U.S. patent application number 12/574118 was filed with the patent office on 2011-04-07 for varying capacitance voltage contrast structures to determine defect resistance.
This patent application is currently assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION. Invention is credited to Christian Lavoie, Conal E. Murray, Oliver D. Patterson, Robert L. Wisnieff.
Application Number | 20110080180 12/574118 |
Document ID | / |
Family ID | 43822721 |
Filed Date | 2011-04-07 |
United States Patent
Application |
20110080180 |
Kind Code |
A1 |
Lavoie; Christian ; et
al. |
April 7, 2011 |
VARYING CAPACITANCE VOLTAGE CONTRAST STRUCTURES TO DETERMINE DEFECT
RESISTANCE
Abstract
A method for determining resistances of defects in a test
structure, comprising: forming a first layer of the test structure
having elements under test; generating a first e-beam image of the
first layer, the first e-beam image graphically identifying defects
detected at the first layer, each defect at the first layer having
a corresponding grey scale level; adding capacitance to the
structure by forming a metal layer of the structure; generating a
second e-beam image of the metal layer, the second e-beam image
graphically identifying defects detected at the metal layer, each
defect at the metal layer having a corresponding grey scale level;
generating a pattern of grey scale levels for each defect based on
the corresponding grey scale level of each defect at each layer of
the test structure; and determining a resistive range of each
defect based on the pattern of grey scale levels generated for each
defect.
Inventors: |
Lavoie; Christian; (Yorktown
Heights, NY) ; Murray; Conal E.; (Yorktown Heights,
NY) ; Patterson; Oliver D.; (Hopewell Junction,
NY) ; Wisnieff; Robert L.; (Yorktown Heights,
NY) |
Assignee: |
INTERNATIONAL BUSINESS MACHINES
CORPORATION
Armonk
NY
|
Family ID: |
43822721 |
Appl. No.: |
12/574118 |
Filed: |
October 6, 2009 |
Current U.S.
Class: |
324/659 ;
324/551 |
Current CPC
Class: |
H01L 22/34 20130101;
H01L 2924/0002 20130101; G01R 31/2884 20130101; H01L 2924/0002
20130101; H01L 22/20 20130101; G01R 31/307 20130101; H01L 22/14
20130101; H01L 22/12 20130101; H01L 2924/00 20130101 |
Class at
Publication: |
324/659 ;
324/551 |
International
Class: |
G01R 27/26 20060101
G01R027/26 |
Claims
1. A method for determining resistances of defective resistive
opens or shorts in a test structure, comprising: forming a first
layer of the test structure having one or more elements under test;
generating a first e-beam image of the first layer, the first
e-beam image graphically identifying defects detected at the first
layer, each defect detected at the first layer having a
corresponding grey scale level; adding capacitance to the test
structure by forming a first metal layer of the test structure;
generating a second e-beam image of the first metal layer, the
second e-beam image graphically identifying defects detected at the
first metal layer, each defect detected at the first metal layer
having a corresponding grey scale level; generating a pattern of
grey scale levels for each defect based on the corresponding grey
scale level of each defect detected at each layer of the test
structure; and determining a resistive range of each defect based
on the pattern of grey scale levels generated for each defect.
2. The method of claim 1, wherein the resistive range is determined
by comparing the pattern of grey scale levels generated for each
defect to a predetermined master table.
3. The method of claim 2, wherein the predetermined master table
includes a plurality of patterns of grey scale levels, each of the
plurality of patterns of grey scale levels is assigned to one of a
plurality of predetermined resistive ranges.
4. The method of claim 1, wherein the first e-beam image and the
second e-beam image are generated by performing a first voltage
contrast inspection over the first layer and a second voltage
contrast inspection over the first metal layer respectively.
5. The method of claim 4, wherein an electron beam is utilized for
the first voltage contrast inspection and the second voltage
contrast inspection.
6. The method of claim 1, further comprising: adding additional
capacitance to the test structure by forming a second metal layer
of the test structure; and generating a third e-beam image of the
second metal layer, the third e-beam image graphically identifying
defects detected at the second metal layer, each defect detected at
the second metal layer having a corresponding grey scale level.
