| Patent | Date |
|---|
Package-on-package assembly with wire bonds to encapsulation surface
Grant 11,424,211 - Sato , et al. August 23, 2 | 2022-08-23 |
Seal for microelectronic assembly
Grant 11,417,576 - Katkar , et al. August 16, 2 | 2022-08-16 |
Nanowire bonding interconnect for fine-pitch microelectronics
Grant 11,387,202 - Haba , et al. July 12, 2 | 2022-07-12 |
Bonded Structures Without Intervening Adhesive
App 20220199560 - Haba; Belgacem ; et al. | 2022-06-23 |
Systems and methods for releveled bump planes for chiplets
Grant 11,348,898 - Delacruz , et al. May 31, 2 | 2022-05-31 |
Direct-bonded Lamination For Improved Image Clarity In Optical Devices
App 20220155490 - Haba; Belgacem ; et al. | 2022-05-19 |
3d Processor
App 20220068890 - Teig; Steven L. ; et al. | 2022-03-03 |
Direct-bonded lamination for improved image clarity in optical devices
Grant 11,256,004 - Haba , et al. February 22, 2 | 2022-02-22 |
Seal for microelectronic assembly
Grant 11,257,727 - Katkar , et al. February 22, 2 | 2022-02-22 |
Compressive sensing based image processing
Grant 11,244,477 - Mohammed February 8, 2 | 2022-02-08 |
Configurable smart object system with clip-based connectors
Grant 11,239,587 - Haba , et al. February 1, 2 | 2022-02-01 |
Layer Structures For Making Direct Metal-to-metal Bonds At Low Temperatures In Microelectronics
App 20220005784 - Gao; Guilian ; et al. | 2022-01-06 |
3D processor having stacked integrated circuit die
Grant 11,152,336 - Teig , et al. October 19, 2 | 2021-10-19 |
High Density Three-dimensional Integrated Capacitors
App 20210265460 - Oganesian; Vage ; et al. | 2021-08-26 |
Compressive sensing based image capture using diffractive mask
Grant 11,094,090 - Mohammed August 17, 2 | 2021-08-17 |
Systems and Methods for Releveled Bump Planes for Chiplets
App 20210249383 - Delacruz; Javier A. ; et al. | 2021-08-12 |
Systems And Methods For Flash Stacking
App 20210225811 - Haba; Belgacem ; et al. | 2021-07-22 |
Stacked Ic Structure With Orthogonal Interconnect Layers
App 20210202387 - Mohammed; Ilyas ; et al. | 2021-07-01 |
3d Chip Sharing Data Bus
App 20210202445 - DeLaCruz; Javier A. ; et al. | 2021-07-01 |
Stretchable Film Assembly With Conductive Traces
App 20210181511 - Haba; Belgacem ; et al. | 2021-06-17 |
Systems and Methods for Releveled Bump Planes for Chiplets
App 20210175206 - Delacruz; Javier A. ; et al. | 2021-06-10 |
Formation of a light-emitting diode display
Grant 11,024,220 - Wang , et al. June 1, 2 | 2021-06-01 |
Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
Grant 11,011,494 - Gao , et al. May 18, 2 | 2021-05-18 |
High density three-dimensional integrated capacitors
Grant 11,004,930 - Oganesian , et al. May 11, 2 | 2021-05-11 |
Systems and methods for flash stacking
Grant 10,991,676 - Haba , et al. April 27, 2 | 2021-04-27 |
3D chip sharing power interconnect layer
Grant 10,978,348 - DeLaCruz , et al. April 13, 2 | 2021-04-13 |
3d Chip With Shared Clock Distribution Network
App 20210104436 - DeLaCruz; Javier ; et al. | 2021-04-08 |
Remote optical engine for virtual reality or augmented reality headsets
Grant 10,969,593 - Haba , et al. April 6, 2 | 2021-04-06 |
Stretchable film assembly with conductive traces
Grant 10,955,671 - Haba , et al. March 23, 2 | 2021-03-23 |
Stacked IC structure with system level wiring on multiple sides of the IC die
Grant 10,950,547 - Mohammed , et al. March 16, 2 | 2021-03-16 |
Compressive sensing based image capture device
Grant 10,937,196 - Mohammed March 2, 2 | 2021-03-02 |
Package-On-Package Assembly With Wire Bonds To Encapsulation Surface
App 20210050322 - Sato; Hiroaki ; et al. | 2021-02-18 |
Systems and methods for releveled bump planes for chiplets
Grant 10,910,344 - Delacruz , et al. February 2, 2 | 2021-02-02 |
Face-to-face mounted IC dies with orthogonal top interconnect layers
Grant 10,892,252 - Nequist , et al. January 12, 2 | 2021-01-12 |
Compressive sensing based image capture using dynamic masking
Grant 10,887,537 - Mohammed January 5, 2 | 2021-01-05 |
Training network for compressive sensing based image processing
Grant 10,885,674 - Mohammed January 5, 2 | 2021-01-05 |
3D chip with shared clock distribution network
Grant 10,886,177 - DeLaCruz , et al. January 5, 2 | 2021-01-05 |
Remote Optical Engine For Virtual Reality Or Augmented Reality Headsets
App 20200409157 - Haba; Belgacem ; et al. | 2020-12-31 |
Compressive sensing based image capture using multi-lens array
Grant 10,863,127 - Mohammed December 8, 2 | 2020-12-08 |
Head mounted viewer for AR and VR scenes
Grant 10,852,545 - Mohammed , et al. December 1, 2 | 2020-12-01 |
Package-on-package assembly with wire bonds to encapsulation surface
Grant 10,833,044 - Sato , et al. November 10, 2 | 2020-11-10 |
Cavities containing multi-wiring structures and devices
Grant 10,813,214 - Uzoh , et al. October 20, 2 | 2020-10-20 |
Systems and methods for producing flat surfaces in interconnect structures
Grant 10,804,151 - Uzoh , et al. October 13, 2 | 2020-10-13 |
Remote optical engine for virtual reality or augmented reality headsets
Grant 10,802,285 - Haba , et al. October 13, 2 | 2020-10-13 |
Over And Under Interconnects
