U.S. patent application number 13/083421 was filed with the patent office on 2011-07-28 for carrier for manufacturing substrate and method of manufacturing substrate using the same.
This patent application is currently assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD.. Invention is credited to Tae Kyun BAE, Seong Min CHO, Hyun Jung HONG, Kyung Ah LEE, Chang Gun OH, Keung Jin SOHN.
Application Number | 20110180205 13/083421 |
Document ID | / |
Family ID | 43992993 |
Filed Date | 2011-07-28 |
United States Patent
Application |
20110180205 |
Kind Code |
A1 |
CHO; Seong Min ; et
al. |
July 28, 2011 |
CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING
SUBSTRATE USING THE SAME
Abstract
Disclosed herein is a carrier for manufacturing a substrate,
including: an insulation layer including a first metal layer formed
on one side or both sides thereof; a second metal layer formed on
one side of the first metal layer; and a third metal layer formed
on one side of the second metal layer, wherein the second metal
layer has a lower melting point than the first metal layer or the
third metal layer. The carrier is advantageous in that a build up
layer can be separated from a carrier by heating, so that a routing
process is not required, with the result that the size of a
substrate does not change when the build up layer is separated from
the carrier, thereby reusing to the carrier and maintaining the
compatibility between the substrate and manufacturing
facilities.
Inventors: |
CHO; Seong Min; (Gyunggi-do,
KR) ; SOHN; Keung Jin; (Gyunggi-do, KR) ; BAE;
Tae Kyun; (Gyunggi-do, KR) ; HONG; Hyun Jung;
(Gyunggi-do, KR) ; LEE; Kyung Ah; (Seoul, KR)
; OH; Chang Gun; (Gyunggi-do, KR) |
Assignee: |
SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
Gyunggi-do
KR
|
Family ID: |
43992993 |
Appl. No.: |
13/083421 |
Filed: |
April 8, 2011 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12720567 |
Mar 9, 2010 |
|
|
|
13083421 |
|
|
|
|
Current U.S.
Class: |
156/247 ;
427/383.1 |
Current CPC
Class: |
Y10T 428/12785 20150115;
Y10T 428/12708 20150115; H05K 2203/047 20130101; H05K 3/0097
20130101; Y10T 29/49117 20150115; Y10T 29/49155 20150115; Y10T
428/12736 20150115; Y10T 428/12792 20150115; H05K 2201/0355
20130101; B32B 15/20 20130101; Y10T 428/12903 20150115; Y10T
428/12944 20150115; Y10T 29/5313 20150115; H05K 2203/1105 20130101;
Y10T 428/12701 20150115; H05K 2203/0156 20130101; H05K 3/4682
20130101; Y10T 29/49126 20150115; Y10T 428/12681 20150115; Y10T
428/12493 20150115 |
Class at
Publication: |
156/247 ;
427/383.1 |
International
Class: |
B32B 38/10 20060101
B32B038/10; B05D 3/02 20060101 B05D003/02; B32B 37/02 20060101
B32B037/02 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 15, 2009 |
KR |
10-2009-0124708 |
Claims
1. A method of manufacturing a substrate using a carrier,
comprising: providing an insulation layer including a first metal
layer formed on one side or both sides thereof; forming a second
metal layer having a lower melting point than the first metal layer
on one side of the first metal layer and then forming a third metal
layer having a higher melting point than the second metal layer on
one side of the second metal layer to provide a carrier; forming a
build up layer on one side of the third metal layer; and heating
the second metal layer to its melting point or higher to separate
the build up layer from the carrier.
2. The method of manufacturing a substrate using a carrier
according to claim 1, wherein, in the forming of the second metal
layer and the third metal layer, the second metal layer is made of
tin or a tin alloy.
3. The method of manufacturing a substrate using a carrier
according to claim 1, wherein, in the forming of the second metal
layer and the third metal layer, the second metal layer is made of
any one selected from the group consisting of tin, cadmium, lead,
bismuth, zinc, and alloys or combinations thereof.
4. The method of manufacturing a substrate using a carrier
according to claim 1, further comprising: removing the second metal
layer remaining on the third metal layer after the separating of
the build up layer from the carrier.
5. The method of manufacturing a substrate using a carrier
according to claim 1, further comprising: removing the third metal
layer after the separating of the build up layer from the
carrier.
