower plate 3 and the second column
portions 54 that are formed on the upper plate 2.
[0194] In the lower plate 3, second ducts 11 are formed by the
second column portions 10. Moreover, in the upper plate 2, second
ducts 55 are formed by the second column portions 54. The second
column portions 10 and the second column portions 54 (or in other
words, the large column members 30 and large column members 51, and
the small column members 31 and the small column members 52), are
provided facing each other in different locations relative to the
Z-axis direction. Because of this, when the upper plate 2, the
first region 50, and the lower plate 3 are stacked together, the
second ducts 11 and the second ducts 55 are connected in a state
wherein each is slightly shifted. The opening portions 53 connect
the second ducts 11 and the second ducts 55, which are connected in
a state wherein they are each slightly shifted.
[0195] The result is that the entirety of the second ducts (the
ducts that are the second ducts 11 and the second ducts 55
together) are structured along the Z-axis direction, in addition to
the X-axis direction and the Y-axis direction. Because of this, in
the entirety of the second ducts, the vaporized refrigerant can
move, and the condensed refrigerant can move, in the X-axis
direction, the Y-axis direction, and the Z-axis direction.
[0196] By the entirety of the second ducts being able to diffuse
heat in the X-axis direction, the Y-axis direction, and the Z-axis
direction, the second region 6 is able to diffuse in three
dimensions the heat removed from the heat emitting object 20. The
ability of the second region 6 to diffuse in three dimensions the
heat of the heat emitting object 20 makes it possible for the
second region 6 to move heat across a broader range to the first
region 5. As a result, the first region 5 is able to use fully the
plurality of first ducts 9 to move the vaporized refrigerant (to
transport the heat).
[0197] While the vaporized refrigerant received from the first
region 5 is condensed in the second region 7, the entirety of the
second ducts is able to diffuse the refrigerant in three
dimensions, and thus, in the second region 7, the vaporized
refrigerant can be cooled while diffusing in three dimensions, to
efficiently condense the vaporized refrigerant. Additionally, in
the second region 7, the condensed refrigerant can move
three-dimensionally, and thus the condensed refrigerant can move to
the first region 5 at a high speed. Additionally, in the entirety
of the second ducts of the second region 7, the condensed
refrigerant can move to the first region 5 across a broad range,
enabling the first region 5 to move the condensed refrigerant using
the plurality of first ducts 9 fully.
[0198] Additionally, the first region 50 is stacked between the
upper plate 2 and the lower plate 3, so the provision of the first
region 50 further increases the strength of the heat transporting
unit 1, and more clearly partitions between the ducts of the first
ducts 9 and the second ducts 11 and 55, enabling the first ducts 9
and the second ducts 11 and 55 to transport the heat more
reliably.
[0199] An example wherein there is a modification that to the first
region 5 and the second regions 6 and 7 will be explained next.
[0200] The interior space 4 is provided with a first region and a
second region have different functions in heat transportation. The
first region is positioned in any region in the interior space 4,
and the second region is positioned in another portion that is not
the first region. The positioning of the first region and the
second region may be determined in a variety of ways.
[0201] FIG. 2, which was used in the first form of embodiment,
illustrates a heat transporting unit 1 wherein the second region 6
and the second region 7 are provided at both ends of the interior
space 4, and the first region 5 is provided interposed between
these second region 6 and second region 7.
[0202] In a heat transporting unit 1 having this type of structure,
the heat from the heat emitting object that is disposed facing the
second region 6 is received by the second regions 6 and diffuses in
the X-axis direction and the Y-axis direction (and further, in the
Z-axis direction). Moreover, the second region 6 moves the heat to
the first region 5.
[0203] Following this, the first region 5, which has received the
heat from the second region 6, transports the heat in the X-axis
direction. The first region 5 transports, to the second region 7,
the heat that has been transported in the X-axis direction.
Moreover, the second region 7 that has received the heat from the
first region 5 performs cooling while the heat diffuses in the
X-axis direction and Y-axis direction (and further, in the Z-axis
direction). The refrigerant condenses through being cooled, and the
second region 7 moves the refrigerant, through the first region 5,
to the second region 6.
