U.S. patent application number 13/454212 was filed with the patent office on 2012-08-16 for exposure apparatus, device production method, cleaning apparatus, cleaning method, and exposure method.
This patent application is currently assigned to NIKON CORPORATION. Invention is credited to Hiroyuki NAGASAKA, Yasushi YODA.
Application Number | 20120204913 13/454212 |
Document ID | / |
Family ID | 40075059 |
Filed Date | 2012-08-16 |
United States Patent
Application |
20120204913 |
Kind Code |
A1 |
NAGASAKA; Hiroyuki ; et
al. |
August 16, 2012 |
EXPOSURE APPARATUS, DEVICE PRODUCTION METHOD, CLEANING APPARATUS,
CLEANING METHOD, AND EXPOSURE METHOD
Abstract
An exposure apparatus exposes a substrate with an exposure light
through an exposure liquid. The exposure apparatus includes an
optical element from which the exposure light exits; a stage which
is movable on the light-exit side of the optical element; a certain
member which is provided on the stage; and a vibration generator
which vibrates the certain member to apply vibration to the liquid
in the liquid immersion space formed on the certain member. It is
possible to suppress the deterioration of the performance which
would be otherwise caused by any contamination.
Inventors: |
NAGASAKA; Hiroyuki;
(Kumagaya-shi, JP) ; YODA; Yasushi; (Kumagaya-shi,
JP) |
Assignee: |
NIKON CORPORATION
Tokyo
JP
|
Family ID: |
40075059 |
Appl. No.: |
13/454212 |
Filed: |
April 24, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12153984 |
May 28, 2008 |
8189168 |
|
|
13454212 |
|
|
|
|
60929907 |
Jul 17, 2007 |
|
|
|
Current U.S.
Class: |
134/147 |
Current CPC
Class: |
G03F 7/70341 20130101;
G03F 7/70716 20130101; G03F 7/70925 20130101 |
Class at
Publication: |
134/147 |
International
Class: |
B08B 3/04 20060101
B08B003/04; B08B 7/04 20060101 B08B007/04; B08B 3/12 20060101
B08B003/12 |
Foreign Application Data
Date |
Code |
Application Number |
May 28, 2007 |
JP |
2007-140474 |
Jul 5, 2007 |
JP |
2007-177217 |
Claims
1. An exposure apparatus which exposes a substrate with an exposure
light through an exposure liquid, the exposure apparatus
comprising: an optical element from which the exposure light exits;
a movable member which is arranged to hold the substrate and is
movable on a light-exit side of the optical element, the movable
member having a supply port which supplies a cleaning liquid; and a
vibration member which vibrates the cleaning liquid.
2. The exposure apparatus according to claim 1, wherein the
vibration member includes a member provided to the movable member,
and the cleaning liquid is vibrated via the member.
3. The exposure apparatus according to claim 1, wherein the
cleaning liquid is the exposure liquid.
4. The exposure apparatus according to claim 3, wherein the
exposure liquid includes pure water.
5. The exposure apparatus according to claim 1, wherein the
cleaning liquid is different from the exposure liquid.
Description
[0001] This is a Continuation of application Ser. No. 12/153,984
filed May 28, 2008, which claims the benefit of U.S. Provisional
Application No. 60/929,907 filed Jul. 17, 2007 and Japanese Patent
Application Nos. 2007-140474 filed May 28, 2007 and 2007-177217
filed Jul. 5, 2007. The disclosures of the prior applications are
hereby incorporated by reference herein in their entirety.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention relates to an exposure apparatus which
exposes a substrate, a device production method, a cleaning
apparatus, a method for cleaning the exposure apparatus, and an
exposure method.
[0004] 2. Description of the Related Art
[0005] In relation to the exposure apparatus used in the
photolithography step, a liquid immersion exposure apparatus is
known, in which a substrate is exposed with an exposure light
through a liquid as disclosed in International Publication No.
99/49504 and Japanese Patent Application Laid-open No.
2004-289127.
SUMMARY OF THE INVENTION
Task to be Solved by the Invention
[0006] In an liquid immersion exposure apparatus, there is such a
possibility that a member, which makes contact with a liquid of the
liquid immersion space, may be contaminated or dirtied. If the
member is left to stand as it is in the contaminated or dirtied
state, there is such a possibility that the performance of the
exposure apparatus may be deteriorated, and the substrate cannot be
exposed satisfactorily.
[0007] An object of the present invention is to provide an exposure
apparatus which makes it possible to suppress the deterioration of
the performance due to the contamination, and a device production
method using the exposure apparatus. Another object of the present
invention is to provide a cleaning apparatus which is capable of
satisfactorily cleaning a liquid immersion exposure apparatus, a
cleaning method using the cleaning apparatus, and an exposure
method.
Solution to the Task
[0008] According to a first aspect of the present invention, there
is provided an exposure apparatus which exposes a substrate with an
exposure light through an exposure liquid, the exposure apparatus
comprising: an optical element from which the exposure light exits;
a movable member which is movable on a light-exit side of the
optical element; a certain member which is provided on the movable
member; and a vibration generator which vibrates the certain member
to apply vibration to a cleaning liquid on the certain member;
wherein at least a part of a surface of the certain member is
liquid-repellent with respect to at least one of the exposure
liquid and the cleaning liquid.
[0009] According to a second aspect of the present invention, there
is provided an exposure apparatus which exposes a substrate with an
exposure light through an exposure liquid, the exposure apparatus
comprising: an optical element from which the exposure light exits;
a movable member which is movable on a light-exit side of the
optical element; a certain member which is provided on the movable
member; a vibration generator which vibrates the certain member to
apply vibration to a cleaning liquid on the certain member; and a
suppressing device which suppresses diffusion of heat generated by
the vibration generator.
[0010] According to a third aspect of the present invention, there
is provided a method for producing a device, the method comprising:
exposing a substrate by using the exposure apparatus as defined in
any one of the foregoing aspects; and developing the exposed
substrate.
[0011] According to a fourth aspect of the present invention, there
is provided a cleaning apparatus usable for a liquid immersion
exposure apparatus which exposes a substrate with an exposure light
through an exposure liquid, the cleaning apparatus comprising a
certain member; and a vibration generator which vibrates the
certain member to apply vibration to a cleaning liquid making
contact with the certain member; wherein at least a part of a
surface of the certain member is liquid-repellent with respect to
at least one of the exposure liquid and the cleaning liquid.
[0012] According to a fifth aspect of the present invention, there
is provided a cleaning apparatus usable for a liquid immersion
exposure apparatus which exposes a substrate with an exposure light
through an exposure liquid, the cleaning apparatus comprising: a
certain member; a vibration generator which vibrates the certain
member to apply vibration to a cleaning liquid making contact with
the certain member; and a suppressing device which suppresses
diffusion of heat generated by the vibration generator.
[0013] According to a sixth aspect of the present invention, there
is provided a cleaning method comprising forming a liquid immersion
space, in a liquid immersion exposure apparatus which exposes a
substrate with an exposure light through an exposure liquid, with a
cleaning liquid on the certain member of the cleaning apparatus
according to any one of the foregoing aspects; and applying
ultrasonic vibration to the cleaning liquid in the liquid immersion
space.
[0014] According to a seventh aspect of the present invention,
there is provided a liquid immersion exposure method for exposing a
substrate with an exposure light through an exposure liquid by
using an exposure apparatus having first and second tables, the
liquid immersion exposure method comprising: performing measurement
for determining an exposure condition, via the exposure liquid
placed between an optical element and a measuring device which is
provided on the first table; exposing the substrate with the
exposure light through the exposure liquid while retaining the
exposure liquid between the substrate and the optical element; and
placing a cleaning liquid between the optical element and a
vibrator provided on the first or second table and vibrating the
vibrator to clean a portion, of the exposure apparatus, which makes
contact with the exposure liquid.
[0015] According to the respective aspects of the present
invention, it is possible to suppress the deterioration of the
performance of the exposure apparatus which would be otherwise
caused due to any contamination.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] FIG. 1 is a schematic arrangement view of an exposure
apparatus according to a first embodiment.
[0017] FIG. 2 is a side sectional view of those disposed in the
vicinity of a substrate table and a nozzle member according to the
first embodiment.
[0018] FIG. 3 is a perspective view of the substrate table
according to the first embodiment.
[0019] FIG. 4 illustrates an example of the cleaning operation
according to the first embodiment.
[0020] FIG. 5 is a side sectional view of those disposed in the
vicinity of a substrate table and a nozzle member according to a
second embodiment.
[0021] FIG. 6 is a perspective view of the substrate table
according to the second embodiment.
[0022] FIG. 7 is a perspective view of a measuring table according
to a third embodiment.
[0023] FIG. 8 is a side sectional view of an example of a
suppressing device according to a fourth embodiment.
[0024] FIG. 9 is a side sectional view of an example of the
suppressing device according to the fourth embodiment.
[0025] FIG. 10 is a side sectional view of an example of the
suppressing device according to the fourth embodiment.
[0026] FIG. 11 is a side sectional view of an example of the
suppressing device according to the fourth embodiment.
[0027] FIG. 12 is a side sectional view of an example of the
suppressing device according to the fourth embodiment.
[0028] FIG. 13 is a side sectional view of an example of the
suppressing device according to the fourth embodiment.
[0029] FIG. 14 is a flow chart illustrating an exemplary liquid
immersion exposure sequence including the cleaning operation.
[0030] FIG. 15 is a flow chart illustrating exemplary steps of
producing a microdevice.
PREFERRED EMBODIMENT FOR CARRYING OUT THE INVENTION
[0031] Embodiments will be explained below with reference to the
drawings in relation to the exposure apparatus of the present
invention and the cleaning apparatus usable therefor. However, the
present invention is not limited to these. In the following
description, an XYZ rectangular coordinates system is defined. The
positional relationship concerning respective members of the
exposure apparatus and the cleaning apparatus usable therefor will
be explained with reference to the XYZ rectangular coordinates
system. An X axis direction is a predetermined direction in a
horizontal plane, a Y axis direction is a direction which is
perpendicular to the X axis direction in the horizontal plane, and
a Z axis direction is a direction which is perpendicular to each of
the X axis direction and the Y axis direction (i.e., the vertical
direction). Directions of rotation (inclination) about the X axis,
the Y axis, and the Z axis are designated as the .theta.X,
.theta.Y, and .theta.Z directions respectively.
First Embodiment
[0032] A first embodiment will be explained. FIG. 1 is a schematic
arrangement view of an exposure apparatus EX according to the first
embodiment. This embodiment will be explained as exemplified by a
case wherein the exposure apparatus EX includes a substrate stage 2
which is movable while holding a substrate P, and a measuring stage
3 which is movable with a measuring device or measuring devices
capable of executing a predetermined measurement in relation to the
exposure provided thereon, and which does not hold the substrate P,
as disclosed for example in U.S. Pat. No. 6,897,963, European
Patent Application Publication No. 1,713,113, and the like.
[0033] With reference to FIG. 1, the exposure apparatus EX includes
a mask stage 1 which is movable while holding a mask M; a substrate
stage 2 which is movable while holding the substrate 2; a measuring
stage 3 which is provided with a measuring device capable of
executing a predetermined measurement in relation to the exposure,
which does not hold the substrate P, and which is movable
independently from the substrate stage 2; a first driving system 4
which moves the mask stage 1; a second driving system 5 which moves
the substrate stage 2 and the measuring stage 3; an interferometer
system 6 including laser interferometers 6A, 6B which measure the
position information about each of the mask and substrate stages;
an illumination system IL which illuminates the mask M with an
exposure light EL; a projection optical system PL which projects,
onto the substrate P, an image of a pattern of the mask M
illuminated with the exposure light EL; and a controller 7 which
controls the entire operation of the exposure apparatus EX.
[0034] The substrate P referred to herein is a substrate for
exposure to produce a device, and includes, for example, those in
which a film of a photosensitive material (photoresist), etc. is
formed on a base material including a semiconductor wafer such as a
silicon wafer and the like. The substrate P also includes those
which are coated with various films of, for example, a protective
film (top coat film) in addition to the photosensitive material.
The mask M includes a reticle on which a device pattern, to be
projected onto the substrate P, is formed. In this embodiment, a
transmission type mask is used as the mask M. However, it is also
possible to use a reflection type mask. The transmission type mask
is not limited to a binary mask on which the pattern is formed with
the light-shielding film, and also includes, for example, a phase
shift mask of the spatial frequency modulation type or the half
tone type.
