| Patent | Date |
|---|
Metal Pads Over Tsv
App 20220302058 - Gao; Guilian ; et al. | 2022-09-22 |
Protective Elements For Bonded Structures
App 20220302048 - DeLaCruz; Javier A. ; et al. | 2022-09-22 |
Direct Bonded Stack Structures For Increased Reliability And Improved Yield In Microelectronics
App 20220293567 - Uzoh; Cyprian Emeka ; et al. | 2022-09-15 |
Package-on-package assembly with wire bonds to encapsulation surface
Grant 11,424,211 - Sato , et al. August 23, 2 | 2022-08-23 |
3D NAND--high aspect ratio strings and channels
Grant 11,404,439 - Katkar , et al. August 2, 2 | 2022-08-02 |
Large metal pads over TSV
Grant 11,393,779 - Gao , et al. July 19, 2 | 2022-07-19 |
Nanowire bonding interconnect for fine-pitch microelectronics
Grant 11,387,202 - Haba , et al. July 12, 2 | 2022-07-12 |
Security circuitry for bonded structures
Grant 11,385,278 - DeLaCruz , et al. July 12, 2 | 2022-07-12 |
Mixed Exposure For Large Die
App 20220216180 - Delacruz; Javier A. ; et al. | 2022-07-07 |
Directly Bonded Structures
App 20220208723 - Katkar; Rajesh ; et al. | 2022-06-30 |
Protective elements for bonded structures
Grant 11,373,963 - DeLaCruz , et al. June 28, 2 | 2022-06-28 |
Bonded Structures Without Intervening Adhesive
App 20220199560 - Haba; Belgacem ; et al. | 2022-06-23 |
Stacked transmission line
Grant 11,369,020 - Huang , et al. June 21, 2 | 2022-06-21 |
Stacked Devices And Methods Of Fabrication
App 20220189941 - Enquist; Paul M. ; et al. | 2022-06-16 |
Systems and methods for releveled bump planes for chiplets
Grant 11,348,898 - Delacruz , et al. May 31, 2 | 2022-05-31 |
Direct-bonded Lamination For Improved Image Clarity In Optical Devices
App 20220155490 - Haba; Belgacem ; et al. | 2022-05-19 |
Symbiotic Network On Layers
App 20220150184 - DeLaCruz; Javier A. ; et al. | 2022-05-12 |
Network On Layer Enabled Architectures
App 20220139883 - DeLaCruz; Javier A. ; et al. | 2022-05-05 |
Integrated Device Packages
App 20220122934 - Haba; Belgacem | 2022-04-21 |
Direct bonded stack structures for increased reliability and improved yield in microelectronics
Grant 11,296,053 - Uzoh , et al. April 5, 2 | 2022-04-05 |
Stacked devices and methods of fabrication
Grant 11,276,676 - Enquist , et al. March 15, 2 | 2022-03-15 |
Bonded Structure With Interconnect Structure
App 20220077087 - Haba; Belgacem | 2022-03-10 |
Bonded Structure With Interconnect Structure
App 20220077063 - Haba; Belgacem | 2022-03-10 |
Symbiotic network on layers
Grant 11,270,979 - Delacruz , et al. March 8, 2 | 2022-03-08 |
Network on layer enabled architectures
Grant 11,264,361 - Delacruz , et al. March 1, 2 | 2022-03-01 |
Mixed exposure for large die
Grant 11,264,357 - Delacruz , et al. March 1, 2 | 2022-03-01 |
Direct-bonded lamination for improved image clarity in optical devices
Grant 11,256,004 - Haba , et al. February 22, 2 | 2022-02-22 |
Configurable smart object system with clip-based connectors
Grant 11,239,587 - Haba , et al. February 1, 2 | 2022-02-01 |
Interlayer Connection Of Stacked Microelectronic Components
App 20220028835 - GAO; Guilian ; et al. | 2022-01-27 |
Molded Direct Bonded And Interconnected Stack
App 20220020729 - GAO; Guilian ; et al. | 2022-01-20 |
Techniques For Manufacturing Split-cell 3d-nand Memory Devices
App 20220005827 - Chang; Xu ; et al. | 2022-01-06 |
Integrated Device Packages
App 20210407941 - Haba; Belgacem | 2021-12-30 |
Active Bridging Apparatus
App 20210351159 - Delacruz; Javier A. ; et al. | 2021-11-11 |
Interlayer connection of stacked microelectronic components
Grant 11,171,117 - Gao , et al. November 9, 2 | 2021-11-09 |
Molded direct bonded and interconnected stack
Grant 11,158,606 - Gao , et al. October 26, 2 | 2021-10-26 |
Embedded Organic Interposer For High Bandwidth
App 20210327851 - Delacruz; Javier A. ; et al. | 2021-10-21 |
High Density Three-dimensional Integrated Capacitors
App 20210265460 - Oganesian; Vage ; et al. | 2021-08-26 |
Systems and Methods for Releveled Bump Planes for Chiplets
App 20210249383 - Delacruz; Javier A. ; et al. | 2021-08-12 |
Systems And Methods For Flash Stacking
App 20210225811 - Haba; Belgacem ; et al. | 2021-07-22 |
Embedded organic interposer for high bandwidth
Grant 11,063,017 - Delacruz , et al. July 13, 2 | 2021-07-13 |
Apparatus For Non-Volatile Random Access Memory Stacks
App 20210193624 - Delacruz; Javier A. ; et al. | 2021-06-24 |
Circuitry For Electrical Redundancy In Bonded Structures
App 20210193603 - DeLACruz; Javier A. ; et al. | 2021-06-24 |
Electrical Redundancy For Bonded Structures
App 20210193625 - Katkar; Rajesh ; et al. | 2021-06-24 |
Stretchable Film Assembly With Conductive Traces
App 20210181511 - Haba; Belgacem ; et al. | 2021-06-17 |
Bonded Optical Devices
App 20210181510 - Katkar; Rajesh ; et al. | 2021-06-17 |
Systems and Methods for Releveled Bump Planes for Chiplets
App 20210175206 - Delacruz; Javier A. ; et al. | 2021-06-10 |
Formation of a light-emitting diode display
Grant 11,024,220 - Wang , et al. June 1, 2 | 2021-06-01 |
High density three-dimensional integrated capacitors
Grant 11,004,930 - Oganesian , et al. May 11, 2 | 2021-05-11 |
Cavity Packages
App 20210134689 - Huang; Shaowu ; et al. | 2021-05-06 |
Systems and methods for flash stacking
Grant 10,991,676 - Haba , et al. April 27, 2 | 2021-04-27 |
Remote optical engine for virtual reality or augmented reality headsets
Grant 10,969,593 - Haba , et al. April 6, 2 | 2021-04-06 |
Direct Gang Bonding Methods And Structures
App 20210098412 - Haba; Belgacem ; et al. | 2021-04-01 |
