U.S. patent application number 13/283127 was filed with the patent office on 2013-05-02 for fin-like field effect transistor (finfet) based, metal-semiconductor alloy fuse device and method of manufacturing same.
This patent application is currently assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.. The applicant listed for this patent is Wei-Chang Kung, Minchang Liang, Shien-Yang Wu. Invention is credited to Wei-Chang Kung, Minchang Liang, Shien-Yang Wu.
Application Number | 20130105895 13/283127 |
Document ID | / |
Family ID | 48171510 |
Filed Date | 2013-05-02 |
United States Patent
Application |
20130105895 |
Kind Code |
A1 |
Liang; Minchang ; et
al. |
May 2, 2013 |
FIN-LIKE FIELD EFFECT TRANSISTOR (FINFET) BASED,
METAL-SEMICONDUCTOR ALLOY FUSE DEVICE AND METHOD OF MANUFACTURING
SAME
Abstract
A fuse device and method for fabricating the fuse device is
disclosed. An exemplary fuse device includes a first contact and a
second contact coupled with a metal-semiconductor alloy layer,
wherein the metal-semiconductor alloy layer extends continuously
between the first contact and the second contact. The
metal-semiconductor alloy layer is disposed over an epitaxial layer
that is disposed over a fin structure of a substrate.
Inventors: |
Liang; Minchang; (Zhu-Dong
Town, TW) ; Wu; Shien-Yang; (Jhudong Town, TW)
; Kung; Wei-Chang; (Hsinchu City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Liang; Minchang
Wu; Shien-Yang
Kung; Wei-Chang |
Zhu-Dong Town
Jhudong Town
Hsinchu City |
|
TW
TW
TW |
|
|
Assignee: |
TAIWAN SEMICONDUCTOR MANUFACTURING
COMPANY, LTD.
Hsin-Chu
TW
|
Family ID: |
48171510 |
Appl. No.: |
13/283127 |
Filed: |
October 27, 2011 |
Current U.S.
Class: |
257/347 ;
257/E21.09; 257/E27.112; 438/478 |
Current CPC
Class: |
H01L 21/76224 20130101;
H01L 29/6681 20130101; H01L 23/5256 20130101; H01L 2924/0002
20130101; H01L 2924/0002 20130101; H01L 27/1052 20130101; H01L
21/02647 20130101; H01L 21/823481 20130101; H01L 27/11206 20130101;
H01L 29/1087 20130101; H01L 29/66545 20130101; H01L 29/785
20130101; H01L 29/665 20130101; H01L 2924/00 20130101; H01L
21/823431 20130101 |
Class at
Publication: |
257/347 ;
438/478; 257/E27.112; 257/E21.09 |
International
Class: |
H01L 27/12 20060101
H01L027/12; H01L 21/20 20060101 H01L021/20 |
Claims
1. A device comprising: a semiconductor substrate; a fin structure
disposed over the semiconductor substrate, wherein the fin
structure includes at least two fins disposed over the substrate;
an epitaxial semiconductor feature disposed over each of the at
least two fins; a metal-semiconductor alloy feature disposed over
the epitaxial semiconductor feature of each of the at least two
fins; and a first contact and a second contact coupled with the
metal-semiconductor alloy feature, wherein the metal-semiconductor
alloy feature extends continuously between the first contact and
the second contact.
2. The device of claim 1 wherein the epitaxial semiconductor
feature disposed over each of the at least two fins are merged
together to form a continuous epitaxial feature disposed over the
at least two fins.
3. The device of claim 1 wherein a width of the metal-semiconductor
alloy feature is defined by at least two gate structures, each of
the at least two gate structures traversing the at least two
fins.
4. The device of claim 3 wherein each of the at least two gate
structures include a gate stack having a gate dielectric layer
disposed over the at least two fins and a gate electrode disposed
over the gate dielectric layer.
5. The device of claim 4 wherein the gate dielectric layer includes
a high-k dielectric layer, and the gate electrode includes a
metal.
6. The device of claim 1 wherein the epitaxial semiconductor
feature includes silicon germanium.
7. The device of claim 1 wherein the metal-semiconductor alloy
feature includes a silicide material.
8. The device of claim 1 wherein the semiconductor substrate is a
silicon-on-insulator substrate.
9. An integrated circuit device comprising: a fuse device that
includes a first contact and a second contact coupled with a
metal-semiconductor alloy layer, wherein the metal-semiconductor
alloy layer extends continuously between the first contact and the
second contact, and further wherein the metal-semiconductor alloy
layer is disposed over an epitaxial layer that is disposed over a
fin structure of a substrate.