[0035] The exposure apparatus EX of the embodiment of the present
invention is a liquid immersion exposure apparatus in which the
substrate P is exposed with the exposure light EL through an
exposure liquid LQ. A first liquid immersion space LS1 is formed
with the exposure liquid LQ so that at least a part of the optical
path space for the exposure light EL is filled with the exposure
liquid LQ. In this embodiment, the first liquid immersion space LS1
is formed so that the optical path space for the exposure light EL,
between a last or final optical element 11 and an object arranged
opposite to or facing the final optical element 11, is filled with
the exposure liquid LQ. The final optical element 11 is arranged
closest to the image plane of the projection optical system PL,
among a plurality of optical elements of the projection optical
system PL. In this specification, as for the "liquid immersion
space", a space or an area, which is actually filled with the
liquid, is referred to as "liquid immersion space". The final
optical element 11 has a lower surface (light exit surface) 11A
from which (via which) the exposure light EL exits or is irradiated
toward the image plane of the projection optical system PL. The
first liquid immersion space LS1 is formed so that the optical path
space, for the exposure light EL, which is between the lower
surface 11A of the final optical element 11 and the object opposite
to the light exit surface 11A of the final optical element 11, is
filled with the exposure liquid LQ. The exposure apparatus EX
radiates the exposure light EL onto the substrate P through the
exposure liquid LQ to expose the substrate P.
[0036] The exposure apparatus EX of this embodiment is provided
with a nozzle member 8 which is capable of forming the first liquid
immersion space LS1. The nozzle member 8 is arranged in the
vicinity of the final optical element 11. The nozzle member 8 has a
lower surface 8A which is capable of being opposite to or facing
(opposable to) the object arranged at the position opposite to the
lower surface 11A of the final optical element 11. In this
embodiment, the first liquid immersion space LS1 is formed by the
exposure liquid LQ which is held or retained between the final
optical element 11 and the nozzle member 8 and the object opposite
to the final optical element 11 and the nozzle member 8.
[0037] The object, which is opposable to the final optical element
11 and the nozzle member 8, includes an object which is movable on
the light-exit side of the final optical element 11 (on the side of
the image plane (image plane side) of the projection optical system
PL). In this embodiment, the object, which is movable on the
light-exit side of the final optical element 11, includes at least
one of the substrate stage 2, the substrate P held by the substrate
stage 2, and the measuring stage 3.
[0038] In this embodiment, a second liquid immersion space LS2 is
formed with a cleaning liquid LC, at a predetermined timing,
between the final optical element 11 and the nozzle member 8 and
the object opposite to the final optical element 11 and the nozzle
member 8. By forming the second liquid immersion space LS2 with the
cleaning liquid LC, it is possible to clean or wash a surface of
the member which makes contact with the cleaning liquid LC of the
second liquid immersion space LS2.
[0039] In this embodiment, the liquid immersion space is formed so
that a partial area (local area) of the surface of the object
described above is covered with the liquid. The interface of the
liquid (meniscus, edge) is formed between the surface of the object
and the lower surface 8A of the nozzle member 8. When the substrate
P is exposed, the first liquid immersion space LS1 is formed so
that a partial area on the substrate P, which includes the
projection area of the projection optical system PL, is covered
with the first liquid LQ. That is, the liquid immersion exposure
apparatus EX of this embodiment adopts the local liquid immersion
system.
[0040] The optical path space for the exposure light EL described
above is a space which includes the optical path via which the
exposure light EL passes. The liquid immersion space is a space
filled with the liquid. In the following description, the exposure
liquid LQ is appropriately referred to as "first liquid LQ", and
the cleaning liquid LC is appropriately referred to as "second
liquid LC".
[0041] The exposure apparatus EX of this embodiment is provided
with a vibration member 150 which is provided on the substrate
stage 2 (substrate table 22), and a vibration generator 10 which
vibrates the vibration member 150. The vibration generator 10
vibrates the vibration member 150 to thereby apply the vibration to
the liquid in the liquid immersion space formed on the vibration
member 150.
[0042] The illumination system IL illuminates a predetermined
illumination area on the mask M with the exposure light EL having a
uniform illuminance distribution. Those usable as the exposure
light EL radiated from the illumination system IL include, for
example, the far ultraviolet light beams (DUV light beams) such as
the emission lines (g-ray, h-ray, and i-ray) radiated, for example,
from a mercury lamp and the KrF excimer laser beam (wavelength: 248
nm), and the vacuum ultraviolet light beams (VUV light beams) such
as the ArF excimer laser beam (wavelength: 193 nm) and the F.sub.2
laser beam (wavelength: 157 nm). In this embodiment, the ArF
excimer laser beam is used as the exposure light EL.
[0043] The mask stage 1 is movable in the three directions of the X
axis, Y axis, and .theta.Z directions by the first driving system 4
in a state that the mask M is held on the mask stage 1. The first
driving system 4 includes an actuator such as a linear motor or the
like. The position information about the mask stage 1 (mask M) is
measured by the laser interferometer 6A of the interferometer
system 6. The laser interferometer 6A measures the position
information of the mask stage 1 in relation to the X axis, Y axis,
and .theta.Z directions by using a measuring mirror 1F provided on
the mask stage 1. The controller 7 controls the position of the
mask stage 1 (mask M) by using the first driving system 4 based on
a measurement result obtained by the interferometer system 6.
[0044] The projection optical system PL projects the image of the
pattern of the mask M onto the substrate P at a predetermined
projection magnification. The optical elements of the projection
optical system PL are held by a barrel PK. The projection optical
system PL of this embodiment is based on the reduction system
having the projection magnification which is, for example, 1/4,
1/5, 1/8 or the like. The projection optical system PL may be of
any one of the 1.times. magnification system and the magnifying
system. In this embodiment, the optical axis AX of the projection
optical system PL is parallel to the Z axis direction. The
projection optical system PL may be of any one of the dioptric
system including no catoptric optical element, the catoptric system
including no dioptric optical element, and the catadioptric system
including catoptric and dioptric optical elements. The projection
optical system PL may form any one of an inverted image and an
erecting image. Although not shown, the projection optical system
PL is provided on a barrel surface plate supported by three support
columns by the aid of an anti-vibration mechanism. However, as
disclosed, for example, in International Publication No.
2006/038952, the projection optical system may be supported by
being hung from an unillustrated main frame member which is
arranged over or above the projection optical system PL, a base
member on which the mask stage 1 is arranged, or the like.
[0045] The substrate stage 2 has a body 21 of the substrate stage 2
(stage body 21), and a substrate table 22 which is provided on the
stage body 21. The substrate table 22 has a holding portion 23
which detachably holds the substrate P. The holding portion 23
holds the substrate P so that the surface of the substrate P is
substantially parallel to the XY plane. The substrate table 22 has
a first recess 22R. The holding portion 23 is arranged in the first
recess 22R. An upper surface 24 of the substrate table 22 is
arranged around the first recess 22R. The upper surface 24 of the
substrate table 22 is arranged around the surface of the substrate
P held by the holding portion 23. The upper surface 24 is
substantially flat, and is arranged in a plane approximately same
as the surface of the substrate P held by the holding portion 23
(in the XY plane). That is, the upper surface 24 of the substrate
table 22 is substantially flush with the surface of the substrate P
held by the holding portion 23. The surface of the substrate P held
by the holding portion 23 and the upper surface 24 of the substrate
table 22 are opposable to the lower surface 11A of the final
optical element 11 and the lower surface 8A of the nozzle member
8.
[0046] The measuring stage 3 has a body 31 of the measuring stage 3
(stage body 31), and a measuring table 32 which is provided on the
stage body 31. At least a part of the measuring device is provided
on the measuring table 32. The measuring device includes a
reference member formed with a reference mark such as a mark for
the alignment sensor, and various photoelectric sensors. The
measuring device is, for example, an uneven illuminance sensor as
disclosed, for example, in U.S. Pat. No. 4,465,368, a spatial image
measuring device for measuring the light intensity of the spatial
image (projected image) of the pattern projected by the projection
optical system PL as disclosed, for example, in United States
Patent Application Publication No. 2002/0041377, an illuminance
monitor as disclosed, for example, in United States Patent
Application Publication No. 2002/0061469, and a wave aberration
measuring device as disclosed in European Patent No. 1,079,223. The
upper surface 34 of the measuring table 32 is substantially flat,
and is substantially parallel to the XY plane. The upper surface 34
of the measuring table 32 is opposable to the lower surface 11A of
the final optical element 11 and the lower surface 8A of the nozzle
member 8.
[0047] The second driving system 5 is capable of moving each of the
substrate stage 2 and the measuring stage 3. The second driving
system 5 is provided with a coarse movement system 13 which moves
each of the stage bodies 21, 31 on the base member BP; and a fine
movement system 14 which moves the tables 22, 32 on the stage
bodies 21, 31, respectively.
[0048] The coarse movement system 13 includes an actuator such as a
linear motor. The coarse movement system 13 is capable of moving
each of the stage bodies 21, 31 on the base member BP in the X
axis, Y axis, and .theta.Z directions. When each of the stage
bodies 21, 31 is moved in the X axis, Y axis, and .theta.Z
directions by the coarse movement system 13, the tables 22, 32,
which are provided on the stage bodies 21, 31, respectively, are
also moved in the X axis, Y axis, and .theta.Z directions together
with the stage bodies 21, 31 respectively.
[0049] The fine movement system 14 includes actuators 14V, such as
voice coil motors or the like, which are intervened between the
stage bodies 21, 31 and the tables 22, 32 respectively; and
unillustrated measuring devices (for example, encoders) which
measure the driving amounts of the actuators 14V respectively. The
fine movement system 14 is capable of moving the tables 22, 23 on
the respective stage bodies 21, 31, respectively, at least in the Z
axis, .theta.X axis, and .theta.Y directions. Further, the fine
movement system 14 is capable of moving (finely moving) the tables
22, 32 on the stage bodies 21, 31 respectively, in the X axis, Y
axis, and .theta.Z directions.
[0050] The substrate table 22 is movable in the six directions of
the X axis, Y axis, Z axis, .theta.X, .theta.Y, and .theta.Z
directions, in a state that the substrate P is held to the
substrate table 22 with the holding portion 23, by the second
driving system 5 which includes the coarse movement system 13 and
the fine movement system 14. Similarly, the measuring table 32 is
movable by the second driving system 5 in the six directions of the
X axis, Y axis, Z axis, .theta.X, .theta.Y, and .theta.Z directions
in a state that the measuring devices are held to the measuring
table 32.
[0051] The position information of the substrate table (substrate
P) and the position information of the measuring table 32 are
measured by the laser interferometer 6B of the interferometer
system 6. The laser interferometer 6B measures the position
information of each of the tables 22, 32 in relation to the X axis,
Y axis, and .theta.Z directions by using the measuring mirrors 22F,
32F of the tables 22, 32, respectively. The surface position
information of the surface of the substrate P held by the holding
portion 23 of the substrate table 22 (position information in
relation to the Z axis, and .theta.X, and .theta.Y directions) and
the surface position information of the predetermined area of the
upper surface of the measuring table 32 are detected by a
focus/leveling-detecting system (not shown). The controller 7
controls the position of the substrate table 22 (substrate P) and
the position of the measuring table 32 by using the second driving
system 5 based on a measurement result obtained by the laser
interferometer 6B of the interferometer system 6 and based on a
detection result obtained by the focus/leveling-detecting system,
respectively.
[0052] FIG. 2 is a side sectional view of those disposed in the
vicinity of the substrate table 22 and the nozzle member 8. FIG. 3
is a perspective view of the substrate table 22 according to this
embodiment. As shown in FIGS. 1, 2, and 3, the vibration member 150
is provided on the substrate table 22 in this embodiment. The
substrate table 22 is movable on the light-exit side of the final
optical element 11. The vibration member 150, which is provided on
the substrate table 22, is also movable on the light-exit side of
the final optical element 11. The vibration member 150 is a
rod-shaped member. In this embodiment, the vibration member 150 is
formed of silica glass. The substrate table 22 has a second recess
150R which is distinct or different from the first recess 22R. The
vibration member 150 is arranged in the second recess 150R. The
upper surface 24 of the substrate table 22 is arranged around the
upper end of the second recess 150R.
[0053] The vibration member 150 has an upper surface 151 which is
opposable to the lower surface 11A of the final optical element 11
and the lower surface 8A of the nozzle member 8. In this
embodiment, the upper surface 151 of the vibration member 150 is
flat. In this embodiment, the vibration member 150 is arranged in
the second recess 150R so that the upper surface 151 is
substantially parallel to the XY plane. However, the upper surface
151 of the vibration member 150 may be a curved surface.
Alternatively, the upper surface 151 of the vibration member 150
may be inclined with respect to the XY plane.
