U.S. patent application number 12/579493 was filed with the patent office on 2011-02-03 for image sensor package structure.
This patent application is currently assigned to Kingpak Technology Inc.. Invention is credited to Tsao-Pin Chen, Mon-Nan Ho, Chung-Hsien Hsin, Chih-Cheng Hsu, Ren-Long Kuo, Chin-Fu Lin, Young-Houng Shiao, Hsiu-Wen Tu.
Application Number | 20110024610 12/579493 |
Document ID | / |
Family ID | 42309610 |
Filed Date | 2011-02-03 |
United States Patent
Application |
20110024610 |
Kind Code |
A1 |
Tu; Hsiu-Wen ; et
al. |
February 3, 2011 |
IMAGE SENSOR PACKAGE STRUCTURE
Abstract
The present invention discloses an image sensor package
structure. The image sensor package structure includes a substrate,
a chip, a transparent lid, a first casing and a package material.
The transparent lid covers a sensitization area of the chip and it
also adheres to the chip which is deposed on the substrate. The
first casing, which adheres to the transparent lid, forms an
opening so that light can pass through the opening and the
transparent lid to enter into the sensitization area. The package
material covers around the chip and the transparent lid and fills
between the substrate and the first casing. Because of the
arrangement of adhesive layers placed between the first casing and
the transparent lid and between the transparent lid and the chip,
the blockage area from moisture is elongated. Therefore, the
reliability of the image sensor package structure can be
enhanced.
Inventors: |
Tu; Hsiu-Wen; (Chu-Pei City,
TW) ; Kuo; Ren-Long; (Chu-Pei City, TW) ;
Shiao; Young-Houng; (Chu-Pei City, TW) ; Chen;
Tsao-Pin; (Chu-Pei City, TW) ; Ho; Mon-Nan;
(Chu-Pei City, TW) ; Hsu; Chih-Cheng; (Chu-Pei
City, TW) ; Lin; Chin-Fu; (Chu-Pei City, TW) ;
Hsin; Chung-Hsien; (Chu-Pei City, TW) |
Correspondence
Address: |
STITES & HARBISON PLLC;Suite 900
1199 N. Fairfax Street
Alexandria
VA
22314
US
|
Assignee: |
Kingpak Technology Inc.
Chu-Pei City
TW
|
Family ID: |
42309610 |
Appl. No.: |
12/579493 |
Filed: |
October 15, 2009 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61229364 |
Jul 29, 2009 |
|
|
|
Current U.S.
Class: |
250/239 ;
257/433 |
Current CPC
Class: |
H01L 23/10 20130101;
H01L 23/04 20130101; H01L 2224/32225 20130101; H01L 2224/73265
20130101; H01L 2924/15311 20130101; H01L 2224/48091 20130101; H01L
2924/15311 20130101; H01L 2224/48227 20130101; H01L 2924/00014
20130101; H01L 2924/00 20130101; H01L 2224/73265 20130101; H01L
2224/48227 20130101; H01L 2224/32225 20130101; H01L 2924/00
20130101; H01L 2224/32225 20130101; H01L 2224/48227 20130101; H01L
27/14618 20130101; H01L 2224/48091 20130101; H01L 2224/73265
20130101 |
Class at
Publication: |
250/239 ;
257/433 |
International
Class: |
H01J 5/02 20060101
H01J005/02 |
Claims
1. An image sensor package structure, comprising: a substrate
provided with a plurality of first conductive contacts; a chip
including a first surface and a second surface opposite to the
first surface, wherein the first surface is bound to the substrate
while the second surface has a sensitization area and a plurality
of second conductive contacts that surrounds a periphery of the
sensitization area and is electrically connected with the first
conductive contacts; a transparent lid having a third surface and a
fourth surface opposite to the third surface, wherein the third
surface adheres to the second surface for covering over the
sensitization area to define an air cavity over the sensitization
area; a first casing having a first board that is centrally formed
with an opening and adheres to the fourth surface; and a package
material covering around the chip, the transparent lid, and the
first casing at peripheries thereof.
2. The image sensor package structure of claim 1, wherein the
substrate is a circuit substrate.