10. The integrated circuit device of claim 9 wherein: the substrate
and the fin structure include silicon; the epitaxial layer includes
silicon germanium; and the metal-semiconductor alloy layer includes
a silicide material.
11. The integrated circuit device of claim 10 wherein the silicide
material includes one of nickel silicide, cobalt silicide, tungsten
silicide, tantalum silicide, titanium silicide, platinum silicide,
erbium silicide, palladium silicide, or combinations thereof.
12. The integrated circuit device of claim 9 wherein the epitaxial
layer extends continuously between fins of the fin structure.
13. The integrated circuit device of claim 9 wherein the epitaxial
layer includes gaps between fins of the fin structure, the
metal-semiconductor alloy layer at least partially filling the
gaps.
14. The integrated circuit device of claim 9 wherein the
metal-semiconductor alloy feature is disposed between gate
structures that traverse fins of the fin structure.
15. The integrated circuit device of claim 9 wherein: the
metal-semiconductor alloy feature has a first portion having a
first width and a second portion having a second width, the second
width being larger than the first width; and the first contact is
coupled with the first portion and the second contact is coupled
with the second portion.
16. The integrated circuit device of claim 15 wherein the first
portion of the metal-semiconductor alloy feature is disposed
between gate structures that traverse fins of the fin structure,
such that the first width of the first portion is defined by the
gate structures.
17-20. (canceled)
21. An integrated circuit device comprising: first and second fins
over a substrate; a first epitaxial feature over the first fin, and
a second epitaxial fin over the second fin, wherein the first and
second epitaxial features are adjacent to each other, and are
merged with each other; a metal-semiconductor alloy feature over
the epitaxial layer; and a first contact and a second contact
coupled with the metal-semiconductor alloy feature, wherein the
metal-semiconductor alloy feature extends continuously between the
first contact and the second contact.
Description
BACKGROUND
[0001] Fuses are widely implemented in integrated circuit devices,
particularly in integrated circuit memory devices, to provide
discretionary electrical connections. For example, in dynamic or
static memory chips, defective memory cells or circuitry may be
replaced by selectively blowing (destroying) fuses associated with
the defective circuitry while activating redundant circuitry. Fuses
are also used for programming functions and codes in logic chips,
as well as programming redundant rows of memory chips. To provide
such discretionary electrical connections, fuses include a fuse
element that is broken (blown) by using electrical current flowing
through the fuse element, or an external heat source, such as a
laser beam. An exemplary fuse element is a polysilicon fuse
element, which provides desirable programming current (current that
needs to flow through the fuse element to break the fuse element).
However, as device technology nodes decrease and high-k/metal gate
technology is implemented (where a gate dielectric and polysilicon
gate electrode are replaced with a high-k dielectric and metal gate
electrode, respectively), polysilicon fuse elements have been
replaced by metal fuse elements, such as copper fuse elements,
because polysilicon fuse element processing is not compatible with
high-k/metal gate processing. Though copper fuse element processing
is compatible with high-k/metal gate processing, copper fuse
elements require a higher programming current than desirable,
typically several times larger than polysilicon fuse elements.
Further, copper fuse element characteristics can be modified during
subsequent process development. Accordingly, although existing
fuses and methods for fabricating fuses have been generally
adequate for their intended purposes they have not been entirely
satisfactory in all respects.
BRIEF DESCRIPTION OF THE DRAWINGS
[0002] The present disclosure is best understood from the following
detailed description when read with the accompanying figures. It is
emphasized that, in accordance with the standard practice in the
industry, various features are not drawn to scale and are used for
illustration purposes only. In fact, the dimensions of the various
features may be arbitrarily increased or reduced for clarity of
discussion.
[0003] FIG. 1A is a top view of an embodiment of a fuse device
according to various aspects of the present disclosure.
[0004] FIG. 1B is a diagrammatic cross-sectional view of the fuse
device along line 1B-1B in FIG. 1A.
[0005] FIG. 1C is a diagrammatic cross-sectional view of the fuse
device along line 1C-1C in FIG. 1A.
[0006] FIG. 1D is a diagrammatic cross-sectional view of the fuse
device along line 1D-1D in FIG. 1A.
[0007] FIG. 2A is a top view of another embodiment of a fuse device
according to various aspects of the present disclosure.