7. The method of claim 1, wherein adding capacitance to the test
structure amplifies defects that exist in the test structure and
differentiates defects by their resistive value.
8. The method of claim 1, wherein the one or more elements under
test comprise of at least one electrical contact or at least one
contact chain.
9. The method of claim 1, wherein the one or more elements under
test comprise of at least one electrical device.
10. The method of claim 1, wherein adding capacitance to the test
structure includes coupling at least one of the one or more
elements under test to another one of the one or more elements
under test or to at least one capacitor.
11. The method of claim 1, wherein the corresponding grey scale
level of each defect is indicative of its resistance.
12. A method for determining resistances of defective resistive
opens or shorts in a test structure, comprising: forming a first
layer of the test structure having one or more elements under test;
generating a first e-beam image of the first layer, the first
e-beam image graphically identifying defects detected at the first
layer, each defect detected at the first layer having a
corresponding grey scale level; adding capacitance to the test
structure by forming a first metal layer of the test structure;
generating a second e-beam image of the first metal layer, the
second e-beam image graphically identifying defects detected at the
first metal layer, each defect detected at the first metal layer
having a corresponding grey scale level; generating a pattern of
grey scale levels for each defect based on the corresponding grey
scale level of each defect detected at each layer of the test
structure; and determining a resistive range of each defect by
comparing the pattern of grey scale levels generated for each
defect to a predetermined master table.
13. The method of claim 12, wherein the predetermined master table
includes a plurality of patterns of grey scale levels, each of the
plurality of patterns of grey scale levels is assigned to one of a
plurality of predetermined resistive ranges.
14. The method of claim 12, wherein adding capacitance to the test
structure includes coupling at least one of the one or more
elements under test to another one of the one or more elements
under test or to at least one capacitor.
15. The method of claim 12, wherein the corresponding grey scale
level of each defect is indicative of its resistance.
16. The method of claim 12, wherein the first e-beam image and the
second e-beam image are generated by performing a first voltage
contrast inspection over the first layer and a second voltage
contrast inspection over the first metal layer respectively.
17. A test structure for determining resistances of defective
resistive opens and shorts, comprising: a contact layer having one
or more elements under test; a first metal layer coupled to the
contact layer, the first metal layer being configured to add
capacitance to the test structure; and a second metal layer coupled
to the first metal layer, the second metal layer being configured
to add additional capacitance to the test structure; wherein
capacitance is added to each metal layer of the test structure to
amplify defects that exist in the test structure and differentiate
defects by their resistive value.
18. The test structure of claim 16, further comprising a third
metal layer coupled to the second metal layer, the third metal
layer being configured to add additional capacitance to the test
structure.
19. The test structure of claim 16, wherein capacitance is added to
the test structure by coupling at least one of the one or more
elements under test to another one of the one or more elements
under test or to at least one capacitor.
20. The test structure of claim 16, wherein the one or more
elements under test comprises of at least one electrical contact or
at least one contact chain.
Description
BACKGROUND
[0001] In-line voltage contrast (VC) inspection is a powerful
technique for detecting and isolating yield limiting defects in the
semiconductor fabricating industry. In-line VC inspection includes
scanning the wafer surface in which test structures exist with a
scanning electron microscope (SEM). As the inspection proceeds, the
SEM induces a charge on all electrically floating elements whereas
any grounded elements remain at zero potential. This potential
difference is visible to the SEM. In particular, for electron
landing energies less than the second crossover of the secondary
electron yield curve (approximately 2.5 keV for tungsten (W) and
copper (Cu)), grounded elements appear bright whereas floating
elements appear dark.
[0002] Test structures exploiting this phenomenon can be created
for many yield limiting defects including metal, gate and active
region shorts and opens, and via and contact opens. For example,
FIGS. 1A-B, show a short (FIG. 1B) indicated by a normally floating
(dark) element becoming bright, and an open (FIG. 1A) indicated
when a normally bright element becomes dark. FIG. 1C shows a gate
level open indicated when a normally bright element becomes dark.
