U.S. patent application number 13/215725 was filed with the patent office on 2013-02-28 for interconnection elements with encased interconnects.
This patent application is currently assigned to TESSERA, INC.. The applicant listed for this patent is Belgacem Haba, Ilyas Mohammed. Invention is credited to Belgacem Haba, Ilyas Mohammed.
Application Number | 20130050972 13/215725 |
Document ID | / |
Family ID | 47743471 |
Filed Date | 2013-02-28 |
United States Patent
Application |
20130050972 |
Kind Code |
A1 |
Mohammed; Ilyas ; et
al. |
February 28, 2013 |
INTERCONNECTION ELEMENTS WITH ENCASED INTERCONNECTS
Abstract
An interconnection element is disclosed that includes a
plurality of drawn metal conductors, a dielectric layer, and
opposed surfaces having a plurality of wettable contacts thereon.
The conductors may include grains having lengths oriented in a
direction between the first and second ends of the conductors. A
dielectric layer for insulating the conductors may have first and
second opposed surfaces and a thickness less than 1 millimeter
between the first and second surface. One or more conductors may be
configured to carry a signal to or from a microelectronic element.
First and second wettable contacts may be used to bond the
interconnection element to at least one of a microelectronic
element and a circuit panel. The wettable contacts may match a
spatial distribution of element contacts at a face of a
microelectronic element or of circuit contacts exposed at a face of
component other than the microelectronic element.
Inventors: |
Mohammed; Ilyas; (Santa
Clara, CA) ; Haba; Belgacem; (Saratoga, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Mohammed; Ilyas
Haba; Belgacem |
Santa Clara
Saratoga |
CA
CA |
US
US |
|
|
Assignee: |
TESSERA, INC.
San Jose
CA
|
Family ID: |
47743471 |
Appl. No.: |
13/215725 |
Filed: |
August 23, 2011 |
Current U.S.
Class: |
361/807 ;
174/110R; 174/119R; 257/E21.499; 29/858; 438/119 |
Current CPC
Class: |
H05K 2203/0235 20130101;
H01L 2224/16225 20130101; H01L 2924/15311 20130101; H01R 12/523
20130101; H01L 21/486 20130101; H01L 23/49838 20130101; H05K 3/4602
20130101; H05K 2201/10378 20130101; H01L 23/49827 20130101; Y10T
29/49176 20150115 |
Class at
Publication: |
361/807 ;
438/119; 174/119.R; 174/110.R; 29/858; 257/E21.499 |
International
Class: |
H05K 7/04 20060101
H05K007/04; H01B 7/00 20060101 H01B007/00; H01R 43/00 20060101
H01R043/00; H01L 21/50 20060101 H01L021/50 |
Claims
1. An interconnection element, comprising: a plurality of drawn
metal conductors each having a structure in which grains therein
have lengths oriented in a direction between first and second ends
thereof; and a dielectric layer surrounding and insulating the
conductors, the dielectric layer having first and second opposed
surfaces and a thickness less than 1 millimeter between the first
and second surfaces, wherein the first and second ends of each
conductor are not covered by the dielectric layer at the first and
second surfaces, at least one of the conductors being configured
for carrying a signal to or from a microelectronic element; the
element having first and second pluralities of wettable contacts
adjacent the first and second opposed surfaces, respectively, the
first and second wettable contacts being usable to bond the
interconnection element to at least one of a microelectronic
element and a circuit panel, at least one of the first wettable
contacts or the second wettable contacts matching a spatial
distribution of element contacts at a face of the microelectronic
element and at least one of the first wettable contacts or the
second wettable contacts matching a spatial distribution of circuit
contacts exposed at a face of a component other than the
microelectronic element.
2. The interconnection element of claim 1, wherein a tolerance for
a cross-sectional width of the metal conductors is 1 micron for a
50 micron width or diameter.
3. The interconnection element of claim 1, wherein a surface
roughness of the metal conductors is less than 1 micron.
4. The interconnection element of claim 1, wherein the metal
conductors are comprised of a metal alloy.
5. The interconnection element of claim 1, wherein a thickness of
the metal conductors is less than 0.5 millimeters.
6. The interconnection element of claim 1, wherein a thickness of
the conductors is less than 100 microns.
7. The interconnection element of claim 1, wherein the conductors
have annular shape.
8. The interconnection element of claim 7, wherein each conductor
surrounds a dielectric core.
9. The interconnection element of claim 8, wherein the conductors
are hollow.
10. The interconnection element of claim 9, wherein air or gas is
inside of the conductors.
11. The interconnection element of claim 1, wherein the first
wettable contacts define a first pitch and wherein the second
wettable contacts define a second pitch that is different from the
first pitch.
12. An interconnection component, comprising: a plurality of drawn
metal conductors each having a structure in which grains therein
have lengths oriented in a direction between first and second ends
thereof; a common metal region surrounding individual ones of the
conductors, the common metal region configured to carry a common
electric potential; and a dielectric separating the individual ones
of the conductors from the common metal region, the dielectric
having first and second opposed surfaces and a thickness less than
0.5 millimeters between the first and second surfaces, wherein the
first and second ends of each conductor are not covered by the
dielectric layer at the first and second surfaces; wherein the
interconnection component has first and second pluralities of
wettable contacts adjacent the first and second opposed surfaces,
respectively, the first and second wettable contacts being usable
to bond the interconnection component to at least one of a
microelectronic element and a circuit panel, at least one of the
first wettable contacts or the second wettable contacts matching a
spatial distribution of element contacts at a face of a
microelectronic element or matching a spatial distribution of
circuit contacts at a face of a circuit panel.
13. The interconnection element of claim 12, wherein a tolerance
for a cross-sectional width of the metal conductors is 1 micron for
a 50 micron width or diameter.
14. The interconnection element of claim 12, wherein a surface
roughness of the metal conductors is less than 1 micron.
15. The interconnection element of claim 12, wherein the metal
conductors are comprised of a metal alloy.
16. The interconnection element of claim 12, wherein a thickness of
the metal conductors is less than 0.5 millimeters.
17. The interconnection element of claim 12, wherein a thickness of
the conductors is less than 100 microns.
18. The interconnection element of claim 12, wherein the first
wettable contacts define a first pitch and wherein the second
wettable contacts define a second pitch that is different from the
first pitch.
19. A system comprising: a microelectronic package comprising the
interconnection element of claim 1 or 12, and wherein the second
wettable contacts are bonded to a microelectronic element; and one
or more other electronic components electrically connected with the
package.
20. A system as claimed in claim 19 further comprising a housing,
the package and the one or more other electronic components being
mounted to the housing.