[0204] In this way, the heat transporting unit 1, which has a
structure that is provided with the second regions 6 and 7 at both
end portions and that is provided with the first region 5
interposed between the second regions 6 and 7, is able to allocate
the three roles of diffusing the heat, transporting the heat, and
cooling the heat into the respective regions. The result is that
the heat transporting unit 1, having such a structure, is able to
transport the heat efficiently.
[0205] Additionally, the second region 6 may be provided at one end
portion in the interior space 4 and the first region 5 may be
provided in the regions thereof other than the second region 6.
That is, the heat transporting unit 1, as illustrated in FIG. 9,
may be provided with a second region 6 at only one end portion in
the interior space 4, with a structure wherein the remaining
portion is provided as first regions 5.
[0206] FIG. 9 is a plan view diagram of a heat transporting unit
according to a second form of embodiment according to the Present
Disclosure. FIG. 9 shows the interior of the heat transporting unit
1 in a visible state. The heat transporting unit 1 illustrated in
FIG. 9 has a second region 6 at only one end portion within the
interior space 4, and a first region 5 in the region that is not
the second region 6. The heat emitting object 20 is disposed facing
the second region 6. The second region 6, as explained in the first
and second forms of embodiment, is provided with second column
portions 10 and second ducts 11.
[0207] The second region 6 uses the second ducts 11 to diffuse the
heat removed from the heat emitting object 20 in the X-axis
direction and the Y-axis direction (and further, in the Z-axis
direction). Additionally, the second region 6 moves the diffused
heat to the first region 5. Specifically, it moves the vaporized
refrigerant to the first region 5.
[0208] The first region 5 transports the heat in the X-axis
direction using the first ducts 9. The first region 5 is provided
with first ducts 9 along the long direction (the X-axis direction),
so the first region 5 is able to cool the heat during the
transportation of the heat using the long first ducts 9. The
vaporized refrigerant is condensed through the cooling of the heat
in the first ducts 9. Because the first ducts 9 have capillary
forces, the condensed refrigerant moves along the X-axis direction
towards the second region 6. This is because in the vicinity of the
second region 6, the refrigerant is vaporized by the heat of the
heat emitting object 20, causing a state wherein there is little
condensed refrigerant, and thus the condensed refrigerant tends to
be moved to the second region 6 by the capillary forces.
[0209] The heat transporting unit 1 that is provided with the
second region 6 at only one end of the interior space 4 in this way
has a simple structure, and thus can reduce manufacturing costs.
Additionally, if there is little difference between the width of
the heat emitting object 20 in the Y-axis direction and the width
of the heat transporting unit 1 in the Y-axis direction (the length
in the short direction), then the second region 6 can adequately
diffuse the vaporized refrigerant in the Y-axis direction, enabling
movement of the vaporized refrigerant to all of the first ducts 9.
Because of this, the vaporized refrigerant is more easily cooled,
during movement, within the first ducts 9, so the second region 7
becomes unnecessary. From this point as well, preferably the heat
transporting unit 1 is provided with a structure such as in FIG.
9.
[0210] Yet another example of a modification to the first region
and the second region will be explained next. A structure will be
explained wherein a second region is provided in the center of the
interior space 4, and first regions are provided at both ends of
the interior space 4.
[0211] FIG. 10 is a perspective diagram of a heat transporting unit
according to a second form of embodiment according to the Present
Disclosure. FIG. 10 illustrates the internal structures in a
visible state. The heat transporting unit 1 illustrated in FIG. 10
has a structure that is provided with a second region 60 in the
center portion of the interior space 4, and provided with first
regions 61 and 62 at both ends of the second region 60 (that is, at
both ends of the interior space 4). Note that the second region 60
has structures and functions identical to those of the second
regions 6 and 7 explained in the first and second forms of
embodiment. That is, it is provided with second column portions 10,
and with second ducts 11 that are formed by the second column
portions 10. The first regions 61 and 62 have structures and
functions that are identical to those of the first region 5 that
was explained in the first and second forms of embodiment. That is,
they are provided with first column portions 8, and provided with
first ducts 9 that are formed by the first column portions 8.