App 20200321275 - Haba; Belgacem ; et al. | 2020-10-08 |
3D Chip with Shared Clock Distribution Network
App 20200294858 - DeLaCruz; Javier ; et al. | 2020-09-17 |
Nanowire Bonding Interconnect For Fine-pitch Microelectronics
App 20200279821 - Haba; Belgacem ; et al. | 2020-09-03 |
Stacked IC Structure with System Level Wiring on Multiple Sides of the IC Die
App 20200273798 - Mohammed; Ilyas ; et al. | 2020-08-27 |
High yield substrate assembly
Grant 10,748,858 - Wang , et al. A | 2020-08-18 |
Probe methodology for ultrafine pitch interconnects
Grant 10,748,824 - Delacruz , et al. A | 2020-08-18 |
Configurable smart object system with magnetic contacts and magnetic assembly
Grant 10,734,759 - Haba , et al. | 2020-08-04 |
Bonded Structures
App 20200227367 - Haba; Belgacem ; et al. | 2020-07-16 |
3d Processor
App 20200227389 - Teig; Steven L. ; et al. | 2020-07-16 |
3D Chip Sharing Power Interconnect Layer
App 20200219771 - DeLaCruz; Javier ; et al. | 2020-07-09 |
Systems And Methods For Flash Stacking
App 20200212013 - Haba; Belgacem ; et al. | 2020-07-02 |
Face-to-Face Mounted IC Dies with Orthogonal Top Interconnect Layers
App 20200203318 - Nequist; Eric M. ; et al. | 2020-06-25 |
3D chip sharing power circuit
Grant 10,672,663 - DeLaCruz , et al. | 2020-06-02 |
3D compute circuit with high density Z-axis interconnects
Grant 10,672,744 - Teig , et al. | 2020-06-02 |
3D processor
Grant 10,672,745 - Teig , et al. | 2020-06-02 |
3D Compute circuit with high density z-axis interconnects
Grant 10,672,743 - Teig , et al. | 2020-06-02 |
Package-on-package Assembly With Wire Bonds To Encapsulation Surface
App 20200168579 - SATO; Hiroaki ; et al. | 2020-05-28 |
Seal For Microelectronic Assembly
App 20200140267 - Katkar; Rajesh ; et al. | 2020-05-07 |
Seal For Microelectronic Assembly
App 20200140268 - Katkar; Rajesh ; et al. | 2020-05-07 |
Probe Methodology For Ultrafine Pitch Interconnects
App 20200105630 - DELACRUZ; Javier A. ; et al. | 2020-04-02 |
3D chip sharing power interconnect layer
Grant 10,600,691 - DeLaCruz , et al. | 2020-03-24 |
3D chip sharing data bus circuit
Grant 10,600,780 - DeLaCruz , et al. | 2020-03-24 |
3D chip sharing data bus
Grant 10,600,735 - DeLaCruz , et al. | 2020-03-24 |
Systems and methods for flash stacking
Grant 10,593,651 - Haba , et al. | 2020-03-17 |
Fan-out wafer level package with resist vias
Grant 10,593,563 - Haba , et al. | 2020-03-17 |
3D chip with shielded clock lines
Grant 10,593,667 - DeLaCruz , et al. | 2020-03-17 |
Package-on-package assembly with wire bonds to encapsulation surface
Grant 10,593,643 - Sato , et al. | 2020-03-17 |
Head Mounted Viewer For Ar And Vr Scenes
App 20200081250 - MOHAMMED; Ilyas ; et al. | 2020-03-12 |
Stacked Optical Waveguides
App 20200081251 - MOHAMMED; Ilyas ; et al. | 2020-03-12 |
3D chip sharing clock interconnect layer
Grant 10,586,786 - DeLaCruz , et al. | 2020-03-10 |
Layer Structures For Making Direct Metal-to-metal Bonds At Low Temperatures In Microelectronics
App 20200075534 - GAO; Guilian ; et al. | 2020-03-05 |
Integrated Voltage Regulator And Passive Components
App 20200075553 - DELACRUZ; Javier A. ; et al. | 2020-03-05 |
Stacked IC structure with system level wiring on multiple sides of the IC die
Grant 10,580,735 - Mohammed , et al. | 2020-03-03 |
Face-to-face mounted IC dies with orthogonal top interconnect layers
Grant 10,580,757 - Nequist , et al. | 2020-03-03 |
Microelectronic elements with post-assembly planarization
Grant 10,559,494 - Oganesian , et al. Feb | 2020-02-11 |
High Performance Light Emitting Diode With Vias
App 20200035886 - Mohammed; Ilyas ; et al. | 2020-01-30 |
Probe methodology for ultrafine pitch interconnects
Grant 10,529,634 - Delacruz , et al. J | 2020-01-07 |
Systems and methods for releveled bump planes for chiplets
App 20190393190 - DELACRUZ; Javier A. ; et al. | 2019-12-26 |
Seal for microelectronic assembly
Grant 10,508,030 - Katkar , et al. Dec | 2019-12-17 |
Substrate-less stackable package with wire-bond interconnect
Grant 10,510,659 - Mohammed Dec | 2019-12-17 |
Systems And Methods For Flash Stacking
App 20190371765 - Haba; Belgacem ; et al. | 2019-12-05 |
Formation of a Light-Emitting Diode Display
App 20190371229 - Wang; Liang ; et al. | 2019-12-05 |
High Yield Substrate Assembly
App 20190341361 - Wang; Liang ; et al. | 2019-11-07 |
Method of manufacturing embedded packaging with preformed vias
Grant 10,460,958 - Mohammed , et al. Oc | 2019-10-29 |
Direct-bonded Lamination For Improved Image Clarity In Optical Devices
App 20190293838 - HABA; Belgacem ; et al. | 2019-09-26 |
Configurable Smart Object System With Grid Or Frame-based Connectors
App 20190280421 - HABA; Belgacem ; et al. | 2019-09-12 |
Configurable Smart Object System With Clip-based Connectors
App 20190280408 - HABA; Belgacem ; et al. | 2019-09-12 |
Configurable Smart Object System With Magnetic Contacts And Magnetic Assembly
App 20190280428 - HABA; Belgacem ; et al. | 2019-09-12 |
Stretchable Film Assembly With Conductive Traces
App 20190273016 - Haba; Belgacem ; et al. | 2019-09-05 |
Remote Optical Engine For Virtual Reality Or Augmented Reality Headsets
App 20190272802 - Haba; Belgacem ; et al. | 2019-09-05 |
