loadpatents
name:-0.025014877319336
name:-0.0065178871154785
name:-0.0019030570983887
OH; Chang Gun Patent Filings

OH; Chang Gun

Patent Applications and Registrations

Patent applications and USPTO patent grants for OH; Chang Gun.The latest application filed is for "antenna substrate".

Company Profile
1.9.21
  • OH; Chang Gun - Suwon-si KR
  • Oh; Chang Gun - Hwaseong-si KR
  • Oh; Chang Gun - Suwon KR
  • Oh; Chang Gun - Gyunggi-do N/A KR
  • Oh; Chang Gun - Hwaseong KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Antenna Substrate
App 20220190479 - LEE; Yang Je ;   et al.
2022-06-16
Antenna substrate
Grant 11,228,107 - Lee , et al. January 18, 2
2022-01-18
Antenna Substrate
App 20210376473 - LEE; Yang Je ;   et al.
2021-12-02
Printed Circuit Board And Method Of Manufacturing The Same
App 20150351219 - Oh; Chang Gun ;   et al.
2015-12-03
Printed Circuit Board And Method For Manufacturing The Same
App 20140174793 - Oh; Chang Gun ;   et al.
2014-06-26
Printed circuit board and method for fabricating the same
Grant 8,720,049 - Bae , et al. May 13, 2
2014-05-13
Method of manufacturing printed circuit board having landless via hole
Grant 8,418,361 - Lee , et al. April 16, 2
2013-04-16
Fabrication Method For Carrier Substrate, Printed Circuit Board Using The Same, And Fabrication Method Thereof
App 20130062112 - LEE; Suk Won ;   et al.
2013-03-14
Method of manufacturing printed circuit board
Grant 8,356,405 - Oh , et al. January 22, 2
2013-01-22
Carrier substrate, fabrication method thereof, printed circuit board using the same, and fabrication method thereof
Grant 8,344,261 - Lee , et al. January 1, 2
2013-01-01
Printed Circuit Board And Method Of Manufacturing The Same
App 20120261166 - OH; Chang Gun ;   et al.
2012-10-18
Printed Circuit Board and Method For Fabricating The Same
App 20120097438 - Bae; Tae Kyun ;   et al.
2012-04-26
Carrier for manufacturing a printed circuit board
Grant 8,156,635 - Cho , et al. April 17, 2
2012-04-17
Method Of Manufacturing Printed Circuit Board
App 20120079716 - OH; Chang Gun ;   et al.
2012-04-05
Method Of Manufacturing Printed Circuit Board Including Landless Via
App 20120066902 - Kim; Han ;   et al.
2012-03-22
Method Of Manufacturing Printed Circuit Board Having Landless Via Hole
App 20120060369 - LEE; Suk Won ;   et al.
2012-03-15
Method of manufacturing printed circuit board including outmost fine circuit pattern
App 20120011716 - Kim; Han ;   et al.
2012-01-19
Carrier For Manufacturing Substrate And Method Of Manufacturing Substrate Using The Same
App 20110315745 - CHO; Seong Min ;   et al.
2011-12-29
Carrier For Manufacturing Substrate And Method Of Manufacturing Substrate Using The Same
App 20110180205 - CHO; Seong Min ;   et al.
2011-07-28
Carrier substrate, fabrication method thereof, printed circuit board using the same, and fabrication method thereof
App 20110155429 - Lee; Suk Won ;   et al.
2011-06-30
Carrier For Manufacturing Printed Circuit Board And Method Of Manufacturing The Same And Method Of Manufacturing Printed Circuit Board Using The Same
App 20110138615 - Sohn; Keung Jin ;   et al.
2011-06-16
Carrier For Manufacturing Substrate And Method Of Manufacturing Substrate Using The Same
App 20110138621 - CHO; Seong Min ;   et al.
2011-06-16
Carrier For Manufacturing Substrate And Method Of Manufacturing Substrate Using The Same
App 20110139858 - Cho; Seong Min ;   et al.
2011-06-16
Printed circuit board including landless via and method of manufacturing the same
App 20090294164 - Kim; Han ;   et al.
2009-12-03
Printed circuit board including outmost fine circuit pattern and method of manufacturing the same
App 20090288872 - Kim; Han ;   et al.
2009-11-26
Printed circuit board and method of manufacturing the same
App 20090260868 - Oh; Chang Gun ;   et al.
2009-10-22
Printed circuit board having landless via hole and method of manufacturing the same
App 20090255722 - Lee; Suk Won ;   et al.
2009-10-15

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