[0212] The heat emitting object 20 (not shown, both in FIG. 10 and
below) is disposed facing the bottom surface of the second region
60. The second region 60 removes heat from the heat emitting object
20. The second region 60 has second ducts 11 along the X-axis
direction and the Y-axis direction (and further, along the Z-axis
direction), and thus is able to move, in the X-axis direction and
Y-axis direction (and further, in the Z-axis direction), the
refrigerant that is vaporized by the heat of the heat emitting
object 20. Furthermore, the second region 60 moves the vaporized
refrigerant to the first regions 61 and 62. The first regions 61
and 62 are provided at both sides of the second region 60, and the
second region 60 moves the vaporized refrigerant in the X-axis
direction as well, and thus the second region 60 moves the
vaporized refrigerant to both the first region 61 and the first
region 62. Additionally, the second region 60 moves the vaporized
refrigerant in the Y-axis direction as well, and thus moves the
vaporized refrigerant from the second region 60 using fully the
crosswise direction of the Y-axis direction of the first regions 61
and 62. That is, in both the first regions 61 and 62, the plurality
of first ducts 9 that are provided are used fully to enable
movement of the vaporized refrigerant in the X-axis direction.
[0213] The vaporized refrigerant that has moved to both the first
region 61 and the first region 62 is moved in the X-axis direction
by the plurality of first ducts 9 in both the first region 61 and
the first region 62.
[0214] At this time, in the respective first region 61 and first
region 62, the vaporized refrigerant is moved towards the
respective end portions, so as to move away from the second region
60. In the respective first regions 61 and 62, the vaporized
refrigerant is cooled during the movement towards the end portions.
The refrigerant is condensed through this cooling. In the
respective first regions 61 and 62, the condensed refrigerant moves
along the X-axis direction due to the capillary forces of the first
ducts 9. At this time, in the respective first regions 61 and 62,
the contents refrigerant is moved towards the second region 60.
[0215] As described above, the heat transporting unit 1 illustrated
in FIG. 10 transports the heat of the heat emitting object 20,
disposed at the center portion thereof, towards both ends. For
example, when one wishes to exhaust, to the periphery, heat that is
produced by a given electronic component or mechanical component,
then preferably a heat transporting unit 1 having the structure
illustrated in FIG. 10 will be used.
[0216] The heat transporting unit 1 in the second form of
embodiment is able to transport and exhaust heat of a heat emitting
object while being compatible with a variety of structures, shapes,
sizes, mounting conditions, and the like, of the heat-emitting
object to which it is applied.
[0217] A third form of embodiment will be explained next.
[0218] Various relationships between the position of the
heat-emitting object and the heat transporting unit will be
explained using the third form of embodiment.
[0219] FIG. 11 is a perspective assembly diagram of a heat
transporting unit according to the third form of embodiment
according to the Present Disclosure. FIG. 11 illustrates a state
wherein the upper plate 2 is at the bottom and the lower plate 3 is
at the top, and, in order to cause the interior to be visible,
illustrates a state wherein the outer surface of the lower plate 3
has been removed.
[0220] The heat transporting unit 1 is provided with a heat
receiving portion 70 for making thermal contact with a heat
emitting object at the upper plate 2 and/or at the lower plate 3.
The heat transporting unit 1 in FIG. 11 is provided with the heat
receiving region 70 at the lower plate 3.
[0221] The heat receiving region 70 is positioned where the heat
emitting object is disposed, and the heat transporting unit 1
removes heat from the heat emitting object through the heat
receiving region 70. Thereafter, the heat transporting unit 1
transports the heat of the heat emitting object in the X-axis
direction from the second region 6 through the first region 5.
[0222] The heat receiving region 70 may be provided as a member for
positioning the heat emitting object, as illustrated in FIG. 11. In
this case, the heat receiving region 70 may have a flat shape or a
frame shape of members having high thermal conductivity, such as a
metal, and alloy, or the like. Conversely, the heat transporting
unit 1 may be provided with a heat receiving region 70 as a target
position for positioning the heat emitting object, without having
to provide a separate element or member as the heat receiving
region 70. That is, in the heat receiving region 70, there is no
need for the explicit provision of a member on the surface of the
lower plate 3, but rather it may be a position, region, or location
for the placement of the heat emitting object 20. What is necessary
is for the user of the heat transporting unit 1 to understand, as
the heat receiving region 70, the region or location for
positioning that selects the position for the placement of the heat
emitting object 20, in order to use the functions of the heat
transporting unit 1. In this point, the responsibility of the party
providing the heat transporting unit 1 to recommend the position
for placing the heat emitting object 20 is defined identically to
that for recommending the heat receiving region 70.