Stretchable film assembly with conductive traces
Grant 10,955,671 - Haba , et al. March 23, 2 | 2021-03-23 |
3d Nand - High Aspect Ratio Strings And Channels
App 20210074723 - Katkar; Rajesh ; et al. | 2021-03-11 |
Package-On-Package Assembly With Wire Bonds To Encapsulation Surface
App 20210050322 - Sato; Hiroaki ; et al. | 2021-02-18 |
Cavity packages
Grant 10,923,408 - Huang , et al. February 16, 2 | 2021-02-16 |
Capacitive Coupling In A Direct-bonded Interface For Microelectronic Devices
App 20210035954 - Haba; Belgacem ; et al. | 2021-02-04 |
Systems and methods for releveled bump planes for chiplets
Grant 10,910,344 - Delacruz , et al. February 2, 2 | 2021-02-02 |
Remote Optical Engine For Virtual Reality Or Augmented Reality Headsets
App 20200409157 - Haba; Belgacem ; et al. | 2020-12-31 |
Direct Bonded Stack Structures For Increased Reliability And Improved Yield In Microelectronics
App 20200411483 - Uzoh; Cyprian Emeka ; et al. | 2020-12-31 |
Connecting Multiple Chips Using An Interconnect Device
App 20200402913 - Delacruz; Javier A. ; et al. | 2020-12-24 |
Network On Layer Enabled Architectures
App 20200388592 - Delacruz; Javier A. ; et al. | 2020-12-10 |
Symbiotic Network On Layers
App 20200387471 - Delacruz; Javier A. ; et al. | 2020-12-10 |
Head mounted viewer for AR and VR scenes
Grant 10,852,545 - Mohammed , et al. December 1, 2 | 2020-12-01 |
Security Circuitry For Bonded Structures
App 20200371154 - DeLaCruz; Javier A. ; et al. | 2020-11-26 |
Package-on-package assembly with wire bonds to encapsulation surface
Grant 10,833,044 - Sato , et al. November 10, 2 | 2020-11-10 |
Capacitive coupling in a direct-bonded interface for microelectronic devices
Grant 10,811,388 - Haba , et al. October 20, 2 | 2020-10-20 |
Cavities containing multi-wiring structures and devices
Grant 10,813,214 - Uzoh , et al. October 20, 2 | 2020-10-20 |
Protective Elements For Bonded Structures
App 20200328164 - DeLaCruz; Javier A. ; et al. | 2020-10-15 |
Protective Elements For Bonded Structures
App 20200328162 - Haba; Belgacem ; et al. | 2020-10-15 |
Remote optical engine for virtual reality or augmented reality headsets
Grant 10,802,285 - Haba , et al. October 13, 2 | 2020-10-13 |
Over And Under Interconnects
App 20200321275 - Haba; Belgacem ; et al. | 2020-10-08 |
Bonding of laminates with electrical interconnects
Grant 10,790,222 - Delacruz , et al. September 29, 2 | 2020-09-29 |
3D NAND--high aspect ratio strings and channels
Grant 10,784,282 - Katkar , et al. Sept | 2020-09-22 |
Interface structures and methods for forming same
Grant 10,784,191 - Huang , et al. Sept | 2020-09-22 |
Bonded Structures With Integrated Passive Component
App 20200294908 - Haba; Belgacem ; et al. | 2020-09-17 |
Nanowire Bonding Interconnect For Fine-pitch Microelectronics
App 20200279821 - Haba; Belgacem ; et al. | 2020-09-03 |
Deformable electrical contacts with conformable target pads
Grant 10,750,614 - Haba , et al. A | 2020-08-18 |
Configurable smart object system with magnetic contacts and magnetic assembly
Grant 10,734,759 - Haba , et al. | 2020-08-04 |
Bonded Structures
App 20200227367 - Haba; Belgacem ; et al. | 2020-07-16 |
Correction Die For Wafer/die Stack
App 20200219852 - Haba; Belgacem | 2020-07-09 |
Systems And Methods For Flash Stacking
App 20200212013 - Haba; Belgacem ; et al. | 2020-07-02 |
Stacked Architecture For Three-dimensional Nand
App 20200203316 - Morein; Stephen ; et al. | 2020-06-25 |
3d Nand - High Aspect Ratio Strings And Channels
App 20200203368 - Katkar; Rajesh ; et al. | 2020-06-25 |
Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows
Grant 10,692,842 - Crisp , et al. | 2020-06-23 |
Package-on-package Assembly With Wire Bonds To Encapsulation Surface
App 20200168579 - SATO; Hiroaki ; et al. | 2020-05-28 |
Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
Grant 10,643,977 - Crisp , et al. | 2020-05-05 |
Correction die for wafer/die stack
Grant 10,636,767 - Haba | 2020-04-28 |
Stacked chip-on-board module with edge connector
Grant 10,622,289 - Zohni , et al. | 2020-04-14 |
SSI PoP
Grant 10,622,291 - Haba | 2020-04-14 |
Ultrathin layer for forming a capacitive interface between joined integrated circuit component
Grant 10,600,760 - Haba , et al. | 2020-03-24 |
Nanoscale interconnect array for stacked dies
Grant 10,600,761 - Wang , et al. | 2020-03-24 |
Vertical capacitors for microelectronics
Grant 10,600,747 - Haba , et al. | 2020-03-24 |
Fan-out wafer level package with resist vias
Grant 10,593,563 - Haba , et al. | 2020-03-17 |
Systems and methods for flash stacking
Grant 10,593,651 - Haba , et al. | 2020-03-17 |
Package-on-package assembly with wire bonds to encapsulation surface
Grant 10,593,643 - Sato , et al. | 2020-03-17 |
Stacked Optical Waveguides
App 20200081251 - MOHAMMED; Ilyas ; et al. | 2020-03-12 |
Head Mounted Viewer For Ar And Vr Scenes
App 20200081250 - MOHAMMED; Ilyas ; et al. | 2020-03-12 |
Integrated Voltage Regulator And Passive Components
App 20200075553 - DELACRUZ; Javier A. ; et al. | 2020-03-05 |
Microelectronic packages having stacked die and wire bond interconnects
Grant 10,566,310 - Haba , et al. Feb | 2020-02-18 |
Microelectronic elements with post-assembly planarization
Grant 10,559,494 - Oganesian , et al. Feb | 2020-02-11 |
Methods of forming flipped RF filter components
Grant 10,535,909 - Huang , et al. Ja | 2020-01-14 |
Molded Direct Bonded And Interconnected Stack
App 20200013754 - GAO; Guilian ; et al. | 2020-01-09 |
Microelectronic Assemblies
App 20200013637 - Haba; Belgacem | 2020-01-09 |