21. A method for manufacturing at least one interconnection
component, comprising: arranging a plurality of individual
insulated elongated metal conductors in a plurality of rows, the
conductors having widths less than 100 microns; treating the
arranged conductors to cause the dielectric material to form a
unitary body in which the positions of the conductors are fixed;
and severing the unitary body in a direction transverse to the
lengths of the conductors to form the at least one interconnection
component having severed portions of the conductors exposed at
first and second opposed surfaces, the conductors being insulated
from one another, the thickness between first and second surfaces
less than 0.5 millimeters.
22. The method for manufacturing of claim 21, wherein the elongated
metal conductors are extruded conductors.
23. The method of claim 21, wherein a maximum distance between any
two adjacent conductors is less than 0.5 millimeters.
24. The method of claim 21, wherein dielectric material insulating
respective conductors extend between opposed ends of the respective
conductors.
25. The method of claim 21, wherein the step of arranging includes
filling each position of the array with an individually insulated
metal conductor.
26. The method of claim 21, wherein the step of arranging includes
arranging a plurality of individual elongated metal conductors at
at least some positions of the array, so as to provide at least a
first spacing between some of the conductors and a second spacing
between others of the metal conductors.
27. The method of claim 21, wherein the at least one component has
first and second pluralities of wettable contacts adjacent the
first and second opposed surfaces, respectively, the first and
second wettable contacts being usable to bond the interconnection
component to at least one of a microelectronic element or a circuit
panel, at least one of the first wettable contacts or the second
wettable contacts configured for bonding to element contacts on a
face of a microelectronic element and at least one of the first
wettable contacts or the second wettable contacts configured for
bonding to circuit contacts on a face of a circuit panel.
28. The method of claim 27, wherein the wettable contacts are
defined by first exposed end surfaces or opposed second exposed end
surfaces of the metal conductors embedded within the at least one
component.
29. The method of claim 28, further comprising forming conductive
elements, including at least some of the second wettable contacts
in electrical connection with the second end surfaces.
30. A method for making a microelectronic assembly, including:
mounting an interconnection component made according to claim 1 or
12 to a substrate having a plurality of first contacts thereon such
that at least some of the first wettable contacts are electrically
connected with the first contacts; and mounting a microelectronic
element having a plurality of second contacts at a face thereof to
the interconnection component such that at least some of the second
contacts are electrically connected with the second wettable
contacts of the interconnection component.
31. The method of claim 30, wherein the step of mounting the
microelectronic element includes joining the second contacts with
the second wettable contacts through masses of conductive bonding
material.
32. The method of claim 31, wherein the step of mounting the at
least one interconnection component with the substrate includes
joining the first contacts with the first wettable contacts through
masses of conductive bonding material.
33. The method of claim 30, wherein the plurality of conductors are
formed from at least one of the group consisting of: gold, copper,
copper alloy, aluminum, and nickel.
34. A method for manufacturing at least one interconnection
component, comprising: arranging a plurality of individual
elongated metal conductors and elongated individual dielectric
elements in parallel in an array, the dielectric elements
separating at least some of the conductors from one another;
heating the array to cause the dielectric material to form a
unitary body in which the positions of the metal conductors are
fixed; and severing the unitary body in a direction transverse to
the lengths of the metal conductors to form at least one component
having severed portions of the metal conductors arranged in the
array and insulated from one another.
35. A method for manufacturing at least one interconnection
component, comprising: successively: a) arranging a plurality of
lengths of first conductors in parallel along surfaces of a core
member; b) forming a dielectric layer separating the lengths from
one another, the dielectric layer having substantially planar
surfaces; c) arranging a plurality of lengths of additional
conductors in parallel along the surfaces of the dielectric layer;
d) forming an additional dielectric layer separating the lengths of
the additional conductors from one another, the additional
dielectric layer having substantially planar surfaces; e) repeating
steps c) and d) one or more times to form a plurality of the
additional dielectric layers each of which separates additional
conductors therein from one another; and f) severing the unitary
body in a direction transverse to the lengths of the first and
additional conductors to form at least one component having severed
portions of the conductors arranged in an array and insulated from
one another.
36. A method for manufacturing at least one interconnection
component, comprising: threading a plurality of lengths of metal
conductors in a parallel serpentine paths around a plurality of
members defining respective turning locations in the paths; forming
a unitary body having dielectric material insulating the metal
conductors from one another and insulating respective path segments
of each metal conductor from one another; and severing the unitary
body in a direction transverse to the lengths of the path segments
to form at least one component having severed portions of the metal
conductors arranged in an array and insulated from one another.
37. The method as claimed in claim 36, wherein the at least one
component has first and second opposed surfaces and each severed
portion is uncovered by the dielectric material of the body at the
first and second surfaces.
Description
BACKGROUND OF THE INVENTION
[0001] Interconnection elements or components, such as interposers,
are used in electronic assemblies to facilitate connection between
components with different connection configurations or to provide
needed spacing between components in a microelectronic assembly.
Some interposers may be used as components of microelectronic
assemblies. These microelectronic assemblies generally include one
or more packaged microelectronic elements such as one or more
semiconductor chips mounted on a substrate. The conductive elements
of the interposer can include the conductive traces and terminals
that can be used for making electrical connection with a larger
substrate or circuit panel in the form of a printed circuit board
("PCB") or the like. This arrangement facilitates electrical
connections needed to achieve desired functionality of the devices.
The chip can be electrically connected to the traces and hence to
the terminals, so that the package can be mounted to a larger
circuit panel by bonding the terminals of the circuit panel to
contact pads on the interposer.
[0002] Despite considerable efforts devoted in the art heretofore
to development of interposers and methods for fabricating such
components, further improvement is desirable.
BRIEF SUMMARY OF THE INVENTION
[0003] In a first aspect of the invention, there is an
interconnection element that includes metal conductors and a
dielectric layer surrounding and insulating the conductors. The
conductors may be a plurality of drawn metal conductors that each
have a structure in which the grains therein have lengths oriented
in a direction between the first and second ends of the metal
conductor. The dielectric layer may have first and second opposed
surfaces, as well as a thickness less than 1 millimeter between the
first and second surfaces. The first and second ends of each
conductor are not covered by the dielectric layer at the first and
second surfaces. At least one of the conductors may be configured
for carrying a signal to or from a microelectronic element. The
interconnection element may have first and second pluralities of
wettable contacts adjacent the first and second opposed surfaces,
respectively. The first and second wettable contacts may be usable
to bond the interconnection element to at least one of a
microelectronic element and a circuit panel. At least one of the
first wettable contacts or the second wettable contacts may match a
spatial distribution of element contacts at a face of the
microelectronic element and at least one of the first wettable
contacts or the second wettable contacts may match a spatial
distribution of circuit contacts exposed at a face of a component
other than the microelectronic element.