High yield substrate assembly
Grant 10,396,041 - Wang , et al. A | 2019-08-27 |
Staged via formation from both sides of chip
Grant 10,354,942 - Oganesian , et al. July 16, 2 | 2019-07-16 |
BVA interposer
Grant 10,297,582 - Caskey , et al. | 2019-05-21 |
Folding thin systems
Grant 10,290,589 - Haba , et al. | 2019-05-14 |
Systems and methods for flash stacking
Grant 10,290,612 - Haba , et al. | 2019-05-14 |
Low stress vias
Grant 10,283,449 - Mohammed , et al. | 2019-05-07 |
High Density Three-dimensional Integrated Capacitors
App 20190131387 - Oganesian; Vage ; et al. | 2019-05-02 |
3D Compute Circuit with High Density Z-Axis Interconnects
App 20190123022 - Teig; Steven L. ; et al. | 2019-04-25 |
3D Processor
App 20190123024 - Teig; Steven L. ; et al. | 2019-04-25 |
3D Compute Circuit with High Density Z-Axis Interconnects
App 20190123023 - Teig; Steven L. ; et al. | 2019-04-25 |
Active chip on carrier or laminated chip having microelectronic element embedded therein
Grant 10,262,947 - Oganesian , et al. | 2019-04-16 |
Configurable Smart Object System With Standard Connectors For Adding Artificial Intelligence To Appliances, Vehicles, And Devices
App 20190097362 - HABA; Belgacem ; et al. | 2019-03-28 |
Substrate-less Stackable Package With Wire-bond Interconnect
App 20190096803 - Mohammed; Ilyas | 2019-03-28 |
Systems and methods for producing flat surfaces in interconnect structures
Grant 10,199,275 - Uzoh , et al. Fe | 2019-02-05 |
Configurable Smart Object System With Methods Of Making Modules And Contactors
App 20190029132 - HABA; Belgacem ; et al. | 2019-01-24 |
Substrate-less stackable package with wire-bond interconnect
Grant 10,170,412 - Mohammed J | 2019-01-01 |
Porous alumina templates for electronic packages
Grant 10,159,148 - Katkar , et al. Dec | 2018-12-18 |
High density three-dimensional integrated capacitors
Grant 10,157,978 - Oganesian , et al. Dec | 2018-12-18 |
Package-on-package Assembly With Wire Bonds To Encapsulation Surface
App 20180350766 - SATO; Hiroaki ; et al. | 2018-12-06 |
3D Chip Sharing Clock Interconnect Layer
App 20180350775 - DeLaCruz; Javier ; et al. | 2018-12-06 |
Stacked IC Structure with System Level Wiring on Multiple Sides of the IC Die
App 20180331037 - Mohammed; Ilyas ; et al. | 2018-11-15 |
3D Chip Sharing Data Bus Circuit
App 20180331094 - DeLaCruz; Javier ; et al. | 2018-11-15 |
3D Chip with Shielded Clock Lines
App 20180331095 - DeLaCruz; Javier ; et al. | 2018-11-15 |
Probe methodology for ultrafine pitch Interconnects
App 20180331000 - DELACRUZ; Javier A. ; et al. | 2018-11-15 |
3D Chip Sharing Power Interconnect Layer
App 20180330992 - DeLaCruz; Javier ; et al. | 2018-11-15 |
3D Chip Sharing Power Circuit
App 20180330993 - DeLaCruz; Javier ; et al. | 2018-11-15 |
3D Chip Sharing Data Bus
App 20180331038 - DeLaCruz; Javier ; et al. | 2018-11-15 |
Face-to-Face Mounted IC Dies with Orthogonal Top Interconnect Layers
App 20180331072 - Nequist; Eric M. ; et al. | 2018-11-15 |
Fan-Out Wafer Level Package with Resist Vias
App 20180301350 - Haba; Belgacem ; et al. | 2018-10-18 |
Cavities Containing Multi-wiring Structures And Devices
App 20180295718 - Uzoh; Cyprian Emeka ; et al. | 2018-10-11 |
Seal for microelectronic assembly
App 20180273377 - KATKAR; Rajesh ; et al. | 2018-09-27 |
Microelectronic Elements With Post-assembly Planarization
App 20180254213 - Oganesian; Vage ; et al. | 2018-09-06 |
Package-on-package assembly with wire bonds to encapsulation surface
Grant 10,062,661 - Sato , et al. August 28, 2 | 2018-08-28 |
Substrate-Less Stackable Package With Wire-Bond Interconnect
App 20180233448 - Mohammed; Ilyas | 2018-08-16 |
Bonded Structures With Integrated Passive Component
App 20180190580 - Haba; Belgacem ; et al. | 2018-07-05 |
Cavities containing multi-wiring structures and devices
Grant 10,015,881 - Uzoh , et al. July 3, 2 | 2018-07-03 |
Method for making a microelectronic assembly having conductive elements
Grant 9,984,901 - Haba , et al. May 29, 2 | 2018-05-29 |
Active Chip On Carrier Or Laminated Chip Having Microelectronic Element Embedded Therein
App 20180130746 - OGANESIAN; Vage ; et al. | 2018-05-10 |
Folding Thin Systems
App 20180130757 - Haba; Belgacem ; et al. | 2018-05-10 |
Microelectronic elements with post-assembly planarization
Grant 9,966,303 - Oganesian , et al. May 8, 2 | 2018-05-08 |
Staged Via Formation From Both Sides Of Chip
App 20180114743 - Oganesian; Vage ; et al. | 2018-04-26 |
Substrate-less stackable package with wire-bond interconnect
Grant 9,953,914 - Mohammed April 24, 2 | 2018-04-24 |
Inverted optical device
Grant 9,947,643 - Mohammed , et al. April 17, 2 | 2018-04-17 |
Systems And Methods For Producing Flat Surfaces In Interconnect Structures
App 20180102286 - UZOH; Cyprian ; et al. | 2018-04-12 |
Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package
Grant 9,917,073 - Mohammed March 13, 2 | 2018-03-13 |
Off-chip vias in stacked chips
Grant 9,899,353 - Haba , et al. February 20, 2 | 2018-02-20 |
Configurable machine learning assemblies for autonomous operation in personal devices
App 20180025268 - TEIG; Steven L. ; et al. | 2018-01-25 |