6. The method of manufacturing a substrate using a carrier
according to claim 1, wherein, in the forming of the second metal
layer and the third metal layer, the second metal layer is formed
on one side of the first metal layer through a plating process.
7. The method of manufacturing a substrate using a carrier
according to claim 1, wherein, in the forming of the second metal
layer and the third metal layer, the second metal layer is formed
on one side of the first metal layer by attaching metal foil onto
the first metal layer through heating and pressing processes.
8. The method of manufacturing a substrate using a carrier
according to claim 1, wherein, in the forming of the second metal
layer and the third metal layer, the third metal layer is formed on
one side of the second metal layer through a plating process.
9. The method of manufacturing a substrate using a carrier
according to claim 1, wherein, in the forming of the second metal
layer and the third metal layer, the third metal layer is formed on
one side of the second metal layer by attaching metal foil onto the
second metal layer through heating and pressing processes.
10. The method of manufacturing a substrate using a carrier
according to claim 1, wherein, in the providing of the insulation
layer including the first metal layer, the first metal layer is
made of copper, nickel or aluminum.
11. The method of manufacturing a substrate using a carrier
according to claim 1, wherein, in the forming of the second metal
layer and the third metal layer, the third metal layer is made of
copper, nickel or aluminum.
12. The method of manufacturing a substrate using a carrier
according to claim 1, wherein, in the providing of the insulation
layer including the first metal layer, the insulation layer
including the first metal layer is a copper clad laminate
(CCL).
13. The method of manufacturing a substrate using a carrier
according to claim 1, wherein, in the forming of the second metal
layer and the third metal layer, an intermetallic compound layer is
formed between the first metal layer and the second metal layer or
between the second metal layer and the third metal layer.
Description
CLAIM TO PRIORITY AND CROSS REFERENCE TO RELATED APPLICATION
[0001] This application is a Divisional application of U.S. patent
application Ser. No. 12/720,567 filed on Mar. 9, 2010, entitled
"Carrier For Manufacturing Substrate And Method Of Manufacturing
Substrate Using The Same", and claims the benefit of Korean Patent
Application No. 10-2009-0124708, filed Dec. 15, 2009, entitled "A
carrier member for manufacturing a substrate and a method of
manufacturing a substrate using the same", which is hereby
incorporated by reference in its entirety into this
application.
BACKGROUND OF THE INVENTION
[0002] 1. Technical Field
[0003] The present invention relates to a carrier for manufacturing
a substrate and a method of manufacturing a substrate using the
same.
[0004] 2. Description of the Related Art
[0005] Generally, printed circuit boards (PCBs) are manufactured by
patterning one or both sides of a substrate, composed of various
thermosetting resins, using copper foil, and disposing and fixing
ICs or electronic parts on the substrate to form an electric
circuit and then coating the substrate with an insulator.
[0006] Recently, with the advancement of the electronics industry,
electronic parts are increasingly required to be highly
functionalized, light, thin, short and small. Thus, printed circuit
boards loaded with such electronic parts are also required to be
highly densified and thin.
[0007] In particular, in order to keep up with the thinning of
printed circuit boards, a coreless substrate which can decrease
thickness by removing a core and can shorten signal processing time
is attracting considerable attention. However, a coreless substrate
needs a carrier serving as a support during a process because it
does not have a core. Hereinafter, a conventional method of
manufacturing a coreless substrate will be described with reference
to FIGS. 1A to 1E.
[0008] FIGS. 1A to 1E are sectional views sequentially showing a
conventional method of manufacturing a substrate using a carrier.
Problems of conventional technologies will be described with
reference to FIGS. 1A to 1E.
[0009] First, as shown in FIG. 1A, a carrier 10 is provided. The
carrier 10 is fabricated by sequentially forming adhesive films 12,
first metal layers 13 and second metal layers 14 on both sides of a
copper clad laminate (CCL) 11. In this case, the carrier is heated
and pressed by a press, and thus the copper clad laminate 11 and
the second metal layer 14 attach to each other at a periphery
thereof by means of the adhesive film 12. Meanwhile, in order to
stably attach the copper clad laminate 11 and the second metal
layer 14 to each other, the contact face therebetween must have a
width of 10 mm, and the first metal layer 13 and the second metal
layer are vacuum-adsorbed.