[0004] In another aspect of the present invention, an
interconnection component includes a plurality of drawn metal
conductors, a common metal region surrounding individual ones of
the conductors, and a dielectric separating the individual ones of
the conductors from the common metal region. The plurality of drawn
metal conductors may each have a structure in which grains therein
have lengths oriented in a direction between first and second ends
thereof. The common metal region may be configured to carry a
common electric potential. The dielectric may have first and second
opposed surfaces and a thickness less than 0.5 millimeters between
the first and second surfaces. The first and second ends of each
conductor may not be covered by the dielectric layer at the first
and second surfaces. The interconnection component may have first
and second pluralities of wettable contacts adjacent the first and
second opposed surfaces, respectively. The first and second
wettable contacts may be usable to bond the interconnection
component to at least one of a microelectronic element and a
circuit panel. At least one of the first wettable contacts or the
second wettable contacts may match a spatial distribution of
element contacts at a face of a microelectronic element or may
match a spatial distribution of circuit contacts at a face of a
circuit panel.
[0005] In one embodiment in accordance with the first or second
aspect, a tolerance for a cross-sectional width of the metal
conductors is 1 micron for a 50 micron width or diameter.
[0006] In another embodiment, in accordance with the first or
second aspect, a surface roughness of the metal conductor is less
than 1 micron.
[0007] In still another embodiment, in accordance with the first or
second aspect, the metal conductor is comprised of a metal alloy.
The thickness of the metal conductor may be less than 0.5
millimeters or less than 100 microns.
[0008] In another embodiment, in accordance with the first or
second aspect, the conductors may have an annular shape and each
conductor may surround a dielectric core. Instead of a dielectric
core, the conductor may instead be hollow, and include air or
gas.
[0009] In another embodiment, in accordance with the first or
second aspect, the first wettable contacts define a first pitch and
the second wettable contact define a second pitch that is different
from the first pitch.
[0010] In another embodiment, in accordance with the first or
second aspect, a system comprises a microelectronic package and one
or more other electronic components. The microelectronic package is
comprised of the interconnection element and second wettable
contacts bonded to the microelectronic element. One or more other
electronic components are electrically connected with the package.
Alternatively, the system further comprises a housing, and the
package and the one or more other electronic components is mounted
to the housing.
[0011] In a third aspect of the presently disclosed embodiment,
there is a method for manufacturing at least one interconnection
component that comprises arranging a plurality of individual
insulated elongated metal conductors in parallel in an array,
treating the conductors to form a unitary body and severing the
unitary body. The conductors may have widths less than 100 microns.
During the step of treating, the dielectric material forms a
unitary body in which the positions of the conductors are fixed.
During the severing step, the unitary body may be severed in a
direction transverse to the lengths of the conductors to form at
least one interconnection component having severed portions of the
conductors exposed at first and second opposed surfaces, such that
the thickness between the first and second surfaces is less than
0.5 millimeters. The conductors will be insulated from one
another.
[0012] In another embodiment, the elongated metal conductors are
extruded conductors.
[0013] In another embodiment, a maximum distance between any two
adjacent conductors is less than 0.5 millimeters.
[0014] In still another embodiment, dielectric material insulating
respective conductors extends between opposed ends of the
respective conductors.
[0015] In yet another embodiment, the step of arranging includes
filling each position of the array with an individually insulated
metal conductor.
[0016] In another embodiment, the step of arranging includes
arranging a plurality of individual elongated metal conductors at
at least some positions of the array. This provides at least a
first spacing between some of the metal conductors and a second
spacing between others of the metal conductors.
[0017] In another embodiment, the at least one component has first
and second pluralities of wettable contacts adjacent the first and
second opposed surfaces, respectively. The first and second
wettable contacts may bond the interconnection component to at
least one of a microelectronic element or a circuit panel. At least
one of the first wettable contacts or the second wettable contacts
may be configured for bonding to element contacts on a face of a
microelectronic element and at least one of the first wettable
contacts or the second wettable contacts may be configured for
bonding to circuit contacts on a face of a circuit panel.
[0018] In another alternative embodiment, the wettable contacts are
defined by first exposed end surfaces or opposed second exposed end
surfaces of the metal conductors embedded within the at least one
component.
[0019] In still another embodiment, the method further includes
forming conductive elements, including at least some of the second
wettable contacts in electrical connection with the second end
surfaces.
[0020] In another aspect of the presently disclosed embodiments, a
method for making a microelectronic assembly includes mounting an
interconnection component made according to the first or second
aspects of the embodiments discussed above to a substrate having a
plurality of first contacts thereon. The at least some of the first
wettable contacts may be electrically connected with the first
contacts. The method further includes mounting a microelectronic
element that has a plurality of second contacts exposed at a face
thereof to the interconnection component. At least some of the
second contacts are electrically connected with the second wettable
contacts of the interconnection component.
[0021] In alternative embodiment of this aspect, the step of
mounting the microelectronic element includes joining the second
contacts with the second wettable contacts through masses of
conductive bonding material.
[0022] In another embodiment, the step of mounting the at least one
interconnection component with the substrate includes joining the
first contacts with the first wettable contacts through masses of
conductive bonding material.
[0023] In another embodiment, the plurality of conductors are
formed from at least one of the group consisting of: gold, copper,
copper alloy, aluminum, and nickel.
[0024] In accordance with another aspect of the presently disclosed
embodiments, a method for manufacturing at least one
interconnection component includes the steps of arranging a
plurality of individual elongated metal conductors and elongated
individual dielectric elements in parallel in an array; heating the
array to cause the dielectric material to form a unitary body in
which the positions of the metal conductors are fixed; and severing
the unitary body in a direction transverse to the lengths of the
metal conductors to form at least one component having severed
portions of the metal conductors arranged in the array and
insulated from one another. The dielectric elements may separates
at least some of the conductors from one another.
[0025] In accordance with another aspect of the presently disclosed
embodiments, a method for manufacturing at least one
interconnection component includes the steps of successively: a)
arranging a plurality of lengths of first conductors in parallel
along surfaces of a core member; b) forming a dielectric layer that
has substantially planar surfaces and separating the lengths from
one another; c) arranging a plurality of lengths of additional
conductors in parallel along the surfaces of the dielectric layer;
d) forming an additional dielectric layer separating the lengths of
the additional conductors from one another, such that the
additional dielectric layer has substantially planar surfaces; e)
repeating steps c) and d) one or more times to form a plurality of
the additional dielectric layers each of which separates additional
conductors therein from one another; and f) severing the unitary
body in a direction transverse to the lengths of the first and
additional conductors to form at least one component having severed
portions of the conductors arranged in an array and insulated from
one another.