Systems and methods for releveled bump planes for chiplets
App 20190393190 - DELACRUZ; Javier A. ; et al. | 2019-12-26 |
Embedded Organic Interposer For High Bandwidth
App 20190385978 - Delacruz; Javier A. ; et al. | 2019-12-19 |
Tsv As Pad
App 20190385935 - GAO; Guilian ; et al. | 2019-12-19 |
Large Metal Pads Over Tsv
App 20190385966 - GAO; Guilian ; et al. | 2019-12-19 |
Interlayer Connection Of Stacked Microelectronic Components
App 20190378820 - Gao; Guilian ; et al. | 2019-12-12 |
Systems And Methods For Flash Stacking
App 20190371765 - Haba; Belgacem ; et al. | 2019-12-05 |
Formation of a Light-Emitting Diode Display
App 20190371229 - Wang; Liang ; et al. | 2019-12-05 |
Stacked Devices And Methods Of Fabrication
App 20190355706 - Enquist; Paul M. ; et al. | 2019-11-21 |
Warpage balancing in thin packages
Grant 10,483,217 - Haba , et al. Nov | 2019-11-19 |
Method and structures for heat dissipating interposers
Grant 10,475,733 - Uzoh , et al. Nov | 2019-11-12 |
Stackable microelectronic package structures
Grant 10,468,380 - Haba , et al. No | 2019-11-05 |
Method of manufacturing embedded packaging with preformed vias
Grant 10,460,958 - Mohammed , et al. Oc | 2019-10-29 |
Direct-bonded Lamination For Improved Image Clarity In Optical Devices
App 20190293838 - HABA; Belgacem ; et al. | 2019-09-26 |
Configurable Smart Object System With Clip-based Connectors
App 20190280408 - HABA; Belgacem ; et al. | 2019-09-12 |
Configurable Smart Object System With Grid Or Frame-based Connectors
App 20190280421 - HABA; Belgacem ; et al. | 2019-09-12 |
Configurable Smart Object System With Magnetic Contacts And Magnetic Assembly
App 20190280428 - HABA; Belgacem ; et al. | 2019-09-12 |
Stretchable Film Assembly With Conductive Traces
App 20190273016 - Haba; Belgacem ; et al. | 2019-09-05 |
Remote Optical Engine For Virtual Reality Or Augmented Reality Headsets
App 20190272802 - Haba; Belgacem ; et al. | 2019-09-05 |
Embedded organic interposers for high bandwidth
Grant 10,403,599 - Delacruz , et al. Sep | 2019-09-03 |
Nanoscale Interconnect Array For Stacked Dies
App 20190237437 - Wang; Liang ; et al. | 2019-08-01 |
Bonding Of Laminates With Electrical Interconnects
App 20190221510 - Delacruz; Javier A. ; et al. | 2019-07-18 |
Dies-on-package devices and methods therefor
Grant 10,354,976 - Tao , et al. July 16, 2 | 2019-07-16 |
Staged via formation from both sides of chip
Grant 10,354,942 - Oganesian , et al. July 16, 2 | 2019-07-16 |
Vertical Capacitors For Microelectronics
App 20190214353 - Haba; Belgacem ; et al. | 2019-07-11 |
Embedded vialess bridges
Grant 10,347,582 - Haba July 9, 2 | 2019-07-09 |
Cavity Packages
App 20190198407 - Huang; Shaowu ; et al. | 2019-06-27 |
Low CTE interposer
Grant 10,319,673 - Haba , et al. | 2019-06-11 |
Nanoscale interconnect array for stacked dies
Grant 10,304,803 - Wang , et al. | 2019-05-28 |
3D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
Grant 10,297,570 - Haba | 2019-05-21 |
BVA interposer
Grant 10,297,582 - Caskey , et al. | 2019-05-21 |
Folding thin systems
Grant 10,290,589 - Haba , et al. | 2019-05-14 |
Systems and methods for flash stacking
Grant 10,290,612 - Haba , et al. | 2019-05-14 |
Method And Structures For Heat Dissipating Interposers
App 20190139878 - Uzoh; Cyprian Emeka ; et al. | 2019-05-09 |
Low stress vias
Grant 10,283,449 - Mohammed , et al. | 2019-05-07 |
Bonding of laminates with electrical interconnects
Grant 10,283,445 - Delacruz , et al. | 2019-05-07 |
High Density Three-dimensional Integrated Capacitors
App 20190131387 - Oganesian; Vage ; et al. | 2019-05-02 |
Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
Grant 10,276,909 - Huang , et al. | 2019-04-30 |
Capacitive Coupling In A Direct-bonded Interface For Microelectronic Devices
App 20190115323 - Haba; Belgacem ; et al. | 2019-04-18 |
Active chip on carrier or laminated chip having microelectronic element embedded therein
Grant 10,262,947 - Oganesian , et al. | 2019-04-16 |
Configurable Smart Object System With Standard Connectors For Adding Artificial Intelligence To Appliances, Vehicles, And Devices
App 20190097362 - HABA; Belgacem ; et al. | 2019-03-28 |
Stacked Transmission Line
App 20190069392 - Huang; Shaowu ; et al. | 2019-02-28 |
Microelectronic assembly with redistribution structure formed on carrier
Grant 10,211,160 - Haba , et al. Feb | 2019-02-19 |
Microelectronic Package Including Microelectronic Elements Having Stub Minimization For Wirebond Assemblies Without Windows
App 20190035769 - Crisp; Richard Dewitt ; et al. | 2019-01-31 |
Flipped Rf Filters And Components
App 20190036191 - Huang; Shaowu ; et al. | 2019-01-31 |
Configurable Smart Object System With Methods Of Making Modules And Contactors
App 20190029132 - HABA; Belgacem ; et al. | 2019-01-24 |
Embedded Vialess Bridges
App 20190019754 - Haba; Belgacem | 2019-01-17 |
Ultrathin Layer for Forming a Capacitive Interface Between Joined Integrated Circuit Component
App 20180366446 - Haba; Belgacem ; et al. | 2018-12-20 |
Porous alumina templates for electronic packages
Grant 10,159,148 - Katkar , et al. Dec | 2018-12-18 |
High density three-dimensional integrated capacitors
Grant 10,157,978 - Oganesian , et al. Dec | 2018-12-18 |
Deformable Electrical Contacts With Conformable Target Pads
App 20180359855 - Haba; Belgacem ; et al. | 2018-12-13 |
Package-on-package Assembly With Wire Bonds To Encapsulation Surface
App 20180350766 - SATO; Hiroaki ; et al. | 2018-12-06 |
Stacked transmission line
