Ohsawa; Kenji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ohsawa; Kenji.The latest application filed is for "heat pipe and method for manufacturing same".
- Ohsawa; Kenji - Kagoshima JP
- Ohsawa; Kenji - Yamato JP
- Ohsawa; Kenji - Kagoshima-shi JP
- Ohsawa; Kenji - Kawagoe JP
- Ohsawa; Kenji - Tokyo JP
- Ohsawa; Kenji - Kanagawa JP
- Ohsawa; Kenji - Yokohama JP
| Patent | Date |
|---|---|
| Heat Pipe And Method For Manufacturing Same App 20210310745 - Ohsawa; Kenji | 2021-10-07 |
| Cooling device and electronic device Grant 9,240,365 - Ohsawa , et al. January 19, 2 | 2016-01-19 |
| Heat sink package and method of manufacturing Grant 8,988,882 - Ohsawa , et al. March 24, 2 | 2015-03-24 |
| Heat sink, cooling module and coolable electronic board Grant 8,982,559 - Ohsawa , et al. March 17, 2 | 2015-03-17 |
| Heat pipe and circuit board with a heat pipe function Grant 8,611,089 - Mizuta , et al. December 17, 2 | 2013-12-17 |
| Heat Pipe App 20130269913 - Ueda; Susumu ; et al. | 2013-10-17 |
| Heat pipe and method for manufacturing same Grant 8,534,348 - Ohsawa , et al. September 17, 2 | 2013-09-17 |
| Heat Transporting Unit, Electronic Circuit Board And Electronic Device App 20130126139 - Tsuruta; Katsuya ; et al. | 2013-05-23 |
| Heat Transporting Unit And Electronic Device App 20120211207 - Ohsawa; Kenji ; et al. | 2012-08-23 |
| Heat Sink Package And Method Of Manufacturing App 20120127667 - Ohsawa; Kenji ; et al. | 2012-05-24 |
| Heat Pipe, Method For Manufacturing A Heat Pipe, And A Circuit Board With A Heat Pipe Function App 20120106084 - Mizuta; Kei ; et al. | 2012-05-03 |
| Cooling Device And Electronic Device App 20120002370 - Ohsawa; Kenji ; et al. | 2012-01-05 |
| Heat Sink, Cooling Module And Coolable Electronic Board App 20110214904 - Ohsawa; Kenji ; et al. | 2011-09-08 |
| Recording Medium Reproducing Device And Reproducing Method App 20100189415 - Ohsawa; Kenji | 2010-07-29 |
| Heat Pipe and Method for Manufacturing Same App 20080135214 - Ohsawa; Kenji ; et al. | 2008-06-12 |
| Memory card Grant 7,374,104 - Aoki , et al. May 20, 2 | 2008-05-20 |
| Heat pipe and method for manufacturing same App 20070056711 - Ohsawa; Kenji | 2007-03-15 |
| Memory card App 20060097060 - Aoki; Yoshitaka ; et al. | 2006-05-11 |
| Method for making semiconductor device using a nickel film for stopping etching Grant 6,838,368 - Ohsawa , et al. January 4, 2 | 2005-01-04 |
| Method for making a semiconductor device Grant 6,514,847 - Ohsawa , et al. February 4, 2 | 2003-02-04 |
| Semiconductor chip having an underplate metal layer Grant 6,351,025 - Ohsawa , et al. February 26, 2 | 2002-02-26 |
| Lead Frame And Manufacturing Method Thereof App 20010014491 - OHSAWA, KENJI | 2001-08-16 |
| Semiconductor package and the manufacturing method Grant 6,258,631 - Ito , et al. July 10, 2 | 2001-07-10 |
| Semiconductor Device, Method Making The Same, And Electronic Device Using The Same App 20010005050 - OHSAWA, KENJI ; et al. | 2001-06-28 |
| Semiconductor package and the manufacturing method Grant 6,104,091 - Ito , et al. August 15, 2 | 2000-08-15 |
| Semiconductor device and method for manufacturing the same Grant 6,093,970 - Ohsawa , et al. July 25, 2 | 2000-07-25 |
| Lead frame Grant 6,078,097 - Ohsawa June 20, 2 | 2000-06-20 |
| Semiconductor device and method of manufacturing the same Grant 6,054,773 - Ohsawa , et al. April 25, 2 | 2000-04-25 |
| Semiconductor device Grant 6,020,626 - Ohsawa , et al. February 1, 2 | 2000-02-01 |
| Semiconductor chip package Grant 5,982,033 - Ohsawa , et al. November 9, 1 | 1999-11-09 |
| Semiconductor chip housing having a reinforcing plate Grant 5,945,741 - Ohsawa , et al. August 31, 1 | 1999-08-31 |
| Lead frame and integrated circuit package Grant 5,886,399 - Ohsawa , et al. March 23, 1 | 1999-03-23 |
| Method of manufacturing a semiconductor package Grant 5,786,239 - Ohsawa , et al. July 28, 1 | 1998-07-28 |
| Lead frame and manufacturing method thereof Grant 5,756,377 - Ohsawa May 26, 1 | 1998-05-26 |
| Resin mold type semiconductor device Grant 5,723,900 - Kojima , et al. March 3, 1 | 1998-03-03 |
| Lead frame and manufacturing method therefor Grant 5,437,764 - Ohsawa , et al. August 1, 1 | 1995-08-01 |
| Semiconductor device Grant 5,349,238 - Ohsawa , et al. September 20, 1 | 1994-09-20 |
| Production of lead frame Grant 5,221,428 - Ohsawa , et al. June 22, 1 | 1993-06-22 |
| Circuit board Grant 4,677,252 - Takahashi , et al. June 30, 1 | 1987-06-30 |
| Method of making multilayer circuit board Grant 4,528,064 - Ohsawa , et al. July 9, 1 | 1985-07-09 |
| Conductive paste Grant 4,435,611 - Ohsawa , et al. March 6, 1 | 1984-03-06 |
| Conductive paste Grant 4,398,975 - Ohsawa , et al. August 16, 1 | 1983-08-16 |
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