Microelectronic package with stacked microelectronic units and method for manufacture thereof
Grant 9,876,002 - Caskey , et al. January 23, 2 | 2018-01-23 |
Systems And Methods For Producing Flat Surfaces In Interconnect Structures
App 20180019167 - UZOH; Cyprian ; et al. | 2018-01-18 |
Laminated chip having microelectronic element embedded therein
Grant 9,859,220 - Oganesian , et al. January 2, 2 | 2018-01-02 |
Porous Alumina Templates For Electronic Packages
App 20170372994 - Katkar; Rajesh ; et al. | 2017-12-28 |
Staged via formation from both sides of chip
Grant 9,847,277 - Oganesian , et al. December 19, 2 | 2017-12-19 |
Heat spreading substrate with embedded interconnects
Grant 9,842,745 - Mohammed , et al. December 12, 2 | 2017-12-12 |
Micro mechanical anchor for 3D architecture
Grant 9,832,887 - Wang , et al. November 28, 2 | 2017-11-28 |
Batch process fabrication of package-on-package microelectronic assemblies
Grant 9,812,433 - Haba , et al. November 7, 2 | 2017-11-07 |
Systems and methods for producing flat surfaces in interconnect structures
Grant 9,812,360 - Uzoh , et al. November 7, 2 | 2017-11-07 |
Semiconductor chip assembly and method for making same
App 20170309593 - KANG; Teck-Gyu ; et al. | 2017-10-26 |
Package-on-package Assembly With Wire Bonds To Encapsulation Surface
App 20170287733 - SATO; Hiroaki ; et al. | 2017-10-05 |
Porous alumina templates for electronic packages
Grant 9,761,517 - Katkar , et al. September 12, 2 | 2017-09-12 |
Microelectronic Elements With Post-assembly Planarization
App 20170256443 - Oganesian; Vage ; et al. | 2017-09-07 |
Low Stress Vias
App 20170250132 - Mohammed; Ilyas ; et al. | 2017-08-31 |
Semiconductor chip assembly and method for making same
Grant 9,716,075 - Kang , et al. July 25, 2 | 2017-07-25 |
Porous Alumina Templates For Electronic Packages
App 20170207159 - Katkar; Rajesh ; et al. | 2017-07-20 |
Package-on-package assembly with wire bonds to encapsulation surface
Grant 9,691,731 - Sato , et al. June 27, 2 | 2017-06-27 |
High Yield Substrate Assembly
App 20170179046 - Wang; Liang ; et al. | 2017-06-22 |
Method of forming a wire bond having a free end
Grant 9,685,365 - Mohammed June 20, 2 | 2017-06-20 |
Microelectronic elements with post-assembly planarization
Grant 9,659,812 - Oganesian , et al. May 23, 2 | 2017-05-23 |
Low-stress vias
Grant 9,659,858 - Mohammed , et al. May 23, 2 | 2017-05-23 |
Microelectronic Package With Stacked Microelectronic Units And Method For Manufacture Thereof
App 20170141094 - Caskey; Terrence ; et al. | 2017-05-18 |
Microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
Grant 9,633,979 - Mohammed , et al. April 25, 2 | 2017-04-25 |
Microelectronic packages having cavities for receiving microelectronic elements
Grant 9,633,968 - Mohammed , et al. April 25, 2 | 2017-04-25 |
Systems And Methods For Producing Flat Surfaces In Interconnect Structures
App 20170110370 - UZOH; Cyprian ; et al. | 2017-04-20 |
Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
Grant 9,627,366 - Mohammed , et al. April 18, 2 | 2017-04-18 |
Stacked microelectronic assembly with TSVS formed in stages and carrier above chip
Grant 9,620,437 - Oganesian , et al. April 11, 2 | 2017-04-11 |
Electrical Barrier Layers
App 20170098621 - UZOH; Cyprian ; et al. | 2017-04-06 |
Porous alumina templates for electronic packages
Grant 9,615,451 - Katkar , et al. April 4, 2 | 2017-04-04 |
Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface
Grant 9,615,456 - Haba , et al. April 4, 2 | 2017-04-04 |
Microelectronic package with stacked microelectronic units and method for manufacture thereof
Grant 9,583,475 - Caskey , et al. February 28, 2 | 2017-02-28 |
Quantum efficiency of multiple quantum wells
Grant 9,583,671 - Wang , et al. February 28, 2 | 2017-02-28 |
Electrical barrier layers
Grant 9,560,773 - Uzoh , et al. January 31, 2 | 2017-01-31 |
Systems and methods for producing flat surfaces in interconnect structures
Grant 9,558,998 - Uzoh , et al. January 31, 2 | 2017-01-31 |
Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof
Grant 9,559,061 - Haba , et al. January 31, 2 | 2017-01-31 |
Memory module in a package
Grant 9,508,629 - Haba , et al. November 29, 2 | 2016-11-29 |
BVA interposer
Grant 9,502,390 - Caskey , et al. November 22, 2 | 2016-11-22 |
Interconnect structure
Grant 9,496,236 - Gupta , et al. November 15, 2 | 2016-11-15 |
Multi-chip module with stacked face-down connected dies
Grant 9,484,333 - Haba , et al. November 1, 2 | 2016-11-01 |
High Density Three-dimensional Integrated Capacitors
App 20160315139 - Oganesian; Vage ; et al. | 2016-10-27 |
Reconstituted Wafer-level Package Dram
App 20160307878 - Mohammed; Ilyas | 2016-10-20 |
Non-crystalline inorganic light emitting diode
Grant 9,461,196 - Mohammed , et al. October 4, 2 | 2016-10-04 |
Staged via formation from both sides of chip
App 20160284627 - OGANESIAN; Vage ; et al. | 2016-09-29 |
Vias in porous substrates
Grant 9,455,181 - Mohammed , et al. September 27, 2 | 2016-09-27 |
Batch Process Fabrication Of Package-on-package Microelectronic Assemblies
App 20160260696 - Haba; Belgacem ; et al. | 2016-09-08 |
Microelectronic Package With Consolidated Chip Structures