[0026] In accordance with another aspect of the presently disclosed
embodiments, a method for manufacturing at least one
interconnection component includes the steps of threading a
plurality of lengths of metal conductors in a parallel serpentine
paths around a plurality of members defining respective turning
locations in the paths; forming a unitary body having dielectric
material insulating the metal conductors from one another and
insulating respective path segments of each metal conductor from
one another; and severing the unitary body in a direction
transverse to the lengths of the path segments to form at least one
component having severed portions of the metal conductors arranged
in an array and insulated from one another.
[0027] In an alternative embodiment, the at least one component has
first and second opposed surfaces and each severed portion is
uncovered by the dielectric material of the body at the first and
second surfaces.
BRIEF DESCRIPTION OF THE DRAWINGS
[0028] FIG. 1 is a perspective view of an interconnection element
in accordance with one embodiment.
[0029] FIG. 1A is a cross-sectional view taken along line A-A of
FIG. 1.
[0030] FIG. 1B is an alternative embodiment of FIG. 1A.
[0031] FIG. 1C is an alternative embodiment of FIG. 1A.
[0032] FIG. 1D is an alternative embodiment of FIG. 1A.
[0033] FIG. 1E is an alternative embodiment of FIG. 1A.
[0034] FIG. 1F is an alternative embodiment of FIG. 1A.
[0035] FIG. 1G is an alternative embodiment of FIG. 1A.
[0036] FIGS. 2, 2', 2A, 2B, 2C, and 2D illustrate steps in one
embodiment of making the interconnection element of FIG. 1.
[0037] FIG. 2E is an alternative embodiment of FIG. 2D.
[0038] FIGS. 3, 3A, and 3B illustrate an alternative method of
making an alternative interconnection element.
[0039] FIGS. 4, 4A, 4B, 4C, and 4D illustrate an alternative method
of making the interconnection element of FIG. 1.
[0040] FIGS. 5, 5A, and 5B illustrate an alternative method of
making an alternative interconnection element.
[0041] FIGS. 6, 6A, 6B, 6C, and 6D illustrate an alternative method
of making an alternative interconnection element.
[0042] FIGS. 7, 7A, 7B, 7C, and 7D illustrate an alternative method
of making an alternative interconnection element.
[0043] FIGS. 8, 8A, 8B, and 8C illustrate an alternative method of
making an alternative interconnection element in accordance with
one embodiment.
[0044] FIGS. 9, 9A, 9B, 9C, 9D, 9E, and 9F illustrate an
alternative method of making an alternative interconnection
element.
[0045] FIGS. 10, 10A, 10B, 10B-1, 10B-2, 10C, 10D, 10E and 10F
illustrate an alternative method of making an alternative
interconnection element.
[0046] FIG. 11 is a cross-sectional view of a system incorporating
an interconnection element.
DETAILED DESCRIPTION
[0047] Referring first to FIG. 1, there is shown an interconnection
element 100 with encased interconnects or conductors 102 in
accordance with one embodiment. The interconnection element 100 may
be in the shape of a square, but any desired shape of
interconnection element may be obtained. The interconnection
element seen in FIG. 1 is comprised of a unitary dielectric body
116 including a dielectric insulating material, which insulates
respective conductors 102 from one another. In an exemplary
embodiment, the dielectric material of the unitary dielectric body
116 can be a polymeric material or a composite material such as a
reinforced polymeric material. In a particular example, the
polymeric material can be or include a thermoplastic or thermoset
plastic material which binds the conductors 102 together in the
unitary dielectric body 116. In another example, the dielectric
material can be or include a dielectric material which has a
coefficient of thermal expansion of less than 10 parts per million
per degree Celsius (hereinafter "ppm/.degree. C."), such as glass
or ceramic material, among others. In one example, the dielectric
material can be or include a liquid crystal polymer material. The
interconnection element 100 may have a dimension X1 that is 500
millimeters and a dimension X2 that is also 500 millimeters, but
any desired dimensions may be used. For example, in a finished
product the interconnection element 100 may be a few millimeters to
a few tens of millions of millimeters. Additionally, the
interconnection element 100, as well as the metal conductors 102
within the interconnection element, may have a thickness X3 that is
less than 0.5 millimeters. The overall shape of the interconnection
element need not be square. In one example, the dimensions X1 and
X2 are not the same.
[0048] Encased interconnects or conductors 102 are shown embedded
within the dielectric material. As will be discussed in more detail
herein, the conductors 102 may be conductor portions that include
severed portions of elongated metal conductors 104 (FIG. 2) encased
within the dielectric material. The conductors 102 can be arranged
in any pattern. For example, the conductors may be arranged in
regular rows in which conductors therein are equally spaced apart
and all positions of each row being occupied by a conductor 102.
Alternatively, in the case shown in FIG. 1, there may be a portion
or row of the interconnection element in which one or more
positions of a row is missing one or more conductors. For example,
at position X in bottom row 111 of conductors 102, there is at
least one missing conductor.
[0049] Turning now to FIG. 1A, in a corresponding cross-section
through line A-A of FIG. 1, interconnection element 100 is free
from any electrically conductive interconnects running between
encased portions 102 of the metal conductors 102 or elsewhere in an
at least partially lateral direction (parallel to the first and
second surfaces 124, 126 of interconnection element 100) within the
dielectric body 116 of the interconnection element 100 between the
end surfaces 101, 103 of the conductors 104. As shown in FIG. 1B,
traces 160 or the like can be used to form connections running in a
lateral direction outside of the area that lies between end
surfaces 101, 103. In an example, there are no lateral connections
within the dielectric body 116 of the interconnection element 100.
In another example, within dielectric body 116, the only
connections formed are by the portions 102 of metal conductors 104
between the first surface 124 and second surface 126 of the
interconnection element 100.
[0050] In the interconnection element of FIG. 1C, end surfaces 103
of conductor portions 102 can be wettable contacts 150 usable to
join conductor portions 102 to another component using solder or
other conductive materials. For example, in FIG. 1F, end surfaces
103 of conductor portions 102 are joined to solder balls 154, which
are, in turn, joined to contacts 180 on a circuit panel, e.g., a
PCB 178 or other component. In one example (not shown), on an
interconnection element 100 (FIGS. 1-1A), end surfaces 101 of metal
conductors 104 can be joined to solder balls 154, which, in turn,
can be joined to contacts 176 on a microelectronic element 174.