Grant 10,149,377 - Huang , et al. De | 2018-12-04 |
Microelectronic Package Having Stub Minimization Using Symmetrically-Positioned Duplicate Sets of Terminals for Wirebond Assemblies Without Windows
App 20180331074 - Crisp; Richard Dewitt ; et al. | 2018-11-15 |
Stackable molded microelectronic packages
Grant 10,128,216 - Haba November 13, 2 | 2018-11-13 |
Embedded Organic Interposers for High Bandwidth
App 20180315735 - Delacruz; Javier A. ; et al. | 2018-11-01 |
Flipped RF filters and components
Grant 10,109,903 - Huang , et al. October 23, 2 | 2018-10-23 |
Fan-Out Wafer Level Package with Resist Vias
App 20180301350 - Haba; Belgacem ; et al. | 2018-10-18 |
Method and structures for heat dissipating interposers
Grant 10,103,094 - Uzoh , et al. October 16, 2 | 2018-10-16 |
Cavities Containing Multi-wiring Structures And Devices
App 20180295718 - Uzoh; Cyprian Emeka ; et al. | 2018-10-11 |
Interface Structures And Methods For Forming Same
App 20180286805 - Huang; Shaowu ; et al. | 2018-10-04 |
Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows
Grant 10,090,280 - Crisp , et al. October 2, 2 | 2018-10-02 |
Embedded vialess bridges
Grant 10,083,909 - Haba September 25, 2 | 2018-09-25 |
Multi-chip package with interconnects extending through logic chip
Grant 10,083,934 - Haba September 25, 2 | 2018-09-25 |
Warpage Balancing In Thin Packages
App 20180261556 - Haba; Belgacem ; et al. | 2018-09-13 |
Stackable Microelectronic Package Structures
App 20180261571 - Haba; Belgacem ; et al. | 2018-09-13 |
Microelectronic Elements With Post-assembly Planarization
App 20180254213 - Oganesian; Vage ; et al. | 2018-09-06 |
Package-on-package assembly with wire bonds to encapsulation surface
Grant 10,062,661 - Sato , et al. August 28, 2 | 2018-08-28 |
Reliable packaging and interconnect structures
Grant 10,037,940 - Uzoh , et al. July 31, 2 | 2018-07-31 |
Robust multi-layer wiring elements and assemblies with embedded microelectronic elements
Grant 10,032,646 - Haba , et al. July 24, 2 | 2018-07-24 |
Ultrathin layer for forming a capacitive interface between joined integrated circuit components
Grant 10,032,751 - Haba , et al. July 24, 2 | 2018-07-24 |
Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
Grant 10,032,752 - Crisp , et al. July 24, 2 | 2018-07-24 |
Bonded Structures With Integrated Passive Component
App 20180190580 - Haba; Belgacem ; et al. | 2018-07-05 |
Structure With Integrated Metallic Waveguide
App 20180191047 - Huang; Shaowu ; et al. | 2018-07-05 |
Cavities containing multi-wiring structures and devices
Grant 10,015,881 - Uzoh , et al. July 3, 2 | 2018-07-03 |
Microelectronic element with bond elements to encapsulation surface
Grant 10,008,477 - Haba , et al. June 26, 2 | 2018-06-26 |
Package-on-package devices with same level WLP components and methods therefor
Grant 9,991,233 - Tao , et al. June 5, 2 | 2018-06-05 |
Package on-package devices with upper RDL of WLPS and methods therefor
Grant 9,991,235 - Tao , et al. June 5, 2 | 2018-06-05 |
Package on-package devices with multiple levels and methods therefor
Grant 9,985,007 - Tao , et al. May 29, 2 | 2018-05-29 |
Method for making a microelectronic assembly having conductive elements
Grant 9,984,901 - Haba , et al. May 29, 2 | 2018-05-29 |
Warpage balancing in thin packages
Grant 9,972,582 - Haba , et al. May 15, 2 | 2018-05-15 |
Wafer-level packaged components and methods therefor
Grant 9,972,573 - Tao , et al. May 15, 2 | 2018-05-15 |
Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor
Grant 9,972,609 - Tao , et al. May 15, 2 | 2018-05-15 |
Adhesive with Self-Connecting Interconnects
App 20180130766 - Haba; Belgacem | 2018-05-10 |
Active Chip On Carrier Or Laminated Chip Having Microelectronic Element Embedded Therein
App 20180130746 - OGANESIAN; Vage ; et al. | 2018-05-10 |
Folding Thin Systems
App 20180130757 - Haba; Belgacem ; et al. | 2018-05-10 |
Microelectronic elements with post-assembly planarization
Grant 9,966,303 - Oganesian , et al. May 8, 2 | 2018-05-08 |
Staged Via Formation From Both Sides Of Chip
App 20180114743 - Oganesian; Vage ; et al. | 2018-04-26 |
Bonding of Laminates with Electrical Interconnects
App 20180114747 - Delacruz; Javier A. ; et al. | 2018-04-26 |
Embedded Vialess Bridges
App 20180108612 - Haba; Belgacem | 2018-04-19 |
Deformable conductive contacts
Grant 9,947,633 - Haba , et al. April 17, 2 | 2018-04-17 |
Flipped Rf Filters And Components
App 20180102578 - Huang; Shaowu ; et al. | 2018-04-12 |
TFD I/O partition for high-speed, high-density applications
Grant 9,928,883 - Sun , et al. March 27, 2 | 2018-03-27 |
Low Cte Interposer
App 20180082935 - Haba; Belgacem ; et al. | 2018-03-22 |
2.5D microelectronic assembly and method with circuit structure formed on carrier
Grant 9,917,042 - Haba , et al. March 13, 2 | 2018-03-13 |
SSI PoP
App 20180068930 - Haba; Belgacem | 2018-03-08 |
Stackable microelectronic package structures
Grant 9,911,717 - Haba , et al. March 6, 2 | 2018-03-06 |
Off-chip vias in stacked chips
Grant 9,899,353 - Haba , et al. February 20, 2 | 2018-02-20 |
Multi-chip Package With Interconnects Extending Through Logic Chip
App 20180047704 - Haba; Belgacem | 2018-02-15 |
Reliable device assembly
Grant 9,893,030 - Uzoh , et al. February 13, 2 | 2018-02-13 |
Off substrate kinking of bond wire
Grant 9,893,033 - Haba , et al. February 13, 2 | 2018-02-13 |
Microelectronic Packages And Assemblies With Repeaters
App 20180040589 - Huang; Shaowu ; et al. | 2018-02-08 |
Vertical Memory Module Enabled by Fan-Out Redistribution Layer