3. The image sensor package structure of claim 1, wherein the
sensitization area has a plurality of photosensitive elements.
4. The image sensor package structure of claim 1, wherein the chip
is a CMOS (Complementary Metal Oxide Semiconductor) image
sensor.
5. The image sensor package structure of claim 1, wherein the third
surface adheres to the second surface through a first adhesive
layer.
6. The image sensor package structure of claim 1, wherein the first
board has a fifth surface adhering to the fourth surface through a
second adhesive layer.
7. The image sensor package structure of claim 6, wherein the
second adhesive layer further extends to cover the lateral areas of
the transparent lid.
8. The image sensor package structure of claim 1, wherein the first
casing is made of a metal material or a heat-resistant plastic
material.
9. The image sensor package structure of claim 1, wherein the
opening is corresponding to the sensitization area.
10. The image sensor package structure of claim 1, wherein the
first board further has at least one gas vent that penetrates
through the first board.
11. The image sensor package structure of claim 1, wherein the
first casing further has a flange that vertically extends from a
periphery of the first board toward the substrate.
12. The image sensor package structure of claim 11, wherein the
flange further has at least one gas vent that penetrates through
the flange.
13. The image sensor package structure of claim 1, further
comprising a plurality of solder balls or a plurality of soldering
pads formed on the lower surface of the substrate.
14. An image sensor package structure, comprising: a substrate
provided with a plurality of first conductive contacts; a chip
including a first surface and a second surface opposite to the
first surface, wherein the first surface is bound to the substrate
while the second surface has a sensitization area and a plurality
of second conductive contacts that surrounds a periphery of the
sensitization area and is electrically connected with the first
conductive contacts; a transparent lid having a third surface and a
fourth surface opposite to the third surface, wherein the third
surface covers over the sensitization area to define an air cavity
over the sensitization area; a second casing having a second board
that is adhesively sandwiched between the second surface and the
third surface, a third board that has one edge connected with one
edge of the second board, and a fourth board that is parallel to
the second board and connected with an opposite edge of the third
board; and a package material covering around the chip and the
second casing at peripheries thereof.
15. The image sensor package structure of claim 14, wherein the
substrate is a circuit substrate.
16. The image sensor package structure of claim 14, wherein the
sensitization area has a plurality of photosensitive elements.
17. The image sensor package structure of claim 14, wherein the
chip is a CMOS (Complementary Metal Oxide Semiconductor) image
sensor.
18. The image sensor package structure of claim 14, wherein the
second board has a sixth surface adhering to the second surface
through a third adhesive layer.
19. The image sensor package structure of claim 14, wherein the
second board has a seventh surface adhering to the third surface
through a fourth adhesive layer.
20. The image sensor package structure of claim 14, wherein the
second casing is made of a heat-resistant plastic material.
21. The image sensor package structure of claim 14, wherein the
fourth board further has at least one gas vent that penetrates
through the fourth board.
22. The image sensor package structure of claim 14, further
comprising a plurality of solder balls or a plurality of soldering
pads formed on the lower surface of the substrate.
23. An image sensor package structure, comprising: a substrate
provided with a plurality of first conductive contacts; a chip
including a first surface and a second surface opposite to the
first surface, wherein the first surface is bound to the substrate
while the second surface has a sensitization area and a plurality
of second conductive contacts that surrounds the periphery of the
sensitization area and is electrically connected with the first
conductive contacts; a transparent lid having a third surface and a
fourth surface opposite to the third surface, wherein the third
surface covers over the sensitization area to define an air cavity
over the sensitization area; a third casing having a fifth board
that adheres to the second surface, a sixth board that has one edge
connected with one edge of the fifth board, a seventh board that is
parallel to the fifth board and connected with an opposite edge of
the sixth board so that the fifth, sixth, and seventh boards
jointly form a transverse U-shaped structure for locking in the
transparent lid, and an eighth board that extends from the seventh
board outward from the third casing; and a package material
covering around the chip and the third casing at peripheries
thereof.
24. The image sensor package structure of claim 23, wherein the
substrate is a circuit substrate.