[0010] Subsequently, as shown in FIG. 1B, build up layers 15 are
formed on both sides of the carrier 10. Here, each of the build up
layers 15 is formed in a general manner, and is additionally
provided with a third metal layer 16 for preventing the warpage of
the build up layer 15 at the outermost layer thereof.
[0011] Subsequently, as shown in FIG. 1C, the build up layers 15
are separated from the carrier 10. Here, the build up layers 15 are
separated from the carrier 10 by removing the edge of the adhesive
film through which the copper clad laminate 11 and the second metal
layer 14 are attached to each other by a routing process.
[0012] Subsequently, as shown in FIG. 1D, the second metal layer 14
and the third metal layer 15 formed at the outermost layers of the
build up layer 15 are removed by etching.
[0013] Subsequently, as shown in FIG. 1E, openings 17 for exposing
pads 19 are formed in the outermost insulation layers of the build
up layer 15, and then solder balls 18 are formed on the pads
19.
[0014] In this conventional substrate manufacturing method, the
build up layer 15 must be finally separated from the carrier 10.
However, since both edges of the carrier 10 are removed through a
routing process during this separation procedure, the size of the
carrier 10 is decreased, and thus it is difficult to reuse the
carrier 10. Therefore, the conventional substrate manufacturing
method is problematic in that the carrier 10 must be additionally
provided whenever a printed circuit board is manufactured, thus
increasing the production cost of the printed circuit board.
Further, the conventional substrate manufacturing method is
problematic in that it is difficult to maintain the compatibility
between a substrate and a manufacturing facility because the size
of the substrate is to changed by a routing process.
[0015] Furthermore, the conventional substrate manufacturing method
is problematic in that the build up layer 15 can be arbitrarily
separated from the carrier 10 because the build up layer 15 is
actually fixed on the carrier 10 by only the adhesion force of the
edge of the adhesive film 12.
SUMMARY OF THE INVENTION
[0016] Accordingly, the present invention has been made to solve
the above-mentioned problems, and the present invention provides a
carrier for manufacturing a substrate, from which a build up layer
can be easily separated by heating a metal layer having a
relatively low melting point without performing a routing process,
and a method of manufacturing a substrate using the same.
[0017] An aspect of the present invention provides a carrier for
manufacturing a substrate, including: an insulation layer including
a first metal layer formed on one side or both sides thereof; a
second metal layer formed on one side of the first metal layer; and
a third metal layer formed on one side of the second metal layer,
wherein the second metal layer has a lower melting point than the
first metal layer or the third metal layer.
[0018] Here, the second metal layer may be made of tin or a tin
alloy.
[0019] Further, the second metal layer may be made of any one
selected from the group consisting of tin, cadmium, lead, bismuth,
zinc, and alloys or combinations thereof.
[0020] Further, the first metal layer or the third metal layer may
be made of copper, nickel or aluminum.
[0021] Further, the insulation layer including the first metal
layer may be a copper clad laminate (CCL).
[0022] Further, an intermetallic compound layer may be formed
between the first metal layer and the second metal layer or between
the second metal layer and the third metal layer.
[0023] Another aspect of the present invention provides a method of
manufacturing a substrate to using a carrier, including: providing
an insulation layer including a first metal layer formed on one
side or both sides thereof; forming a second metal layer having a
lower melting point than the first metal layer on one side of the
first metal layer and then forming a third metal layer having a
higher melting point than the second metal layer on one side of the
second metal layer to provide a carrier; forming a build up layer
on one side of the third metal layer; and heating the second metal
layer to its melting point or higher to separate the build up layer
from the carrier.
[0024] Here, in the forming of the second metal layer and the third
metal layer, the second metal layer may be made of tin or a tin
alloy.
[0025] Further, in the forming of the second metal layer and the
third metal layer, the second metal layer may be made of any one
selected from the group consisting of tin, cadmium, lead, bismuth,
zinc, and alloys or combinations thereof.
[0026] Further, the method of manufacturing a substrate using a
carrier may further include: removing the second metal layer
remaining on the third metal layer after the separating of the
build up layer from the carrier.
[0027] Further, the method of manufacturing a substrate using a
carrier may further include: removing the third metal layer after
the separating of the build up layer from the carrier.