App 20160260671 - Haba; Belgacem ; et al. | 2016-09-08 |
Multiple die face-down stacking for two or more die
Grant 9,437,579 - Haba , et al. September 6, 2 | 2016-09-06 |
High density three-dimensional integrated capacitors
Grant 9,437,557 - Mohammed , et al. September 6, 2 | 2016-09-06 |
Fan-out WLP with package
App 20160254247 - SATO; Hiroaki ; et al. | 2016-09-01 |
High density three-dimensional integrated capacitors
Grant 9,431,475 - Oganesian , et al. August 30, 2 | 2016-08-30 |
Low-stress TSV design using conductive particles
Grant 9,433,100 - Woychik , et al. August 30, 2 | 2016-08-30 |
Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof
App 20160247764 - Haba; Belgacem ; et al. | 2016-08-25 |
Active Chip On Carrier Or Laminated Chip Having Microelectronic Element Embedded Therein
App 20160233165 - Oganesian; Vage ; et al. | 2016-08-11 |
Interposer having molded low CTE dielectric
Grant 9,406,532 - Haba , et al. August 2, 2 | 2016-08-02 |
Package-on-package Assembly With Wire Bonds To Encapsulation Surface
App 20160211237 - Sato; Hiroaki ; et al. | 2016-07-21 |
Inverted Optical Device
App 20160204091 - Mohammed; Ilyas ; et al. | 2016-07-14 |
Heat spreading substrate
Grant 9,390,998 - Mohammed , et al. July 12, 2 | 2016-07-12 |
Reconstituted wafer-level package DRAM
Grant 9,391,008 - Mohammed July 12, 2 | 2016-07-12 |
Systems And Methods For Producing Flat Surfaces In Interconnect Structures
App 20160190000 - UZOH; Cyprian ; et al. | 2016-06-30 |
Method of thinning a wafer to provide a raised peripheral edge
Grant 9,378,985 - Haba , et al. June 28, 2 | 2016-06-28 |
Memory Module In A Package
App 20160172332 - Haba; Belgacem ; et al. | 2016-06-16 |
Stacked microelectronic assembly with TSVs formed in stages with plural active chips
Grant 9,368,476 - Oganesian , et al. June 14, 2 | 2016-06-14 |
Microelectronic Assemblies Having Stack Terminals Coupled By Connectors Extending Through Encapsulation
App 20160163679 - Mohammed; Ilyas ; et al. | 2016-06-09 |
Substrate-less Stackable Package with Wire-Bond Interconnect
App 20160163639 - MOHAMMED; ILYAS | 2016-06-09 |
Stacked Microelectronic Assembly With Tsvs Formed In Stages And Carrier Above Chip
App 20160163620 - Oganesian; Vage ; et al. | 2016-06-09 |
Staged via formation from both sides of chip
Grant 9,362,203 - Oganesian , et al. June 7, 2 | 2016-06-07 |
Active chip on carrier or laminated chip having microelectronic element embedded therein
Grant 9,355,959 - Oganesian , et al. May 31, 2 | 2016-05-31 |
Multi-function and shielded 3D interconnects
Grant 9,355,948 - Oganesian , et al. May 31, 2 | 2016-05-31 |
Batch process fabrication of package-on-package microelectronic assemblies
Grant 9,356,006 - Haba , et al. May 31, 2 | 2016-05-31 |
Non-lithographic formation of three-dimensional conductive elements
Grant 9,355,901 - Oganesian , et al. May 31, 2 | 2016-05-31 |
Microelectronic package with consolidated chip structures
Grant 9,355,996 - Haba , et al. May 31, 2 | 2016-05-31 |
Microelectronic package
Grant 9,349,672 - Mohammed , et al. May 24, 2 | 2016-05-24 |
Method for manufacturing a fan-out WLP with package
Grant 9,337,165 - Sato , et al. May 10, 2 | 2016-05-10 |
Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof
Grant 9,330,954 - Haba , et al. May 3, 2 | 2016-05-03 |
Pin attachment
Grant 9,324,681 - Haba , et al. April 26, 2 | 2016-04-26 |
Systems and methods for producing flat surfaces in interconnect structures
Grant 9,318,385 - Uzoh , et al. April 19, 2 | 2016-04-19 |
Wearable ultra-thin miniaturized mobile communications
Grant 9,319,499 - Wilson , et al. April 19, 2 | 2016-04-19 |
Inverted optical device
Grant 9,293,641 - Mohammed , et al. March 22, 2 | 2016-03-22 |
High Density Three-dimensional Integrated Capacitors
App 20160079189 - Mohammed; Ilyas ; et al. | 2016-03-17 |
Batch Process Fabrication Of Package-on-package Microelectronic Assemblies
App 20160079215 - Haba; Belgacem ; et al. | 2016-03-17 |
Bva Interposer
App 20160079214 - Caskey; Terrence ; et al. | 2016-03-17 |
Memory module in a package
Grant 9,287,216 - Haba , et al. March 15, 2 | 2016-03-15 |
Single exposure in multi-damascene process
Grant 9,287,164 - Uzoh , et al. March 15, 2 | 2016-03-15 |
Wearable Devices Including Metalized Interfaces And Strap-integrated Sensor Electrodes
App 20160070393 - Sharma; Sumit ; et al. | 2016-03-10 |
Microelectronic Packages And Methods Therefor
App 20160056058 - Haba; Belgacem ; et al. | 2016-02-25 |
Stacked microelectronic assembly with TSVS formed in stages and carrier above chip
Grant 9,269,692 - Oganesian , et al. February 23, 2 | 2016-02-23 |
Substrate-less stackable package with wire-bond interconnect
Grant 9,263,413 - Mohammed February 16, 2 | 2016-02-16 |
Porous Alumina Templates For Electronic Packages
App 20160044781 - Katkar; Rajesh ; et al. | 2016-02-11 |
Microelectronic Package With Stacked Microelectronic Units And Method For Manufacture Thereof
App 20160035712 - Caskey; Terrence ; et al. | 2016-02-04 |
Systems And Methods For Producing Flat Surfaces In Interconnect Structures
App 20160027693 - UZOH; Cyprian ; et al. | 2016-01-28 |
Embedded Packaging With Preformed Vias
App 20160020121 - Mohammed; Ilyas ; et al. | 2016-01-21 |