As shown, even if the defect causing the electrical failure is
buried or extremely small, its existence is indicated by a change
in the VC signal of the entire element. In addition, the exact
location of an open is indicated by a change in the VC signal of
the structure after the break.
[0003] E-beam inspection is a popular technique for in-line
detection of yield limiting defects. One limitation is sensitivity
to resistive opens and shorts. Under e-beam inspection, resistances
less than about 10 Mohms look like shorts and resistances a little
greater than this value look like opens. There is a resistance
range where the voltage contrast appears gray, but this is
relatively small.
[0004] The 10 Mohms value is used because the latest e-beam
inspection tools utilize electron beam currents of up to 500 nA.
The net induced current flow at the wafer surface is a fraction of
this current and depends on the beam conditions. Assuming it is
30%, then the voltage induced on an electrical node with a leakage
path to ground of 10 Mohms is 1.5V. Theoretically, the beam current
could be changed and the induced voltage would change
proportionally. In practice though, only a single voltage is used
per wafer scan.
[0005] Quantifying the resistance of resistive opens is quite
difficult. The ability to quantify the resistance of opens would be
helpful for characterization of processes.
SUMMARY
[0006] According to one embodiment of the present invention, a
method for determining resistances of defective resistive opens or
shorts in a test structure is provided. The method includes:
forming a first layer of the test structure having one or more
elements under test; generating a first e-beam image of the first
layer, the first e-beam image graphically identifying defects
detected at the first layer, each defect detected at the first
layer having a corresponding grey scale level; adding capacitance
to the test structure by forming a first metal layer of the test
structure; generating a second e-beam image of the first metal
layer, the second e-beam image graphically identifying defects
detected at the first metal layer, each defect detected at the
first metal layer having a corresponding grey scale level;
generating a pattern of grey scale levels for each defect based on
the corresponding grey scale level of each defect detected at each
layer of the test structure; and determining a resistive range of
each defect based on the pattern of grey scale levels generated for
each defect.
[0007] According to another aspect of the invention, a method for
determining resistances of defective resistive opens or shorts in a
test structure is provided. The method includes: forming a first
layer of the test structure having one or more elements under test;
generating a first e-beam image of the first layer, the first
e-beam image graphically identifying defects detected at the first
layer, each defect detected at the first layer having a
corresponding grey scale level; adding capacitance to the test
structure by forming a first metal layer of the test structure;
generating a second e-beam image of the first metal layer, the
second e-beam image graphically identifying defects detected at the
first metal layer, each defect detected at the first metal layer
having a corresponding grey scale level; generating a pattern of
grey scale levels for each defect based on the corresponding grey
scale level of each defect detected at each layer of the test
structure; and determining a resistive range of each defect by
comparing the pattern of grey scale levels generated for each
defect to a predetermined master table.
[0008] According to yet another aspect of the invention, a test
structure for determining resistances of defective resistive opens
and shorts, comprising: a contact layer having one or more elements
under test; a first metal layer coupled to the contact layer, the
first metal layer being configured to add capacitance to the test
structure; and a second metal layer coupled to the first metal
layer, the second metal layer being configured to add additional
capacitance to the test structure; wherein capacitance is added to
each metal layer of the test structure to amplify defects that
exist in the test structure and differentiate defects by their
resistive value.