Other materials can be used in place of solder to join features of
the components of the assembly such as tin, indium, a conductive
paste or a conductive matrix material. Additional wettable metal
layers or structures can be added to interconnection element 100
that can be wettable contacts for connection to other
microelectronic components. Such wettable metal layers or
structures can be a noble metal or alloys thereof, such as copper,
nickel, gold, or platinum palladium, among others. In one example,
an organic solderability preservative ("OSP") can coat a metal
contact to avoid oxidation and to preserve the wettability of the
metal contacts.
[0051] In variations of the interconnection element 100 (FIGS.
1-1A), structures that can be wettable contacts include portions of
traces or contact pads or pads 162 that can be patterned with
traces 160 or can overlie surfaces 124 or 126 of the dielectric
body.
[0052] In the embodiment shown in FIG. 1C, wettable contacts can be
provided as contact pads 162, electrically interconnected with end
surfaces 101 through traces 160 and other electrically conductive
structures, e.g., conductive vias 166. In one example, traces 160
can electrically connect to and overlie respective end surfaces 101
and extend away therefrom in a direction parallel to surface 124 in
a redistribution layer 168. Traces 160 can be used to provide a
wettable contact at a laterally offset position from the location
of end surface 101. In the embodiment shown in FIG. 1C, multiple
layers of traces 160 are formed within or on a redistribution
dielectric 171 of redistribution layer 168; however, a single layer
could be used to achieve a desired offset configuration. The layers
of traces are separated from one another by portions of the
redistribution dielectric 171 that extend between the traces 160
both in different layers and within the same layer. The traces 160
are connected, as desired, between layers using conductive vias
166, which are formed through portions of redistribution dielectric
171.
[0053] Traces 160 can have different widths, including widths which
are smaller or larger than the widths of end surfaces 101,103 of
metal conductors 102. This facilitates fabrication of an
interconnection element having high routing density. Generally, the
widths of traces 160 are selected in a range from about 5 to 100
.mu.m (e.g., 20-40 .mu.m); however, portions of traces (such as
portions of traces 160 or contact pads 162 used as wettable
contacts) or some traces themselves can have widths greater than
100 .mu.m. Together with the metal conductors 102, traces 160 can
form an electrical circuit of interconnection element 100. Each
trace 160 can be connected to at least one metal conductor 102 or
to at least one other trace. However, some traces can "float," in
that they can be electrically disconnected from posts and other
traces. Likewise, one or more of the posts can remain unconnected
to any traces. Other metal structures such as ground planes or
ground rings may also be provided in a metal layer that includes
the traces 160 or contacts 162.
[0054] An embodiment of interconnection element 100 having one or
more redistribution layers 168 can allow interconnection element
100 to be used to connect to a microelectronic component having a
different connection configuration than the configuration of metal
conductors 104. In particular, interconnection element 100 can be
configured with a redistribution layer that results in wettable
contacts having different pitches above or at surfaces 124,126 of
the component. As shown in FIG. 1C, the pitch of end surfaces 101
used as wettable contacts formed on the first surface 124 is
greater than the pitch of the wettable contacts formed by vias 166
on the surface 125 of redistribution layer 168. The embodiment
shown in FIG. 1D is similar in this respect, in that the pitch of
the wettable contacts that are the contact pads 162 on surface 126
of the interconnection element 100 is greater than the pitch of the
wettable contacts that are pads 162 on the surface 125 of the
redistribution layer 168.
[0055] As shown in FIGS. 1F and 1G, interconnection element 100 in
either of the forms shown in FIGS. 1F and 1G, respectively, can be
used to connect two components with respective contacts having
different pitches or other different configurations. In the example
shown in FIG. 1F, microelectronic element 174 has contacts 176
having a smaller pitch than the pitch of contacts 180 on PCB 178.
Contacts 180 of PCB 178 are joined to end surfaces 103, which act
as wettable contacts therefor, and contacts 176 of microelectronic
element 174 are joined to contact pads 162 exposed at the surface
125 of the redistribution layer 168 of interconnection element 100,
which is inverted with respect to the depiction of FIG. 1C. The
embodiment shown in FIG. 1G is similar to that which is shown in
FIG. 1F, except that contact pads or pads 184, which overlie end
surfaces 103, act as wettable contacts for attachment to contacts
180 of PCB 178 using solder balls 154.
[0056] FIG. 1E shows an embodiment of interconnection element 100
having a second redistribution layer 182 formed along the second
surface 126 of the interconnection element 100. The second
redistribution layer 182 is similar to the first redistribution
layer 168, except that, in the embodiment shown, contacts 184
overlie portions of the second surface 186 of the interconnection
element 100. Contact pads 184 are connected to respective end
surfaces 103 of metal conductors 102 by traces 192 and additional
conductive vias 188 formed within redistribution dielectric 194.
Further, pads 184 can be offset from respective end surfaces 103 to
which they are electrically connected so as to be useable as
wettable contacts on surface 186, which is a different
configuration than end surfaces 103. In the embodiment shown, the
wettable contacts formed by contact pads 184 have a greater pitch
than end surfaces 103 and an even greater pitch than that of the
contact pads 162 on the surface 125 of the first redistribution
layer 168 that are useable as wettable contacts on surface 125.
Such an arrangement can be used to form pitches for wettable
contacts that differ between their respective surfaces by a factor
of at least 1.5 and, in some embodiments, a factor of at least
about 2. It is noted that contact pads 184,162 can overlie and
connect directly to vias 166,188. Alternatively, pads 190 can be
connected directly to traces 160 either by a form of bonding or by
being integrally formed therewith and exposed at either of surfaces
186 and 125. The embodiment of interconnection element 100 shown in
FIG. 1E can be used in an assembly for attachment between a
microelectronic element and a PCB in a similar arrangement, as
shown in FIGS. 10F and 10G, and can allow for an even greater
difference in pitch between the conductive features of the
microelectronic element and the PCB.
[0057] Microelectronic elements, or devices, can be mounted on the
substrates using techniques such as ball-bonding, as shown, or
using other techniques. Similarly, such techniques may be used for
connecting the substrates stacked on one another as additional
components to the assemblies shown herein. Further examples of such
assemblies are shown and described in U.S. Pat. No. 7,759,782 and
in U.S. Pat. Appln. Pub. No. 2010/0273293, the disclosures of which
are hereby incorporated by reference herein in their entireties.
For example, an interconnection element can be disposed on and
connected to a PCB that includes an electrically conductive plane
or EMI (electromagnetic interference) shield. The end surfaces of
the posts can then be solder-bonded to contact pads of the PCB with
the EMI shield being ball-bonded to a peripheral trace of the
interconnection element for grounding to the shield. Further, the
interconnection elements discussed herein can be interconnected to
form multi-interposer assemblies. Such an assembly can include two
interconnection elements that overlie each other. One of the
stacked interconnection elements can, for example, have a recess
formed in the molded dielectric layer thereof to receive, without
electronic connection to, a microelectronic package bonded to the
other interconnection element.