Semiconductor Chip Assembly And Method For Making Same
App 20160005711 - Kang; Teck-Gyu ; et al. | 2016-01-07 |
Compliant interconnects in wafers
Grant 9,224,649 - Oganesian , et al. December 29, 2 | 2015-12-29 |
Package-on-package assembly with wire bonds to encapsulation surface
Grant 9,224,717 - Sato , et al. December 29, 2 | 2015-12-29 |
Porous alumina templates for electronic packages
Grant 9,226,396 - Katkar , et al. December 29, 2 | 2015-12-29 |
Microelectronic Package With Consolidated Chip Structures
App 20150371968 - Haba; Belgacem ; et al. | 2015-12-24 |
Microelectronic packages and methods therefor
Grant 9,218,988 - Haba , et al. December 22, 2 | 2015-12-22 |
Low-stress vias
Grant 9,214,425 - Mohammed , et al. December 15, 2 | 2015-12-15 |
Batch process fabrication of package-on-package microelectronic assemblies
Grant 9,214,454 - Haba , et al. December 15, 2 | 2015-12-15 |
Microelectronic Packages Having Cavities For Receiving Microelectronic Elements
App 20150340336 - Mohammed; Ilyas ; et al. | 2015-11-26 |
Flow underfill for microelectronic packages
Grant 9,196,581 - Haba , et al. November 24, 2 | 2015-11-24 |
Structure For Microelectronic Packaging With Bond Elements To Encapsulation Surface
App 20150334831 - Haba; Belgacem ; et al. | 2015-11-19 |
Off-chip Vias In Stacked Chips
App 20150333042 - Haba; Belgacem ; et al. | 2015-11-19 |
Electrical Barrier Layers
App 20150334829 - UZOH; Cyprian ; et al. | 2015-11-19 |
Stacked Microelectronic Assembly With Tsvs Formed In Stages With Plural Active Chips
App 20150333050 - Oganesian; Vage ; et al. | 2015-11-19 |
High density three-dimensional integrated capacitors
Grant 9,190,463 - Mohammed , et al. November 17, 2 | 2015-11-17 |
Method Of Thinning A Wafer To Provide A Raised Peripheral Edge
App 20150325562 - Haba; Belgacem ; et al. | 2015-11-12 |
Low-stress Vias
App 20150325498 - Mohammed; Ilyas ; et al. | 2015-11-12 |
Microelectronic package with stacked microelectronic units and method for manufacture thereof
Grant 9,165,911 - Caskey , et al. October 20, 2 | 2015-10-20 |
High performance package on package
Grant 9,165,906 - Mohammed , et al. October 20, 2 | 2015-10-20 |
Embedded packaging with preformed vias
Grant 9,167,710 - Mohammed , et al. October 20, 2 | 2015-10-20 |
High Performance Light Emitting Diode With Vias
App 20150295151 - Mohammed; Ilyas ; et al. | 2015-10-15 |
Batch Process Fabrication Of Package-on-package Microelectronic Assemblies
App 20150279823 - Haba; Belgacem ; et al. | 2015-10-01 |
Single Exposure In Multi-damascene Process
App 20150279730 - UZOH; Cyprian ; et al. | 2015-10-01 |
Single exposure in multi-damascene process
Grant 9,142,508 - Uzoh , et al. September 22, 2 | 2015-09-22 |
Optical Enhancement Of Light Emitting Devices
App 20150263252 - Wang; Liang ; et al. | 2015-09-17 |
Semiconductor chip assembly and method for making same
Grant 9,137,903 - Kang , et al. September 15, 2 | 2015-09-15 |
Microelectronic Elements With Post-assembly Planarization
App 20150249037 - Oganesian; Vage ; et al. | 2015-09-03 |
Microelectronic package with consolidated chip structures
Grant 9,123,600 - Haba , et al. September 1, 2 | 2015-09-01 |
Electrical barrier layers
Grant 9,125,333 - Uzoh , et al. September 1, 2 | 2015-09-01 |
Multi-chip Module With Stacked Face-down Connected Dies
App 20150236002 - Haba; Belgacem ; et al. | 2015-08-20 |
Method of thinning a wafer to provide a raised peripheral edge
Grant 9,111,946 - Haba , et al. August 18, 2 | 2015-08-18 |
Front Facing Piggyback Wafer Assembly
App 20150228633 - Mohammed; Ilyas ; et al. | 2015-08-13 |
Microelectronic packages having cavities for receiving microelectronic elements
Grant 9,105,612 - Mohammed , et al. August 11, 2 | 2015-08-11 |
Multiple Die Face-down Stacking For Two Or More Die
App 20150221617 - Haba; Belgacem ; et al. | 2015-08-06 |
Non-lithographic Formation Of Three-dimensional Conductive Elements
App 20150221551 - Oganesian; Vage ; et al. | 2015-08-06 |
Stacked microelectronic assembly with TSVS formed in stages with plural active chips
Grant 9,099,296 - Oganesian , et al. August 4, 2 | 2015-08-04 |
Carrier structures for microelectronic elements
Grant 9,099,479 - Oganesian , et al. August 4, 2 | 2015-08-04 |
Package-on-package assembly with wire bonds to encapsulation surface
Grant 9,093,435 - Sato , et al. July 28, 2 | 2015-07-28 |
Structure for microelectronic packaging with bond elements to encapsulation surface
Grant 9,095,074 - Haba , et al. July 28, 2 | 2015-07-28 |
Parallel plate slot emission array
Grant 9,070,849 - Mohammed , et al. June 30, 2 | 2015-06-30 |
High Yield Substrate Assembly
App 20150171027 - Wang; Liang ; et al. | 2015-06-18 |
Quantum Efficiency Of Multiple Quantum Wells
App 20150171265 - Wang; Liang ; et al. | 2015-06-18 |
Off-chip vias in stacked chips
Grant 9,048,234 - Haba , et al. June 2, 2 | 2015-06-02 |
Substrate-to-Carrier Adhesion Without Mechanical Adhesion Between Abutting Surfaces Thereof
App 20150145140 - Haba; Belgacem ; et al. | 2015-05-28 |
BSI image sensor package with embedded absorber for even reception of different wavelengths
Grant 9,041,133 - Oganesian , et al. May 26, 2 | 2015-05-26 |