[0009] Additional features and advantages are realized through the
techniques of the present invention. Other embodiments and aspects
of the invention are described in detail herein and are considered
a part of the claimed invention. For a better understanding of the
invention with the advantages and the features, refer to the
description and to the drawings.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0010] The subject matter which is regarded as the invention is
particularly pointed out and distinctly claimed in the claims at
the conclusion of the specification. The forgoing and other
features, and advantages of the invention are apparent from the
following detailed description taken in conjunction with the
accompanying drawings in which:
[0011] FIGS. 1A-C illustrate images of defects observed using
conventional voltage contrast (VC) inspection according to one
exemplary embodiment of the present invention;
[0012] FIG. 2 illustrates an exemplary environment of voltage
contrast inspection employing a test structure built up to a first
layer according to one exemplary embodiment of the present
invention;
[0013] FIG. 3 illustrates an exemplary environment of voltage
contrast inspection employing the test structure built up to a
first metal layer to add capacitance across the test structure
according to one exemplary embodiment of the present invention;
[0014] FIG. 4 illustrates an exemplary environment of voltage
contrast inspection employing the test structure built up to a
second metal layer to add additional capacitance to the test
structure according to one exemplary embodiment of the present
invention;
[0015] FIGS. 5A-5B illustrate exemplary e-beam images that
graphically identify defects of a layer of the test structure under
examination;
[0016] FIG. 6 illustrates an exemplary pattern of grey scale levels
for a candidate defect detected from the test structure;
[0017] FIG. 7 illustrates a predetermined master table used for
determining a resistive range of the candidate defect detected from
the test structure; and
[0018] FIG. 8 is a flow diagram that provides a method for
determining resistances of defective opens or shorts in a test
structure.
DETAILED DESCRIPTION
[0019] Exemplary embodiments of the present invention are described
in the context of exemplary multi-level/layer integrated circuit
structures; including semiconductor structures and overlying
metallization or other interconnects, using various levels of
conductors that are separated from each other and the substrate by
dielectric layers. However, structures formed using other methods
of semiconductor fabrication also fall with the scope of exemplary
embodiments of the present invention. Various metals or metal
alloys can be used as conductors in exemplary embodiments of the
invention. For example, copper, tungsten or aluminum can be used as
candidates for the conductors. Silicides, such as NiSi, PtSi or
their alloys would also serve as good candidates for the
conductors. Candidates for dielectric materials can include silicon
oxide or organosilicate glass. Of course, other dielectric
materials can be used in other exemplary embodiments of the
invention.
[0020] Exemplary embodiments of a system and method for determining
resistances of defective resistive opens or shorts in a voltage
contrast test structure in accordance with the present invention
will now be described with reference to the drawings. The exemplary
method described herein enables a user to quantify the resistance
of defective resistive opens and shorts by adding additional
capacitance to a test structure at subsequent test layers. In one
exemplary embodiment, the test structure is inspected with an
e-beam tool at each of its layers enabling for the generation of an
e-beam image of each of its layer to graphically identify defects
observed at each layer of the test structure. In one exemplary
embodiment, each defect detected at each layer has a corresponding
grey scale level indicative of its resistance. In one exemplary
embodiment, a pattern of grey scale levels is generated for each
defect based on the corresponding grey scale level of each defect
detected at each layer of the structure.
[0021] A resistive range can be determined for each defect based on
the pattern of grey scale levels generated for each respective
defect. In accordance with one embodiment, the resistive range is
determined by comparing the pattern of grey scale levels generated
for each defect to a predetermined master table. The predetermined
master table can include a plurality of patterns of grey scale
levels each assigned to one of a plurality of predetermined
resistive ranges. Obtaining an idea of the resistance value of
defects can be helpful during failure analysis. For example, if the
resistance is high enough, it might not cause electrical failure. A
user (e.g., chip designer) can also determine the impact of high
resistive leakages on yield. This information can also enable a
user to focus its attention on other more troubling defects (ones
with a small resistance that may cause electrical failure).
Further, the resistance of the typical defect can be used as a
metric when investigating different potential solutions. The
ability to quantify the resistance of opens would be helpful for
characterization of processes.