[0054] The upper surface 24 of the substrate table 22 is arranged
around the upper surface 151 of the vibration member 150 arranged
in the second recess 150R. The upper surface 151 of the vibration
member 150 and the upper surface 24 of the substrate table 22 are
arranged with a predetermined gap G intervening therebetween. That
is, the gap is formed between the vibration member 151 and the
member forming the upper surface 24 of the substrate table 22. In
this embodiment, the gap G is, for example, about 0.1 mm.
[0055] In this embodiment, the upper surface 151 of the vibration
member 150 and the upper surface 24 of the substrate table 22 are
arranged in a same plane (XY plane). In other words, the upper
surface 151 of the vibration member 150 and the upper surface 24 of
the substrate table 22 are substantially flush with each other.
Further, the upper surface 151 of the vibration member 150 and the
upper surface 24 of the substrate table 22 are substantially flush
with the surface of the substrate P held by the holding portion 23
of the substrate table 22.
[0056] The vibration generator 10 is connected to the vibration
member 150. In this embodiment, the vibration generator 10 is
connected to the lower surface 152 of the vibration member 150. The
vibration generator 10 is arranged at the inside of the second
recess 150R. The vibration generator 10 is connected to the lower
surface 152 of the vibration member 150 at the inside of the second
recess 150R.
[0057] The vibration generator 10 vibrates the vibration member
150. The vibration generator 10 includes an ultrasonic wave
generator, and applies the ultrasonic wave to the vibration member
150. In this embodiment, the vibration generator 10 includes a
piezoelectric element such as PZT (lead zirconate titanate) or a
quartz oscillator, and a circuit for driving the piezoelectric
element. A magnetorestrictive oscillator or generator, which is
obtained by winding a coil around a ferrite core, may be used
instead of the piezoelectric element. The vibration generator 10 is
controlled by the controller 7. The controller 7 of the exposure
apparatus EX vibrates the vibration member 150 by using the
vibration generator 10. The driving circuit for the piezoelectric
element may be incorporated into the controller 7. In the following
description, the vibration generator 10 is appropriately referred
to as "ultrasonic wave generator 10".
[0058] As shown in FIG. 2, the nozzle member 8 is arranged in the
vicinity of the final optical element 11. The nozzle member 8 is an
annular member which is arranged around the final optical element
11 (optical path space for the exposure light EL). For example,
when the first liquid immersion space LS1 is formed on the
substrate P, the first liquid LQ is retained between the surface of
the substrate P and the lower surface 11A of the final optical
element 11 and the lower surface 8A of the nozzle member 8.
[0059] The nozzle member 8 has a supply port 81 which is capable of
supplying the first liquid LQ, and a recovery port 82 which is
capable of recovering the first liquid LQ. The recovery port 82 is
arranged at a part of the lower surface 8A of the nozzle member 8.
An opening 8K is formed at a part, of the nozzle member 8, opposite
to or facing the lower surface 11A of the final optical element 11.
The exposure light EL, irradiated from the lower surface 11A of the
final optical element 11, passes through the opening 8K, and the
exposure light EL is irradiated onto the substrate P.
[0060] The exposure apparatus EX is provided with a first liquid
supply device 86 which provides or generates the first liquid LQ, a
second liquid supply device 96 which provides or generates the
second liquid LC, and a liquid recovery device 89 which is capable
of recovering the liquid. The first liquid supply device 86, the
second liquid supply device 96, and the liquid recovery device 89
are controlled by the controller 7. The first liquid supply device
86 and the supply port 81 are connected to each other via a supply
tube 85 and a supply flow passage 84 which is formed in the nozzle
member 8. The liquid recovery device 89 and the recovery port 82
are connected to each other via a recovery tube 88 and a recovery
flow passage 87 which is formed in the nozzle member 8. The second
liquid supply device 96 is connected to the supply tube 85 via a
flow passage-switching mechanism 160. The flow passage-switching
mechanism 160 is controlled by the controller 7.
[0061] As described above, the first liquid LQ is an exposure
liquid or a liquid for the exposure. The first liquid LQ, which is
clean and temperature-adjusted, can be fed to the supply port 81 by
the first liquid supply device 86. The second liquid LC is a
cleaning liquid or a liquid for cleaning. The second liquid LC can
be fed to the supply port 81 by the second liquid supply device 96.
The liquid recovery device 89 includes a vacuum system, and is
capable of recovering the first liquid LQ and the second liquid
LC.
[0062] In this embodiment, the controller 7 can stop the supply of
the second liquid LC from the second liquid supply device 96 to the
supply port 81 when the first liquid LQ fed from the first liquid
supply device 86 is supplied to the supply port 81, by controlling
the flow passage-switching mechanism 160, the first liquid supply
device 86, and the second liquid supply device 96. Further, the
controller 7 can stop the supply of the first liquid LQ from the
first liquid supply device 86 to the supply port 81 when the second
liquid LC fed from the second liquid supply device 96 is supplied
to the supply port 81.
[0063] For example, in order to form the first liquid immersion
space LS1 with the first liquid LQ, the controller 7 stops the
supply of the second liquid LC from the second liquid supply device
96 to the supply port 81, and feeds the first liquid LQ from the
first liquid supply device 86. The first liquid LQ fed from the
first liquid supply device 86 flows through the supply tube 85 and
the supply flow passage 84 of the nozzle member 8, and then the
first liquid LQ is supplied to the supply port 81. The supply port
81 supplies the first liquid LQ fed from the first liquid supply
device 86 in order to form the first liquid immersion space LS1
with the first liquid LQ. The first liquid LQ, which is recovered
from the recovery port 82 in accordance with the operation of the
liquid recovery device 89, flows through the recovery flow passage
87 of the nozzle member 8, and then the first liquid LQ is
recovered by the liquid recovery device 89 via the recovery tube
88. The controller 7 executes the recovery operation to recover the
first liquid LQ, using the recovery port 82, concurrently with the
supply operation to supply the first liquid LQ using the supply
port 81, thereby forming the first liquid immersion space LS1.
[0064] On the other hand, in order to form the second liquid
immersion space LS2 with the second liquid LC, the controller 7
stops the supply of the first liquid LQ from the first liquid
supply device 86 to the supply port 81, and feeds the second liquid
LC from the second liquid supply device 96. The second liquid LC,
fed from the second liquid supply device 96, flows through the
supply tube 85 and the supply flow passage 84 of the nozzle member
8, and then the second liquid LC is supplied to the supply port 81.
The supply port 81 supplies the second liquid LC fed from the
second liquid supply device 96 in order to form the second liquid
immersion space LS2 with the second liquid LC. The second liquid
LC, recovered from the recovery port 82 in accordance with the
operation of the liquid recovery device 89, flows through the
recovery flow passage 87 of the nozzle member 8, and then the
second liquid LC is recovered by the liquid recovery device 89 via
the recovery tube 88. The controller 7 executes the recovery
operation to recover the second liquid LC, using the recovery port
82, concurrently with the supply operation to supply the second
liquid LC using the supply port 81, thereby forming the second
liquid immersion space LS2.
[0065] In this way, the supply port 81 is capable of supplying each
of the first liquid LQ and the second liquid LC in this
embodiment.
[0066] In this embodiment, water (pure or purified water) is used
as the first liquid LQ.
[0067] In this embodiment, any liquid, which is different from the
first liquid LQ, is used as the second liquid LC. In this
embodiment, hydrogen water (hydrogen-dissolved water), in which
hydrogen gas is dissolved in water, is used as the second liquid
LC.
[0068] Those usable as the second liquid LC also include dissolved
gas conditioned water in which predetermined gas is dissolved in
water, including, for example, ozone water (ozone-dissolved water)
in which ozone gas is dissolved in water, nitrogen water
(nitrogen-dissolved water) in which nitrogen gas is dissolved in
water, argon water (argon-dissolved water) in which argon gas is
dissolved in water, carbon dioxide water (carbon dioxide-dissolved
water) in which carbon dioxide gas is dissolved in water, and the
like. The second liquid LC may also be any gas supersaturation
water in which gas is dissolved while exceeding the solubility to
be obtained at the atmospheric pressure. It is also allowable to
use, as the second liquid LC, any chemical-added water in which a
predetermined chemical is added to water, including, for example,
hydrogen peroxide water in which hydrogen peroxide is added to
water, chlorine-added water in which hydrochloric acid
(hypochlorous acid) is added to water, ammonia water in which
ammonia is added to water, choline water in which choline is
dissolved, sulfuric acid-added water in which sulfuric acid is
added to water, etc. It is also allowable to use, as the second
liquid LC, alcohols such as ethanol and methanol, ethers,
gamma-butylolactone, thinners, surfactants, fluorine-based solvents
such as HFE, etc.
[0069] In this embodiment, the upper surface 151 of the vibration
member 150 is liquid-repellent or lyophobic with respect to the
first liquid LQ and the second liquid LC. The contact angle of the
upper surface 151 of the vibration member 150 with respect to each
of the first liquid LQ and the second liquid LC is not less than 90
degrees. In this embodiment, the upper surface 151 of the vibration
member 150 is formed of a film of a liquid-repellent material
including, for example, fluorine-based resin (for example, PTFE,
PFA or the like). It is desirable that the side surface of the
vibration member 150 is also liquid-repellent with respect to the
first liquid LQ and the second liquid LC.
[0070] Similarly, the upper surface 24 of the substrate table 22 is
liquid-repellent with respect to the first liquid LQ and the second
liquid LC. The contact angle of the upper surface 24 of the
substrate table 22 with respect to each of the first liquid LQ and
the second liquid LC is not less than 90 degrees. In this
embodiment, the upper surface 24 of the substrate table 22 is
formed of a film of a liquid-repellent material including, for
example, fluorine-based resin (for example, PTFE, PFA or the like).
It is desirable that the inner side surface of the second recess
150R of the substrate table 22 (a surface opposite to the side
surface of the vibration member 150) is also liquid-repellent with
respect to the first liquid LQ and the second liquid LC.
[0071] Similarly, the upper surface 34 of the measuring table 32 is
liquid-repellent with respect to the first liquid LQ and the second
liquid LC. The contact angle of the upper surface 34 of the
measuring table 32 with respect to each of the first liquid LQ and
the second liquid LC is not less than 90 degrees. In this
embodiment, the upper surface 34 of the measuring table 32 is
formed of a film of a liquid-repellent material including, for
example, fluorine-based resin (for example, PTFE, PFA or the like).
The liquid-repellent films, which are used for the vibration member
150, the substrate table 22, and the measuring table 32, may be
formed of a same material (substance) respectively, or may be
formed of different materials (substances).
[0072] Next, an explanation will be made about a method for
exposing the substrate P by using the exposure apparatus EX
constructed as described above.
[0073] For example, the controller 7 uses the second driving system
5 to arrange the measuring table 32 at the position opposite to the
nozzle member 8, to thereby form the first liquid immersion space
LS1 with the first liquid LQ between the nozzle member 8 and the
measuring table 32. The controller 7 executes the measurement by
the various measuring devices arranged on the measuring table 32
via the first liquid LQ in the first liquid immersion space LS1.
Further, the controller 7 adjusts the exposure condition to be
adapted when the substrate P is exposed, the exposure condition
including, for example, the image formation characteristic of the
projection optical system PL, etc., based on results of the
measurement obtained by the measuring devices, and the controller 7
starts the exposure operation for the substrate P. Upon exposing
the substrate P, the controller 7 uses the second driving system 5
to arrange the substrate stage 2 holding the substrate P at the
position opposite to the nozzle member 8, to thereby form the first
liquid immersion space LS1 between the nozzle member 8 and the
substrate table 22 (substrate P).
[0074] In this embodiment, as disclosed, for example, in European
Patent Application Publication No. 1,713,113 and United States
Patent Application Publication No. 2006/0023186, the controller 7
synchronously moves the substrate table 22 and the measuring table
32 in the XY directions with respect to the final optical element
11 and the nozzle member 8 while allowing at least one of the upper
surface 24 of the substrate table 22 and the upper surface 34 of
the measuring table 32 to be opposite to the lower surface 11A of
the final optical element 11 and the lower surface 8A of the nozzle
member 8 in a state that the upper surface 24 of the substrate
table 22 and the upper surface 34 of the measuring table 32
approach closely to each other or make contact with each other so
that at least one of the substrate table 22 and the measuring table
32 continuously forms the space capable of holding or retaining the
first liquid LQ between the final optical element 11 and the nozzle
member 8. By doing so, the controller 7 can move the first liquid
immersion space LS1 of the first liquid LQ between the upper
surface 24 of the substrate table 22 and the upper surface 34 of
the measuring table 32 while suppressing the leakage of the first
liquid LQ. Upon moving the first liquid immersion space LS1 of the
first liquid LQ between the upper surface 24 of the substrate table
22 and the upper surface 34 of the measuring table 32, adjustment
is made so that the upper surface 24 of the substrate table 22 and
the upper surface 34 of the measuring table 32 have an
approximately same height (are approximately flush with each
other).
