U.S. patent application number 13/591272 was filed with the patent office on 2012-12-13 for method for producing semiconductor wafers composed of silicon having a diameter of at least 450 mm, and semiconductor wafer composed of silicon having a diameter of 450 mm.
This patent application is currently assigned to SILTRONIC AG. Invention is credited to Walter Heuwieser, Alfred Miller, Georg Raming, Andreas Sattler.
Application Number | 20120315428 13/591272 |
Document ID | / |
Family ID | 44276974 |
Filed Date | 2012-12-13 |
United States Patent
Application |
20120315428 |
Kind Code |
A1 |
Raming; Georg ; et
al. |
December 13, 2012 |
Method For Producing Semiconductor Wafers Composed Of Silicon
Having A Diameter Of At Least 450 mm, and Semiconductor Wafer
Composed Of Silicon Having A Diameter of 450 mm
Abstract
Silicon semiconductor wafers are produced by: pulling a single
crystal with a conical section and an adjoining cylindrical section
having a diameter .gtoreq.450 mm and a length of .gtoreq.800 mm
from a melt in a crucible, wherein in pulling the transition from
the conical section to the cylindrical section, the pulling rate is
at least 1.8 times higher than the average pulling rate during the
pulling of the cylindrical section; cooling the growing single
crystal with a cooling power of at least 20 kW; feeding heat from
the side wall of the crucible to the single crystal, wherein a gap
having a height of .gtoreq.70 mm is present between a heat shield
surrounding the single crystal and the melt surface.
Inventors: |
Raming; Georg; (Tann,
DE) ; Heuwieser; Walter; (Stammham, DE) ;
Sattler; Andreas; (Trostberg, DE) ; Miller;
Alfred; (Emmerting, DE) |
Assignee: |
SILTRONIC AG
Munich
DE
|
Family ID: |
44276974 |
Appl. No.: |
13/591272 |
Filed: |
August 22, 2012 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
13005584 |
Jan 13, 2011 |
|
|
|
13591272 |
|
|
|
|
Current U.S.
Class: |
428/64.1 |
Current CPC
Class: |
C30B 29/06 20130101;
C30B 15/203 20130101; C30B 15/14 20130101; Y10T 428/21
20150115 |
Class at
Publication: |
428/64.1 |
International
Class: |
C01B 33/02 20060101
C01B033/02 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 20, 2010 |
DE |
10 2010 005 100.4 |
Claims
1. A semiconductor wafer composed of silicon, which has a diameter
of 450 mm and a region with v-defects that extends from the center
of the semiconductor wafer to the edge of the semiconductor
wafer.
2. The semiconductor wafer of claim 1, which has an average density
of OSF defects of not more than 6 cm.sup.-2.
3. The semiconductor wafer of claim 1, having a radial variation of
resistivity of not more than 10%.
4. The semiconductor wafer of claim 2, having a radial variation of
resistivity of not more than 10%.
5. The semiconductor wafer of claim 1, having a radial variation of
oxygen concentration of not more than 12%.
6. The semiconductor wafer of claim 2, having a radial variation of
oxygen concentration of not more than 12%.
7. The semiconductor wafer of claim 3, having a radial variation of
oxygen concentration of not more than 12%.
8. The semiconductor wafer of claim 4, having a radial variation of
oxygen concentration of not more than 12%.
9. The semiconductor wafer of claim 1, which also comprises an
epitaxial coating.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a division of and claims priority to
U.S. Ser. No. 13/005,584, filed Jan. 13, 2011 (pending), and claims
priority to German Patent Application No. 10 2010 005 100.4, filed
Jan. 20, 2010, all of which are incorporated herein by
reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The invention relates to a method for producing
semiconductor wafers composed of silicon having a diameter of at
least 450 mm and having defect properties which make such
semiconductor wafers suitable for use as substrates for the
production of electronic components. The invention also relates to
a semiconductor wafer composed of silicon having a diameter of 450
mm.