[0028] Further, in the forming of the second metal layer and the
third metal layer, the second metal layer may be formed on one side
of the first metal layer through a plating process.
[0029] Further, in the forming of the second metal layer and the
third metal layer, the second metal layer may be formed on one side
of the first metal layer by attaching metal foil onto the first
metal layer through heating and pressing processes.
[0030] Further, in the forming of the second metal layer and the
third metal layer, the third metal layer may be formed on one side
of the second metal layer through a plating process.
[0031] Further, in the forming of the second metal layer and the
third metal layer, the third metal layer is formed on one side of
the second metal layer by attaching metal foil onto the second
metal layer through heating and pressing processes.
[0032] Further, in the providing of the insulation layer including
the first metal layer, the first metal layer may be made of copper,
nickel or aluminum.
[0033] Further, in the forming of the second metal layer and the
third metal layer, the third metal layer may be made of copper,
nickel or aluminum.
[0034] Further, in the providing of the insulation layer including
the first metal layer, the insulation layer including the first
metal layer may be a copper clad laminate (CCL).
[0035] Further, in the forming of the second metal layer and the
third metal layer, an intermetallic compound layer may be formed
between the first metal layer and the second metal layer or between
the second metal layer and the third metal layer.
[0036] Various objects, advantages and features of the invention
will become apparent from the following description of embodiments
with reference to the accompanying drawings.
[0037] The terms and words used in the present specification and
claims should not be interpreted as being limited to typical
meanings or dictionary definitions, but should be interpreted as
having meanings and concepts relevant to the technical scope of the
present invention based on the rule according to which an inventor
can appropriately define the concept of the term to describe the
best method he or she knows for carrying out the invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[0038] The above and other objects, features and advantages of the
present invention will be more clearly understood from the
following detailed description taken in conjunction with the
accompanying drawings, in which:
[0039] FIGS. 1A to 1E are sectional views sequentially showing a
conventional method of manufacturing a substrate using a
carrier;
[0040] FIG. 2 is a sectional view showing a carrier for
manufacturing a substrate according to an embodiment of the present
invention; and
[0041] FIGS. 3 to 12 are sectional views sequentially showing a
method of manufacturing a substrate using the carrier according to
an embodiment of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0042] The objects, features and advantages of the present
invention will be more clearly understood from the following
detailed description and preferred embodiments taken in conjunction
with the accompanying drawings. Throughout the accompanying
drawings, the same reference numerals are used to designate the
same or similar components, and redundant descriptions thereof are
omitted. Further, in the following description, the terms "one
side", "the other side", "first", "second", "third" and the like
are used to differentiate a certain component from other
components, but the configuration of such components should not be
construed to be limited by the terms. Further, in the description
of the present invention, when it is determined that the detailed
description of the related art would obscure the gist of the
present invention, the description thereof will be omitted.
[0043] Hereinafter, preferred embodiments of the present invention
will be described in detail with reference to the attached
drawings.
[0044] FIG. 2 is a sectional view showing a carrier for
manufacturing a substrate according to an embodiment of the present
invention.
[0045] As shown FIG. 2, a carrier 1000 for manufacturing a
substrate according to an embodiment of the present invention
includes an insulation layer 100 provided with first metal layers
110 on one side or both sides thereof, a second metal layer 120
formed on one side of each of the first metal layers 110, and a
third metal layer 130 formed on one side of the second metal layer
120, wherein the second metal layer 120 has a lower melting point
than the first metal layer 110 or the third metal layer 130.
[0046] The insulation layer 100 is a base member constituting the
carrier 1000, and is provided with the first metal layers 110 on
one side or both sides thereof. The insulation layer 100 is not
particularly limited, but the insulation layer 100 provided with
the first metal layers 110 on one side or both sides thereof may be
a single-sided copper clad laminate (CCL) or a double-sided copper
clad laminate (CCL). In addition to this, prepreg or ajinomoto
build up film (ABF), which is a commonly-used insulating material,
may be employed as the insulation layer 100. Further, the
insulation layer 100 may further include paper, glass fiber,
non-woven glass fabric or the like as a reinforcing material in
order to improve the mechanical strength of the carrier 1000.