[0008] FIG. 2B is a diagrammatic cross-sectional view of the fuse
device along line 2B-2B in FIG. 2A.
[0009] FIG. 2C is a diagrammatic cross-sectional view of the fuse
device along line 2C-2C in FIG. 2A.
[0010] FIG. 2D is a diagrammatic cross-sectional view of the fuse
device along line 2D-2D in FIG. 2A.
[0011] FIG. 3A is a top view of yet another embodiment of a fuse
device according to various aspects of the present disclosure.
[0012] FIG. 3B is a diagrammatic cross-sectional view of the fuse
device along line 3B-3B in FIG. 3A.
[0013] FIG. 3C is a diagrammatic cross-sectional view of the fuse
device along line 3C-3C in FIG. 3A.
[0014] FIG. 3D is a diagrammatic cross-sectional view of the fuse
device along line 3D-3D in FIG. 3A.
[0015] FIG. 4 is a top view of yet another embodiment of a fuse
device according to various aspects of the present disclosure.
[0016] FIG. 5 is a flow chart of a method for fabricating a fuse
device according to various aspects of the present disclosure.
DETAILED DESCRIPTION
[0017] The following disclosure provides many different
embodiments, or examples, for implementing different features of
the invention. Specific examples of components and arrangements are
described below to simplify the present disclosure. These are, of
course, merely examples and are not intended to be limiting. For
example, the formation of a first feature over or on a second
feature in the description that follows may include embodiments in
which the first and second features are formed in direct contact,
and may also include embodiments in which additional features may
be formed between the first and second features, such that the
first and second features may not be in direct contact. In
addition, the present disclosure may repeat reference numerals
and/or letters in the various examples. This repetition is for the
purpose of simplicity and clarity and does not in itself dictate a
relationship between the various embodiments and/or configurations
discussed.
[0018] FIG. 1A is a top view of a fuse device 200, in portion or
entirety, according to various aspects of the present disclosure.
FIG. 1B is a diagrammatic cross-sectional view of the fuse device
200 along line 1B-1B in FIG. 1A; FIG. 1C is a diagrammatic
cross-sectional view of the fuse device 200 along line 1C-1C in
FIG. 1A; and FIG. 1D is a diagrammatic cross-sectional view of the
fuse device 200 along line 1D-1D in FIG. 1A. The fuse device 200 is
a fin-like field effect transistor (FinFET) based,
metal-semiconductor alloy fuse device. The term FinFET device
refers to any fin-based, single or multi-gate transistor. The
FinFET based, metal-semiconductor alloy fuse device 200 may be
included in a microprocessor, memory cell, and/or other integrated
circuit device. FIGS. 1A-1D will be discussed concurrently and have
been simplified for the sake of clarity to better understand the
inventive concepts of the present disclosure. Further, additional
features can be added in the fuse device 200, and some of the
features described below can be replaced or eliminated in other
embodiments of the fuse device.
[0019] The metal-semiconductor alloy feature fuse device 200 has a
dimension that runs in a first direction and a dimension that runs
in a second direction that is different than the first direction.
For example, the fuse device 200 has a length, L, and a width, W.
The fuse device 200 includes a substrate (wafer) 210. In the
depicted embodiment, the substrate 210 is a silicon substrate.
Alternatively or additionally, the substrate 210 includes an
elementary semiconductor, such as germanium; a compound
semiconductor, such as silicon carbide, gallium arsenic, gallium
phosphide, indium phosphide, indium arsenide, and/or indium
antimonide; or combinations thereof. Alternatively, the substrate
210 is a silicon-on-insulator (SOI) substrate. The SOI substrate
can be fabricated using separation by implantation of oxygen
(SIMOX), wafer bonding, and/or other suitable methods. The
substrate 210 may include various doped regions and other suitable
features.
[0020] A fin structure that includes fins 212 extends from the
substrate 210. The fuse device 200 may include more or less fins
212 depending on design requirements of the fuse device 200. In the
depicted embodiment, the fins 212 are extensions of the substrate
210 and include silicon. The fins 212 may include other material
portions. The fin structure is formed by implementing a lithography
and etching process. For example, beginning with the substrate 210,
a lithography and etching process forms trenches in the substrate
210, thereby forming fins 212 that extend from the substrate 210.