25. The image sensor package structure of claim 23, wherein the
sensitization area has a plurality of photosensitive elements.
26. The image sensor package structure of claim 23, wherein the
chip is a CMOS (Complementary Metal Oxide Semiconductor) image
sensor.
27. The image sensor package structure of claim 23, wherein the
fifth board has an eighth surface adhering to the second surface
through a fifth adhesive layer.
28. The image sensor package structure of claim 23, wherein the
eighth board further has at least one gas vent that penetrates
through the eighth board.
29. The image sensor package structure of claim 23, wherein the
third casing is made of a heat-resistant plastic material.
30. The image sensor package structure of claim 23, further
comprising a plurality of solder balls or a plurality of soldering
pads formed on the lower surface of the substrate.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Technical Field
[0002] The present invention relates to semiconductor packaging
structures. More particularly, the present invention relates to an
image sensor package structure with improved structural
reliability.
[0003] 2. Description of Related Art
[0004] With the rapid progress of technologies, popularization of
multimedia devices is accelerated. In addition, when a large number
of digital imaging apparatuses, such as digital still cameras,
digital video cameras, and digital scanners, have been introduced
to the market in recent years, image digitization has become an
inevitable trend. One of the crucial elements that makes the
digital imaging apparatuses work is the image sensor. It serves to
receive and convert optical signals or image signals into electric
signals, and transmit the electric signals to a circuit board for
analysis, enabling a digital imaging apparatus to photograph.
[0005] In order to meet the market demand for digital imaging
apparatuses to be as compact as possible, the used image sensor
nowadays is typically a CCD (Charge Coupled Device), a CMOS
(Complementary Metal Oxide Semiconductor) image sensor, or the
like. Therefore, the possibility of downsizing digital imaging
apparatuses relies on the technology in packaging the image sensors
into minimized image sensor package structures.
[0006] Such packaging technology is preferably applicable to mass
productions with lower material costs. In addition, the packaging
technology should provide appropriate protection to the
sensitization area on an image sensor that is extremely sensitive
and might be adversely affected by external dust and moisture so as
to improve the imaging performance of the image sensor and enhance
the reliability of the resultant package structure. Moreover, the
service life is maximized and the quality of the digital imaging
apparatus is ensured.
[0007] However, the liquid compound conventionally used by the
traditional packaging technology to package image sensors for
preventing moisture invasion is very expensive and leaves the
overall material costs of the existing image sensor package
structure high. Moreover, the constantly changing processing
temperature during baking tends to cause the volatile gases in the
liquid compound to burst or create crevices in the baked compound.
As a result, the image sensor is likely to be invaded by moisture.
When the image sensor package structure later receives a
reliability test, the moisture will expand and increase the
pressure inside the image sensor package structure, thus resulting
in damage to the image sensor and significantly reducing the
production yield and reliability of the image sensor package
structure.
SUMMARY OF THE INVENTION
[0008] The present invention provides an image sensor package
structure wherein a transparent lid is peripherally covered by
adhesive layers or a casing, so the blockage area from moisture is
elongated, thereby preventing the image sensor package structure
from external moisture invasion and improving the reliability of
the image sensor package structure.
[0009] The present invention provides an image sensor package
structure wherein a casing is provided with at least one gas vent
that allows volatile gases contained in the liquid compound to
escape during compound dispensing or post mold cure, thereby
improving the production yield of the image sensor package
structure.
[0010] The present invention provides an image sensor package
structure wherein a casing serves to support the image sensor
package structure, so the amount of expensive liquid compound used
can be decreased, reducing material costs.
[0011] The present invention provides an image sensor package
structure wherein the casing and adhesive layers are stacked so as
to enlarge the air cavity between a transparent lid and a chip in
volume, thereby improving the imaging quality.
[0012] To achieve the aforementioned effects, the image sensor
package structure includes a substrate provided with a plurality of
first conductive contacts; a chip including a first surface and a
second surface opposite to the first surface, wherein the first
surface is bound to the substrate while the second surface has a
sensitization area and a plurality of second conductive contacts
that surrounds the periphery of the sensitization area and is
electrically connected with the first conductive contacts; a
transparent lid having a third surface and a fourth surface
opposite to the third surface, wherein the third surface adheres to
the second surface for covering over the sensitization area to
define an air cavity over the sensitization area; a first casing
having a first board that is centrally formed with an opening and
adheres to the fourth surface; and a package material covering
around the chip, the transparent lid, and the first casing at
peripheries thereof.