[0047] Since the first metal layer 110 serves as a support of the
carrier 1000, the first metal layer 110 must have a bearing
resistance of predetermined strength or more in order to prevent
the warpage of the carrier 1000 and must have a higher melting
point than the second metal layer 120 which is melted when a build
up layer 140 is separated from the carrier 1000. Considering the
above bearing resistance and melting point, the first metal layer
110 may be made of copper, nickel or aluminum. However, when a
copper clad laminate (CCL) is used as the insulation layer, it goes
without saying that the first metal layer 110 is made of
copper.
[0048] Meanwhile, in FIG. 2, the first metal layers 110 are formed
on both sides of the insulation layer 100, but the present
invention is not limited thereto. The first metal layer 110 may be
selectively formed on only one side of the insulation layer 100.
That is, when build up layers 140 are formed on both sides of the
carrier 1000 (refer to FIG. 8), the first metal layers 110 may be
formed on both sides of the insulation layer 100, and, when the
build up layer 140 is formed on only one side of the carrier 1000,
the first metal layer 110 may be formed on only one side of the
insulation layer 100.
[0049] The second metal layer 120 serves to entirely maintain the
conjunction between the carrier 1000 and the build up layer 140 by
attaching the first metal layer 110 and the third metal layer 130
to each other. Here, the second metal layer 120 may be made of tin
or a tin alloy, or may be made of any one selected from the group
consisting of tin, cadmium, lead, bismuth, zinc, and alloys or
combinations thereof. Further, the second metal layer 120 may be
formed on the first metal layer 110 through a plating process, or
may be formed on the first metal layer 110 by attaching metal foil
onto the first metal layer 110 through heating and pressing
processes. In this case, the second metal layer 120 reacts with the
first metal layer 110 to form an intermetallic compound layer 125.
For example, when the first metal layer 110 is made of copper and
the to second metal layer 120 is made of tin, an intermetallic
compound layer 125, such as Cu.sub.6Sn.sub.5, Cu.sub.3Sn or the
like, is formed between the first metal layer 110 and the second
metal layer 120. However, in order to separate the build up layer
140 from the carrier 1000, the second metal layer 120 must not be
entirely converted into the intermetallic compound layer 125, and a
pure second metal layer having a constant melting point must
remain. Finally, the second metal layer 120 is heated to the
melting point or higher and thus melted to separate the build up
layer 140 from the carrier 1000 (refer to FIG. 9). For reference,
tin, cadmium, lead, bismuth, zinc or the like, constituting the
second metal layer 120, has a melting point ranging from about
232.degree. C. to about 419.degree. C. (tin: about 232.degree. C.,
cadmium: about 320.9.degree. C., lead: about 327.degree. C.,
bismuth: about 271.3.degree. C., zinc: about 419.degree. C.),
whereas copper, nickel or aluminum, constituting the first metal
layer 110, has a melting point ranging from about 660.degree. C. to
about 1455.degree. C. (copper: about 1083.degree. C., nickel: about
1455.degree. C., aluminum: about 660.degree. C.). Therefore, the
first metal layer 110, the second metal layer 120 and the third
metal layer 130 are heated to a predetermined temperature (for
example, a temperature ranging from 232.degree. C. or more to less
than 1083.degree. C. when the second metal layer 120 is made of tin
and each of the first metal layer 110 and the third metal layer 130
is made of copper), so that only the second metal layer 120 is
selectively melted without phase-changing the first metal layer 110
and the third metal layer 130, thereby separating the build up
layer 140 from the carrier 1000.
[0050] Since the third metal layer 130, similarly to the
above-mentioned first metal layer 110, serves as a support of the
carrier 1000, the third metal layer 130 must have bearing
resistance of predetermined strength or more in order to prevent
the warpage of the carrier 1000 and must have a higher melting
point than the second metal layer 120 which is melted when the
build up layer 140 is separated from the carrier 1000. Further, the
third metal layer 130 may be made of a material which can be easily
etched because it must be removed finally. Considering the above
bearing resistance, melting point and etchability, the third metal
layer 130 may be made of copper, nickel or aluminum. Further, the
third metal layer 130 may be formed on the second metal layer 120
through a plating process, or may be formed on the second metal
layer 120 by attaching metal foil onto the second metal layer 120
through heating and pressing processes. In this case, as described
above, the third metal layer 130 reacts with the second metal layer
120 to form an intermetallic compound layer 135.