[0223] The provision of the heat receiving region 70 in the heat
transporting unit 1 is because this facilitates the definition of
the target for the position for the placement of the heat emitting
object, and because this facilitates the achievement of cooling the
heat emitting object more efficiently, as in the experimental
results, described below.
[0224] Here the heat receiving region 70 being provided spanning
the boundary 12 of the first region 5 and the second region 6 is
preferred from the perspective of the efficiency of heat
transportation in the heat transporting unit 1.
[0225] The inventors performed experiments regarding this point,
and the experimental results will be described. FIG. 12 is an
explanatory diagram listing an example of embodiment and
comparative examples.
[0226] In the example of embodiment, the heat emitting object 20
(that is, the heat receiving region 70) is provided spanning the
boundary 12 of the second region 6 and the first region 5.
[0227] In the first comparative example, the heat emitting object
20 (that is, the heat receiving region 70) is provided at the
bottom surface of the second region 6, where the heat emitting
object 20 is in a state that is essentially within the bottom
surface of the second region 6.
[0228] In the second comparative example, the heat emitting object
20 (that is, the heat receiving region 70) is provided at the
bottom surface of the second region 6, and the heat emitting object
20 is included further within the bottom surface of the second
region 6 than in the first comparative example, and the heat
emitting object 20 covers the second region 6 more broadly than in
the case of the second comparative example.
[0229] Heat was actually applied to the heat emitting object 20,
and the surface temperature of the heat emitting object 20 was
measured, based on these three types of structures.
[0230] FIG. 13 is a graph showing the measurement results in the
example of embodiment and in the comparative examples. As is clear
from the graph in FIG. 13, in the example of embodiment the surface
temperature of the heat emitting object 20 was 73.4.degree. C. In
the first comparative example, the surface temperature of the heat
emitting object 20 was 73.8.degree. C. In the second comparative
example, the surface temperature of the heat emitting object 20 was
76.0.degree. C.
[0231] As can be understood from these results, the structure of
the example of embodiment was most able to cool the heat of the
heat emitting object (that is, most able to transport the heat).
That is, the heat receiving region 70 preferably is provided
spanning the boundary 12 of the first region 5 and the second
region 6.
[0232] Note that the position of placement of the heat receiving
region 70 does not depend on only the cooling effect of this type
of heat emitting object, and thus should be determined in
accordance with parameters such as, for example, the size, shape,
mounting position, and the like of the heat emitting object 20, and
the third form of embodiment does not limit particularly the
position of placement of the heat receiving region 70. Moreover,
the surface temperatures obtained through the measurement results
are only examples, and, of course, will vary depending on a variety
of parameters such as the size, shape, and mounting position of the
heat emitting object, and on measurement environment conditions,
type of refrigerant, and so forth.
[0233] As described above, the heat transporting unit 1 in the
third form of embodiment is able to transport heat of the heat
emitting object more efficiently through the specification of the
position of placement of the heat emitting object.
[0234] A fourth form of embodiment will be explained next.
[0235] A case wherein the heat transporting unit is further
provided with a heat radiating portion for radiating the
transported heat will be explained using the fourth form of
embodiment.
[0236] FIG. 14 is a side view diagram of a heat transporting unit
according to a fourth form of embodiment according to the Present
Disclosure. The heat transporting unit 1, as with that which was
explained in FIG. 2, is provided with a first region 5, a second
region 6, and a second region 7 within the interior space 4. A heat
emitting object 20 is positioned in the vicinity of the boundary
between the second region 6 and the first region 5, and the second
region 6 diffuses the heat removed from the heat emitting object
20.
[0237] The heat diffused by the second region 6 moves to the first
region 5, and the first region 5 transports the heat towards the
second region 7. The heat that arrives at the second region 7
diffuses within the second region 7.
[0238] A cooling fan 80 is illustrated in FIG. 14 as an example of
a heat radiating portion. The cooling fan 80 cools the second
region 7. In the second region 7, the heat that was transported
from the heat emitting object 20 arrives and is cooled, to condense
the vaporized refrigerant. The cooling fan 80 expedites the
condensation of the refrigerant. The condensed refrigerant moves
from the second region 7 to the second region 6. The heat
transporting unit 1, through producing this movement, produces heat
cycling, enabling the effective transportation and cooling of the
heat of the heat emitting object 20.