[0058] Referring now to FIGS. 2-2D, one embodiment of making the
interconnection element 100 is shown. Turning first to FIG. 2, a
metal conductor 104 is shown. The conductor 104 has a first end
106, a second end 108, a circular cross-section, and an outer
surface 109. In one embodiment, the diameter of the conductor 104
can be less than 100 microns, for example. In particular
embodiments, the diameter of the conductor may range from 15
microns to 100 microns. In examples, the conductor 104 can include
a metal such as copper, nickel, silver, aluminum, or an alloy of
one or more such metals. Conductor 104 typically is in the form of
an extruded or drawn wire having been made by a known extrusion
process. As best shown in the exploded view of FIG. 2', the
extruded structure of conductor 104 includes metal grains that are
elongated in a longitudinal direction 107 of the wire. This results
in grains oriented in direction 107 between the first end 106 and
second end 108. The orientation of the grains is in contrast to a
conductor formed from plated metal, which results in grains
typically having a uniform size in all directions. Conductors 104
with this structure may have a substantially constant cross-section
or diameter. In one embodiment, a tolerance of the diameter may be
1 micron for a conductor having a diameter of 50 microns. The
conductor 104 may have a strength greater than 100 MPa, such that
the conductor 104 is not compliant. The surface roughness of the
conductor may be less than 1 micron.
[0059] As shown in FIG. 2A, an insulated conductor 110 has a first
end 112 and a second end 114. The insulated conductor 110 is
comprised of the conductor 104, as well as an insulating dielectric
material that coats or surrounds the outer surface 109 of conductor
104. The insulating material can be arranged around the conductor
104 so that the insulated conductor 110 can also maintain a
relatively constant diameter. In one embodiment, the dielectric
material has a thickness T extending from the outer surface 109 of
the conductor 104. In one embodiment, the thickness T of the
dielectric 116 can range from a few tens of microns to 1000 microns
or more. In a particular embodiment, the thickness T can be less
than 250 microns.
[0060] Referring now to FIG. 2B, a plurality of elongated insulated
conductors 110 can be arranged together in a plurality of parallel
rows. Each of the first ends 112 and the second ends 114 of the
insulated conductors 110 can be aligned with one another so that
each of the first ends 112 and second ends 114 are flush with one
another. As shown, in this embodiment, the insulated conductors 110
can be arranged parallel to one another to achieve a uniform
spacing between the conductors, as seen in the stacked arrangement
132 of FIG. 2B. In a particular embodiment, the insulated
conductors 110 can be placed in a "honeycomb" arrangement wherein a
given insulated conductor 110A at an interior location of the
arranged conductors contacts six other insulated conductors 110B of
like construction.
[0061] As shown in FIG. 2C, the dielectric 116 material is treated
to form a unitary body 120 with conductors 104 encased therein. For
example, the array can be treated by heat, pressure, or a
combination of heat and pressure to form the unitary body. In a
particular embodiment, energy may be applied to the arrangement via
other means, for example, ultra-sonic, radio frequency, or
ultraviolet radiation to effect reflowing or curing of the
dielectric material. The unitary body 120 can then be severed to
form an individual interconnection element 100 or a component as
seen in FIG. 1, having portions 102 of the encased conductors 104
which are severed from the unitary body 120. In one embodiment, the
unitary body is severed in a direction transverse to the lengths of
conductors to form the at least one interconnection component
having severed portions of the conductors exposed at its first and
second opposed surfaces. In this embodiment, the thickness of the
interconnection element between the first and second opposed
surfaces may be less than 0.5 millimeters.
[0062] It is to be appreciated that after formation of the unitary
body 120, the unitary body 120 may be cut into any desired shape or
size. For example, in the variation shown in FIG. 2E, a top plan
view of the unitary body 120 is shown. In addition to cutting the
unitary body 120 along horizontal dicing lanes 170A, as in the
previous embodiment, the unitary body 120 may also be cut along
longitudinal dicing lanes 170B-E, which is along the same direction
as the grains of the metal conductors, or only cut in the
longitudinal direction. Alternatively, the unitary body 120 may
only be cut along longitudinal dicing lanes or there may be
additional cuts in a direction transverse to the horizontal dicing
lanes of the previous embodiment, so that the interconnection
element may be cut into a checkerboard pattern. Any desired
configuration that can form the unitary body is contemplated.
[0063] Turning now to FIGS. 3-3B, a method of making an alternative
interconnection element 200 (FIG. 3B) is shown. As best seen in
FIG. 3, the interconnection element 200 can be formed from an
arrangement of both insulated conductors 210 and insulating
dielectric rods 230. The dielectric rods 230 may be arranged
relative to the insulated conductors 210 in any desired manner. In
one representative exemplary embodiment, the insulated conductors
210 are positioned near a central portion of the overall stacked
arrangement 232. The central portion of the stacked arrangement 232
is comprised of three rows of insulated conductors. Each of these
three rows includes at least two insulated conductors. Dielectric
rods 230 are then arranged peripheral to each of the central
insulated conductors. As shown, the dielectric rods 230 can form a
square around the insulated conductors 210. A plurality of
insulated conductors 210 is then arranged peripheral to the
rods.
[0064] Once the plurality of insulated conductors 210 and
dielectric rods 230 are arranged, the dielectric 216 material
within the insulated conductors 210 and the dielectric rods 230 can
be treated to form the unitary body 220 seen in FIG. 3A. The
unitary body 220 can then be severed to form individual
interconnection elements 200 of varying thicknesses. In one
example, the unitary body 220 can be severed in a direction
transverse to the lengths of the insulated conductors 210 to form
an interconnection component that has severed portions of the
conductors exposed at first and second opposed surfaces. In this
example, the thickness of the interconnection element 200 may be
less than 0.5 millimeters.
[0065] Turning now to the embodiment of FIGS. 4-4D, an alternative
method of forming an interconnection element is shown. Referring to
FIG. 4, a dielectric rod 330 comprised of a dielectric material is
shown. FIG. 4A illustrates an extruded metal conductor 304, as
previously disclosed herein, that is comprised of a metal or metal
alloy. A plurality of dielectric rods 330 and metal conductors 304
can be arranged in any desired pattern to provide for an
interconnection element 300 (FIG. 4D) with encased interconnects
302. As shown in the stacked arrangement 332, alternating patterns
of dielectric rods 330 and metal conductors 304 are provided. A
first row is comprised of an entire row of dielectric rods 330. A
second row can be comprised of both dielectric rods 330 and metal
conductors 304, such that every other rod is a dielectric rod, and
between each dielectric rod is a metal conductor 304. Every other
row can be comprised of dielectric rods, and each row between the
rows of dielectric rods 330 can be a combination of metal
conductors 304 disposed between dielectric rods 330. It is to be
appreciated that the conductors 304 do not have to be evenly spaced
or take on a geometric configuration.