The lithography process may include resist coating (for example,
spin-on coating), soft baking, mask aligning, exposure,
post-exposure baking, developing the resist, rinsing, drying (for
example, hard baking), other suitable processes, or combinations
thereof. Alternatively, the lithography process can be implemented
or replaced by other methods, such as maskless lithography,
electron-beam writing, ion-beam writing, and/or nanoimprint
technology. The etching process includes a dry etching process, wet
etching process, other suitable etching process, or combinations
thereof. In an example, the fins 212 are formed by forming a resist
layer over the substrate 210, exposing the resist to a pattern, and
developing the resist to form a masking element including the
resist. The masking element may then be used to etch the fins 212
into the substrate 210, for example, by using a reactive ion etch
(RIE). The fins 212 may be formed by a double-patterning
lithography (DPL) process. DPL is a method of constructing a
pattern on a substrate by dividing the pattern into two interleaved
patterns. DPL allows enhanced feature (for example, fin) density.
Various DPL methodologies may be used including double exposure
(such as using two mask sets), resist freezing, other suitable
processes, or combinations thereof.
[0021] Isolation feature 220, such as shallow trench isolation
(STI) structure and/or local oxidation of silicon (LOCOS)
structure, surrounds the fin structure (in the depicted embodiment,
the fins 212) and isolates the fins 212 from each other. Where the
fuse device 200 is a portion of a microprocessor, memory cell, or
other integrated circuit device, the isolation feature 220 may
isolate the fuse device 200 from other devices and/or features of
such microprocessor, memory cell, or other integrated circuit
device. The isolation feature 220 includes silicon oxide, silicon
nitride, silicon oxynitride, other suitable material, or
combinations thereof. In the depicted embodiment, the isolation
feature 220 includes an oxide material, such as silicon oxide. The
filled trenches may have a multi-layer structure, for example, a
thermal oxide liner layer with silicon nitride filling the trench.
The isolation features 212 are formed by any suitable process. For
example, in the depicted embodiment, the isolation feature 220 may
be formed by completely or partially filling the trenches etched in
the substrate 210 to form the fins 212 with an insulating
material.
[0022] An epitaxial feature 230 is disposed over each fin 212 of
the fin structure. In the depicted embodiment, the epitaxial
features 230 are merged together to form a continuous epitaxial
feature 235. The epitaxial features 230 are formed by epitaxially
(epi) growing a semiconductor material on exposed portions of the
fins 212. In the depicted embodiment, the semiconductor material is
epitaxially grown by an epi process until the epitaxial features
230 of the fins 212 are merged together to form the continuous
epitaxial feature 235. The epitaxy process may use CVD deposition
techniques (such as vapor-phase epitaxy (VPE) and/or ultra-high
vacuum CVD (UHV-CVD)), molecular beam epitaxy, other suitable
processes, or combinations thereof. The epitaxy process may use
gaseous and/or liquid precursors. In the depicted embodiment, the
epitaxial features 230 (and thus the continuous epitaxial feature
235) includes silicon germanium (SiGe) formed by a silicon
germanium epitaxial process. The silicon germanium can reduce heat
transfer to the substrate 210. Alternatively, the epitaxial
features 230 (continuous epitaxial feature 235) includes other
epitaxial materials. Such epitaxial materials may be selected from
epitaxial materials having a desired thermal characteristic, such
as a low thermal conductivity. For example, the selected epitaxial
materials may exhibit a thermal resistance that reduces heat
conduction to the substrate 210. The epitaxial features 230
(continuous epitaxial feature 235) may be doped during deposition
(growth) by adding impurities to the source material of the epitaxy
process or subsequent to its deposition growth process by an ion
implantation process. The doped epitaxial layer may have a gradient
doping profile. A chemical mechanical polishing (CMP) process may
be performed to planarize the epitaxial features 230 (continuous
epitaxial feature 235).
[0023] A metal-semiconductor alloy feature 240 is disposed over the
epitaxial features 230, and in the depicted embodiment, over the
continuous epitaxial feature 235. In the depicted embodiment, the
metal-semiconductor alloy feature 240 includes a silicide material,
such as nickel silicide, cobalt silicide, tungsten silicide,
tantalum silicide, titanium silicide, platinum silicide, erbium
silicide, palladium silicide, other suitable silicides, or
combinations thereof. The metal-semiconductor alloy feature 240 may
be formed by a silicidation process, such as a self-aligned
silicide (salicide) process.