[0075] The controller 7 radiates the exposure light EL from the
mask M onto the substrate P through the first liquid LQ of the
first liquid immersion space LS1. Accordingly, the image of the
pattern of the mask M is projected onto the substrate P, and thus
the substrate P is exposed therewith.
[0076] The controller 7 moves the first liquid immersion space LS1
onto the measuring table 32 after the exposure of the substrate P
is completed. The controller 7 moves the substrate table 22,
holding the substrate P for which the exposure has been completed,
to a predetermined substrate exchange position; and the controller
7 unloads the substrate P, for which the exposure has been
completed, from the substrate table 22, the controller 7 loads a
substrate P, which is to be exposed, onto the substrate table 22.
During the substrate exchange performed at the substrate exchange
position, if necessary, the controller 7 executes the measuring
operation using the measuring table 32 via or through the first
liquid LQ of the first liquid immersion space LS1. After completing
the loading of the substrate P onto the substrate table 22, the
controller 7 moves the first liquid immersion space LS1 onto the
substrate table 22 (substrate P), and exposes the substrate P
through the first liquid LQ of the first liquid immersion space LS1
in the same manner as described above. The controller 7 repeats the
operation as described above to successively expose a plurality of
pieces of the substrate P.
[0077] When the substrate P is exposed, the first liquid LQ of the
first liquid immersion space LS1 makes contact with each of the
surface of the substrate P, the lower surface 11A of the final
optical element 11, and the lower surface 8A of the nozzle member
8. There is such a possibility, for example, that a part of the
substance of the substrate P (for example, a part of the
photosensitive material) might be eluted into the first liquid LQ
making contact with the substrate P. If such a liquid LQ makes
contact with the lower surface 11A of the final optical element 11
and/or the lower surface 8A of the nozzle member 8, then there is
such a possibility that the lower surfaces 11A, 8A might be
contaminated or dirtied with the substance eluted from the
substrate P. Without being limited to the substance eluted from the
substrate F, there is such a possibility that the lower surfaces
11A, 8A may be also contaminated, for example, with any substance
(foreign matter) floating in the space in which the exposure
apparatus EX is placed such that the foreign matter directly
adheres to the lower surfaces 11A, 8A and/or the foreign matter
enters into and mixes with the first liquid LQ.
[0078] In view of the above, in this embodiment, at least one of
the final optical element 11 and the nozzle member 8 is cleaned or
washed by using the second liquid LC. In this embodiment, the
second liquid immersion space LS2 is formed with the second liquid
LC between the upper surface 151 of the vibration member 150 and
the final optical element 11 and the nozzle member 8, and the
vibration is applied to the second liquid LC of the formed second
liquid immersion space LS2 to thereby clean at least one of the
final optical element 11 and the nozzle member 8.
[0079] Next, an explanation will be made about a method for
cleaning the final optical element 11 and the nozzle member 8 by
using the second liquid LC.
[0080] In order to clean the final optical element 11 and the
nozzle member 8 by using the second liquid LC, the controller 7
moves the substrate table 22 so that the vibration member 150 is
opposite to the final optical element 11 to form the second liquid
immersion space LS2 with the second liquid LC between the final
optical element 11 and the nozzle member 8 and the vibration member
150. In order to form the second liquid immersion space LS2 with
the second liquid LC, the controller 7 stops the supply of the
first liquid LQ from the supply port 81, and the controller 7
supplies the second liquid LC from the supply port 81. As shown in
FIG. 4, the second liquid immersion space LS2 is formed between the
final optical element 11 and the nozzle member 8 and the vibration
member 150 with the second liquid LC supplied from the supply port
81. The nozzle member 8 executes the recovery operation to recover
the second liquid LC using the recovery port 82 concurrently with
the supply operation to supply the second liquid LC using the
supply port 81, and thus the second liquid immersion space LS2 is
formed. As shown in FIG. 4, in this embodiment, the size of the
second liquid immersion space LS2 in the XY plane is greater than
the upper surface 151 of the vibration member 150. The second
liquid immersion space LS2 is formed between the final optical
element 11 and the nozzle member 8 and the vibration member 150 and
the substrate table 22.
[0081] The controller 7 vibrates the vibration member 150 by the
ultrasonic wave generator 10 in a state that the second liquid
immersion space LS2 is formed. The ultrasonic wave generator 10
vibrates the vibration member 150 to thereby apply the ultrasonic
wave (vibration) to the second liquid LC of the second liquid
immersion space LS2 formed on the vibration member 150. In this
embodiment, the ultrasonic wave generator 10 is capable of applying
the vibration in a range of 20 kHz to 5000 kHz to the vibration
member 150. The ultrasonic wave generator 10 applies the ultrasonic
wave (vibration) to the second liquid LC of the second liquid
immersion space LS2 formed between the final optical element 11 and
the nozzle member 8 and the vibration member 150 and the substrate
table 22 to make foreign matter (pollution matter or contaminating
matter), adhering to at least one of the final optical element 11
and the nozzle member 8, to be exfoliated or removed from at least
one of the final optical element 11 and the nozzle member 8,
thereby cleaning at least one of the final optical element 11 and
the nozzle member 8. For example, the vibrator 10 generates
cavitation (generation of minute bubbles and generation of shock
wave or impulse wave upon disappearance of the minute bubbles) in
the second liquid LC by applying the ultrasonic wave (vibration) to
the second liquid LC. The cavitation causes the foreign matter
(contaminating matter), adhering to at least one of the final
optical element 11 and the nozzle member 8, to exfoliate the
foreign matter from at least one of the final optical element 11
and the nozzle member 8, thereby cleaning at least one of the final
optical element 11 and the nozzle member 8.
[0082] The supply and the recovery of the second liquid LC are
continued during a period in which the vibration member 150 is
vibrated by the ultrasonic wave generator 10 (during the cleaning
operation). However, it is also allowable that the supply and the
recovery of the second liquid LC are stopped temporarily or
intermittently.
[0083] The substrate table 22 may be moved by the second driving
system 5 in the XY plane with respect to the projection optical
system PL and the nozzle member 8 during the period in which the
vibration member 150 is vibrated by the ultrasonic wave generator
10. Accordingly, the lower surface 8A of the nozzle member 8 and
the lower surface 11A of the final optical element 11 can be
cleaned more uniformly and reliably irrelevant to the difference in
the size of the upper surface 151 of the vibration member 150 with
respect to the first liquid immersion space LS1 and the second
liquid immersion space LS2. The vibration of the vibration member
150 may be stopped during the movement of the substrate table 22,
and the vibration member 150 may be vibrated only when the
substrate table 22 is stopped at a predetermined position.
[0084] As shown in FIG. 4, in this embodiment, a dummy substrate DP
is held by the holding portion 23 of the substrate table 22 in the
cleaning operation using the second liquid LC. The dummy substrate
DP is a member (clean member) which is distinct from the substrate
P for the exposure and which has a high cleanness to scarcely
release any foreign matter. The dummy substrate DP has an outer
shape approximately same as that of the substrate P for the
exposure, and the dummy substrate DP can be held by the holding
portion 23. In this embodiment, the holding portion 23 has a pin
chuck mechanism, and detachably holds each of the substrate P and
the dummy substrate DP. A surface of the dummy substrate DP is
liquid-repellent with respect to the second liquid LC. The cleaning
operation can be executed also by using the cleaning liquid LC in a
state that the holding portion 23 is exposed, without holding the
dummy substrate DP by the holding portion 23.
[0085] As explained above, according to this embodiment, it is
possible to satisfactorily clean the liquid immersion member which
includes the final optical element 11, the nozzle member 8, etc.,
and which is capable of forming the liquid immersion space with
respect to the substrate table 22. Therefore, it is possible to
suppress the deterioration of the performance of the exposure
apparatus EX which would be otherwise caused by the contamination
of the final optical element 11 and the nozzle member 8.
[0086] In this embodiment, there is provided the ultrasonic wave
generator 10 which applies the ultrasonic wave to the second liquid
LC of the second liquid immersion space LS2. Therefore, it is
possible to enhance the cleaning effect. In this embodiment, the
final optical element 11 and the nozzle member 8 can be
satisfactorily cleaned owing to the synergistic effect of the
ultrasonic wave and the second liquid LC (hydrogen water) suitable
for the cleaning.
[0087] In this embodiment, the vibration member 150, which is
small-sized and can be provided on the substrate table 22, is
vibrated in order to apply the ultrasonic wave to the second liquid
LC of the second liquid immersion space LS2. Accordingly, the
vibration member 150 can be smoothly vibrated at a high frequency
(oscillation frequency), and thus it is possible to smoothly apply
the ultrasonic wave at the high frequency to the second liquid LC
of the second liquid immersion space LS2. In a case that a more
satisfactory cleaning effect is obtained when the ultrasonic wave
applied to the second liquid LC of the second liquid immersion
space LS2 has a higher frequency, then it is effective that the
vibration member 150, which is provided on the substrate table 22,
is vibrated at a high frequency (oscillation frequency), for
example, of not less than 1 MHz. Alternatively, the vibration may
be effected while switching a plurality of frequencies or
continuously modulating the vibration frequency of the vibration
member 150 by the controller 7 or the driving circuit of the
piezoelectric element of the ultrasonic wave generator 10. By doing
so, any foreign matter, which is included in a plurality of types
of foreign matters adhered to the final optical element 11 and the
nozzle member 8 and which is hardly separated or exfoliated with a
specific single frequency, can be also easily separated or
exfoliated, thereby making the effect of the cavitation based on
the ultrasonic wave to be more remarkable.
[0088] In this embodiment, the upper surface 151 of the vibration
member 150 is flush with the upper surface 24 of the substrate
table 22. Therefore, it is possible to form the second liquid
immersion space LS2 satisfactorily.
[0089] The vibration member 150 and the substrate table 22 are
arranged with the predetermined gap G being intervened
therebetween. Therefore, the vibration member 150 can be smoothly
vibrated. Further, the vibration of the vibration member 150 does
not exert any harmful influence on the substrate table 22 because
the vibration member 150 and the substrate table 22 are arranged
with the predetermined gap G intervening therebetween. Further, the
gap G between the vibration member 150 (upper surface 151) and the
substrate table 22 (upper surface 24) is minute (about 0.1 mm); and
the upper surface 151 of the vibration member 150 and the upper
surface 24 of the substrate table 22 are liquid-repellent with
respect to the first liquid LQ and the second liquid LC. Therefore,
it is possible to prevent or suppress the first liquid LQ and the
second liquid LC from remaining on the upper surfaces 151, 24, and
it is possible to suppress the inflow of the liquid into the
substrate table 22 from the gap G between the vibration member 150
(upper surface 151) and the substrate table 22 (upper surface
24).
[0090] A seal member, which suppresses the inflow of the liquid
into the substrate table 22, can be arranged between the vibration
member 150 and the substrate table 22. For example, when a
resilient (flexible) seal member such as an O-ring is arranged, it
is possible to suppress the inflow of the liquid into the substrate
table 22 without disturbing the vibration of the vibration member
150. Alternatively, a soft seal film, which is larger than the
opening of the second recess 150R, may be prepared; and the opening
of the second recess 150R may be covered with the seal film, and
the back surface of the seal film may be adhered to the upper
surface 151 of the vibration member 150. By doing so, the vibration
of the vibration member 150 is transmitted or transferred to the
liquid, while avoiding the inflow of the liquid into the gap G. In
this case, it is preferable that a material of the seal film is
formed of the above-described liquid-repellent material. A part of
the seal film positioned on the upper surface 151 of the vibration
member 150 may be removed to expose a part of the upper surface 151
of the vibration member 150.
[0091] It is also possible to provide a recovery port 154 for
recovering the liquid between the vibration member 150 and the
substrate table 22. For example, by providing the recovery port 154
at the inside of the second recess 150R (on the side surface or the
bottom surface of the inner well defining the second recess 150R)
to surround the vibration member 150, the liquid inflowed into any
space between the vibration member 150 and the substrate table 22
can be recovered satisfactorily.
[0092] This embodiment is illustrative of an exemplary case in
which only one vibration member 150 is provided on the substrate
table 22. However, the vibration member 150 may be provided on the
substrate table 22 at each of a plurality of positions thereof.
[0093] This embodiment is illustrative of the exemplary case in
which the supply port 81 formed in the nozzle member 8 is capable
of supplying both of the second liquid LC and the first liquid LQ.
However, a supply port for supplying the second liquid LC and a
supply port for supplying the first liquid LQ may be separately
formed in the nozzle member 8. Similarly, the nozzle member 8 may
be provided with a recovery port for recovering the first liquid LQ
and a recovery port for recovering the second liquid LC which are
separate ports.