[0051] The carrier 1000 according to this embodiment is heated to a
predetermined temperature (a melting point of the second metal
layer 120) or higher to separate the build up layer 140 therefrom
(refer to FIG. 9). Therefore, the present invention, differently
from conventional technologies, is advantageous in that a routing
process can be omitted, and in that the conjunction of the carrier
1000 and the build up layer 140 can be stably maintained at about
200.degree. C. generally reached during a process of manufacturing
a substrate.
[0052] FIGS. 3 to 12 are sectional views sequentially showing a
method of manufacturing a substrate using the carrier according to
an embodiment of the present invention.
[0053] As shown in FIGS. 3 to 12, a method of manufacturing a
substrate using the carrier according to an embodiment of the
present invention includes: providing an insulation layer 100
including first metal layers 110 formed on one side or both sides
thereof; forming a second metal layer 120 having a lower melting
point than the first metal layer 110 on one side of each of the
first metal layers 110 and then forming a third metal layer 130
having a higher melting point than the second metal layer 120 on
one side of the second metal layer 120 to provide a carrier 1000;
forming a build up layer 140 on one side of the third metal layer
130; and heating the second metal layer 120 to its melting point or
higher to separate the build up layer 140 from the carrier
1000.
[0054] First, as shown in FIG. 3, an insulation layer 100 including
first metal layers 110 formed on both sides thereof is provided.
Here, a copper clad laminate (CCL) may be used as the insulation
layer 100, and, in this case, the first metal layers 110 formed on
both sides of the insulation layer 100 may be copper foil. However,
the insulation layer 100 is not limited to the copper clad laminate
(CCL), and prepreg or ajinomoto build up film (ABF), which is a
commonly-used insulating material, may be employed as the
insulation layer 100. In this case, the first metal layers may be
made of copper, nickel or aluminum. Meanwhile, in FIG. 3, although
the first metal layers 110 are formed on both sides of the
insulation layer 100, the first metal layer 110 may be selectively
formed on only one side of the insulation layer 100, thus
selectively forming the build up layer 140 on only one side of the
carrier 1000 during a subsequent process.
[0055] Subsequently, as shown in FIG. 4, a second metal layer 120
is formed on one side of each of the first metal layers 110. Here,
the second metal layer 120 may be formed on the first metal layer
110 through a plating process, or may be formed on the first metal
layer 110 by attaching metal foil onto the first metal layer 110
through heating and pressing processes.
[0056] Meanwhile, the second metal layer 120 reacts with the first
metal layer 110 to form an intermetallic compound layer 125 between
the first metal layer 110 and the second metal layer 120. Further,
since the second metal layer 120 must serve to separate the build
up layer 140 from the carder 1000 by melting it in a subsequent
process, the second metal layer 120 must have a lower melting point
than the first metal layer 110 or third metal layer 130 made of
copper, nickel or aluminum or the like. Considering this point, the
second metal layer 120 may be made of tin or a tin alloy, or may be
made of any one selected from the group consisting of tin, cadmium,
lead, bismuth, zinc, and alloys or combinations thereof.
[0057] Subsequently, as shown in FIG. 5, a third metal layer 130 is
formed on the second metal layer 120 to provide a carrier 1000.
Here, the third metal layer 130, similarly to the method of forming
the second metal layer 120, may be formed on the second metal layer
120 through a plating process, or may be formed on the second metal
layer 120 by attaching metal foil onto the second metal layer 120
through heating and pressing processes. In this case, the third
metal layer 130 reacts with the second metal layer 120 to form an
intermetallic compound layer 135 between the second metal layer 120
and the third metal layer 130.
[0058] Meanwhile, since the third metal layer 130 must have a
higher melting point than the second metal layer 120 made of tin,
cadmium, lead, bismuth, zinc or the like and must be removed in a
subsequent process, the third metal layer 130 may be made of a
material which can be easily etched. Considering this point, the
third metal layer 130 may be made of copper, nickel or
aluminum.
[0059] Subsequently, as shown in FIGS. 6 to 8, a build up layer 140
is formed on one side of the third metal layer 130. Here, the build
up layer 140 can be completed by applying an insulating material
141 onto the third metal layer 130, forming viaholes in the
insulating material 141 using an YAG or CO.sub.2 laser and then
forming a circuit layer 143 including vias 145 on the insulating
material 141 through a Semi-Additive Process (SAP) or a Modified
Semi-Additive Process (MSAP).