[0022] Now referring to the drawings, FIG. 2 illustrates a portion
of a test structure 100 in accordance with one exemplary
embodiment. The test structure 100 described herein can be part of
the design for an integrated circuit chip. The test structure 100
includes one or more elements under test 102 formed over buried
oxide layer 104 on a bulk substrate 105 and in a dielectric layer
106 of the structure during the fabrication of an integrated
circuit (IC) chip. For ease of discussion, only one element under
test 102 is shown in detail in FIG. 1. The element under test 102
can be any electrical device, such as a transistor (e.g., Negative
Field Effect Transistor (NFET)) that generally includes a gate
electrode 108 and gate dielectric 109 over a channel region 110 in
the substrate 106 with a drain region 112 grounded to the substrate
105 through a hole 113 formed through the oxide 104. In addition, a
source region 114 formed in the substrate on opposite sides of the
channel region. In this example, the transistor is coupled to
electrical contacts 120 that serve as interconnects. The element
under test 102 as described herein can also be rows of contacts 120
or a via chain (not shown). As shown in this example, one contact
is used as a local interconnect 121A to ground the gate electrode
108 while another contact serves as the contact 121B to be
tested.
[0023] In accordance with one exemplary embodiment, the elements
under test form a product or contact layer 122 of the test
structure in which other layers or levels of the test structure are
built upon. In one exemplary embodiment, the test structure is
built up to a first metal layer 124 as shown in FIG. 3. In
accordance with one exemplary embodiment, capacitance is added to
the test structure at the first metal layer 124. Capacitance is
added by coupling multiple elements under test to one another or
coupling M1 capacitors to each element under test through a pattern
of wires. In this example, the element under test is coupled to a
capacitor 126 by an interconnect. In accordance with one exemplary
embodiment, additional capacitance is added to the test structure
at a second metal layer 128 as shown in FIG. 4. Interconnects 130
are used to enable additional capacitance to be added at the second
metal layer 128. As such, an exponentially increasing amount of
capacitance is added to the test structure with each metal level.
With little capacitance, most resistive defects will appear as
opens. As capacitance is added however, the lower resistive defects
start looking like shorts changing the conditions of the defects.
In other words, adding capacitance to the test structure as
described above amplifies defective resistive opens/shorts that
exist in the test structure and differentiates defects by their
resistive value. The test structure can be built up to a third
metal layer, a fourth metal layer, and so forth, where each
subsequent metal layer serves to increase the amount of capacitance
to the test structure.
[0024] In accordance with one exemplary embodiment, defects
(defective resistance opens or shorts) are detected at each layer
of the test structure using voltage contrast (VC) inspection.
Voltage contrast inspection may use any currently known or later
developed technique, e.g., using voltage contrast inspection tool
140 including a scanning electron microscope (SEM). The VC
inspection tool 140 is configured to generate an electron beam 142
used to scan the surface of each layer of the test structure and
detect defects at each layer of the test structure.
[0025] A voltage contrast inspection is capable of localizing
defects, and capable of acquiring a high-resolution electron beam
image of the defect. The voltage contrast inspection technique
operates on the basis that the potential differences in the various
locations (e.g., at contacts) of a layer under examination cause
differences in electron emission intensities when the layer is the
target of the electron beam. In other words, each contact scanned
by the electron beam emits a number of electrons proportional to
the voltage potential at that contact. Each e-beam image can
graphically identify defects at each layer of the test structure.
More specifically, each e-beam image can graphically identify
defect locations in the form of a wafer map/pattern. Of course,
e-beam images can also identify non-defects and their
locations.
[0026] In accordance with one exemplary embodiment, each defect is
graphically depicted with a corresponding grey scale level
indicative of its resistance. The corresponding grey scale level of
each defect can be anywhere between, for example, 1-100, where a
contact appears darker at grey scale levels closer to 1 and a
contact appears brighter at grey scale levels closer to 100 in
accordance with one exemplary embodiment. Of course, the scale can
be of any range with different levels of granularity and should not
be limited to the example described herein. Further, the system may
be configured such that a high potential contact is displayed as
bright and a low potential contact is displayed as bright. However,
in this example, a contact that appears dark suggests a high
potential while contacts that appear bright suggests a low
potential.
[0027] FIG. 5A illustrates an exemplary e-beam image 150 generated
for one of the layers. As shown, a pattern of contacts with
corresponding grey scale levels are depicted. In this e-beam image
150, the one contact that appears bright clearly from the pattern
should be dark because it is outside the pattern, thus is a defect.