[0066] Once the desired number of rows is vertically stacked to
provide for the appropriate or desired size of the interconnection
element, the dielectric rods 330 may be treated to form the unitary
body 220 shown in FIG. 4C. In this embodiment, the resulting
interconnection element 300 (FIG. 4D) is similar in shape and
pattern to the interconnection element 100 shown in FIG. 1. It
differs only in the manner in which the interconnection element is
formed, and also in the pattern of the conductors. As shown, each
row does not have an identical number of conductors. For example,
one may have nine conductors, instead of ten as in the other
rows.
[0067] It is to be appreciated that the metal conductors 304 and
dielectric rods 330 can be in arranged in any manner which is
desired. For example, referring to FIGS. 5-5B, an alternative
method for forming an interconnection element 400 (FIG. 5B) is
shown. Stacked arrangement 432 of the same dielectric rods 430 and
metal conductors 404 is shown. In this embodiment, as shown in FIG.
5, the dielectric rods 430 and metal conductors 404 are arranged so
that the metal conductors are positioned along the outer periphery
and also at the central portion of the stacked arrangement 432.
Upon reflow, a unitary body 420 is obtained, which illustrates the
pattern of the metal conductors 404 embedded within the dielectric
416.
[0068] Referring now to FIGS. 6-6D, another method of making an
interconnection element 500 is shown. Referring to FIG. 6, metal
coated dielectric rod 510 is shown as a component used in making
the interconnection element 500. The core 511 of the metal coated
dielectric rod 510 is an elongated dielectric rod 530. A metal
layer 540 is provided or coated around the elongated dielectric rod
530. The metal layer 540 can be plated onto the dielectric rod 530,
or a layer of metal 540 may be simply coated onto the dielectric
rod 530. Referring to FIG. 6A, the dielectric rod 530 is shown. A
plurality of the metal coated dielectric rods 510 and other
(non-metal coated) dielectric rods 530 can then arranged into a
desired stacked arrangement 532, such as the stacked arrangement
shown in FIG. 6B. In this embodiment, the metal-coated rods 510 are
evenly spaced between dielectric rods 530. As shown, every other
row in the stacked arrangement 532 is a row comprised of only
dielectric rods 530. The rows intermediate the rows of only
dielectric rods are comprised of both metal coated dielectric rods
510 and dielectric rods 530, wherein each of the metal coated
dielectric rods 510 are positioned between dielectric rods 530,
such that the metal coated rods 510 are surrounded by dielectric
rods 530.
[0069] Referring to FIG. 6C, the dielectric material is treated to
form a unitary body 520. Thereafter, the unitary body 520 may be
cut to form individual interconnection elements, such as
interconnection element 500 shown in FIG. 6D.
[0070] Referring now to FIGS. 7-7D, an alternative method for
preparing an interconnection element 600 (FIG. 7D) with encased
interconnects 602 is provided. As shown, an insulated conductor 610
is comprised of a conductor 604, surrounded by a dielectric layer
616, which is further surrounded by a metal layer 660. The
insulated conductor 610 is therefore similar to the insulated
conductor 110 shown in FIG. 1, but has an additional metal layer
660 exposed at an outer surface thereof. As in prior embodiments,
the conductor 204 is formed by extruding or drawing metal so that
the grains are elongated in the direction of the extrusion. The
dielectric layer 216 may be coated on the conductor 204, and a
metal layer 660 may be plated onto the exterior surface of the
dielectric layer 216 to form the conductor rod 610. This, in
effect, provides for a dual metal layer.
[0071] A plurality of dielectric rods 630 (FIG. 7A) and insulated
conductors 610 may then be arranged in any desired pattern, such as
the pattern shown in the stacked arrangement 632 of FIG. 7B.
Thereafter, the dielectric rods 630 and dielectric layers 216 of
the conductor rods 610 may be treated to form a unitary body 620,
as shown in FIG. 7C. The unitary body 620 may then be divided into
smaller portions to form an individual interconnection element,
such as the interconnection element 600 shown in FIG. 7D.
[0072] Referring now to FIGS. 8-8C, an alternate arrangement
utilizing the insulated conductor 610 shown in FIG. 7 is
illustrated. In this embodiment, separate dielectric rods are not
incorporated into the stacked arrangement 732. Rather, as shown in
FIG. 8A, insulated conductor 610 are arranged in a stacked
arrangement. Unlike the previous embodiments, wherein a dielectric
rod 630 is placed between adjacent insulated conductors 610, the
insulated conductors 610 of this embodiment are stacked directly on
one another so that each insulated conductor 610 in each of the
horizontal or vertical columns is aligned with one another. As
shown in FIG. 8B, upon reflow, the insulated conductors 610 join
together to form a unitary body 620, but openings 662 can appear
between adjacent conductor rods. The outer metal layers 664 or
"clad layers" of the insulated conductors 610 join together to form
an electrically continuous reference conductor which can be used
for carrying a reference voltage such as ground or a power supply
voltage. The inner conductive cores 665 of the insulated conductors
610 can therefore carry respective signals or voltages and can be
shielded from one another by the electrically continuous metal
layer formed by the clad layers 664. As shown in FIG. 8C, the
unitary body 620 can then be cut into individual interconnection
elements 600. If desired, a dielectric material can be deposited
into the openings 662 between conductor rods 610.
[0073] Referring now to FIGS. 9-9F, an alternative method of
manufacturing an interconnect element 700 (FIG. 9E) is shown.
Instead of merely stacking the drawn or extruded elongated metal
conductors or dielectric rods on top of one another into a desired
pattern, metal conductors are woven over and under sets of pins and
a dielectric material is provided after the metal conductors have
been arranged into a desired pattern. Turning first to FIGS. 9-9A,
a plurality of pins 740,742 are arranged in two rows, wherein each
of the pins 740A-J in the first row 741 is positioned between each
of the pins 742A-K in the second row 743.
[0074] Referring to FIG. 9A, which is a top plan view of FIG. 9, a
first pre-formed metal conductor 704A or metal wire is wrapped over
and under each of the pins 740A-J in the first row 741 and pins
742A-K in the second row 743. As best seen in FIG. 9B, the metal
conductor follows a serpentine pattern between the first and second
rows 741,743. The metal conductor 704A first passes around the
first pin 740A in the second row 743, then around the first pin
740A in the first row 741, then around the second pin 742B in the
second row 743. The metal conductor 704A continues on in a
serpentine path around each of the remaining pins 740B-J in the
first and second rows 741,743 until the metal conductor 704 is
wrapped around the last pin 740J in the first row 741 and the last
pin 742K in the second row 743.