Second Embodiment
[0094] Next, a second embodiment will be explained. In the
following description, the constitutive parts or components, which
are same as or equivalent to those of the embodiment described
above, are designated by same reference numerals, and any
explanation therefor will be simplified or omitted. The first
embodiment described above is explained by an example wherein the
supply port 81, from which the second liquid LC is supplied to form
the second liquid immersion space LS2, is arranged on the nozzle
member 8. However, the feature of the second embodiment is that a
supply port 81B, from which the second liquid LC is supplied to
form the second liquid immersion space LS2, is arranged on the
substrate table 22.
[0095] FIG. 5 is a sectional view of those disposed in the vicinity
of the substrate table 22 according to the second embodiment. FIG.
6 is a perspective view of the substrate table 22 according to the
second embodiment. As shown in FIGS. 5 and 6, an exposure apparatus
EX according to the second embodiment is provided with the supply
port 81B arranged on the substrate table 22 in order to supply the
second liquid LC. The supply port 81B supplies the second liquid LC
in order to form the second liquid immersion space LS2 with the
second liquid LC.
[0096] In this embodiment, the supply port 812 is provided as a
plurality of supply ports 812 arranged around the second recess
150R. Each of the supply ports 81B is connected, via a flow
passage, to the second liquid supply device 96 which is capable of
feeding the second liquid LC. Even with the second liquid LC
supplied from the supply ports 81B arranged on the substrate table
22, the second liquid immersion space LS2 can be satisfactorily
formed between the final optical element 11 and the nozzle member 8
and the vibration member 150 and the substrate table 22.
[0097] A recovery port 154, from which the second liquid LC is to
be recovered, can be provided on the substrate table 22 (for
example, around the second recess 150R). One or more of the
recovery ports 154 can be provided at the outside of the supply
ports 81B with respect to the second recess 150R.
[0098] At least one of the recovery port and the supply port for
the second liquid LC to be provided on the substrate table 22 may
be formed continuously around the second recess 150R.
[0099] When at least one of the recovery port and the supply port
for the second liquid LC is arranged on the substrate table 22,
then at least one of the supply port 81 and the recovery port 82
provided on the nozzle member 8 may be used to supply and/or
recover the second liquid LC during the cleaning performed with the
second liquid LC. Alternatively, it is also allowable that the
supply port 81 and the recovery port 82 are not used. The first
liquid LQ may be supplied and recovered by using the supply port 81
and the recovery port 82 upon the completion of the cleaning with
the second liquid LC, thereby cleaning out (rinsing) the second
liquid LC adhering to the substrate table 22, the final optical
element 11, and the nozzle member 8.
Third Embodiment
[0100] Next, a third embodiment will be explained. In the following
description, the constitutive parts or components, which are same
as or equivalent to those of the embodiments described above, are
designated by same reference numerals, and any explanation therefor
will be simplified or omitted. The first and second embodiments
described above are illustrative of an exemplary case in which the
vibration member 150 is provided on the substrate table 22.
However, the feature of the third embodiment is that the vibration
member 150 is provided on a measuring table 32.
[0101] FIG. 7 is a perspective view of the measuring table 32
according to the third embodiment. With reference to FIG. 7, a
vibration member 150C is provided on the measuring table 32. The
measuring table 32 has a recess 153 in which the vibration member
150C can be arranged. The recess 153 is formed at a part of the
upper surface 34, of the measuring table 32, which is opposable to
the lower surface 11A of the final optical element 11 and the lower
surface 8A of the nozzle member 8. The upper surface 34 of the
measuring table 32 is arranged around the upper surface 151C of the
vibration member 150C arranged in the recess 153. A gap is formed
between the vibration member 150C and the measuring table 32. The
upper surface 151C of the vibration member 150C and the upper
surface 34 of the measuring table 32 are arranged so that a gap G2
is formed therebetween. The gap G2 is, for example, about 0.1 mm.
An ultrasonic wave generator 10C, which is provided to vibrate the
vibration member 150C, is connected to the vibration member 150C at
the inside of the recess 153.
[0102] The upper surface 34 of the measuring table 32 is flat, and
is substantially parallel to the XY plane. In this embodiment, the
upper surface 151C of the vibration member 150C is substantially
flush with the upper surface 34 of the measuring table 32.
[0103] The upper surface 151C of the vibration member 150C and the
upper surface 34 of the measuring table 32 are substantially flush
with surfaces 301A, 302A of the measuring devices 301, 302,
respectively, which are provided on the measuring table 32. Each of
the measuring devices 301, 302 is provided with an optical member
such as a glass plate which is arranged on the measuring table 32,
and a light-receiving element which is capable of receiving a light
(exposure light EL) via the optical member. The surfaces 301A, 302A
include the surfaces of the optical members arranged on the
measuring table 32. The measuring table 32 includes a measuring
member 303. The upper surface 151C of the vibration member 150C and
the upper surface 34 of the measuring table 32 are substantially
flush with a surface 303A of the measuring member 303.
[0104] Also in this embodiment, the upper surface 151C of the
vibration member 150C is liquid-repellent with respect to the first
liquid LQ and the second liquid LC. The contact angle of the
vibration member 150C with respect to each of the first liquid LQ
and the second liquid LC is not less than 90 degrees. Also in this
embodiment, the upper surface 151C of the vibration member 150C is
formed of a film of a liquid-repellent material including, for
example, fluorine-based resin (for example, PTFE, PFA or the like).
It is desirable that the side surface of the vibration member 150C
is also liquid-repellent with respect to the first liquid LQ and
the second liquid LC.
[0105] As described above, the upper surface 34 of the measuring
table 32 is liquid-repellent with respect to the first liquid LQ
and the second liquid LC. The liquid-repellent films, which are
used for the vibration member 150C and the measuring table 32, may
be formed of a same material (substance), or may be formed of
different materials (substances).
[0106] Upon executing the cleaning operation, the controller 7
forms the second liquid immersion space LS2 by making the final
optical element 11 and the nozzle member 8 to be opposite to or
face the vibration member 150C and the measuring table 32. In this
state, the vibration member 150C, which is provided on the
measuring table 32, is vibrated by the ultrasonic wave generator
10C connected to the vibration member 150C. Accordingly, the
ultrasonic wave can be applied to the second liquid LC in the
second liquid immersion space LS2, and thus the final optical
element 11 and the nozzle member 8 can be cleaned satisfactorily.
The supply and the recovery of the second liquid LC are continued
during the cleaning operation. However, the supply and the recovery
of the second liquid LC may be stopped temporarily or
intermittently.
[0107] During the period in which the vibration member 150C is
vibrated by the ultrasonic wave generator 10C, the measuring table
32 may be moved by the second driving system 5 in the XY plane with
respect to the projection optical system PL and the nozzle member
8. With this, the lower surface 8A of the nozzle member 8 and the
lower surface 11A of the final optical element 11 can be cleaned or
washed uniformly and reliably irrelevant to the difference in the
size of the upper surface 151 of the vibration member 150C with
respect to the first liquid immersion space LS1 and the second
liquid immersion space LS2. The vibration of the vibration member
150C may be stopped during the movement of the measuring table 32,
and the vibration member 10 may be vibrated only when the measuring
table 32 is stopped at a predetermined position.
[0108] The vibration member 150C and the measuring table 32 are
arranged while allowing the gap G2 to intervene therebetween.
Therefore, the vibration member 150C can be vibrated smoothly.
Further, the vibration of the vibration member 150C does not exert
any harmful influence on the measuring table 32, because the
vibration member 150C and the measuring table 32 are arranged while
allowing the gap G2 to intervene therebetween. An anti-vibration
mechanism may be provided for the measuring table 32 so that the
vibration of the vibration member 150C is not transmitted to the
measuring devices 301, 302. The gap G2 between the vibration member
150C (upper surface 151C) and the measuring table 32 (upper surface
34) is minute (about 0.1 mm). Further, the upper surface 151C of
the vibration member 150C and the upper surface 34 of the measuring
table 32 are liquid-repellent with respect to the first liquid LQ
and the second liquid LC. Therefore, it is possible to prevent or
suppress the first liquid LQ and the second liquid LC from
remaining on the upper surfaces 151C, 34, and it is possible to
suppress the inflow of the liquid into the measuring table 32 from
the gap G2 between the vibration member 150C (upper surface 151C)
and the measuring table 32 (upper surface 34).
[0109] The second liquid LC, which is to be supplied in order to
form the second liquid immersion space LS2, can be supplied from
the supply port 81 arranged on the nozzle member 8 in the same
manner as in the first embodiment. A supply port for supplying the
second liquid LC may be provided on the measuring table 32 (for
example, around the recess 153), and the second liquid immersion
space LS2 may be formed with the second liquid LC supplied from the
supply port as well. A recovery port 154C for recovering the second
liquid LC may be provided on the measuring table 32 (for example,
around the recess 153). One or more of the recovery ports may be
formed continuously or in a dispersed form at the outside of the
supply port 81B with respect to the second recess 150R. When at
least one of the recovery port and the supply port for the second
liquid LC is provided on the measuring table 32, then at least one
of the supply port 81 and the recovery port 82 provided on the
nozzle member 8 may be used to supply and/or recover the second
liquid LC during the cleaning performed with the second liquid LC.
Alternatively, it is also allowable that at least one of the supply
port 81 and the recovery port 82 is not used. By supplying and
recovering the first liquid LQ by using the supply port 81 and the
recovery port 82 respectively upon the completion of the cleaning
with the second liquid LC, the second liquid LC adhering to the
measuring table 32, the final optical element 11, and the nozzle
member 8 may be washed out (rinsed).
[0110] A resilient (flexible) seal member such as an O-ring, etc.,
which suppresses the inflow of the liquid into the measuring table
32, can be arranged between the vibration member 150C and the
measuring table 32. Alternatively, a soft seal film, which is
liquid-repellent and which is larger than the opening of the recess
153, may be prepared. The opening of the recess 153 may be covered
with the seal film, and the back surface of the seal film may be
adhered to the upper surface 151 of the vibration member 150. In
this case, a part of the seal film positioned on the upper surface
151 of the vibration member 150 may be removed to expose a part of
the upper surface 151C of the vibration member 150C.
[0111] A recovery port 154C may be provided to surround the
vibration member 150C, for example at the inside of the recess 153,
to recover the liquid between the vibration member 150C and the
measuring table 32.
[0112] This embodiment is illustrative of an example in which only
one vibration member 150C is provided on the measuring table 32.
However, the vibration member 150C may be provided as a plurality
of vibration members 150C arranged on the measuring table 32 at a
plurality of positions of the measuring table 32 respectively.
Fourth Embodiment
[0113] When the heat generation amount of the ultrasonic wave
generator 10 (10C) is great in the first to third embodiments
described above, the following is also allowable. That is, a
temperature adjusting device, which adjusts the temperature of the
ultrasonic wave generator 10 (10C), is provided; and/or a
heat-insulating member or a heat-absorbing member, which suppresses
the emanation or diffusion of the heat of the ultrasonic wave
generator 10 (10C), is arranged around the ultrasonic wave
generator 10 (10C) so that the heat of the ultrasonic wave
generator 10 (10C) is not transmitted to any member (substrate
table 22, measuring table 32) disposed around the ultrasonic wave
generator 10 (10C). In particular, when the ultrasonic wave
generator 10C is provided on the measuring table 32 as in the third
embodiment, it is desirable that the temperature adjusting device
and/or the heat-insulating member (heat-absorbing member) described
above is arranged so that the heat is not transmitted or
transferred to the measuring devices 301, 302.
[0114] An explanation will be made below as the fourth embodiment
about an example of the suppressing device for suppressing the
emanation or diffusion of the heat generated by the ultrasonic wave
generator 10 (10C). The following description is illustrative of an
exemplary case in which the suppressing device suppresses the
diffusion of the heat generated by the ultrasonic wave generator 10
provided on the substrate table 22. The ultrasonic wave generator
10 includes the piezoelectric element, and is connected to the
vibration member 150 in the same manner as in the first to third
embodiments described above. The controller 7 vibrates
(ultrasonically vibrates) the vibration member 150 by using the
ultrasonic wave generator 10 to apply the vibration (ultrasonic
wave) to the cleaning liquid LC on the vibration member 150.
Accordingly, it is possible to clean at least one of the final
optical element 11 and the nozzle member 8.
[0115] FIG. 8 is a sectional view schematically illustrating an
example of a suppressing device 300A. With reference to FIG. 8, the
suppressing device 300A has a first member 301A which is arranged
in the recess 150R and which is arranged around the ultrasonic wave
generator 10. The first member 301A is a cylindrical member. The
first member 301A is arranged between the ultrasonic wave generator
10 and the substrate table 22. The first member 301A is formed of,
for example, a metal such as aluminum or a synthetic resin having
the heat-insulating property (heat-absorbing property).