[0004] 2. Background Art
[0005] Semiconductor wafers composed of silicon having a nominal
diameter of 450 min are currently being developed as substrates for
the next generation. The developers are faced with a great
challenge since the jump in diameter from 300 mm to 450 mm requires
far more than simple adaptation and optimization of known
production methods. One particular challenge consists of achieving
the quality preferred at diameters of 300 mm, in particular with
regard to defect properties. There is interest in defect properties
in particular for defects brought about by accumulations of lattice
vacancies to ("v-defects" hereinafter), or by accumulation of
interstitial silicon, ("i-defects" hereinafter), and with regard to
defects such as BMD ("bulk micro defects") and OSF ("oxidation
induced stacking faults"), in the formation of which oxygen
precipitation plays an important part.
[0006] WO 2009/104534 A1 is representative of prior art showing
that the jump in diameter from 300 mm to 450 mm has already been
accomplished.
[0007] The report by Shiraishi et al., JOURNAL OF CRYSTAL GROWTH
229 (2001) 17-21, summarizes experience gained in the course of the
development of a method for producing single crystals composed of
silicon having a diameter of 400 mm. This experience includes the
fact that it was not possible to produce semiconductor wafers which
were free of defects or which exhibited a defect profile that is
uniform over the diameter.
SUMMARY OF THE INVENTION
[0008] An object of the present invention is to provide a method
for producing semiconductor wafers composed of silicon in high
yields and with economic pulling rates, the semiconductor wafers
having a diameter of at least 450 mm and a defect profile that is
uniform over the diameter. These and other objects are achieved by
a method for producing semiconductor wafers comprising pulling a
single crystal with a conical section having an increasing diameter
and an adjoining cylindrical section having a diameter of at least
450 mm and a length of at least 800 mm from a melt contained in a
crucible, at a pulling rate which, in the course of pulling the
transition from the conical section to the cylindrical section, is
at least 1.8 times higher than the average pulling rate during the
pulling of the cylindrical section; cooling the growing single
crystal with a cooling power of at least 20 kW; feeding heat from
the side wall of the crucible to the growing single crystal,
wherein a gap having a height of at least 70 mm is present between
a heat shield surrounding the growing single crystal and the
surface of the melt; and slicing semiconductor wafers from the
cylindrical section, wherein a plurality of the semiconductor
wafers have a region with v-defects that extends from the center of
the semiconductor wafers to as the edge of the semiconductor
wafers.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 illustrates one embodiment of a hot zone useful in
the inventive method.
[0010] FIG. 2 illustrates one example of cooling power at various
positions of single crystal during pulling of a single crystal.
[0011] FIG. 3 illustrates on embodiment of pulling rate versus
single crystal length, showing the higher inventive pull rate
during transition from the conical to cylindrical section.
[0012] FIG. 4 illustrates radial variation of defects at the 23 cm
position of the single crystal, measured by laser light
scattering.
[0013] FIG. 5 illustrates radial variation of defects at the 41 cm
position of the single crystal, measured by laser light
scattering.
[0014] FIG. 6 illustrates radial variation of defects at the 67 cm
position of the single crystal, measured by laser light
scattering.
[0015] FIG. 7 illustrates radial variation of oxygen concentration
relative to position in the single crystal.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0016] The plurality of the semiconductor wafers having a diameter
of at least 450 mm that are produced with the aid of the method are
distinguished by a defect region with v-defects that extends from
the center of a semiconductor wafer to the edge thereof. In the
case of these semiconductor wafers, the average density of OSF
defects is preferably not more than 6 cm.sup.-2, more preferably
not more than 2 cm.sup.-2, and most preferably not more than 0.5
cm.sup.-2. The radial variation of the resistivity is preferably
not more than 10%, more preferably not more than 5%, and most
preferably not more than 2%. The radial variation of the oxygen
concentration ROV is preferably not more than 12%, more preferably
not more than 8%, and most preferably not more than 4%. The
semiconductor wafers can be used directly or after the deposition
of an epitaxial layer as substrates for producing electronic
components.