[0013] To achieve the aforementioned effects, the image sensor
package structure alternatively includes a substrate provided with
a plurality of first conductive contacts; a chip including a first
surface and a second surface opposite to the first surface, wherein
the first surface is bound to the substrate while the second
surface has a sensitization area and a plurality of second
conductive contacts that surrounds the periphery of the
sensitization area and is electrically connected with the first
conductive contacts; a transparent lid having a third surface and a
fourth surface opposite to the third surface, wherein the third
surface covers over the sensitization area to define an air cavity
over the sensitization area; a second casing having a second board
that is adhesively sandwiched between the second surface and the
third surface, a third board that has one edge connected with one
edge of the second board, and a fourth board that is parallel to
the second board and connected with an opposite edge of the third
board; and a package material covering around the chip and the
second casing at peripheries thereof.
[0014] To achieve the aforementioned effects, the image sensor
package structure alternatively includes a substrate provided with
a plurality of first conductive contacts; a chip including a first
surface and a second surface opposite to the first surface, wherein
the first surface is bound to the substrate while the second
surface has a sensitization area and a plurality of second
conductive contacts that surrounds the periphery of the
sensitization area and is electrically connected with the first
conductive contacts; a transparent lid having a third surface and a
fourth surface opposite to the third surface, wherein the third
surface covers over the sensitization area to define an air cavity
over the sensitization area; a third casing having a fifth board
that adheres to the second surface, a sixth board that has one edge
connected with one edge of the fifth board, a seventh board that is
parallel to the fifth board and connected with an opposite edge of
the sixth board so that the fifth, sixth, and seventh boards
jointly form a transverse U-shaped structure for locking in the
transparent lid, and an eighth board that extends from the seventh
board outward from the third casing; and a package material
covering around the chip and the third casing at peripheries
thereof.
[0015] By implementing the present invention, at least the
following progressive effects can be achieved:
[0016] 1. By virtue of the adhesive layers or the casing covering
around the transparent lid, the blockage area from moisture is
elongated so that the image sensor package structure is prevented
from external moisture invasion.
[0017] 2. Since the casing serves to support the image sensor
package structure, the amount of the expensive liquid compound used
can be reduced, leading to reduced material costs.
[0018] 3. The stacked casing and adhesive layers help to enlarge
the air cavity between the transparent lid and the chip in volume,
thereby improving imaging quality.
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The invention as well as a preferred mode of use, further
objectives and advantages thereof will be best understood by
reference to the following detailed description of illustrative
embodiments when read in conjunction with the accompanying
drawings, wherein:
[0020] FIG. 1 is a cross-sectional view of an image sensor package
structure according to a first embodiment of the present
invention;
[0021] FIG. 2 is a bottom oblique view of a first casing according
to the first embodiment of the present invention;
[0022] FIG. 3 is a cross-sectional view of an image sensor package
structure according to a second embodiment of the present
invention;
[0023] FIG. 4 is a cross-sectional view of an image sensor package
structure according to a third embodiment of the present
invention;
[0024] FIG. 5, according to a first concept of the present
invention, shows soldering pads formed on the lower surface of the
substrate; and
[0025] FIG. 6, according to a second concept of the present
invention, shows soldering pads formed on the lower surface of the
substrate.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
First Embodiment
[0026] Referring to FIG. 1, the present embodiment is an image
sensor package structure 100, including: a substrate 110, a chip
120, a transparent lid 130, a first casing 140, and a package
material 150.
[0027] As shown in FIG. 1, the substrate 110 may be a circuit
substrate and provided thereon with at least one first conductive
contact 111.