[0116] By providing the first member 301A, it is possible to
suppress the diffusion of the heat generated by the ultrasonic wave
generator 10; and it is possible to suppress the transfer of the
heat generated by the ultrasonic wave generator 10 to the member
(substrate table 22) disposed around the ultrasonic wave generator
10.
[0117] FIG. 9 is a sectional view schematically illustrating
another example of a suppressing device 300B. With reference to
FIG. 9, the suppressing device 300B has a first member 301E which
is arranged in the recess 150R and which is arranged around the
ultrasonic wave generator 10, and a second member 302B which is
arranged in the recess 150R and around the vibration member 150. In
FIG. 9, each of the first member 301B and the second member 302B is
a cylindrical member. The first member 301B is arranged between the
ultrasonic wave generator 10 and the substrate table 22, and the
second member 302B is arranged between the vibration member 150 and
the substrate table 22. In FIG. 9, the first member 301B and the
second member 302B are fitted into the recess 150R. However, the
wall surface of the recess 150R may be integrally formed by the
first member 301B and the second member 302B. In FIG. 9, the
circumferences of the first member 301B and the second member 302B
are surrounded by the member constructing the substrate table 22.
However, the circumference of at least one of the first member 301B
and the second member 302B may be a gas space. That is, any space
(for example, a cylindrical space) may be provided between the
outer circumference of the first member 301B and/or the outer
circumference of the second member 302B and the circumferential
wall surface defining the recess 150R. More excellent
heat-insulating effect can be expected via the space as described
above.
[0118] The vibration member 150 and the second member 302B are
arranged with a predetermined gap being intervened therebetween.
Accordingly, the vibration member 150 can be vibrated smoothly. The
gap, which is formed between the vibration member 150 and the
second member 302B, is adjusted to have a predetermined value
(about 0.1 mm), and thus any inflow of the liquid into the gap
between the vibration member 150 and the second member 302B is
suppressed.
[0119] Each of the first member 301B and the second member 302B is
formed of, for example, a metal such as aluminum or a member
(synthetic resin) having the heat-insulating property
(heat-absorbing property). In the example shown in FIG. 9, the
first member 301B and the second member 302B are connected to each
other, and are integrated into one body. The first member 301B and
the second member 302B may be separated from each other. The first
member 301B and the second member 302B may be formed of different
materials.
[0120] By providing the first member 301B, it is possible to
suppress the diffusion of the heat generated by the ultrasonic wave
generator 10; and it is possible to suppress the transfer of the
heat generated by the ultrasonic wave generator 10 to the substrate
table 22. Further, by providing the second member 302B, it is
possible to suppress the transfer of the heat of the ultrasonic
wave generator 10 to the substrate table 22 via the vibration
member 150. In this viewpoint, it is desirable that the vibration
member 150(C) is formed of a heat-insulating or adiabatic material
such as silica glass as described above. Further, the outer
circumferential surface and/or the bottom surface of the vibration
member 150(C) may be coated with a heat-insulating material.
[0121] In the embodiments explained with reference to FIGS. 8 and
9, it is also allowable that the first member 301A (301B) is not
cylindrical. By arranging any suppressing member capable of
suppressing the heat diffusion at least at a part of the
surroundings of the ultrasonic wave generator 10, it is possible to
suppress the transfer of the heat generated by the ultrasonic wave
generator 10 to the substrate table 22. Similarly, it is also
allowable that the second member 302A (302B) is not cylindrical;
and it is also appropriate that any suppressing member, capable of
suppressing the heat diffusion, is arranged at least at a part of
the surroundings of the vibration member 150.
[0122] FIG. 10 is a sectional view schematically illustrating
another example of a suppressing device 300C. With reference to
FIG. 10, the suppressing device 300C has a first member 301C which
is arranged around the ultrasonic wave generator 10, and a fluid
supply device 303 which supplies a fluid for temperature adjustment
(temperature-adjusting fluid). The first member 301C is a
cylindrical member. The first member 301C is formed of a material
having a high coefficient of thermal conductivity including, for
example, a metal such as aluminum.
[0123] In this embodiment, the fluid supply device 303 supplies, to
the first member 301C, the fluid which is adjusted to have a
predetermined temperature. The suppressing device 300C adjusts the
temperature of the first member 301C by using the fluid supplied
from the fluid supply device 303. The suppressing device 300C can
suppress the transfer of the heat generated by the ultrasonic wave
generator 10 to the substrate table 22 by adjusting the temperature
of the first member 301C.
[0124] The suppressing device 300C can adjust the temperature of
the ultrasonic wave generator 10 by adjusting the temperature of
the first member 301C arranged around the ultrasonic wave generator
10. That is, the suppressing device 300C functions as a temperature
adjusting device for adjusting the temperature of the ultrasonic
wave generator 10.
[0125] In this embodiment, the fluid supply device 303 supplies the
liquid for the temperature adjustment. Those usable as the liquid
to be supplied from the fluid supply device 303 include, for
example, water (pure or purified water) and fluorine-based inactive
liquid (for example, "Fluorinert" produced by Sumitomo 3M
Limited).
[0126] In this embodiment, the first member 301C has an internal
flow passage 304C. The internal flow passage 304C is arranged
substantially annularly along the cylindrical first member 301C.
The internal flow passage 304C may be formed to have a helical
form. The fluid supply device 303 supplies the
temperature-adjusting liquid to one end of the internal flow
passage 304C of the first member 301C. The temperature-adjusting
liquid, which is supplied from the fluid supply device 303, flows
through the internal flow passage 304C of the first member 301C,
and thus the temperature of the first member 301C is adjusted.
[0127] In this embodiment, after the liquid flows through the
internal flow passage 304C of the first member 301C, the liquid is
returned to the fluid supply device 303 via the other end of the
internal flow passage 304C. The liquid is reused after the liquid
flows through the internal flow passage 304C. The fluid supply
device 303 adjusts the temperature of the liquid which flowed
through the internal flow passage 304C of the first member 301C and
returned to the fluid supply device 303, and then the fluid supply
device 303 supplies the liquid again to the internal flow passage
304C of the first member 301C. The liquid may be recovered by a
predetermined fluid recovery device without reusing the liquid
after the liquid flowed through the internal flow passage 304C of
the first member 301C. The liquid LQ of the first liquid supply
device 86 may be utilized as a liquid source for the fluid supply
device 303.
[0128] Owing to the suppressing device 300C, it is possible to
suppress the diffusion of the heat generated by the ultrasonic wave
generator 10, and it is possible to sufficiently suppress the
transfer of the heat generated by the ultrasonic wave generator 10
to the substrate table 22.
[0129] FIG. 11 is a sectional view schematically illustrating
another example of a suppressing device 300D. With reference to
FIG. 11, the suppressing device 300D has a first member 301D which
is arranged around the ultrasonic wave generator 10; a second
member 302D which is connected to the first member 301D and which
is arranged around the vibration member 150; and a fluid supply
device 303 which supplies a fluid for temperature adjustment
(temperature-adjusting fluid). The first member 301D is a
cylindrical member. The first member 301D has an internal flow
passage 304D through which the temperature-adjusting liquid
supplied from the fluid supply device 303 flows. The first member
301D is formed of a material having a high coefficient of thermal
conductivity including, for example, a metal such as aluminum.
[0130] The second member 302D is a cylindrical member which is
formed of a material having a high coefficient of thermal
conductivity including, for example, a metal such as aluminum. The
vibration member 150 and the second member 302D are arranged with a
predetermined gap intervening therebetween; and the vibration
member 150 can be vibrated smoothly. The gap, formed between the
vibration member 150 and the second member 302D, is adjusted to
have a predetermined value (about 0.1 mm); and any inflow of the
liquid into the gap between the vibration member 150 and the second
member 302D is suppressed.
[0131] The temperature of the second member 302C connected to the
first member 301D can be also adjusted by adjusting the temperature
of the first member 301D by using the temperature-adjusting liquid
supplied from the fluid supply device 303. Even with the
suppressing device 300D shown in FIG. 11, it is possible to
suppress the diffusion of the heat generated by the ultrasonic wave
generator 10, and it is possible to sufficiently suppress the
transfer of the heat generated by the ultrasonic wave generator 10
to the substrate table 22.
[0132] FIG. 12 is a sectional view schematically illustrating
another example of a suppressing device 300E. With reference to
FIG. 12, the suppressing device 300E has a first member 301E which
is arranged around the ultrasonic wave generator 10; a second
member 302E which is connected to the first member 301E and which
is arranged around the vibration member 150; and a fluid supply
device 303 which supplies a fluid for temperature adjustment
(temperature-adjusting fluid).
[0133] The first member 301E is a cylindrical member. The first
member 301E has an internal flow passage 304E through which the
temperature-adjusting liquid supplied from the fluid supply device
303 flows. The first member 301E is formed of a material having a
high coefficient of thermal conductivity including, for example, a
metal such as aluminum.
[0134] The second member 302E is a cylindrical member. The second
member 302E has an internal flow passage 305E through which the
temperature-adjusting liquid supplied from the fluid supply device
303 flows. The second member 302E is formed of a material having a
high coefficient of thermal conductivity including, for example, a
metal such as aluminum.
[0135] The vibration member 150 and the second member 302E are
arranged with a predetermined gap being intervened therebetween.
The vibration member 150 can be vibrated smoothly. The gap, which
is formed between the vibration member 150 and the second member
302E, is adjusted to have a predetermined value (about 0.1 mm), and
any inflow of the liquid into the gap between the vibration member
150 and the second member 302E is suppressed.
[0136] The internal flow passage 304E of the first member 301E and
the internal flow passage 305E of the second member 302E are
connected to one another. In this embodiment, the fluid supply
device 303 supplies the temperature-adjusting liquid to the
internal flow passage 304E of the first member 301E. The liquid,
which is supplied from the fluid supply device 303, flows through a
part of the internal flow passage 304E of the first member 301, and
the liquid flows through the internal flow passage 305E of the
second member 302E. After that, the liquid flows through a part of
the internal flow passage 304E of the first member 301E, and the
liquid is returned to the fluid supply device 303. According to the
suppressing device 300E shown in FIG. 12, the liquid, which is
supplied from the fluid supply device 303, can be used to adjust
both of the temperatures of the first member 301E and the second
member 302E. Therefore, it is possible to suppress the diffusion of
the heat generated by the ultrasonic wave generator 10, and it is
possible to sufficiently suppress the transfer of the heat
generated by the ultrasonic wave generator 10 to the substrate
table 22.
[0137] In the embodiments explained with reference to FIGS. 9, 11,
and 12, the first member and the second member are different
members. However, the first member and the second member may be
formed with one member.
[0138] In the embodiments explained with reference to FIGS. 10 to
12, the temperature-adjusting liquid flows through the internal
flow passages 304C, 304D, 304E formed in the first members 301C,
301D, 301E, respectively. However, for example, a tube member may
be wound around the first member, and the liquid may flow through a
flow passage of the tube member. In this case, it is possible to
omit the internal flow passage of the first member. Alternatively,
the temperature-adjusting liquid may flow through both of the
internal flow passage formed in the first member and the flow
passage of the tube member, without omitting the internal flow
passage of the first member. Similarly, a tube member, having a
flow passage through which the temperature-adjusting liquid flows,
can be arranged around the second member.
[0139] The first member may be omitted, and a tube member may be
wound around the ultrasonic wave generator 10; and the
temperature-adjusting liquid may flow through a flow passage of the
tube member.
[0140] Alternatively, as shown in FIG. 13, an internal flow passage
10R may be formed in a part of the piezoelectric element 10A of the
ultrasonic wave generator 10; and the temperature-adjusting fluid,
which is supplied from the fluid supply device 303, may flow
through the internal flow passage 10R. The fluid supply device 303
is capable of allowing the temperature-adjusting liquid to flow
through the internal flow passage 10R of the piezoelectric element
10A, to thereby adjust the temperature of the piezoelectric element
10A (ultrasonic wave generator 10). Accordingly, it is possible to
suppress the ultrasonic wave generator 10 from causing the
diffusion of the heat.
[0141] The embodiments explained with reference to FIGS. 10 to 13
are illustrative of the exemplary case in which the fluid supplied
from the fluid supply device 303 is the liquid. However, the fluid
may be a gas. In the embodiments described above, the vibration
member 150(C) is formed of silica glass. However, the vibration
member 150(C) may be formed of any other heat-insulating material
including, for example, ceramics and glass. Alternatively, the
vibration member 150(C) can be also formed of a heat conductive
material including, for example, a metal such as aluminum. During
the cleaning in which the vibration member 150 is vibrated, the
cleaning liquid LC of the second liquid immersion area LS2 usually
exists on the vibration member. Therefore, it can be expected that
the vibration member 150(C) is cooled by the liquid LC. For this
purpose, it is also allowable that the cleaning liquid LC for
forming the second liquid immersion area LS2 is
temperature-adjusted. For example, the temperature of the cleaning
liquid LC for forming the second liquid immersion area LS2 can be
made higher than the temperature of the liquid immersion liquid LQ
for forming the first liquid immersion area LS1.