Vias In Porous Substrates
App 20150140807 - Mohammed; Ilyas ; et al. | 2015-05-21 |
Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
Grant 9,034,696 - Mohammed , et al. May 19, 2 | 2015-05-19 |
Staged Via Formation From Both Sides Of Chip
App 20150130077 - Oganesian; Vage ; et al. | 2015-05-14 |
Non-crystalline Inorganic Light Emitting Diode
App 20150129876 - Mohammed; Ilyas ; et al. | 2015-05-14 |
Heat spreading substrate with embedded interconnects
App 20150132894 - Mohammed; Ilyas ; et al. | 2015-05-14 |
Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
Grant 9,023,691 - Mohammed , et al. May 5, 2 | 2015-05-05 |
Non-lithographic formation of three-dimensional conductive elements
Grant 9,018,769 - Oganesian , et al. April 28, 2 | 2015-04-28 |
Multiple die face-down stacking for two or more die
Grant 9,013,033 - Haba , et al. April 21, 2 | 2015-04-21 |
Cavities Containing Multi-wiring Structures And Devices
App 20150101858 - Uzoh; Cyprian Emeka ; et al. | 2015-04-16 |
Package-on-package Assembly With Wire Bonds To Encapsulation Surface
App 20150091118 - Sato; Hiroaki ; et al. | 2015-04-02 |
Interconnection elements with encased interconnects
Grant 8,988,895 - Mohammed , et al. March 24, 2 | 2015-03-24 |
Three-dimensional System-in-a-package
App 20150079733 - Oganesian; Vage ; et al. | 2015-03-19 |
Substrate-Less Stackable Package With Wire-Bond Interconnect
App 20150069639 - Mohammed; Ilyas | 2015-03-12 |
Vias in porous substrates
Grant 8,975,751 - Mohammed , et al. March 10, 2 | 2015-03-10 |
Quantum efficiency of multiple quantum wells
Grant 8,975,616 - Wang , et al. March 10, 2 | 2015-03-10 |
Structure for microelectronic packaging with terminals on dielectric mass
Grant 8,975,738 - Haba , et al. March 10, 2 | 2015-03-10 |
Stacked Microelectronic Packages Having At Least Two Stacked Microelectronic Elements Adjacent One Another
App 20150048524 - Mohammed; Ilyas ; et al. | 2015-02-19 |
Multi-chip module with stacked face-down connected dies
Grant 8,956,916 - Haba , et al. February 17, 2 | 2015-02-17 |
Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contacts
Grant 8,957,520 - Sato , et al. February 17, 2 | 2015-02-17 |
Micro Mechanical Anchor For 3d Architecture
App 20150041208 - Wang; Liang ; et al. | 2015-02-12 |
Embedded Packaging With Preformed Vias
App 20150043190 - Mohammed; Ilyas ; et al. | 2015-02-12 |
Fan-Out WLP With Package
App 20150044824 - Sato; Hiroaki ; et al. | 2015-02-12 |
Microelectronic Package With Integrated Bearing Surfaces
App 20150044823 - Mohammed; Ilyas | 2015-02-12 |
Methods of fabricating a flip chip package for dram with two underfill materials
Grant 8,951,845 - Sakuma , et al. February 10, 2 | 2015-02-10 |
Structure For Microelectronic Packaging With Bond Elements To Encapsulation Surface
App 20150034371 - Haba; Belgacem ; et al. | 2015-02-05 |
Heat spreading substrate with embedded interconnects
Grant 8,946,757 - Mohammed , et al. February 3, 2 | 2015-02-03 |
Non-crystalline inorganic light emitting diode
Grant 8,941,111 - Mohammed , et al. January 27, 2 | 2015-01-27 |
Multi-Function and Shielded 3D Interconnects
App 20150021788 - Oganesian; Vage ; et al. | 2015-01-22 |
BSI image sensor package with variable-height silicon for even reception of different wavelengths
Grant 8,937,361 - Oganesian , et al. January 20, 2 | 2015-01-20 |
Microelectronic Assemblies Having Reinforcing Collars On Connectors Extending Through Encapsulation
App 20150014856 - Mohammed; Ilyas ; et al. | 2015-01-15 |
Interconnect Structure
App 20150014850 - Gupta; Debabrata ; et al. | 2015-01-15 |
Microelectronic Assemblies With Stack Terminals Coupled By Connectors Extending Through Encapsulation
App 20150014847 - Mohammed; Ilyas ; et al. | 2015-01-15 |
Pin Attachment
App 20150011052 - Haba; Belgacem ; et al. | 2015-01-08 |
Cavities containing multi-wiring structures and devices
Grant 8,916,781 - Haba , et al. December 23, 2 | 2014-12-23 |
Memory Module In A Package
App 20140367866 - Haba; Belgacem ; et al. | 2014-12-18 |
Front facing piggyback wafer assembly
Grant 8,912,024 - Mohammed , et al. December 16, 2 | 2014-12-16 |
Multi-chip Module With Stacked Face-down Connected Dies
App 20140357021 - Haba; Belgacem ; et al. | 2014-12-04 |
High yield substrate assembly
Grant 8,900,974 - Wang , et al. December 2, 2 | 2014-12-02 |
Compliant Interconnects In Wafers
App 20140342503 - Oganesian; Vage ; et al. | 2014-11-20 |
Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material
Grant 8,890,304 - Sato , et al. November 18, 2 | 2014-11-18 |
Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
Grant 8,890,327 - Mohammed , et al. November 18, 2 | 2014-11-18 |
Low-stress Vias
App 20140332981 - MOHAMMED; Ilyas ; et al. | 2014-11-13 |
Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
Grant 8,883,563 - Haba , et al. November 11, 2 | 2014-11-11 |
Structure for microelectronic packaging with bond elements to encapsulation surface
Grant 8,878,353 - Haba , et al. November 4, 2 | 2014-11-04 |
Chips with high fracture toughness through a metal ring
Grant 8,865,570 - Mohammed October 21, 2 | 2014-10-21 |
Wearable Ultra-thin Miniaturized Mobile Communications