App 20180040587 - Tao; Min ; et al. | 2018-02-08 |
Warpage Balancing in Thin Packages
App 20180040572 - Haba; Belgacem ; et al. | 2018-02-08 |
Package-on-Package Devices with Multiple Levels and Methods Therefor
App 20180026018 - Tao; Min ; et al. | 2018-01-25 |
Dies-on-Package Devices and Methods Therefor
App 20180026017 - Tao; Min ; et al. | 2018-01-25 |
Wafer-Level Packaged Components and Methods Therefor
App 20180025987 - Tao; Min ; et al. | 2018-01-25 |
Package-on-Package Devices with WLP Components with Dual RDLS for Surface Mount Dies and Methods Therefor
App 20180026019 - Tao; Min ; et al. | 2018-01-25 |
Package-on-Package Devices with Same Level WLP Components and Methods Therefor
App 20180026011 - Tao; Min ; et al. | 2018-01-25 |
Package-on-Package Devices with Upper RDL of WLPS and Methods Therefor
App 20180026016 - Tao; Min ; et al. | 2018-01-25 |
Configurable machine learning assemblies for autonomous operation in personal devices
App 20180025268 - TEIG; Steven L. ; et al. | 2018-01-25 |
Flip-chip, Face-up And Face-down Centerbond Memory Wirebond Assemblies
App 20180025967 - Haba; Belgacem ; et al. | 2018-01-25 |
3D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
Grant 9,871,014 - Haba January 16, 2 | 2018-01-16 |
Flipped die stacks with multiple rows of leadframe interconnects
Grant 9,859,257 - Delacruz , et al. January 2, 2 | 2018-01-02 |
Microelectronic interconnect element with decreased conductor spacing
Grant 9,856,135 - Ryu , et al. January 2, 2 | 2018-01-02 |
Laminated chip having microelectronic element embedded therein
Grant 9,859,220 - Oganesian , et al. January 2, 2 | 2018-01-02 |
Stacked Transmission Line
App 20170374734 - Huang; Shaowu ; et al. | 2017-12-28 |
Deformable Conductive Contacts
App 20170373033 - Haba; Belgacem ; et al. | 2017-12-28 |
Porous Alumina Templates For Electronic Packages
App 20170372994 - Katkar; Rajesh ; et al. | 2017-12-28 |
Embedded vialess bridges
Grant 9,852,994 - Haba December 26, 2 | 2017-12-26 |
Method And Structures For Heat Dissipating Interposers
App 20170365546 - Uzoh; Cyprian Emeka ; et al. | 2017-12-21 |
Staged via formation from both sides of chip
Grant 9,847,277 - Oganesian , et al. December 19, 2 | 2017-12-19 |
Low CTE interposer
Grant 9,837,344 - Haba , et al. December 5, 2 | 2017-12-05 |
Micro mechanical anchor for 3D architecture
Grant 9,832,887 - Wang , et al. November 28, 2 | 2017-11-28 |
Multi-chip package with interconnects extending through logic chip
Grant 9,818,723 - Haba November 14, 2 | 2017-11-14 |
Nanoscale Interconnect Array for Stacked Dies
App 20170323867 - Wang; Liang ; et al. | 2017-11-09 |
TFD I/O Partition for High-Speed, High-Density Applications
App 20170323667 - Sun; Zhuowen ; et al. | 2017-11-09 |
Batch process fabrication of package-on-package microelectronic assemblies
Grant 9,812,433 - Haba , et al. November 7, 2 | 2017-11-07 |
Flip-chip, face-up and face-down centerbond memory wirebond assemblies
Grant 9,806,017 - Haba , et al. October 31, 2 | 2017-10-31 |
Semiconductor chip assembly and method for making same
App 20170309593 - KANG; Teck-Gyu ; et al. | 2017-10-26 |
Microelectronic Packages Having Stacked Die And Wire Bond Interconnects
App 20170294410 - Haba; Belgacem ; et al. | 2017-10-12 |
Reliable packaging and interconnect structures
App 20170294376 - UZOH; Cyprian Emeka ; et al. | 2017-10-12 |
Package-on-package Assembly With Wire Bonds To Encapsulation Surface
App 20170287733 - SATO; Hiroaki ; et al. | 2017-10-05 |
SSI PoP
Grant 9,773,723 - Haba September 26, 2 | 2017-09-26 |
Stacked Chip-on-board Module With Edge Connector
App 20170263540 - Zohni; Wael ; et al. | 2017-09-14 |
Porous alumina templates for electronic packages
Grant 9,761,517 - Katkar , et al. September 12, 2 | 2017-09-12 |
Stub Minimization For Wirebond Assemblies Without Windows
App 20170256519 - Crisp; Richard Dewitt ; et al. | 2017-09-07 |
Microelectronic Elements With Post-assembly Planarization
App 20170256443 - Oganesian; Vage ; et al. | 2017-09-07 |
Reversed build-up substrate for 2.5D
Grant 9,754,866 - Wang , et al. September 5, 2 | 2017-09-05 |
Low Stress Vias
App 20170250132 - Mohammed; Ilyas ; et al. | 2017-08-31 |
Correction Die for Wafer/Die Stack
App 20170250161 - Haba; Belgacem | 2017-08-31 |
Stacked chip-on-board module with edge connector
Grant 9,735,093 - Zohni , et al. August 15, 2 | 2017-08-15 |
Reconfigurable PoP
Grant 9,728,495 - Haba , et al. August 8, 2 | 2017-08-08 |
Semiconductor chip assembly and method for making same
Grant 9,716,075 - Kang , et al. July 25, 2 | 2017-07-25 |
Porous Alumina Templates For Electronic Packages
App 20170207159 - Katkar; Rajesh ; et al. | 2017-07-20 |
Reliable packaging and interconnect structures
Grant 9,711,401 - Uzoh , et al. July 18, 2 | 2017-07-18 |
Multi-chip Package With Interconnects Extending Through Logic Chip
App 20170200696 - Haba; Belgacem | 2017-07-13 |
Dual-channel Dimm
App 20170186474 - Haba; Belgacem ; et al. | 2017-06-29 |
Package-on-package assembly with wire bonds to encapsulation surface
Grant 9,691,731 - Sato , et al. June 27, 2 | 2017-06-27 |
Flipped Die Stacks With Multiple Rows Of Leadframe Interconnects
App 20170179081 - Delacruz; Javier A. ; et al. | 2017-06-22 |
Structures for heat dissipating interposers
Grant 9,685,401 - Uzoh , et al. June 20, 2 | 2017-06-20 |
Embedded Vialess Bridges
App 20170170121 - Haba; Belgacem | 2017-06-15 |
TFD I/O partition for high-speed, high-density applications
Grant 9,679,613 - Sun , et al. June 13, 2 | 2017-06-13 |