[0024] Contacts 250 are disposed over and electrically coupled with
the metal-semiconductor alloy feature 240. The metal-semiconductor
alloy feature 240 extends continuously and unbroken between the
contacts 250, and the metal-semiconductor alloy 240 serves as a
fuse element of the fuse device 200. The contacts 250 include a
conductive material, such as aluminum, copper, titanium, tantalum,
tungsten, other conductive material, alloys thereof, or
combinations thereof. In the depicted embodiment, one of the
contacts 250 is an anode of the fuse device 200 and one of the
contacts 250 is a cathode of the fuse device 200.
[0025] In operation, the contacts 250 are biased (voltage is
applied thereto) such that current flows into the contact 250
serving as the anode through the metal-semiconductor alloy feature
240 to the contact 250 serving as the cathode. When a programming
current of the fuse device 200 is reached by biasing the contacts
250, a discontinuity occurs in the metal-semiconductor alloy
feature 240 that prevents current from flowing from the anode to
the cathode via the metal-semiconductor alloy feature 240, thereby
breaking (blowing) the fuse device 200. For example, the
discontinuity may occur when a portion of the metal-semiconductor
alloy feature 240 melts from heat generated by the flowing current.
During operation, heat generated by the current flowing from the
anode to the cathode via the metal-semiconductor alloy feature 240
is largely constrained by the epitaxial features 230 (in the
depicted embodiment, the continuous epitaxial feature 235) and the
isolation feature 220 from flowing into the substrate 210. Such
heat constraint can ensure that the fuse device 200 breaks at its
designed programming current.
[0026] Characteristics of the fuse element, the metal-semiconductor
alloy feature 240, of the fuse device 200 may be similar to
characteristics of polysilicon fuse elements implemented in
conventional fuse devices. For example, similar to fuse devices
having polysilicon fuse elements, the fuse device 200 having the
metal-semiconductor alloy feature 240 (metal-semiconductor alloy
fuse element) functions at lower programming current than that
required for conventional fuse devices having copper fuse elements.
Specifically, it has been observed that the programming current of
the fuse device 200 is as much as one order of magnitude lower than
the programming current of a fuse device having a copper fuse
element (for example, the programming current of the fuse device
having the metal-semiconductor alloy fuse element may be about
2.00.times.10.sup.-3 A (amps), whereas the programming current of
the fuse device having the copper fuse element may be about
1.75.times.10.sup.-2 A). In the depicted embodiment, as noted, the
epitaxial features 230 (continuous epitaxial feature 235)
contribute to maintaining the lower programming current of the fuse
device 200 having the metal-semiconductor alloy feature 240
(metal-semiconductor alloy fuse element) by preventing or reducing
heat generated during operation from flowing to the substrate 210.
Further, as described further below, while providing desirable
programming current, the fuse device 200 having the
metal-semiconductor alloy feature 240 (metal-semiconductor alloy
fuse element) is easily implemented in high-k/metal gate
processing, as compared to fuse devices having polysilicon fuse
elements. The fuse device 200 thus achieves desirable operating
characteristics, such as those achieved by fuse devices having
polysilicon fuse elements, while achieving desirable compatibility
in conventional processing, such as that achieved by fuse devices
having copper fuse elements. Even further, when compared to fuse
devices having copper fuse elements, the fuse device 200 having the
metal-semiconductor alloy feature 240 (metal-semiconductor alloy
fuse element) can maintain its characteristics during subsequent
process development and optimization, thus minimizing possible
design changes at later process development stages. Different
embodiments may have different advantages, and no particularly
advantage is necessarily required of any embodiment.
[0027] FIG. 2A is a top view of a fuse device 300, in portion or
entirety, according to various aspects of the present disclosure.
FIG. 2B is a diagrammatic cross-sectional view of the fuse device
300 along line 2B-2B in FIG. 2A; FIG. 2C is a diagrammatic
cross-sectional view of the fuse device 300 along line 2C-2C in
FIG. 2A; and FIG. 2D is a diagrammatic cross-sectional view of the
fuse device 300 along line 2D-2D in FIG. 2A. FIGS. 2A-2D will be
discussed concurrently and have been simplified for the sake of
clarity to better understand the inventive concepts of the present
disclosure. The embodiment of FIGS. 2A-2D is similar in many
respects to the embodiment of FIGS. 1A-1D. Accordingly, similar
features in FIGS. 1A-1D and FIGS. 2A-2D are identified by the same
reference numerals for clarity and simplicity. In the fuse device
300, the epitaxial features 230 do not merge together to form the
continuous epitaxial feature 235. However, the epitaxial features
230 are proximate to one another, such that metal-semiconductor
alloy features formed on the epitaxial features 230 (also referred
to as epitaxial islands) merge together to form the
metal-semiconductor alloy feature 240, which extends continuously
and unbroken between the contacts 250. In an example, a distance
between adjacent epitaxial features 230 is less than or equal to
about 10 nm. Additional features can be added in the fuse device
300, and some of the features described below can be replaced or
eliminated for other embodiments of the fuse device 300.