[0028] The chip 120 has a first surface 121 and a second surface
122, referring to the lower surface and the upper surface of the
chip 120, respectively. Therein, the first surface 121 is combined
with the substrate 110, so as to adhere the chip 120 to the
substrate 110. Additionally, a glue layer 112 may be provided
between the chip 120 and the substrate 110 for enhancing the
combination between the chip 120 and the substrate 110. The second
surface 122 of the chip 120 is formed with at least one second
conductive contact 123 and a sensitization area 124. The
sensitization area 124 includes therein a plurality of
photosensitive elements and one or more said second conductive
contacts 123 surrounding the periphery of the sensitization area
124 in electrical connection with the photosensitive elements in
the sensitization area 124.
[0029] Moreover, the second conductive contact 123 may be
electrically connected to the first conductive contact 111 of the
substrate 110 through a metal conducting wire 10 formed by wiring.
The chip 120 may be a CMOS (Complementary Metal Oxide
Semiconductor) image sensor or a CCD (Charge Coupled Device) for
sensing light.
[0030] As can be seen in FIG. 1, the transparent lid 130 has a
third surface 131 and a fourth surface 132, referring to the lower
surface and the upper surface of the transparent lid 130,
respectively. The transparent lid 130 covers the sensitization area
124 of the chip 120 for protecting the sensitization area 124 of
the chip 120 from contaminants that may otherwise adversely affect
the imaging quality of the sensed image. Also, the transparent lid
130 allows light to pass therethrough and enter into the
sensitization area 124 of the chip 120.
[0031] The third surface 131 of the transparent lid 130 adheres to
the second surface 122 of the chip 120 by means of a first adhesive
layer 160, which may be made of epoxy resin. Since the first
adhesive layer 160 is settled between the sensitization area 124
and the second conductive contact 123, the first adhesive layer 160
does not cover the sensitization area 124, and thus the chip 120 is
ensured with the optimal light-sensing effect. As a result of the
first adhesive layer 160, an air cavity 170 is formed between the
transparent lid 130 and the sensitization area 124 of the chip
120.
[0032] Referring to FIG. 2, the first casing 140 has a first board
141, which may be a quadrilateral board centrally formed with an
opening 143. The first casing 140 may further include a flange 142
that is defined by a vertically extended peripheral portion of the
first board 141, so that the first casing 140 has a stepped inner
periphery.
[0033] As shown in FIG. 1, the first board 141 has a fifth surface
144 adhering to the fourth surface 132 of the transparent lid 130
by means of a second adhesive layer 180. In other words, the
peripheral surface of the opening 143 of the first board 141 is
adhesively attached to the transparent lid 130, while the second
adhesive layer 180 extends and covers lateral sides of the
transparent lid 130 for enhancing the combination between the first
casing 140 and the transparent lid 130. The second adhesive layer
180 may also be made of epoxy resin.
[0034] Again in FIG. 1, the opening 143 of the first board 141 is
positioned corresponding to the sensitization area 124 of the chip
120, so as to allow light to pass through the opening 143 and
pierce through the transparent lid 130 to enter into the
sensitization area 124 of the chip 120, thereby enabling the
sensitization area 124 to receive light and conduct its sensing
function.
[0035] The first casing 140 may be made of a heat-resistant plastic
material or a metal material. When the first casing 140 is made of
the metal material, the first casing 140 provides additional
heat-dissipation effect to the image sensor package structure 100.
Furthermore, the first casing 140 and the transparent lid 130 may
be adhesively combined beforehand by means of the second adhesive
layer 180, and then jointly adhered to the chip 120 by means of the
first adhesive layer 160.
[0036] Also in FIG. 1, the package material 150 is formed by
injecting liquid compound or mold compound to cover around the chip
120, the transparent lid 130, and the first casing 140 at
peripheries thereof so that the chip 120 and metal conducting wires
10 are protected by the package material 150 from damage that may
be otherwise caused by external force or moisture.
[0037] For dissipation of volatile gases contained in the liquid
compound during compound dispensing, the first casing 140 or the
flange 142 of the first casing 140 may further have at least one
gas vent 145. The gas vent 145 penetrates through the first casing
140 or the flange 142 so as to allow the volatile gases in the
liquid compound to instantly dissipate through the gas vent 145
during compound dispensing or baking. It prevents formation of air
bubbles otherwise incurred by such volatile gases in the package
material 150, and ensures the production yield of the image sensor
package structure 100.