[0142] Alternatively, it is also appropriate to suppress the
diffusion of the heat generated by the ultrasonic wave generator 10
by using any other system including, for example, the Peltier
element.
[0143] The embodiments explained with reference to FIGS. 8 to 13
are illustrative of the exemplary case in which the diffusion of
the heat generated by the ultrasonic wave generator 10 provided on
the substrate table 22 is suppressed and/or the temperature of the
ultrasonic wave generator 10 is adjusted. However, it is a matter
of course that the diffusion of the heat generated by the
ultrasonic wave generator 10C provided on the measuring table 32
can be suppressed and/or the temperature of the ultrasonic wave
generator 10C can be adjusted by using any one of the devices or
apparatuses explained with reference to FIGS. 8 to 13. As described
above, various sensors, measuring members, etc. are provided on the
measuring table 32. However, when the diffusion of the heat
generated by the ultrasonic wave generator 10 is suppressed as
explained with reference to FIGS. 9 to 13, it is possible to
suppress the occurrence of any error, in the measurement using the
sensor (measuring member) of the measuring table 32, which would be
otherwise caused by the heat generated by the ultrasonic wave
generator 10.
[0144] In the first to fourth embodiments described above, the
second liquid immersion space may be formed with the first liquid
LQ to clean at least one of the final optical element 11 and the
nozzle member 8. For example, when the first liquid LQ to be used
has the cleaning ability (for example, fluorine-based liquid), or
when the caused contamination can be satisfactorily removed (can be
cleaned) with the first liquid LQ, then the cleaning can be
performed satisfactorily with the first liquid LQ.
[0145] In the first to fourth embodiments described above, the
first liquid LQ and the second liquid LC different from the first
liquid LQ may be used in a chronological order in order to form the
second liquid immersion space LS2 between the nozzle member 8 and
the substrate table 22 (or the measuring table 32). For example,
when the first liquid LQ is water (pure or purified water), and the
second liquid LC is dissolved gas conditioned water (hydrogen
water, nitrogen water or the like) obtained by dissolving a
predetermined gas in water, then it is possible to execute the
cleaning operation using the first liquid LQ, after the cleaning
operation using the second liquid LC. It is possible to shorten the
period of time required for the process for substituting the second
liquid LC with the first liquid LQ after the completion of the
cleaning operation.
[0146] The vibration member 150(C) and the ultrasonic wave
generator 10(C) used in the embodiments described above are merely
exemplary, for which it is possible to use those having various
structures. For example, instead of the use of the vibration member
150(C), a liquid-repellent coating may be applied to the surface of
the piezoelectric element of the ultrasonic wave generator 10(C),
and the piezoelectric element may be provided so that the surface
of the piezoelectric element, which is subjected to the coating, is
flush with the upper surface 24 of the substrate table 22 or the
upper surface 34 of the measuring table 32. In this case, the
liquid-repellent coating film is the "vibration member" or the
"certain member" of the present invention.
[0147] In the respective embodiments described above, the nozzle
member 8 may be vibrated to apply the ultrasonic wave (vibration)
to the liquid in the second liquid immersion space LS2.
[0148] In the respective embodiments described above, in order to
facilitate the cleaning of the final optical element 11 and the
nozzle member 8, the vibration (ultrasonic wave) of not less than
20 kHz is applied to the liquid (LQ or LC). However, it is also
allowable to apply the vibration of less than 20 kHz to the liquid
(LQ or LC). Alternatively, the frequency may be appropriately
modulated as described above so that the frequency f1 of not less
than 20 kHz and the frequency f2 of less than 20 kHz are
periodically switched, or the frequencies f1, f2 are continuously
changed therebetween.
[0149] In the first to fourth embodiments described above, the
cleaning operation for the final optical element 11 and the nozzle
member 8 can be executed, for example, every time when a
predetermined number or pieces of the substrate P are exposed, for
every lot, or at every predetermined time interval. FIG. 14 shows
an example of the sequence of the liquid immersion exposure
including the cleaning operation as described in the first to
fourth embodiments. The measuring table 32 is positioned at the
position opposite to the nozzle member 8 in accordance with the
control of the controller 7, the first liquid immersion space LS1
is formed between the nozzle member 8 and the measuring table 32,
and the measurement is executed with the various measuring devices
of the measuring table 32 via the first liquid LQ (S1).
Subsequently, the substrate table 22 is moved to a position under
or below the nozzle member 8 while separating the measuring table
32 away from the position under or below the nozzle member 8.
Accordingly, the liquid LQ is delivered from the measuring table 32
to the substrate table 22, and the first liquid immersion space LS1
is formed between the substrate P on the substrate table 22 and the
nozzle member 8 and the projection optical system PL (S2). The
controller 7 adjusts the exposure condition of the substrate P
based on the measurement result obtained on the measuring table 32
and performs the liquid immersion exposure for the substrate P
(S3). When the liquid immersion exposure is completed, then the
substrate table 22 is moved to the predetermined substrate exchange
position, and the substrate is exchanged at that position (S4). The
cleaning operation is executed as described above after the
exchange of the substrate or concurrently with the exchange of the
substrate (S5). For example, when the cleaning operation is
performed on the substrate table 22 as in the first embodiment, the
cleaning operation can be performed after the substrate exchange
step S4 after the exposure is completed for a predetermined number
or pieces of the substrate. When the cleaning operation is
performed on the measuring table 32 as in the third embodiment, the
cleaning operation can be performed concurrently with the substrate
exchange step S4 on the substrate stage 22, or before or after the
substrate exchange step S4 after the exposure is completed for a
predetermined number or pieces of the substrate.
[0150] In the embodiments described above, a detector, which is
capable of detecting the contamination state of at least one of the
final optical element 11 and the nozzle member 8, may be provided;
and the cleaning operation may be executed when it is judged that
at least one of the final optical element 11 and the nozzle member
8 is contaminated, based on a detection result obtained by the
detector. For example, a light amount detector may be arranged at
the measuring table 32; and the light amount of the exposure light
EL radiated from the lower surface 11A of the final optical element
11 may be detected by the light amount detector arranged at the
measuring table 32. It is possible to judge whether or not the
cleaning operation is to be executed, based on the detection
result. There is a high possibility that the light amount of the
exposure light EL radiated onto the light amount detector might
change between a state that the lower surface 11A of the final
optical element 11 is contaminated or dirtied and a state that the
lower surface 11A of the final optical element 11 is not
contaminated or dirtied. Therefore, it is possible to determine the
contamination state of the lower surface 11A of the final optical
element 11 based on the detection result of the light amount
detector.
[0151] On the other hand, it is allowable to expose the substrate P
with the exposure light EL via the mask M and the projection
optical system PL and to perform the developing process, and then
to measure the shape of the pattern formed on the substrate P by a
predetermined measuring device; and to judge whether or not the
cleaning operation is to be executed, based on the obtained
measurement result. For example, if it is judged that the defect of
the pattern is not within an allowable range based on the
measurement result of the shape of the pattern, then it is judged
that the contamination state of the lower surface 11A of the final
optical element 11 is not within an allowable range as well, and to
execute the cleaning operation.
[0152] Alternatively, the following is also allowable to provide an
image pickup device (camera), capable of obtaining the image
(optical image) information of the lower surface 11A of the final
optical element 11, the lower surface 8A of the nozzle member 8,
etc.; to judge whether or not the lower surface 11A of the final
optical element 11, the lower surface 8A of the nozzle member 8,
etc. is (are) contaminated based on the obtained image pickup
result of the image pickup device; and to judge whether or not the
cleaning operation is to be executed based on the result of the
judgment.
[0153] In the embodiments described above, it is also allowable to
provide a detector which detects the ultrasonic wave generated by
the ultrasonic wave generator 10(C) via the vibration member
150(C). For example, an ultrasonic wave-receiving element
constructed of PZT may be provided by embedding the ultrasonic
wave-receiving element in the nozzle member 8 and/or the measuring
table 32. With this, it is possible to confirm the ultrasonic wave
is effectively transmitted to the second liquid immersion space
LS2, and to observe the influence exerted on the transmission of
the ultrasonic wave by the frequency of the ultrasonic wave and the
supply and recovery of the second liquid LC (the flow rate, the
medium, the temperature and the like). The piezoelectric element
driving circuit of the ultrasonic wave generator 10(C) can be set
most appropriately based on the obtained result of the
observation.
[0154] In the respective embodiments described above, the upper
surface 151 (151C) of the vibration member 150 (150C), the upper
surface 24 of the substrate table 22, the upper surface 34 of the
measuring table 32, etc. are liquid-repellent with respect to both
of the first liquid LQ and the second liquid LC. However, these
components may be liquid-repellent with respect only to one of the
first liquid LQ and the second liquid LC, for example, with respect
only to the first liquid LQ for the exposure.
[0155] It goes without saying that the cleaning operations and the
cleaning mechanisms, explained in the respective embodiments (and
in the various modifications thereof), can be appropriately
combined and used. In the embodiments described above, the portions
making contact with the liquid LQ, including the lower surface 11A
of the final optical element 11, the lower surface 8A of the nozzle
member 8 and the like, are cleaned by using the ultrasonic wave
generated from the ultrasonic wave generator 10 when the cleaning
liquid LC exists on the vibration member 150(C). However, these
portions can be also cleaned by allowing the cleaning liquid LC to
exist not only on the vibration member 150(C) but also on any
portion (position) different from the vibration member 150(C) on
the substrate table 22 and/or the measuring table 32. In this case,
the substrate table 22 or the measuring table 32 may be moved with
respect to the nozzle member 8 when the cleaning liquid LC exists
between the lower surface 8A of the nozzle member 8 and the
substrate table 22 or the measuring table 32.
[0156] The liquid LQ for the exposure is water in the respective
embodiments described above. However, the liquid LQ may be any
liquid other than water. For example, when the light source of the
exposure light EL is the F.sub.2 laser, the F.sub.2 laser beam is
not transmitted through water. Therefore, those preferably usable
as the liquid LQ may include, for example, fluorine-based fluids
such as fluorine-based oil and perfluoropolyether (PFPE) through
which the F.sub.2 laser beam is transmissive. Alternatively, other
than the above, it is also possible to use, as the liquid LQ, those
(for example, cedar oil) which have the transmittance with respect
to the exposure light EL, which have the refractive index as high
as possible, and which are stable against the photoresist coated on
the surface of the substrate P and the projection optical system
PL. As for the liquid LQ, it is also allowable to use those having
the refractive index of about 1.6 to 1.8. The liquid LQ, which has
the refractive index (for example, not less than 1.5) higher than
that of pure water, includes, for example, predetermined liquids
having the C--H bond or the O--H bond such as isopropanol having a
refractive index of about 1.50 and glycerol (glycerin) having a
refractive index of about 1.61; predetermined liquids (organic
solvents) such as hexane, heptane, and decane, and decalin
(decahydronaphthalene) having a refractive index of about 1.60. As
for the liquid LQ, it is also allowable to use those obtained by
mixing arbitrary two or more liquids of the foregoing liquids and
those obtained by adding (mixing) at least one of the foregoing
liquid or liquids to (with) pure water. Further, as for the liquid
LQ, it is also allowable to use those obtained by adding (mixing)
base or acid such as H.sup.+, Cs.sup.+, K.sup.+, Cl.sup.-,
SO.sub.4.sup.2-, and PO.sub.4.sup.2- to (with) pure water, and it
is also allowable to use those obtained by adding (mixing) fine
particles of Al oxide or the like to (with) pure water. As for the
liquid LQ, it is preferable to use those which have the small
coefficient of light absorption, which have the small temperature
dependency, and which are stable against the photosensitive
material coated on the surface of the substrate P (or the top coat
film, the antireflection film, etc.) and/or the projection system
PL. Further, those usable for the optical element (for example, the
final optical element 11) of the projection optical system PL
include those formed of single crystal materials of fluorine
compounds such as barium fluoride, strontium fluoride, lithium
fluoride, sodium fluoride, etc., other than silica, glass and
calcium fluoride. Alternatively, the optical element (the final
optical element 11, etc.) of the projection optical system PL,
which makes contact with the liquid LQ, may be formed of any
material having a refractive index (for example, not less than 1.6)
higher than those of silica glass and calcium fluoride. Those
usable as the material having the refractive index of not less than
1.6 include sapphire, germanium dioxide and the like as disclosed,
for example, in International Publication No. 2005/059617, and
potassium chloride (refractive index: about 1.75) as disclosed in
International Publication No. 2005/059618. As for the liquid LQ, it
is also possible to use various fluids including, for example,
supercritical fluids.