[0028] FIG. 3A is a top view of a fuse device 400, in portion or
entirety, according to various aspects of the present disclosure.
FIG. 3B is a diagrammatic cross-sectional view of the fuse device
400 along line 3B-3B in FIG. 3A; FIG. 3C is a diagrammatic
cross-sectional view of the fuse device 400 along line 3C-3C in
FIG. 3A; and FIG. 3D is a diagrammatic cross-sectional view of the
fuse device 400 along line 3D-3D in FIG. 3A. FIGS. 3A-3D will be
discussed concurrently and have been simplified for the sake of
clarity to better understand the inventive concepts of the present
disclosure. The embodiment of FIGS. 3A-3D is similar in many
respects to the embodiment of FIGS. 1A-1D. Accordingly, similar
features in FIGS. 1A-1D and FIGS. 3A-3D are identified by the same
reference numerals for clarity and simplicity. Additional features
can be added in the fuse device 400, and some of the features
described below can be replaced or eliminated for other embodiments
of the fuse device 400.
[0029] In the fuse device 400, gate structures 450 control or
define the width (W) of the fuse device 400. The gate structures
450 traverse the fins 212, and in the depicted embodiment, traverse
at least two portions of the fins 212, such that during processing,
the metal-semiconductor alloy feature 240 forms between the gate
structures 450. A width of the fuse device 400 can thus be less
than that achievable by conventional processing, such as less than
a resolution limit permitted by lithography processing. Where the
fuse device 400 is included in a microprocessor, memory cell, or
other integrated circuit device, the gate structures 450 are dummy
gate structures that may be formed simultaneously with gate
structures of other devices of the microprocessor, memory cell, or
other integrated circuit device. The gate structures 450 are formed
by a suitable process, including deposition processes, lithography
patterning processes, etching processes, other suitable processes,
or combinations thereof. The deposition processes include chemical
vapor deposition (CVD), physical vapor deposition (PVD), atomic
layer deposition (ALD), high density plasma CVD (HDPCVD), metal
organic CVD (MOCVD), remote plasma CVD (RPCVD), plasma enhanced CVD
(PECVD), low-pressure CVD (LPCVD), atomic layer CVD (ALCVD),
atmospheric pressure CVD (APCVD), plating, other suitable methods,
or combinations thereof. The lithography patterning processes
include resist coating (for example, spin-on coating), soft baking,
mask aligning, exposure, post-exposure baking, developing the
photoresist, rinsing, drying (for example, hard baking), other
suitable processes, or combinations thereof. Alternatively, the
lithography exposing process is implemented or replaced by other
methods, such as maskless lithography, electron-beam writing, or
ion-beam writing. In yet another alternative, the lithography
patterning process could implement nanoimprint technology. The
etching processes include dry etching, wet etching, other etching
methods, or combinations thereof.
[0030] The gate structures 450 include a gate stack that includes a
gate dielectric 452 and a gate electrode 454. The gate stack of the
gate structures 450 may include numerous other layers, for example,
capping layers, interface layers, diffusion layers, barrier layers,
hard mask layers, or combinations thereof. The gate dielectric 452
includes a dielectric material, such as silicon oxide, high-k
dielectric material, other suitable dielectric material, or
combinations thereof. Examples of high-k dielectric material
include HfO.sub.2, HfSiO, HfSiON, HfTaO, HfTiO, HfZrO, zirconium
oxide, aluminum oxide, hafnium dioxide-alumina
(HfO.sub.2--Al.sub.2O.sub.3) alloy, other suitable high-k
dielectric materials, or combinations thereof. The gate electrode
454 includes polysilicon and/or a metal including Al, Cu, Ti, Ta,
W, Mo, TaN, NiSi, CoSi, TiN, WN, TiAl, TiAlN, TaCN, TaC, TaSiN,
other conductive materials, or combinations thereof. In the
depicted embodiment, the gate electrode 254 includes metal, and is
formed in a gate last process.