[0038] Still referring to FIG. 1, in the image sensor package
structure 100, the first adhesive layer 160 and the second adhesive
layer 180 adhere the transparent lid 130 to the chip 120 and adhere
the first casing 140 to the transparent lid 130, respectively. The
fourth surface 132 of the transparent lid 130 is peripherally
covered by the second adhesive layer 180 while the first board 141
covers thereon. Consequently, the transparent lid 130 has its edges
covered and sealed by the first casing 140 and the second adhesive
layer 180, thereby elongating the blockage area from moisture
seeping into the air cavity 170 and in turn effectively enhancing
the reliability of the image sensor package structure 100.
[0039] The first casing 140 in the image sensor package structure
100 not only advantageously provides structural support but also
decreases the volume of the package material 150, which reduces the
amount of liquid compound used in the image sensor package
structure 100, and thereby lowering material costs.
Second Embodiment
[0040] Referring to FIG. 3, in an image sensor package structure
200 of the present embodiment, the first casing 140 of the first
embodiment is replaced by a second casing 210. While the remainder
has been described in detailed in the first embodiment, related
explanation is omitted herein. The second casing 210 is combined
with the transparent lid 130 in a different way. The second casing
210 has a second board 211, a third board 212, and a fourth board
213.
[0041] According to FIG. 3, the second board 211 and the fourth
board 213 of the second casing 210 are parallel to each other while
the third board 212 serves to connect edges of the second board 211
and the fourth board 213, so that the second casing 210 has a
stepped shape. Moreover, the third board 212 may be perpendicular
to the second board 211 and the fourth board 213, or be connected
to either boards (second board 211 and fourth board 213) at angles
other than 90 degrees. The second board 211 has a sixth surface 214
adhering to the second surface 122 of the chip 120 by means of a
third adhesive layer 220, so as to adhere the second casing 210 to
the chip 120.
[0042] The second board 211 further has a seventh surface 215
adhering to the third surface 131 of the transparent lid 130 by
means of a fourth adhesive layer 230. Both the third adhesive layer
220 and the fourth adhesive layer 230 may be made of epoxy resin.
The transparent lid 130 and the second board 211 may be formed
through an injection molding process as a whole before the second
casing 210 is adhered to the chip 120 by means of the third
adhesive layer 220.
[0043] Also in FIG. 3, the fourth board 213 of the second casing
210 may further have at least one gas vent 216. The gas vent 216
penetrates through the second casing 210 so as to allow the
volatile gases in the liquid compound to instantly dissipate
through the gas vent 216 during compound dispensing or baking. It
prevents formation of air bubbles otherwise incurred by volatile
gases in the package material 150 and ensures the production yield
of the image sensor package structure 200. The package material 150
is arranged between the substrate 110 and the second casing 210 for
covering the periphery of the second casing 210, the metal
conducting wires 10 and the chip 120. In addition, since the second
casing 210 directly adheres to the chip 120, it may be made of a
heat-resistant plastic material, enduring a temperature as high as
260 or more.
[0044] In the image sensor package structure 200, since the chip
120 and transparent lid 130 jointly sandwich therebetween the third
adhesive layer 220, the second board 211 and the fourth adhesive
layer 230, a distance between the transparent lid 130 and the chip
120 is enlarged, in turn widening the air cavity 170 in volume,
preventing ghost images that are otherwise caused by multiple
reflection or diffraction of light, thereby improving the imaging
quality of the image sensor.
[0045] In addition, the second casing 210 in the image sensor
package structure 200 not only advantageously provides structural
support but also reduces the volume of the package material 150,
which also decreases the amount of liquid compound used in the
image sensor package structure 200, thereby lowering material
costs.
Third Embodiment
[0046] Referring to FIG. 4, in an image sensor package structure
300 of the present embodiment, the second casing 210 of the second
embodiment is replaced by a third casing 310. Since the remainder
has been described in detailed in the first embodiment, related
explanation is omitted herein. The third casing 310 has a fifth
board 311, a sixth board 312, a seventh board 313, and an eighth
board 314.