[0157] In the respective embodiments described above, the optical
path on the light-exit side (image plane side) of the final optical
element of the projection optical system is filled with the liquid.
However, it is also possible to adopt a projection optical system
wherein the optical path space on the light-incident side (object
plane side) of the final optical element is also filled with the
liquid, as disclosed in International Publication No. 2004/019128
(corresponding to United States Patent Application Publication No.
2005/0248856).
[0158] The respective embodiments described above adopt the
exposure apparatus in which the space between the projection
optical system PL and the substrate P is locally filled with the
liquid. However, it is also possible to adopt a liquid immersion
exposure apparatus which performs the exposure in a state that the
entire surface of the substrate as the exposure objective is
immersed in the liquid as disclosed, for example, in U.S. Pat. No.
5,825,043.
[0159] The substrate P, which is usable in the respective
embodiments described above, is not limited only to the
semiconductor wafer for producing the semiconductor device. Those
applicable include a glass substrate for a display device, a
ceramic wafer for a thin film magnetic head, a master plate
(synthetic silica glass, silicon wafer) for a mask or reticle used
for the exposure apparatus, and the like.
[0160] As for the exposure apparatus EX, in addition to the
scanning type exposure apparatus (scanning stepper) of the
step-and-scan system for performing the scanning exposure with the
pattern of the mask M by synchronously moving the mask M and the
substrate P, it is possible to adopt a projection exposure
apparatus (stepper) of the step-and-repeat system for performing
the full field exposure with the pattern of the mask M in a state
that the mask M and the substrate P are allowed to stand still, and
then by successively step-moving the substrate P.
[0161] It is also allowable to adopt, as the exposure apparatus EX,
a full field exposure apparatus of the stitch system wherein a
reduction image of a first pattern is transferred onto the
substrate P by using a projection optical system in a state that
the first pattern and the substrate P are allowed to substantially
stand still during the exposure in the step-and-repeat manner, and
then the full field exposure is performed on the substrate P by
partially overlaying a reduction image of a second pattern with
respect to the first pattern by using the projection optical system
in a state that the second pattern and the substrate P are allowed
to substantially stand still. As for the exposure apparatus of the
stitch system, it is also possible to adopt an exposure apparatus
of the step-and-stitch system wherein at least two patterns are
partially overlaid and transferred onto the substrate P, and the
substrate P is successively moved.
[0162] It is also possible to adopt, as the exposure apparatus EX,
for example, an exposure apparatus in which patterns of two masks
are combined on the substrate via the projection optical system,
and one shot area on the substrate is subjected to the double
exposure substantially simultaneously by one time of the scanning
exposure as disclosed, for example, in U.S. Pat. No. 6,611,316. It
is also possible to adopt, as the exposure apparatus EX, an
exposure apparatus of the proximity system, a mirror projection
aligner, etc.
[0163] It is also possible to adopt, as the exposure apparatus EX,
a twin-stage type exposure apparatus provided with a plurality of
substrate stages as disclosed in U.S. Pat. Nos. 6,341,007,
6,400,441, 6,549,269, 6,590,634, 6,208,407, 6,262,796 and the like.
It is also possible to adopt the exposure apparatus provided with a
plurality of substrate stages and measuring stages. In the case of
the exposure apparatus provided with a plurality of stages, it is
also allowable that the vibration member and the vibration
generator are provided on any one of the stages. In the embodiments
described above, the vibration member 150(C) and the ultrasonic
wave generator 10(C) are provided on the substrate table and/or the
measuring table. However, it is also allowable to provide another
movable table different from the tables, for example, a table which
is used exclusively for the cleaning and is provided with the
vibration member and the ultrasonic wave generator.
[0164] As for the type of the exposure apparatus EX, the present
invention is not limited to the exposure apparatus for the
semiconductor device production for exposing the substrate P with
the semiconductor device pattern. The present invention is also
widely applicable to an exposure apparatus for producing a liquid
crystal display device or for producing a display as well as an
exposure apparatus for producing, for example, a thin film magnetic
head, an image pickup device (CCD), a micromachine, MEMS, a DNA
chip, the reticle, or the mask, etc.
[0165] In the respective embodiments described above, the
interferometer system, which includes the laser interferometer, is
used to measure the position information about each of the mask
stage, the substrate stage and the measuring stage. However, the
measurement of the position information is not limited to this. For
example, it is also allowable to use an encoder system for
detecting a scale (diffraction grating) provided on each of the
stages. In this case, it is preferable that a hybrid system
including both of the interferometer system and the encoder system
is provided, and the measurement result of the encoder system is
calibrated (subjected to the calibration) by using the measurement
result of the interferometer system. The position control of the
stage may be performed by switchingly using the interferometer
system and the encoder system or using both of the interferometer
system and the encoder system.
[0166] In the respective embodiments described above, the ArF
excimer laser may used as the light source device for generating
the ArF excimer laser light beam as the exposure light EL. However,
it is also allowable to use a high harmonic wave-generating device
which includes a solid laser light source such as a DFB
semiconductor laser or a fiber laser, etc.; a light-amplifying
section having a fiber amplifier or the like; and a
wavelength-converting section and which outputs a pulse light beam
having a wavelength of 193 nm as disclosed, for example, in U.S.
Pat. No. 7,023,610. Further, in the embodiments described above,
each of the illumination areas and the projection areas described
above is rectangular. However, it is also allowable to adopt any
other shape including, for example, circular arc-shaped forms.
[0167] In the embodiments described above, the light-transmissive
type mask is used, in which the predetermined light-shielding
pattern (or phase pattern or dimming or light-reducing pattern) is
formed on the light-transmissive substrate. However, instead of
such a mask, as disclosed, for example, in U.S. Pat. No. 6,778,257,
it is also allowable to use a variable shaped mask (also referred
to as "electronic mask", "active mask", or "image generator") on
which a transmissive pattern, a reflective pattern, or a
light-emitting pattern is formed based on the electronic data of a
pattern to be subjected to the exposure. The variable shaped mask
includes, for example, DMD (Digital Micro-mirror Device) as a kind
of the non-light emission type image display device (spatial light
modulator). The variable shaped mask is not limited to DMD. Instead
of DMD, it is also allowable to use a non-light emission type image
display device as explained below. The non-light emission type
image display device is a device or element which spatially
modulates the state of the polarization, the phase, or the
amplitude (intensity) of the light traveling in a predetermined
direction. The transmission type spatial light modulator includes,
for example, an electrochromic display (ECD) other than the
transmission type liquid crystal display device (LCD: Liquid
Crystal Display). In addition to DMD described above, the
reflection type spatial light modulator can be exemplified by a
reflecting mirror array, a reflection type liquid crystal display
device, an electrophoresis display (EPD: Electro Phonetic Display),
an electronic paper (or the electronic ink), an optical diffraction
type light valve (Grating Light Valve), etc.
[0168] It is also allowable to provide a pattern-forming device
including a self-light emission type image display device, instead
of the variable shaped mask provided with the non-light emission
type image display device. In this case, it is unnecessary to
provide the illumination optical system. The self-light emission
type image display device includes, for example, CRT (Cathode Ray
Tube), an inorganic EL display, an organic EL display (OLED:
Organic Light Emitting Diode), an LED display, an LD display, an
electric field emission display (FED: Field Emission Display), a
plasma display (PDP: Plasma Display Panel) and the like. For
example, a solid light source chip having a plurality of light
emission points, a solid light source chip array including a
plurality of chips arranged in an array form, a device of a type
including a plurality of light emission points prepared on one
substrate, etc. may be used as the self-light emission type image
display device provided for the pattern-forming device. Such a
solid light source chip may be electrically controlled to form a
pattern. The solid light source device or element may be inorganic
or organic.
[0169] The respective embodiments described above are illustrative
of the exemplary case of the exposure apparatus provided with the
projection optical system PL. However, the present invention may be
adopted for an exposure apparatus and an exposure method which use
no projection optical system PL. Even when the projection optical
system PL is not used, the exposure light is radiated onto the
substrate via an optical member such as a lens, and the liquid
immersion space is formed in a predetermined space between such an
optical member and the substrate.
[0170] It is possible to adopt, as the exposure apparatus EX, an
exposure apparatus (lithography system) in which the substrate P is
exposed with a line-and-space pattern by forming interference
fringes on the substrate P as disclosed, for example, in
International Publication No. 2001/035168. The present invention is
also applicable to a liquid immersion type exposure apparatus
wherein the liquid immersion area between the projection optical
system and the substrate is retained by an air curtain formed
therearound.
[0171] The exposure apparatus EX according to the embodiment of the
present invention is produced by assembling the various subsystems
including the respective constitutive elements as defined in claims
so that the predetermined mechanical accuracy, electric accuracy,
and optical accuracy are maintained. In order to secure the various
accuracies, those performed before and after the assembling include
the adjustment for achieving the optical accuracy for the various
optical systems, the adjustment for achieving the mechanical
accuracy for the various mechanical systems, and the adjustment for
achieving the electric accuracy for the various electric systems.
The steps of assembling the various subsystems into the exposure
apparatus include, for example, the mechanical connection, the
wiring connection of the electric circuits, and the piping
connection of the air pressure circuits in correlation with the
various subsystems. It goes without saying that the steps of
assembling the respective individual subsystems are performed
before performing the steps of assembling the various subsystems
into the exposure apparatus. When the steps of assembling the
various subsystems into the exposure apparatus are completed, the
overall adjustment is performed to secure the various accuracies as
the entire exposure apparatus. It is desirable that the exposure
apparatus is produced in a clean room in which the temperature, the
cleanness, etc. are managed.
[0172] As shown in FIG. 15, a microdevice such as a semiconductor
device is produced by performing, for example, a step 201 of
designing the function and the performance of the microdevice; a
step 202 of manufacturing a mask (reticle) based on the designing
step; a step 203 of producing a substrate as a base material for
the device; a substrate-processing step 204 including the process
of exposing the substrate with the exposure light from the mask in
accordance with the embodiment described above and developing the
exposed substrate; a step 205 of assembling the device (including
processing processes such as a dicing step, a bonding step, a
packaging step, etc.); an inspection step 206; and the like. The
cleaning method performed in the exposure apparatus EX as explained
in the foregoing respective embodiments is included in the
substrate-processing step 204. The substrate P is exposed by using
the exposure apparatus EX cleaned by the cleaning method.
[0173] The embodiments of the present invention have been explained
above. However, in the present invention, it is possible to
appropriately combine and use all of the constitutive components
described above. In some cases, a part or parts of the constitutive
components are not used. For example, in the fourth embodiment and
the modifications thereof, it is also allowable that the surface of
the vibration member is not liquid-repellent with respect to the
liquid immersion liquid LQ and/or the cleaning liquid LC. In the
respective embodiments described above, it is not necessarily
indispensable that the first and second liquid supply devices 86,
96 and the liquid recovery device 89 are not provided for the
exposure apparatus; for example, it is also allowable to
substitutively use the equipment of the factory or the like in
which the exposure apparatus is installed. The structure, which is
required for the liquid immersion exposure, is not limited to the
structure as described above. It is possible to use those
disclosed, for example, in European Patent Publication No. 1420298,
International Publication Nos. 2004/055803, 2004/057590,
2005/029559 (corresponding to United States Patent Publication No.
2006/0231206), and International Publication No. 2004/086468
(corresponding to United States Patent Publication No.
2005/0280791), and Japanese Patent Application Laid-open No.
2004-289126 (corresponding to U.S. Pat. No. 6,952,253). In relation
to the liquid immersion mechanism of the liquid immersion exposure
apparatus and the apparatuses equipped thereto, the contents of
U.S. Pat. No. 6,952,253 and United States Patent Publication Nos.
2006/0231206 and 2005/0280791, etc. as described above are
incorporated herein by reference within a range of permission of
the domestic laws and ordinances of the designated state or the
selected state.
[0174] The contents of all of the published patent documents and
United States patents in relation to the exposure apparatus, etc.,
which are cited in the respective embodiments and the modifications
described above, are incorporated herein by reference.
[0175] According to the exposure method and the device production
method of the present invention, a portion or portions of the
exposure apparatus making contact with the liquid is (are)
effectively cleaned by using the cleaning liquid, and hence the
yield of the produced device is improved. Therefore, the present
invention will remarkably contribute to the international
development of the precision mechanical equipment industry
including the semiconductor industry.
* * * * *