[0031] The gate structure further includes spacers 456. The spacers
456 are disposed on sidewalls of the gate stack of the gate
structure 450, such as along sidewalls of the gate dielectric 452
and the gate electrode 454. The spacers 456 include a dielectric
material, such as silicon oxide, silicon nitride, silicon
oxynitride, other suitable material, or combinations thereof. The
spacers 456 may include a multi-layer structure, such as a
multi-layer structure including a silicon nitride layer and a
silicon oxide layer. The spacers are formed by a suitable process
to a suitable thickness. For example, in the depicted embodiment,
spacers 456 may be formed by depositing a silicon nitride layer and
then dry etching the layer to form the spacers 456 as illustrated
in FIGS. 3C and 3D.
[0032] FIG. 4 is a top view of a fuse device 500, in portion or
entirety, according to various aspects of the present disclosure.
The embodiment of FIG. 4 is similar in many respects to the
embodiment of FIGS. 1A-1D, 2A-2D, and 3A-3D. Accordingly, similar
features in FIGS. 1A-1D, 2A-2D, and 3A-3D and FIG. 4 are identified
by the same reference numerals for clarity and simplicity. In the
depicted embodiment, the fuse device 500 has an asymmetric shape.
For example, the fuse device 500 has a first portion 500A and a
second portion 500B, where one of the contacts 250 is disposed over
and coupled with the first portion 500A and one of the contacts 250
is disposed over and coupled with the second portion 500B. A width
(W.sub.1) of the first portion 500A is smaller than a width
(W.sub.2) of the second portion 500B. During processing, the gate
structures 450 can be formed to define the width (W.sub.1) of the
first portion 500A, as in the depicted embodiment. In operation,
the asymmetric shape of the fuse device 500 can create a
temperature gradient, such that the fuse device 500 is easier to
break. For example, as a current travels via the
metal-semiconductor alloy feature 240 between the contacts 250,
because the width (W.sub.1) of the first portion 500A is smaller
than the width (W.sub.2) of the second portion 500B, a current
density in the first portion 500A will be greater than a current
density in the second portion 500B, such that a thermal energy (and
thus temperature) in the first portion 500A is greater than a
thermal energy (and thus temperature) in the second portion 500B.
Such temperature gradient can provide improved programmability,
such as improved programming current ability for breaking the fuse
device 500. It is noted that the asymmetric shape of the fuse
device 500 is merely an example, and that other asymmetric shapes
of fuse devices that achieve desired programmability are
contemplated by the present disclosure. Additional features can be
added in the fuse device 500, and some of the features described
below can be replaced or eliminated for other embodiments of the
fuse device 500.
[0033] FIG. 5 is a flow chart of a method 600 for fabricating an
integrated circuit device according to various aspects of the
present disclosure. In the depicted embodiment, the method 600
fabricates an integrated circuit device that includes a fuse
device, specifically a FinFET based, metal-semiconductor alloy fuse
device, such as fuse devices 200, 300, 400, and 500 described above
with reference to FIGS. 1A-1D, 2A-2D, 3A-3D, and 4, respectively.
The method 600 begins at block 610 a plurality of fins are formed
over a substrate. The substrate may be similar to the substrate 210
and the fins may be similar to the fins 212 described above. At
block 620, an epitaxial layer is formed over each of the plurality
of fins. The epitaxial layer may be similar to the epitaxial
features 230 (or continuous epitaxial feature 235) described above.
At block 630, a metal-semiconductor alloy feature is formed over
the epitaxial layer. The metal-semiconductor alloy feature may be
similar to the metal-semiconductor alloy feature 240 described
above. At block 640, a first contact and a second contact are
formed that are coupled with the metal-semiconductor alloy feature,
where the metal-semiconductor alloy feature extends continuously
between the first contact and the second contact. The first and
second contacts may be similar to the contacts 250 described above.
The method 600 may continue to complete fabrication of the
integrated circuit device. Additional steps can be provided before,
during, and after the method 600, and some of the steps described
can be replaced or eliminated for other embodiments of the method
600. For example, before the epitaxial layer is formed over each of
the plurality of fins, gate structures may be formed that traverse
the plurality of fins. The gate structures may be similar to the
gate structures 450 described above. The metal-semiconductor alloy
feature may therefore be confined to forming between the gate
structures. In an example, the gate structures include a gate
dielectric, such as a high-k gate dielectric layer, and a dummy
gate electrode, such as a polysilicon gate electrode. In accordance
with this example, the dummy gate electrode may be replaced with a
metal gate after the metal-semiconductor alloy feature is
formed.