This one contact is indicated by arrow 152. Once this defect at one
layer (e.g., contact layer) of the structure is recorded along with
its corresponding grey scale level, the same defect scanned at
another layer (e.g., first metal layer) of the structure is also
recorded along with its corresponding grey scale level as depicted
in exemplary e-beam image 154 in FIG. 5B. Therefore, by scanning
the same structure multiple times at different layers of the
structure, the resistance of each defect may be localized within a
certain range.
[0028] In operation, voltage contrast inspection is performed for
each layer of the test structure to generate a corresponding e-beam
image of each layer. For example, contact layer 106 is scanned to
generate a first e-beam image that graphically identifies defects
detected at the contact layer 106 as shown in FIG. 2. Then, the
first metal layer 124, which provides added capacitance to the
structure, is scanned to generate a second e-beam image that
graphically identifies defects at the first metal layer 124 as
shown in FIG. 3. Additional layers of the structure are scanned to
generate corresponding e-beam images of those layers. Once each
layer is scanned and the defects with their corresponding grey
scale level are recorded, a pattern of grey scale levels for each
defect is generated in accordance with one exemplary embodiment.
The pattern of grey scale levels of each defect is based on the
corresponding grey scale level of each defect detected at each
layer of the test structure. FIG. 6 illustrates an exemplary
pattern of grey scale levels 160 of a candidate defect. As shown,
the corresponding grey scale level of the defect at each layer of
the structure is recorded forming pattern 160. In this example, the
corresponding grey scale level of the candidate defect at the
contact layer, the first metal layer, the second metal layer, the
third metal layer and the fourth metal layer is recorded to
generate the pattern 160. The defects detected with each scan are
associated based on their location on the wafer (i.e., the same
physical defect will be detected at multiple levels). The pattern
of grey scale levels for each defect is compared to a predetermined
master table to determine a resistance range of each defect. An
exemplary predetermined master table 162 is shown in FIG. 7.
[0029] In accordance with one exemplary embodiment, the
predetermined master table 162 includes a plurality of patterns of
grey scale levels each assigned to one of a plurality of
predetermined resistive ranges. In this example, the pattern 160
for the candidate defect matches the pattern of grey scale levels
having a resistive range of 10-50 Mohm. Of course, the resistive
ranges can vary depending on application and can be more granular.
In other words, the range of resistance values for each pattern can
be smaller further providing a more accurate resistance reading of
each defect.
[0030] In accordance with one exemplary embodiment, the
predetermined master table can be formed by modeling a test
structure with predetermined values. For example, an accurate model
of a test structure with known resistances and capacitance can be
represented by Equation (1):
V.sub.out(t)=IR(1-exp(-t/RC)) (equation 1)
In this equation, Vout represents the output voltage of the element
under test. Vout is a function of time (t), resistance (R), the
induced current (I), and the total capacitance (C) added to the
structure. This function reaches a maximum value of IR. This is a
steady state value. In most cases, the induced voltage is limited
by other factors, including the build-up of an electric field which
reduces I and is believed to saturate between 2 and 3 volts.
Therefore, a more accurate model is represented by Equation (2)
where the product RC is the time constant of the equation.
V.sub.out(t)=min[3,IR(1-exp(-t/RC)] (equation 2)
In accordance with one exemplary embodiment, the system described
herein includes a central processing unit (CPU) (not shown), which
can be an integral part of the VC inspection tool 140 or a separate
unit, configured to generate the e-beam images as described above.
The CPU is also configured to record the corresponding grey scale
level of each defect at each layer of the structure and generate a
pattern of grey scale levels for each defect. The CPU is further
configured to determine a resistive range of each defect by
comparing the pattern of grey scale levels generated for each
defect to the predetermined master table.
[0031] The CPU can be any conventional processing unit configured
for carrying out the methods and/or functions described herein. In
one exemplary embodiment, the CPU comprises a combination of
hardware and/or software/firmware with a computer program that,
when loaded and implemented, permits the CPU to operate such that
it carries out the methods described herein.