[0017] In order to be able to produce corresponding single crystals
with an economic pulling rate of at least 0.5 mm/min with high
yields, it is necessary to take account of some preconditions with
regard to the furnace configuration ("hot zone") and with regard to
some process implementation parameters.
[0018] FIG. 1 shows a "hot zone" suitable for carrying out the
method. The single crystal 1 is pulled from a melt 2 contained in a
crucible 3. Arranged around the crucible is a resistance heater 4,
with the aid of which the melt is kept liquid. A magnetic field,
for example a Cusp field or a horizontal magnetic field, can be
impressed on the melt 2. A device 5 for generating the magnetic
field is present for this purpose. The single crystal 1 is
surrounded by a cooler 6 and a heat shield 7. The heat shield 7 has
an end section that is tapered conically toward the single crystal.
The bottom surface at the lower end of the end section of the heat
shield 7 is at a distance D from the surface of the melt 2. A gap
having a height corresponding to the distance D is therefore
present between the heat shield 7 and the surface of the melt.
[0019] As has been shown by experiments conducted by the inventors,
the yield of dislocation-free single crystals falls significantly
if the pulling rate when pulling the transition from the conical
section 8 to the cylindrical section 9 of the single crystal is not
significantly higher than the average pulling rate during the
growth of the cylindrical section 9 of the single crystal 1. In
order largely to avoid losses of yield as a result of dislocation
formation, the pulling rate during the pulling of the transition
from the conical section 8 to the cylindrical section 9 of the
single crystal, that is to say from the point in time at which the
conical section has reached approximately 30% of the desired
diameter of the cylindrical section until the point in time at
which the desired diameter is reached, should be at least 1.8
times, preferably 1.8 to 3 times, higher than the average pulling
rate during the pulling of the cylindrical section of the single
crystal.
[0020] The average pulling rate during the pulling of the
cylindrical section of the single crystal is preferably not less
than 0.5 mm/min, more preferably not less than 0.65 mm/min.
[0021] In order that a single crystal composed of silicon having a
diameter of at least 450 mm can be pulled with a pulling rate of
not less than 0.5 mm/min, the heat of crystallization that arises
has to be effectively dissipated. It has been ascertained that the
required cooling power of the cooler 6 has to be at least 20 kW. It
is advantageous if the emissivity of that inner surface of the
cooler 6 which faces the single crystal is as high as possible,
such that thermal radiation coming from the single crystal is
effectively absorbed. The inner surface of the cooler can therefore
be coated with a heat-absorbing layer, preferably a graphite layer.
The outwardly facing surface of the cooler 6 is preferably
polished, in order that thermal radiation impinging there is
effectively reflected and does not burden the cooler.
[0022] Furthermore, care should be taken to ensure that the thermal
loading experienced by the growing single crystal as a result of
the cooling does not bring about thermal stresses whose nature is
such that they destroy the single crystal. The experiments
conducted by the inventors have shown that the thermal loading
should be prevented from bringing about a van Mises stress of more
than 35 MPa. The following parameters were used to calculate the
van Mises stress: modulus of elasticity=150 GPa, an extension
coefficient at room temperature of 2.6e-6 l/K and a Poisson ratio
of 0.25. It was found that the resulting thermal loading remains
non-critical if the distance D between the bottom surface at the
lower end of the end section of the heat shield 7 and the surface
of the melt 2 is not less than 70 mm.
[0023] A distance D of not less than 70 mm is also necessary in
order that the axial temperature gradient G at the phase boundary
between the melt 2 and the growing single crystal 1 is
approximately identical in the center and at the edge of the single
crystal. The growth rate v of the single crystal and the axial
temperature gradient G are, in the form of the quotient v/G, those
variables which are crucial with regard to whether an excess of
vacancies or an excess of interstitial silicon arises in the single
crystal. If, by way of example, the intention is to prevent
vacancies from dominating in the center of the single crystal and
interstitial silicon from dominating at the edge of the single
crystal, it is necessary to implement a measure against the usually
occurring situation in which the axial temperature gradient
increases significantly from the center of the single crystal to
the edge of the single crystal. In the case of single crystals
having a relatively large diameter, the axial temperature gradient
in the center G.sub.c is usually significantly less than the axial
temperature gradient at the edge G.sub.e of the single crystal,
because heat is emitted from the edge of the single crystal. If the
distance D between the bottom surface at the lower end of the end
section of the heat shield 7 and the surface of the melt 2 is not
less than 70 mm, enough heat can pass from the side wall of the
crucible 3 to the edge of the phase boundary, such that G.sub.e is
matched to G.sub.c.