Stub minimization for assemblies without wirebonds to package substrate
Grant 9,679,838 - Crisp , et al. June 13, 2 | 2017-06-13 |
Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other
Grant 9,679,876 - Crisp , et al. June 13, 2 | 2017-06-13 |
Stackable Molded Microelectronic Packages
App 20170154874 - Haba; Belgacem | 2017-06-01 |
Multi-chip microelectronic assembly with built-up fine-patterned circuit structure
Grant 9,666,560 - Wang , et al. May 30, 2 | 2017-05-30 |
Substrate and assembly thereof with dielectric removal for increased post height
Grant 9,666,450 - Sakuma , et al. May 30, 2 | 2017-05-30 |
Multi-chip Microelectronic Assembly With Built-up Fine-patterned Circuit Structure
App 20170148764 - Wang; Liang ; et al. | 2017-05-25 |
Low-stress vias
Grant 9,659,858 - Mohammed , et al. May 23, 2 | 2017-05-23 |
Microelectronic elements with post-assembly planarization
Grant 9,659,812 - Oganesian , et al. May 23, 2 | 2017-05-23 |
Multiple die stacking for two or more die
Grant 9,640,515 - Zohni , et al. May 2, 2 | 2017-05-02 |
Microelectronic packages having cavities for receiving microelectronic elements
Grant 9,633,968 - Mohammed , et al. April 25, 2 | 2017-04-25 |
Multi-die wirebond packages with elongated windows
Grant 9,633,975 - Haba , et al. April 25, 2 | 2017-04-25 |
Microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
Grant 9,633,979 - Mohammed , et al. April 25, 2 | 2017-04-25 |
Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
Grant 9,627,366 - Mohammed , et al. April 18, 2 | 2017-04-18 |
Stacked microelectronic assembly with TSVS formed in stages and carrier above chip
Grant 9,620,437 - Oganesian , et al. April 11, 2 | 2017-04-11 |
Microelectronic Interconnect Element With Decreased Conductor Spacing
App 20170096329 - Ryu; Chang Myung ; et al. | 2017-04-06 |
Electrical Barrier Layers
App 20170098621 - UZOH; Cyprian ; et al. | 2017-04-06 |
Porous alumina templates for electronic packages
Grant 9,615,451 - Katkar , et al. April 4, 2 | 2017-04-04 |
Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface
Grant 9,615,456 - Haba , et al. April 4, 2 | 2017-04-04 |
Capacitive Coupling of Integrated Circuit Die Components
App 20170092620 - Haba; Belgacem ; et al. | 2017-03-30 |
Stub Minimization Using Duplicate Sets Of Signal Terminals In Assemblies Without Wirebonds To Package Substrate
App 20170084584 - Crisp; Richard Dewitt ; et al. | 2017-03-23 |
Microelectronic packages and assemblies with improved flyby signaling operation
Grant 9,595,511 - Haba , et al. March 14, 2 | 2017-03-14 |
Microelectronic Assembly With Redistribution Structure Formed On Carrier
App 20170069575 - Haba; Belgacem ; et al. | 2017-03-09 |
3d-joining Of Microelectronic Components With Conductively Self-adjusting Anisotropic Matrix
App 20170069595 - Haba; Belgacem | 2017-03-09 |
Stub Minimization Using Duplicate Sets Of Terminals For Wirebond Assemblies Without Windows
App 20170062389 - Crisp; Richard Dewitt ; et al. | 2017-03-02 |
Low Cte Interposer
App 20170053857 - Haba; Belgacem ; et al. | 2017-02-23 |
Stackable molded microelectronic packages
Grant 9,570,382 - Haba February 14, 2 | 2017-02-14 |
Stacked packaging improvements
Grant 9,570,416 - Haba , et al. February 14, 2 | 2017-02-14 |
Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof
Grant 9,559,061 - Haba , et al. January 31, 2 | 2017-01-31 |
Electrical barrier layers
Grant 9,560,773 - Uzoh , et al. January 31, 2 | 2017-01-31 |
Microelectronic Element With Bond Elements To Encapsulation Surface
App 20170025390 - Haba; Belgacem ; et al. | 2017-01-26 |
Multi-chip package with interconnects extending through logic chip
Grant 9,553,071 - Haba January 24, 2 | 2017-01-24 |
Stackable molded microelectronic packages with area array unit connectors
Grant 9,553,076 - Haba January 24, 2 | 2017-01-24 |
Robust Multi-layer Wiring Elements And Assemblies With Embedded Microelectronic Elements
App 20170018440 - Haba; Belgacem ; et al. | 2017-01-19 |
Stub minimization using duplicate sets of signal terminals
Grant 9,530,458 - Crisp , et al. December 27, 2 | 2016-12-27 |
Microelectronic interconnect element with decreased conductor spacing
Grant 9,524,947 - Ryu , et al. December 20, 2 | 2016-12-20 |
Reversed Build-up Substrate For 2.5d
App 20160365302 - Wang; Liang ; et al. | 2016-12-15 |
Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis
Grant 9,515,053 - Crisp , et al. December 6, 2 | 2016-12-06 |
Flipped die stacks with multiple rows of leadframe interconnects
Grant 9,508,691 - Delacruz , et al. November 29, 2 | 2016-11-29 |
Memory module in a package
Grant 9,508,629 - Haba , et al. November 29, 2 | 2016-11-29 |
BVA interposer
Grant 9,502,390 - Caskey , et al. November 22, 2 | 2016-11-22 |
Microelectronic assembly with opposing microelectronic packages each having terminals with signal assignments that mirror each other with respect to a central axis
Grant 9,496,243 - Crisp , et al. November 15, 2 | 2016-11-15 |
New 2.5d Microelectronic Assembly And Method With Circuit Structure Formed On Carrier
App 20160329300 - Haba; Belgacem ; et al. | 2016-11-10 |
SSI PoP
App 20160329309 - Haba; Belgacem | 2016-11-10 |
Reliable Device Assembly
App 20160329290 - Haba; Belgacem ; et al. | 2016-11-10 |
Multi-chip module with stacked face-down connected dies
Grant 9,484,333 - Haba , et al. November 1, 2 | 2016-11-01 |
High Density Three-dimensional Integrated Capacitors
App 20160315139 - Oganesian; Vage ; et al. | 2016-10-27 |
Reliable Packaging And Interconnect Structures