[0032] Now referring to FIG. 8 a method for determining resistances
of defective resistive opens or shorts in a test structure in
accordance with one exemplary embodiment will now be discussed.
[0033] At block 200, form a first layer of the test structure
having one or more elements under test. The one or more elements
under test can include at least one contact, via chain, transistor
or a combination thereof in accordance with one exemplary
embodiment. The first layer of the test structure can be formed in
a manner as described above and shown in FIG. 2.
[0034] At block 202, generate a first e-beam image of the first
layer that graphically identifies defects detected at the first
layer where each defect detected at the first layer is depicted
with a corresponding grey scale level. The first e-beam image is
generated by scanning the surface of the first layer (e.g., contact
layer) with an electron beam as described above.
[0035] At block 204, add capacitance to the test structure by
forming a first metal layer of the test structure. Capacitance is
added by coupling multiple elements under test to one another or
coupling M1 capacitors to each element under test through a pattern
of wires as described above. The added capacitance amplifies
defective resistive opens/shorts that exist in the test
structure.
[0036] At block 206, generate a second e-beam image of the first
metal layer that graphically identifies defects detected at the
first metal layer where each defect detected at the first metal
layer is depicted with a corresponding grey scale level. The second
e-beam image is generated by scanning the surface of the first
metal layer with another electron beam as described above.
[0037] At block 208, generate a pattern of grey scale levels for
each defect based on the corresponding grey scale level of each
defect detected at each layer of the test structure. The defects
detected with each scan are associated based on their location on
the wafer (i.e., the same physical defect will be detected at
multiple levels). That same defect being detected at multiple
levels enable the generation of the pattern of grey scale levels
for that particular defect as described above.
[0038] At block 210, determine a resistive range of each defect
based on the pattern of grey scale levels generated for each
defect. The resistive range is determined by comparing the pattern
of grey scale levels generated for each defect to a predetermined
master table as described above.
[0039] In accordance with one exemplary embodiment, additional
metal levels are formed where capacitance is added at subsequent
metal levels. Capacitance is added to differentiate defects by
their resistive value. The methods described herein would enable a
user to determine the magnitude of resistance of an open having
resistance but is not necessarily a hard failure (e.g., less than
100 ohms).
[0040] The ability to quantify the resistance of opens represents a
key tool in assessing the position and extent of defects within
semiconductor structures without the need to delayer or section the
semiconductor wafer. This ability would be useful in the detection
of defects induced by certain semiconductor fabrication steps early
in the manufacturing process.
[0041] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
the invention. As used herein, the singular forms "a", "an" and
"the" are intended to include the plural forms as well, unless the
context clearly indicates otherwise. It will be further understood
that the terms "comprises" and/or "comprising," when used in this
specification, specify the presence of stated features, integers,
steps, operations, elements, and/or components, but do not preclude
the presence or addition of one or more other features, integers,
steps, operations, element components, and/or groups thereof.
[0042] The corresponding structures, materials, acts, and
equivalents of all means or step plus function elements in the
claims below are intended to include any structure, material, or
act for performing the function in combination with other claimed
elements as specifically claimed. The description of the present
invention has been presented for purposes of illustration and
description, but is not intended to be exhaustive or limited to the
invention in the form disclosed. Many modifications and variations
will be apparent to those of ordinary skill in the art without
departing from the scope and spirit of the invention. The
embodiment was chosen and described in order to best explain the
principles of the invention and the practical application, and to
enable others of ordinary skill in the art to understand the
invention for various embodiments with various modifications as are
suited to the particular use contemplated
[0043] The flow diagrams depicted herein are just one example.
There may be many variations to this diagram or the steps (or
operations) described therein without departing from the spirit of
the invention. For instance, the steps may be performed in a
differing order or steps may be added, deleted or modified. All of
these variations are considered a part of the claimed
invention.
[0044] While the preferred embodiment to the invention had been
described, it will be understood that those skilled in the art,
both now and in the future, may make various improvements and
enhancements which fall within the scope of the claims which
follow. These claims should be construed to maintain the proper
protection for the invention first described.
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