EXAMPLE
[0024] A single crystal having a diameter of 450 mm in the
cylindrical section was pulled using the method. The cylindrical
section had a length of 800 mm. The "hot zone" had the features
illustrated in FIG. 1. During the pulling of the single crystal,
argon at a pressure of 2800 Pa (28 mbar) was passed through the
"hot zone" at a rate of 165 l/min. A horizontal magnetic field
having a flux density of 270 mT was impressed on the melt. The
distance D between the bottom surface at the lower end of the end
section of the heat shield 7 and the surface of the melt 2 was 70
mm. The cooler 6 had an inner surface blackened with graphite, and
a polished outer surface. The cooling power was on average in the
region of 24 kW. FIG. 2 shows the profile of the cooling power PowC
as a function of the position POS--indicated in length units--in
the cylindrical section of the single crystal. During the pulling
of the cylindrical section, the average pulling rate was 0.65
mm/min. FIG. 3 shows the profile of the pulling rate KH as a
function of the position POS in the cylindrical section of the
single crystal. During the pulling of the transition from the
conical section to the cylindrical section of the single crystal,
the pulling rate was 1.8 times higher than the average pulling rate
of 0.65 mm/min. The single crystal and the crucible were rotated in
opposite directions at a speed of 7 rpm and 0.3 rpm,
respectively.
[0025] Afterward, the cylindrical section of the single crystal was
processed to form semiconductor wafers composed of silicon and
important properties of the semiconductor wafers were examined.
[0026] FIG. 4 to FIG. 6 show the result of laser scattered light
measurements which were carried out using a measuring device of the
MO-4 type from Mitsui Mining & Smelting, on the basis of the
example of three semiconductor wafers that originated from the
first, second and third thirds of the cylindrical section (POS 23
cm, POS 41 cm and POS 67 cm). The scattered light measurements show
the density DD of v-defects as a function of the radius R of the
semiconductor wafers. It can be discerned that the semiconductor
wafers have independently of the position in the cylindrical
section a region with v-defects that extends from the center to the
edge of the semiconductor wafers.
[0027] The following table lists the average density of OSF defects
of semiconductor wafers, which were counted after wet oxidation and
thermal treatment at 1100.degree. C. lasting for 120 min, and the
positions of the semiconductor wafers in the cylindrical section of
the single crystal.
TABLE-US-00001 TABLE Position [cm] OSF [cm.sup.-2] 12.0 5.3 23.0
0.5 30.0 0.5 41.0 1 51.0 0.5 67.0 0
[0028] The radial variation of the resistivity was on average less
than 2%. The resistivity decreased, owing to segregation, from
approximately 17.2 ohm cm at the start of the cylindrical section
to approximately 13.9 ohm cm at the end of the cylindrical
section.
[0029] FIG. 7 shows the radial variation of the oxygen
concentration ROV, measured according to New ASTM, as a function of
the position POS in the cylindrical section of the single crystal.
The oxygen concentration decreased axially from approximately
9.510.sup.17 atom/cm.sup.3 at the start of the cylindrical section
to approximately 5.310.sup.17 atom/cm.sup.3 at the end of the
cylindrical section.
[0030] A charge carrier lifetime measurement--making visible the
curvature of the phase boundary between the single crystal and the
melt--after a thermal treatment that formed oxygen precipitates
revealed that the phase boundary at position 210 mm of the
cylindrical section was curved convexly in relation to the single
crystal, with a curvature of 27 mm in the center of the phase
boundary.
* * * * *