SOHN; Keung-Jin

Patent Applications and Registrations

Patent applications and USPTO patent grants for SOHN; Keung-Jin.The latest application filed is for "resin composition for printed circuit board, insulating film, and printed circuit board using the same".

Company Profile

2.8.26

SOHN; Keung-Jin - Suwon-si KR
Sohn; Keung Jin - Gyunggi-do KR
Sohn; Keung Jin - Seongnam KR
Sohn; Keung-Jin - Seongnam-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin Composition For Printed Circuit Board, Insulating Film, And Printed Circuit Board Using The Same App 20160237303 - YUN; Geum-Hee ; et al.	2016-08-18
Method For Measuring Coefficient Of Thermal Expansion And Thermal Mechanical Analyzer App 20160139068 - Han; Youn Gyu ; et al.	2016-05-19
Insulating Resin Composition For Printed Circuit Board And Products Manufactured By Using The Same App 20150114693 - Moon; Jin Seok ; et al.	2015-04-30
Carrier And Method Of Manufacturing Printed Circuit Board Using The Same App 20150107760 - Moon; Jin Seok ; et al.	2015-04-23
Laminate For Printed Circuit Board, Printed Circuit Board Using The Same, And Method Of Manufacturing The Same App 20150041206 - Ryu; Joung Gul ; et al.	2015-02-12
Prepreg, Copper Clad Laminate, And Printed Circuit Board App 20140060899 - Park; Jung Hwan ; et al.	2014-03-06
Multilayer Type Coreless Substrate And Method Of Manufacturing The Same App 20140027156 - Kim; Ki Hwan ; et al.	2014-01-30
Printed circuit board with reinforced thermoplastic resin layer Grant 8,450,618 - Sohn , et al. May 28, 2	2013-05-28
Semiconductor Package And Method For Manufacturing The Same App 20130119540 - Hong; Jong Kuk ; et al.	2013-05-16
Method for manufacturing semiconductor package Grant 8,415,200 - Hwang , et al. April 9, 2	2013-04-09
Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board Grant 8,397,378 - Sohn , et al. March 19, 2	2013-03-19
Fabrication Method For Carrier Substrate, Printed Circuit Board Using The Same, And Fabrication Method Thereof App 20130062112 - LEE; Suk Won ; et al.	2013-03-14
Carrier substrate, fabrication method thereof, printed circuit board using the same, and fabrication method thereof Grant 8,344,261 - Lee , et al. January 1, 2	2013-01-01
Method Of Manufacturing Printed Circuit Board App 20120152753 - LEE; Suk Won ; et al.	2012-06-21
Printed Circuit Board And Method For Manufacturing The Same App 20120103671 - LEE; Eung Suek ; et al.	2012-05-03
Carrier for manufacturing a printed circuit board Grant 8,156,635 - Cho , et al. April 17, 2	2012-04-17
Method For Manufacturing Semiconductor Package App 20120088334 - HWANG; Mi Sun ; et al.	2012-04-12
Method of manufacturing printed circuit board App 20120030938 - Park; Ho-Sik ; et al.	2012-02-09
Printed circuit board App 20120018195 - Park; Ho-Sik ; et al.	2012-01-26
Printed circuit board App 20120012379 - Park; Ho-Sik ; et al.	2012-01-19
Carrier For Manufacturing Substrate And Method Of Manufacturing Substrate Using The Same App 20110315745 - CHO; Seong Min ; et al.	2011-12-29
Printed circuit board with reinforced thermoplastic resin layer App 20110315437 - Sohn; Keung-Jin ; et al.	2011-12-29
Carrier For Manufacturing Substrate And Method Of Manufacturing Substrate Using The Same App 20110180205 - CHO; Seong Min ; et al.	2011-07-28
Carrier substrate, fabrication method thereof, printed circuit board using the same, and fabrication method thereof App 20110155429 - Lee; Suk Won ; et al.	2011-06-30
Carrier For Manufacturing Substrate And Method Of Manufacturing Substrate Using The Same App 20110139858 - Cho; Seong Min ; et al.	2011-06-16
Carrier For Manufacturing Substrate And Method Of Manufacturing Substrate Using The Same App 20110138621 - CHO; Seong Min ; et al.	2011-06-16
Carrier For Manufacturing Printed Circuit Board And Method Of Manufacturing The Same And Method Of Manufacturing Printed Circuit Board Using The Same App 20110138615 - Sohn; Keung Jin ; et al.	2011-06-16
Metal core package substrate and method for manufacturing the same App 20090288293 - Lee; Sang Youp ; et al.	2009-11-26
Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board App 20090255714 - Sohn; Keung-Jin ; et al.	2009-10-15
Printed circuit board and manufacturing method thereof App 20090250253 - Park; Ho-Sik ; et al.	2009-10-08

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