App 20140308987 - Wilson; Stuart E. ; et al. | 2014-10-16 |
Interconnect structure
Grant 8,853,558 - Gupta , et al. October 7, 2 | 2014-10-07 |
Microelectronic elements with post-assembly planarization
Grant 8,847,376 - Oganesian , et al. September 30, 2 | 2014-09-30 |
Staged via formation from both sides of chip
Grant 8,847,380 - Oganesian , et al. September 30, 2 | 2014-09-30 |
High yield substrate assembly
Grant 8,841,204 - Wang , et al. September 23, 2 | 2014-09-23 |
Multi-chip module with stacked face-down connected dies
Grant 8,841,765 - Haba , et al. September 23, 2 | 2014-09-23 |
High Density Three-dimensional Integrated Capacitors
App 20140273393 - Mohammed; Ilyas ; et al. | 2014-09-18 |
Porous Alumina Templates For Electronic Packages
App 20140262457 - Katkar; Rajesh ; et al. | 2014-09-18 |
Microelectronic Package With Consolidated Chip Structures
App 20140239514 - Haba; Belgacem ; et al. | 2014-08-28 |
Flow Underfill For Microelectronic Packages
App 20140217584 - Haba; Belgacem ; et al. | 2014-08-07 |
Non-lithographic Formation Of Three-dimensional Conductive Elements
App 20140210104 - Oganesian; Vage ; et al. | 2014-07-31 |
Microelectronic Package With Stacked Microelectronic Units And Method For Manufacture Thereof
App 20140212996 - Caskey; Terrence ; et al. | 2014-07-31 |
Microelectronic Packages And Methods Therefor
App 20140213021 - Haba; Belgacem ; et al. | 2014-07-31 |
Low-stress Tsv Design Using Conductive Particles
App 20140201994 - Woychik; Charles G. ; et al. | 2014-07-24 |
Stacked Microelectronic Assembly With Tsvs Formed In Stages And Carrier Above Chip
App 20140206147 - Oganesian; Vage ; et al. | 2014-07-24 |
Active Chip On Carrier Or Laminated Chip Having Microelectronic Element Embedded Therein
App 20140203452 - Oganesian; Vage ; et al. | 2014-07-24 |
Interposer Having Molded Low Cte Dielectric
App 20140206184 - Haba; Belgacem ; et al. | 2014-07-24 |
Thin Wafer Handling
App 20140179061 - Haba; Belgacem ; et al. | 2014-06-26 |
Non-crystalline Inorganic Light Emitting Diode
App 20140175440 - Mohammed; Ilyas ; et al. | 2014-06-26 |
Structure For Microelectronic Packaging With Bond Elements To Encapsulation Surface
App 20140175671 - Haba; Belgacem ; et al. | 2014-06-26 |
High Performance Package On Package
App 20140159248 - Mohammed; Ilyas ; et al. | 2014-06-12 |
Flip Chip Package For Dram With Two Underfill Materials
App 20140141568 - Sakuma; Kazuo ; et al. | 2014-05-22 |
Chips With High Fracture Toughness Through A Metal Ring
App 20140141597 - Mohammed; Ilyas | 2014-05-22 |
Structure For Microelectronic Packaging With Terminals On Dielectric Mass
App 20140131851 - Haba; Belgacem ; et al. | 2014-05-15 |
Chip Assembly Having Via Interconnects Joined By Plating
App 20140131892 - Oganesian; Vage ; et al. | 2014-05-15 |
Multi-function And Shielded 3d Interconnects
App 20140097546 - Oganesian; Vage ; et al. | 2014-04-10 |
Compliant Interconnects In Wafers
App 20140099754 - Oganesian; Vage ; et al. | 2014-04-10 |
Dual Wafer Spin Coating
App 20140057370 - Oganesian; Vage ; et al. | 2014-02-27 |
Stacked Microelectronic Assembly With Tsvs Formed In Stages With Plural Active Chips
App 20140048954 - Oganesian; Vage ; et al. | 2014-02-20 |
Parallel Plate Slot Emission Array
App 20140045285 - Mohammed; Ilyas ; et al. | 2014-02-13 |
Reconstituted Wafer-level Package Dram
App 20140035153 - Mohammed; Ilyas | 2014-02-06 |
Bva Interposer
App 20140036454 - Caskey; Terrence ; et al. | 2014-02-06 |
Microelectronic Packages Having Cavities For Receiving Microelectronic Elements
App 20140021641 - Mohammed; Ilyas ; et al. | 2014-01-23 |
High Performance Light Emitting Diode With Vias
App 20140014894 - Mohammed; Ilyas ; et al. | 2014-01-16 |
Parallel Plate Slot Emission Array
App 20140008669 - Mohammed; Ilyas ; et al. | 2014-01-09 |
Quantum Efficiency Of Multiple Quantum Wells
App 20140008607 - Wang; Liang ; et al. | 2014-01-09 |
Optical Enhancement Of Light Emitting Devices
App 20140008676 - Wang; Liang ; et al. | 2014-01-09 |
Package-on-package assembly with wire bonds to encapsulation surface
Grant 08618659 - | 2013-12-31 |
Simultaneous Wafer Bonding And Interconnect Joining
App 20130341804 - Oganesian; Vage ; et al. | 2013-12-26 |
Microelectronic Assembly Tolerant To Misplacement Of Microelectronic Elements Therein
App 20130334698 - Mohammed; Ilyas ; et al. | 2013-12-19 |
Substrate-less Stackable Package With Wire-bond Interconnect
App 20130313716 - Mohammed; Ilyas | 2013-11-28 |
High Density Three-dimensional Integrated Capacitors
App 20130313680 - Oganesian; Vage ; et al. | 2013-11-28 |
Microelectronic Package With Stacked Microelectronic Elements And Method For Manufacture Thereof
App 20130300000 - Sato; Hiroaki ; et al. | 2013-11-14 |
High Yield Substrate Assembly
App 20130288412 - WANG; Liang ; et al. | 2013-10-31 |
Off-chip Vias In Stacked Chips
App 20130273693 - Haba; Belgacem ; et al. | 2013-10-17 |
Microelectronic Package
App 20130249116 - Mohammed; Ilyas ; et al. | 2013-09-26 |
Heat Spreading Substrate
App 20130215121 - Guevara; Gabriel Z. ; et al. | 2013-08-22 |
Single Exposure In Multi-damascene Process
App 20120326313A1 - | 2012-12-27 |
| 