[0034] It is noted that the method 600 can form the fuse devices
described herein while simultaneously forming other devices of the
integrated circuit device. For example, the method 600 may
simultaneously form the FinFET based, metal-semiconductor alloy
fuse device and a FinFET device of the integrated circuit device.
The fuse devices described herein are thus compatible with
conventional complementary metal-oxide-semiconductor (CMOS)
processing, particularly high-k/metal gate CMOS processing.
Accordingly, manufacturing costs and manufacturing time are not
negatively impacted by implementing the fuse devices described
herein in integrated circuit device manufacturing. Different
embodiments may have different advantages, and no particularly
advantage is necessarily required of any embodiment.
[0035] The present disclosure provides for many different
embodiments. In an example, a device includes a semiconductor
substrate; a fin structure disposed over the semiconductor
substrate, wherein the fin structure includes at least two fins
disposed over the substrate; an epitaxial semiconductor feature
disposed over each of the at least two fins; a metal-semiconductor
alloy feature disposed over the epitaxial semiconductor feature of
each of the at least two fins; and a first contact and a second
contact coupled with the metal-semiconductor alloy feature, wherein
the metal-semiconductor alloy feature extends continuously between
the first contact and the second contact. The epitaxial
semiconductor feature disposed over each of the at least two fins
may be merged together to form a continuous epitaxial feature
disposed over the at least two fins. The epitaxial semiconductor
feature may include silicon germanium. The metal-semiconductor
alloy feature may include a silicide material. The semiconductor
substrate may be a silicon-on-insulator substrate. A width of the
metal-semiconductor alloy feature may be defined by at least two
gate structures, each of the at least two gate structures
traversing the at least two fins. In an example, at least two gate
structures include a gate stack having a gate dielectric layer
disposed over the at least two fins and a gate electrode disposed
over the gate dielectric layer. The gate dielectric layer may be a
high-k dielectric layer, and the gate electrode may be a metal gate
electrode.
[0036] In another example, a fuse device includes a first contact
and a second contact coupled with a metal-semiconductor alloy
layer, wherein the metal-semiconductor alloy layer extends
continuously between the first contact and the second contact. The
metal-semiconductor alloy layer is disposed over an epitaxial layer
that is disposed over a fin structure of a substrate. In an
example, the substrate and the fin structure include silicon; the
epitaxial layer includes silicon germanium; and the
metal-semiconductor alloy layer includes a silicide material, such
as nickel silicide, cobalt silicide, tungsten silicide, tantalum
silicide, titanium silicide, platinum silicide, erbium silicide,
palladium silicide, or combinations thereof. The epitaxial layer
may extend continuously between fins of the fin structure. The
epitaxial layer may include gaps between fins of the fin structure,
where the metal-semiconductor alloy layer at least partially fills
the gaps. The metal-semiconductor alloy feature may be disposed
between gate structures that traverse fins of the fin structure. In
an example, the metal-semiconductor alloy feature has a first
portion having a first width and a second portion having a second
width, the second width being larger than the first width, where
the first contact is coupled with the first portion and the second
contact is coupled with the second portion. The first portion of
the metal-semiconductor alloy feature may be disposed between gate
structures that traverse fins of the fin structure, such that the
first width of the first portion is defined by the gate
structures.
[0037] In yet another example, a method includes forming a
plurality of fins over a substrate; forming an epitaxial layer over
each of the plurality of fins; forming a metal-semiconductor alloy
feature over the epitaxial layer; and forming a first contact and a
second contact coupled with the metal-semiconductor alloy feature,
wherein the metal-semiconductor alloy feature extends continuously
between the first contact and the second contact. Forming the
epitaxial layer over each of the plurality of fins may include
epitaxially growing a semiconductor material on each of the
plurality of fins until the semiconductor material grown on each of
the plurality of fins merges together to form a continuous
epitaxial layer. The method may further include forming gate
structures that traverse the plurality of fins before forming the
epitaxial layer. The method may further include replacing a dummy
gate of the gate structures with a metal gate after forming the
metal-semiconductor alloy feature.
[0038] The foregoing outlines features of several embodiments so
that those skilled in the art may better understand the aspects of
the present disclosure. Those skilled in the art should appreciate
that they may readily use the present disclosure as a basis for
designing or modifying other processes and structures for carrying
out the same purposes and/or achieving the same advantages of the
embodiments introduced herein. Those skilled in the art should also
realize that such equivalent constructions do not depart from the
spirit and scope of the present disclosure, and that they may make
various changes, substitutions, and alterations herein without
departing from the spirit and scope of the present disclosure.
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