[0239] The heat transportation effectiveness of the heat
transporting unit 1 is improved involves the transportation of the
cooled heat in the opposite direction (that is, the movement of the
condensed refrigerant) in addition to the transportation of the
heat of the heat emitting object 20 (that is, the movement of the
vaporized refrigerant). Because of this, the heat transporting
efficiency of the heat transporting unit 1 is improved through
increasing the efficiency and the speed of movement of the
condensed refrigerant through the heat radiating portion.
[0240] In this way, the provision of the additional heat radiating
portion enables the heat transporting unit 1 to transport the heat
with high efficiency.
[0241] While a cooling fan was shown in FIG. 14 as an example of a
heat radiating portion, instead of a cooling fan, a liquid-cooled
jacket, a Peltier element, a heat sink, or any other member capable
of radiating heat can be used as the heat radiating portion.
[0242] The heat transporting unit 1 can replace a heat radiating
fin or liquid cooling device, or the like, that is mounted in a
notebook PC, a mobile terminal, a computer terminal, or the like,
and can replace a cooling device that is mounted in an industrial
device, or replace a heat radiating case or a cooling device that
is mounted in a control computer unit, or the like. The heat
transporting unit 1 can transport heat at a higher speed than a
heat pipe that has been used conventionally, and thus can be
applied to cooling a variety of electronic components. The result
is that the heat transporting unit 1 can be used in a broad scope
of applications.
[0243] The heat transporting unit 1 in the fourth form of
embodiment transports the heat of the heat emitting object more
efficiently.
[0244] A heat transporting unit 1 as explained in any of the first
through fourth forms of embodiment can be applied well to an
electronic device that is provided with a heat transporting unit 1,
a heat emitting object 20 that is in thermal contact with at least
a portion of the surface of the heat transporting unit 1 (or which
may be in contact with the heat receiving portion explained in the
third form of embodiment), an electronic circuit board whereon the
heat emitting object 20 is mounted, and a case for housing the
electronic circuit board.
[0245] FIG. 15 is a schematic diagram of an electronic device
according to the fifth form of embodiment according to the Present
Disclosure. The electronic device 90 houses, within a case 91, a
heat transporting unit 1 for cooling an electronic circuit board 92
and a heat emitting object 20, mounted thereon. The electronic
circuit board 92 has a variety of electronic components mounted
thereon, so the heat transporting unit 1 transports heat, with
those electronic components requiring the transportation of heat as
the heat emitting object 20.
[0246] Additionally, the heat transporting unit 1, if necessary,
may be provided with a heat radiating portion, as represented by
the cooling fan 80.
[0247] This type of electronic device 90 can be cooled when the
heat of the heat emitting object is transported in a specific
direction, thus making it possible to prevent malfunction of or
damage to the electronic device, enabling higher performance to be
achieved.
[0248] The electronic device is of a thin shape such as an
automobile television or personal monitor, or may be a mobile
terminal that must be of a small size. Conversely, the electronic
device includes also mobile telephones, mobile music playing
equipment, mobile mail terminals, PDAs, digital cameras, digital
video cameras, mobile recorders, smartphones, and mobile video
recording equipment.
[0249] The electronic device 90 in the fifth form of embodiment is
able to transport effectively, to the periphery, the heat of those
electronic components and mechanical components that have high heat
production, thus making it possible to prevent in advance
malfunctions or failures of the electronic device 90.
[0250] Note that while in the forms of embodiment in the Present
Disclosure the heat emitting object was thermally connected to
either the upper plate or the lower plate, instead it may be
thermally connected to both the upper plate and the lower plate.
Furthermore, the heat emitting object may be connected thermally
through a heat receiving member, having high thermal conductivity,
which is a separate member, to the upper plate and/or the lower
plate. The provision of the heat receiving member enables its use
as a positioner or a securing member when connecting thermally to
the heat emitting object.
[0251] While a preferred embodiment of the Present Disclosure is
shown and described, it is envisioned that those skilled in the art
may devise various modifications without departing from the spirit
and scope of the foregoing Description and the appended Claims.
* * * * *