[0060] Meanwhile, referring to FIGS. 6 to 11, it is shown in FIG.
11 that a circuit layer 153 including vias 155 is formed on the
outermost insulating material 141 after the build up layer 140 is
separated from the carrier 100 although the circuit layer 153
including vias 155 is not formed on the outermost insulating
material 141 in this process, but the scope of the present
invention is not limited thereto. For example, in this process,
circuit layers 143 and 153 including vias 145 and 155 may be
sequentially formed on their respective insulating materials 141
while sequentially forming the insulating materials 141.
[0061] Subsequently, as shown in FIG. 9, the second metal layer 120
is heated to its melting point or higher to separate the build up
layer 140 form the carrier 1000. As described the second metal
layer 120 has a melting point ranging from about 232.degree. C. to
about 419.degree. C., whereas the first metal layer 110 or the
third metal layer 130 has a melting point ranging from about
660.degree. C. to about 1455.degree. C. Therefore, the first metal
layer 110, the second metal layer 120 and the third metal layer 130
are heated to a predetermined temperature (for example, a
temperature ranging from 232.degree. C. or more to less than
1083.degree. C. when the second metal layer 120 is made of tin and
each of the first metal layer 110 and the third metal layer 130 is
made of copper), thus separating the build up layer 140 from the
carrier 1000. In this case, physical force may be additionally
applied thereto in order to more efficiently separate the build up
layer 140 from the carrier 1000.
[0062] Meanwhile, after the build up layer 140 is separated from
the carrier 1000, a molten second metal layer 120 can remain on the
third metal layer 130. The molten second metal layer 120 remaining
on the third metal layer 130 may be removed by an etching
process.
[0063] Subsequently, as shown in FIG. 10, the third metal layer 130
is removed from the build up layer 140. Although methods of
removing the third metal layer 130 are not particularly limited,
the third metal layer 130, similarly to the molten second metal
layer 120 remaining on the third metal layer 130, may also be
removed by an etching process. Further, a manufacturing process can
be simplified by simultaneously removing the third metal layer 130
when the molten second metal layer 120 remaining on the third metal
layer 130 is removed by an etching process.
[0064] Subsequently, as shown in FIG. 11, a circuit layer 153
including vias 155 is formed on the outermost insulating material
141 of the build up layer 141. Since the third metal layer 130 is
removed from the build up layer 140 in the previous process, the
outermost insulating material 141 of the build up layer 140 is
exposed. Therefore, the circuit layer 153 including vias 155 may be
formed by forming viaholes in the exposed outermost insulating
material 141 using an YAG or CO.sub.2 laser and then performing a
Semi-Additive Process (SAP) or a Modified Semi-Additive Process
(MSAP). However, as described above, when the circuit layers 143
and 153 including vias 145 and 155 are sequentially formed on their
respective insulating materials 141 while sequentially forming the
insulating materials 141 in the process of forming the build up
layer 140, this process may be omitted.
[0065] Subsequently, as shown in FIG. 12, a solder resist layer 160
is formed on the outermost insulating material of the build up
layer 140. Here, the solder resist layer 160 is made of a
heat-resistant coating material, and serves to protect the circuit
layer 153 such that solder is not applied onto the circuit layer
153 during soldering. Further, in order to electrically connect the
circuit layer 153 with external circuits, openings 165 may be
formed in the solder resist layer 160 to expose pads.
[0066] As described above, according to the present invention, a
build up layer can be separated from a carrier by heating, so that
a routing process is not required, with the result that the size of
a substrate does not change when the build up layer is separated
from the carrier, thereby reusing the carrier and maintaining the
compatibility between the substrate and manufacturing
facilities.
[0067] Although the preferred embodiments of the present invention
have been disclosed for illustrative purposes, those skilled in the
art will appreciate that various modifications, additions and
substitutions are possible, without departing from the scope and
spirit of the invention as disclosed in the accompanying
claims.
[0068] Simple modifications, additions and substitutions of the
present invention belong to the scope of the present invention, and
the specific scope of the present invention will be clearly defined
by the appended claims.
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