[0075] Referring back to FIG. 9, any desired number of metal
conductors 704 may be wrapped around each of the pins, so that a
plurality of metal conductors 704 are wrapped around the pins
740,742. In one embodiment, metal conductors 704A-I are provided,
but any number of metal conductors may be provided as needed.
Turning now to FIG. 9B, after each of the desired number of metal
conductors 704 are wrapped around the pins 740,742, the pins may be
brought closer together. As shown, this allows each of the lengths
L of metal conductors between the first and second rows to be
aligned with one another, as well as parallel to one another. A
dielectric encapsulant 744 can be used to encapsulate the metal
conductors 704A-I and pins 740A-J and 742A-K, as shown in FIG. 9C.
After the dielectric material is cured, a unitary body 720 is
formed, as shown in FIG. 9D. Portions of the unitary body 720 may
be cut along planes L-L, which are positioned just inside the
planes L-L between the rows of pins 740,742. Once these portions
are cut out, the only remaining portions of the unitary body 720
are the metal conductors 704 and the intermediate dielectric
material. As in the previous embodiments, the unitary body 720 may
be cut into smaller portions to form individual interconnection
elements, as shown in FIGS. 9E and 9F. The interconnection element
700 is therefore structurally similar to the previously disclosed
embodiments, such as the interconnection element 100 of FIG. 1, but
differs in its method of manufacture. Additional conductive
elements, conductive layers, and the like may be provided to the
interconnection element as needed, including, without limitation,
those shown in FIGS. 1B-1F.
[0076] Referring now to FIGS. 10-10F, another method for making an
alternative interconnection element 800 (FIG. 10D) is shown. In
contrast to previous embodiments, this method requires first
obtaining a mandrel 746, such as the mandrel 746 shown in
perspective view in FIG. 10, and a cross-sectional view in FIG.
10A, and then providing alternating layers of metal conductive
wires 754A-D and dielectric wire 753A-D around the top surface 747
and bottom surface 748 of the mandrel 746. The mandrel 746 is
primarily used to provide a guide or a base for the overall shape
of metal conductive wires and dielectric wires that will be
deposited thereon.
[0077] Referring now to FIG. 10B, a perspective view, and FIGS.
10B-1 and 10B-2, cross sectional-views of FIG. 10B, are shown. In
this embodiment, a continuous dielectric wire 753A is provided
across the top surface 747 and bottom surface 748 of the mandrel
746. In one embodiment, the dielectric wire 753A is wrapped around
the first end 749 and second end 750 of the mandrel, so that the
third and fourth edges 741,752 remain exposed. Due to the wrapping
of dielectric wire 753A around the mandrel, the dielectric wire
753A provides for a plurality of rows of the dielectric wire, such
as dielectric wire rows 753A1,753A2,753A3.
[0078] Turning to FIG. 10C, once the first dielectric wire 753A has
been wrapped around the mandrel 746, a first wiring layer 754A may
be provided. A continuous metal conductor wire 754A may be provided
adjacent the first dielectric wire 753A. Referring to FIG. 10C, the
metal conductor wire 754A is shown wrapped around first and second
edges 749, 750 of the mandrel 746, as well as the dielectric wire
753A.
[0079] Referring to FIG. 10D, additional alternating layers of
dielectric wires, such as 753B, 753C, and 753D, as well as
alternating layers of metal conductor wires 754B,754C,754D, are
shown. Each of the layers extend around the first and second edges
749,750 of the mandrel 746. Once a desired thickness is reached, a
unitary body 720 has been formed. The mandrel 746 may then be cut
out from the unitary body 720. As shown, the unitary body 720 may
be cut along lines 10D1-10D1, 10D2-10D2, and 10D3-10D3, which
results in the portion 720A of the unitary body 720 shown in FIG.
10E. Additionally, the unitary body 720 may be cut along line
10D4-10D4, which results in a portion 720B (not shown) which is
identical to portion 720A. Portions 720A,720B may then be cut into
smaller individual components to form individual interconnection
elements, such as the interconnection element 700 shown in FIG.
10E. Additional conductive portions (not shown) may also be
provided onto the interconnection element, such as those shown in
FIGS. 1B-1G.
[0080] The various interconnection elements discussed above can be
incorporated into microelectronic packages or assemblies that can
be used in the construction of diverse electronic systems. In one
embodiment, as shown in FIG. 11, a system 800 in accordance with a
further embodiment of the invention includes a structure 806 as
described in the prior embodiments of microelectronic packages, in
conjunction with other electronic components 808 and 810. For
example, referring back to FIGS. 1F and 1G, instead of the
microelectronic element 174 and interconnection element 100 being
electrically connected to a PCB 178, the interconnection element
100 and microelectronic element 174 may be connected to another
device to form a system, such as the system 800 shown in FIG. 11.
In the example depicted, component 808 is a semiconductor chip
whereas component 810 is a display screen, but any other component
can be used. Of course, although only two additional components are
depicted in FIG. 11 for clarity of illustration, the system may
include any number of such components. The structure 806 as
described above may be, for example, a composite chip or a
structure incorporating plural chips. In a further variant, both
may be provided, and any number of such structures may be used.
Structure 806 and components 808 and 810 are mounted in a common
housing 801, schematically depicted in broken lines, and are
electrically interconnected with one another as necessary to form
the desired circuit. In the exemplary system shown, the system
includes a circuit panel 802 such as a flexible PCB, and the
circuit panel includes numerous conductors 804, of which only one
is depicted in FIG. 5, interconnecting the components with one
another. However, this is merely exemplary; any suitable structure
for making electrical connections can be used. The housing 801 is
depicted as a portable housing of the type usable, for example, in
a cellular telephone or personal digital assistant, and screen 810
is exposed at the surface of the housing. Where structure 806
includes a light-sensitive element such as an imaging chip, a lens
811 or other optical device also may be provided for routing light
to the structure. Again, the simplified system shown in FIG. 11 is
merely exemplary; other systems, including systems commonly
regarded as fixed structures, such as desktop computers, routers
and the like, can be made using the structures discussed above.
[0081] Although the invention herein has been described with
reference to particular embodiments, it is to be understood that
these embodiments are merely illustrative of the principles and
applications of the present invention. It is therefore to be
understood that numerous modifications may be made to the
illustrative embodiments and that other arrangements may be devised
without departing from the spirit and scope of the present
invention as defined by the appended claims.
* * * * *