App 20160307798 - UZOH; Cyprian Emeka ; et al. | 2016-10-20 |
Single package dual channel memory with co-support
Grant 9,460,758 - Crisp , et al. October 4, 2 | 2016-10-04 |
Enhanced stacked microelectronic assemblies with central contacts
Grant 9,461,015 - Haba , et al. October 4, 2 | 2016-10-04 |
Staged via formation from both sides of chip
App 20160284627 - OGANESIAN; Vage ; et al. | 2016-09-29 |
Vias in porous substrates
Grant 9,455,181 - Mohammed , et al. September 27, 2 | 2016-09-27 |
Stub Minimization For Wirebond Assemblies Without Windows
App 20160276316 - Crisp; Richard Dewitt ; et al. | 2016-09-22 |
Stub Minimization For Assemblies Without Wirebonds To Package Substrate
App 20160268187 - Crisp; Richard Dewitt ; et al. | 2016-09-15 |
Z-connection for a microelectronic package using electroless plating
Grant 9,443,837 - Haba , et al. September 13, 2 | 2016-09-13 |
Batch Process Fabrication Of Package-on-package Microelectronic Assemblies
App 20160260696 - Haba; Belgacem ; et al. | 2016-09-08 |
Microelectronic Package With Consolidated Chip Structures
App 20160260671 - Haba; Belgacem ; et al. | 2016-09-08 |
Reversed build-up substrate for 2.5D
Grant 9,437,536 - Wang , et al. September 6, 2 | 2016-09-06 |
High density three-dimensional integrated capacitors
Grant 9,437,557 - Mohammed , et al. September 6, 2 | 2016-09-06 |
Multiple die face-down stacking for two or more die
Grant 9,437,579 - Haba , et al. September 6, 2 | 2016-09-06 |
Fan-out WLP with package
App 20160254247 - SATO; Hiroaki ; et al. | 2016-09-01 |
High density three-dimensional integrated capacitors
Grant 9,431,475 - Oganesian , et al. August 30, 2 | 2016-08-30 |
Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof
App 20160247764 - Haba; Belgacem ; et al. | 2016-08-25 |
Stub minimization for multi-die wirebond assemblies with parallel windows
Grant 9,423,824 - Crisp , et al. August 23, 2 | 2016-08-23 |
Stackable microelectronic package structures
Grant 9,425,167 - Haba , et al. August 23, 2 | 2016-08-23 |
Substrate And Assembly Thereof With Dielectric Removal For Increased Post Height
App 20160233109 - Sakuma; Kazuo ; et al. | 2016-08-11 |
Active Chip On Carrier Or Laminated Chip Having Microelectronic Element Embedded Therein
App 20160233165 - Oganesian; Vage ; et al. | 2016-08-11 |
Multi-die Wirebond Packages With Elongated Windows
App 20160233193 - Haba; Belgacem ; et al. | 2016-08-11 |
Off Substrate Kinking Of Bond Wire
App 20160225739 - Haba; Belgacem ; et al. | 2016-08-04 |
Multiple Die Stacking For Two Or More Die
App 20160225746 - Zohni; Wael ; et al. | 2016-08-04 |
Interposer having molded low CTE dielectric
Grant 9,406,532 - Haba , et al. August 2, 2 | 2016-08-02 |
Low CTE interposer
Grant 9,401,288 - Haba , et al. July 26, 2 | 2016-07-26 |
Package-on-package Assembly With Wire Bonds To Encapsulation Surface
App 20160211237 - Sato; Hiroaki ; et al. | 2016-07-21 |
Method of forming a reliable microelectronic assembly
Grant 9,398,700 - Uzoh , et al. July 19, 2 | 2016-07-19 |
Microelectronic packages with nanoparticle joining
Grant 9,397,063 - Haba July 19, 2 | 2016-07-19 |
Stub Minimization Using Duplicate Sets Of Terminals For Wirebond Assemblies Without Windows
App 20160197058 - Crisp; Richard Dewitt ; et al. | 2016-07-07 |
Reliable packaging and interconnect structures
Grant 9,385,036 - Uzoh , et al. July 5, 2 | 2016-07-05 |
Stub Minimization Using Duplicate Sets Of Signal Terminals In Assemblies Without Wirebonds To Package Substrate
App 20160190100 - Crisp; Richard Dewitt ; et al. | 2016-06-30 |
Stacked Chip-on-board Module With Edge Connector
App 20160190048 - Zohni; Wael ; et al. | 2016-06-30 |
Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows
Grant 9,377,824 - Crisp , et al. June 28, 2 | 2016-06-28 |
Method of making a stacked microelectronic package
Grant 9,378,967 - Haba , et al. June 28, 2 | 2016-06-28 |
Method of thinning a wafer to provide a raised peripheral edge
Grant 9,378,985 - Haba , et al. June 28, 2 | 2016-06-28 |
Stub minimization for assemblies without wirebonds to package substrate
Grant 9,373,565 - Crisp , et al. June 21, 2 | 2016-06-21 |
Memory Module In A Package
App 20160172332 - Haba; Belgacem ; et al. | 2016-06-16 |
Co-support circuit panel and microelectronic packages
Grant 9,368,477 - Crisp , et al. June 14, 2 | 2016-06-14 |
Stacked microelectronic assembly with TSVs formed in stages with plural active chips
Grant 9,368,476 - Oganesian , et al. June 14, 2 | 2016-06-14 |
Stacked Microelectronic Assembly With Tsvs Formed In Stages And Carrier Above Chip
App 20160163620 - Oganesian; Vage ; et al. | 2016-06-09 |
Microelectronic Assemblies Having Stack Terminals Coupled By Connectors Extending Through Encapsulation
App 20160163679 - Mohammed; Ilyas ; et al. | 2016-06-09 |
Staged via formation from both sides of chip
Grant 9,362,203 - Oganesian , et al. June 7, 2 | 2016-06-07 |
Active chip on carrier or laminated chip having microelectronic element embedded therein
Grant 9,355,959 - Oganesian , et al. May 31, 2 | 2016-05-31 |
Microelectronic package with consolidated chip structures
Grant 9,355,996 - Haba , et al. May 31, 2 | 2016-05-31 |
Non-lithographic formation of three-dimensional conductive elements
Grant 9,355,901 - Oganesian , et al. May 31, 2 | 2016-05-31 |
Multi-function and shielded 3D interconnects
Grant 9,355,948 - Oganesian , et al. May 31, 2 | 2016-05-31 |
Batch process fabrication of package-on-package microelectronic assemblies
Grant 9,356,006 - Haba , et al. May 31, 2 | 2016-05-31 |
Reduced stress TSV and interposer structures
