Tsuruta; Katsuya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tsuruta; Katsuya.The latest application filed is for "heat pipe".
- Tsuruta; Katsuya - Kagoshima N/A JP
- Tsuruta; Katsuya - Yamato JP
- Tsuruta; Katsuya - Kagoshima-shi JP
| Patent | Date |
|---|---|
| Cooling device and electronic device Grant 9,240,365 - Ohsawa , et al. January 19, 2 | 2016-01-19 |
| Heat sink package and method of manufacturing Grant 8,988,882 - Ohsawa , et al. March 24, 2 | 2015-03-24 |
| Heat sink, cooling module and coolable electronic board Grant 8,982,559 - Ohsawa , et al. March 17, 2 | 2015-03-17 |
| Heat pipe and circuit board with a heat pipe function Grant 8,611,089 - Mizuta , et al. December 17, 2 | 2013-12-17 |
| Heat Pipe App 20130269913 - Ueda; Susumu ; et al. | 2013-10-17 |
| Heat pipe and method for manufacturing same Grant 8,534,348 - Ohsawa , et al. September 17, 2 | 2013-09-17 |
| Heat Transporting Unit, Electronic Circuit Board And Electronic Device App 20130126139 - Tsuruta; Katsuya ; et al. | 2013-05-23 |
| Heat Transporting Unit And Electronic Device App 20120211207 - Ohsawa; Kenji ; et al. | 2012-08-23 |
| Heat Sink Package And Method Of Manufacturing App 20120127667 - Ohsawa; Kenji ; et al. | 2012-05-24 |
| Heat Pipe, Method For Manufacturing A Heat Pipe, And A Circuit Board With A Heat Pipe Function App 20120106084 - Mizuta; Kei ; et al. | 2012-05-03 |
| Cooling Device And Electronic Device App 20120002370 - Ohsawa; Kenji ; et al. | 2012-01-05 |
| Heat Pipe And Electronic Device App 20110308772 - Tsuruta; Katsuya ; et al. | 2011-12-22 |
| Heat Sink, Cooling Module And Coolable Electronic Board App 20110214904 - Ohsawa; Kenji ; et al. | 2011-09-08 |
| Heat Pipe and Method for Manufacturing Same App 20080135214 - Ohsawa; Kenji ; et al. | 2008-06-12 |
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