[0047] According to FIG. 4, the fifth board 311 and the seventh
board 313 are parallel to each other while the sixth board 312
serves to connectedges of the fifth board 311 and the seventh board
313, so that the fifth board 311, the sixth board 312, and the
seventh board 313 jointly form a transverse U-shaped structure. In
addition, the eighth board 314 is defined by an extended peripheral
portion of the seventh board 313 extending transversely outward
from the third casing 310.
[0048] As can be seen in FIG. 4, the fifth board 311 has an eighth
surface 315 adhering to the second surface 122 of the chip 120 by
means of a fifth adhesive layer 320, so as to fixedly fasten the
third casing 310 to the chip 120. The opening defined by the
transverse U-shaped structure of the third casing 310 locking in
the transparent lid 130 so that the periphery of the transparent
lid 130 is fully covered by the third casing 310. Similarly, the
transparent lid 130 and the third casing 310 may be formed through
an injection molding process as a whole before adhering to the chip
120 by means of the fifth adhesive layer 320.
[0049] Also in FIG. 4, the eighth board 314 may further have at
least one gas vent 316. The gas vent 316 penetrates through the
eighth board 314 so as to allow the volatile gases in the liquid
compound to instantly dissipate through the gas vent 316 during
compound dispensing or baking, in turn preventing formation of air
bubbles otherwise incurred by such volatile gases in the package
material 150, and ensuring the production yield of the image sensor
package structure 300. The package material 150 is arranged between
the substrate 110 and the third casing 310 for covering the
periphery of the third casing 310, the metal conducting wires 10
and the chip 120. In addition, since the third casing 310 directly
adheres to the chip 120, it may be made of a heat-resistant plastic
material, enduring a temperature as high as 260 or more.
[0050] In the image sensor package structure 300, since the chip
120 and transparent lid 130 jointly sandwich between them the fifth
board 311 and the fifth adhesive layer 320, the distance between
the transparent lid 130 and the chip 120 is enlarged, in turn
increasing the air cavity 170 in volume, thereby improving the
imaging quality of the image sensor. In addition, the third casing
310 in the image sensor package structure 300 not only
advantageously provides structural support but also reduces the
volume of the package material 150, which also decreases the amount
of liquid compound used in the image sensor package structure 300,
thereby reducing material costs.
[0051] In the image sensor package structures 100, 200, 300, the
presence of the gas vents 145, 216, 316 effectively ensures
dissipation of volatile gases during the compound dispensing or
baking process. Furthermore, in the image sensor package structure
100 or 300, the transparent lid 130 is peripherally covered by the
second adhesive layer 180 or the seventh board 313, which
elongating the blockage area of moisture entering into the air
cavity 170 and thus preventing moisture invasion that may otherwise
occur in the air cavity 170.
[0052] In each of the above embodiments, a plurality of solder
balls 20 may be attached to the lower surface 113 of the substrate
110. The solder balls 20 may be electrically connected to the first
conductive contacts 111 on the substrate 110 by means of the
circuit structure of the substrate 110 so that the solder balls 20
allow the image sensor package structure 100, 200 or 300 to
electrically connect with external circuit devices.
[0053] Furthermore, referring to FIGS. 5 and 6, in addition to the
solder balls 20, soldering pads 30 may be formed on the lower
surface 113 of the substrate 110. The soldering pads 30 may also be
electrically connected to the circuit structure of the substrate
110, and also be in electrical connection to the first conductive
contacts 111 on the substrate 110. Thus, the soldering pads 30
allow the image sensor package structure 100, 200 or 300 to
electrically connect with external circuit devices. Preferably, the
soldering pads 30 may be formed along the periphery of the lower
surface 113, as shown in FIG. 5, or may be formed into an array, as
shown in FIG. 6.
[0054] The embodiments described above are intended only to
demonstrate the technical concept and features of the present
invention so as to enable a person skilled in the art to understand
and implement the contents disclosed herein. It is understood that
the disclosed embodiments are not to limit the scope of the present
invention. Therefore, all equivalent changes or modifications based
on the concept of the present invention should be encompassed by
the appended claims.
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