Grant 9,349,669 - Uzoh , et al. May 24, 2 | 2016-05-24 |
Microelectronic package
Grant 9,349,672 - Mohammed , et al. May 24, 2 | 2016-05-24 |
Method for manufacturing a fan-out WLP with package
Grant 9,337,165 - Sato , et al. May 10, 2 | 2016-05-10 |
Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof
Grant 9,330,954 - Haba , et al. May 3, 2 | 2016-05-03 |
Pin attachment
Grant 9,324,681 - Haba , et al. April 26, 2 | 2016-04-26 |
Substrate and assembly thereof with dielectric removal for increased post height
Grant 9,318,460 - Sakuma , et al. April 19, 2 | 2016-04-19 |
Multi-die wirebond packages with elongated windows
Grant 9,318,467 - Haba , et al. April 19, 2 | 2016-04-19 |
Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
Grant 9,312,239 - Haba , et al. April 12, 2 | 2016-04-12 |
Multiple die stacking for two or more die
Grant 9,312,244 - Zohni , et al. April 12, 2 | 2016-04-12 |
Stub Minimization Using Duplicate Sets Of Signal Terminals
App 20160093339 - Crisp; Richard Dewitt ; et al. | 2016-03-31 |
Stackable Molded Microelectronic Packages With Area Array Unit Connectors
App 20160086922 - Haba; Belgacem | 2016-03-24 |
Co-support for XFD packaging
Grant 9,293,444 - Crisp , et al. March 22, 2 | 2016-03-22 |
Bva Interposer
App 20160079214 - Caskey; Terrence ; et al. | 2016-03-17 |
High Density Three-dimensional Integrated Capacitors
App 20160079189 - Mohammed; Ilyas ; et al. | 2016-03-17 |
Batch Process Fabrication Of Package-on-package Microelectronic Assemblies
App 20160079215 - Haba; Belgacem ; et al. | 2016-03-17 |
Memory module in a package
Grant 9,287,216 - Haba , et al. March 15, 2 | 2016-03-15 |
Single exposure in multi-damascene process
Grant 9,287,164 - Uzoh , et al. March 15, 2 | 2016-03-15 |
Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows
Grant 9,287,195 - Crisp , et al. March 15, 2 | 2016-03-15 |
Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrate
Grant 9,281,271 - Crisp , et al. March 8, 2 | 2016-03-08 |
Stacked chip-on-board module with edge connector
Grant 9,281,266 - Zohni , et al. March 8, 2 | 2016-03-08 |
Microelectronic Packages And Methods Therefor
App 20160056058 - Haba; Belgacem ; et al. | 2016-02-25 |
Stacked microelectronic assembly with TSVS formed in stages and carrier above chip
Grant 9,269,692 - Oganesian , et al. February 23, 2 | 2016-02-23 |
Porous Alumina Templates For Electronic Packages
App 20160044781 - Katkar; Rajesh ; et al. | 2016-02-11 |
Stacked Packaging Improvements
App 20160035692 - Haba; Belgacem ; et al. | 2016-02-04 |
RECONFIGURABLE PoP
App 20160035656 - Haba; Belgacem ; et al. | 2016-02-04 |
Embedded Packaging With Preformed Vias
App 20160020121 - Mohammed; Ilyas ; et al. | 2016-01-21 |
In-package fly-by signaling
Grant 9,241,420 - Crisp , et al. January 19, 2 | 2016-01-19 |
Semiconductor Chip Assembly And Method For Making Same
App 20160005711 - Kang; Teck-Gyu ; et al. | 2016-01-07 |
Porous alumina templates for electronic packages
Grant 9,226,396 - Katkar , et al. December 29, 2 | 2015-12-29 |
Compliant interconnects in wafers
Grant 9,224,649 - Oganesian , et al. December 29, 2 | 2015-12-29 |
Package-on-package assembly with wire bonds to encapsulation surface
Grant 9,224,717 - Sato , et al. December 29, 2 | 2015-12-29 |
Stub minimization using duplicate sets of signal terminals
Grant 9,224,431 - Crisp , et al. December 29, 2 | 2015-12-29 |
Microelectronic Package With Consolidated Chip Structures
App 20150371968 - Haba; Belgacem ; et al. | 2015-12-24 |
Microelectronic unit and package with positional reversal
Grant 9,219,050 - Crisp , et al. December 22, 2 | 2015-12-22 |
Microelectronic packages and methods therefor
Grant 9,218,988 - Haba , et al. December 22, 2 | 2015-12-22 |
Stackable Molded Microelectronic Packages
App 20150364406 - Haba; Belgacem | 2015-12-17 |
Co-support For Xfd Packaging
App 20150364450 - Crisp; Richard Dewitt ; et al. | 2015-12-17 |
Batch process fabrication of package-on-package microelectronic assemblies
Grant 9,214,454 - Haba , et al. December 15, 2 | 2015-12-15 |
Method And Structures For Heat Dissipating Interposers
App 20150340310 - Uzoh; Cyprian Emeka ; et al. | 2015-11-26 |
Microelectronic Packages Having Cavities For Receiving Microelectronic Elements
App 20150340336 - Mohammed; Ilyas ; et al. | 2015-11-26 |
Off-chip Vias In Stacked Chips
App 20150333042 - Haba; Belgacem ; et al. | 2015-11-19 |
Stacked Microelectronic Assembly With Tsvs Formed In Stages With Plural Active Chips
App 20150333050 - Oganesian; Vage ; et al. | 2015-11-19 |
Electrical Barrier Layers
App 20150334829 - UZOH; Cyprian ; et al. | 2015-11-19 |
Structure For Microelectronic Packaging With Bond Elements To Encapsulation Surface
App 20150334831 - Haba; Belgacem ; et al. | 2015-11-19 |
Method Of Thinning A Wafer To Provide A Raised Peripheral Edge
App 20150325562 - Haba; Belgacem ; et al. | 2015-11-12 |
Low-stress Vias
App 20150325498 - Mohammed; Ilyas ; et al. | 2015-11-12 |
Method of making a stacked microelectronic package
App 20150325561 - Haba; Belgacem ; et al. | 2015-11-12 |
Single Package Dual Channel Memory With Co-support
App 20150302901 - Crisp; Richard Dewitt ; et al. | 2015-10-22 |
Single Exposure In Multi-damascene Process
App 20150279730 - UZOH; Cyprian ; et al. | 2015-10-01 |
Batch Process Fabrication Of Package-on-package Microelectronic Assemblies
App 20150279823 - Haba; Belgacem ; et al. | 2015-10-01 |
Package-on-package assembly with wire bonds to encapsulation surface
Grant 08618659 - | 2013-12-31 |
| 