Shiao; Young-Houng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shiao; Young-Houng.The latest application filed is for "manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same".

Company Profile

0.15.8

Shiao; Young-Houng - Hsin-Chu Hsien N/A TW
Shiao; Young-Houng - Chu-Pei TW
Shiao; Young-Houng - Chu-Pei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Image sensor packaging structure with black encapsulant Grant 8,928,104 - Tu , et al. January 6, 2	2015-01-06
Image sensor package structure with casing including a vent without sealing and in communication with package material Grant 8,847,146 - Tu , et al. September 30, 2	2014-09-30
Wafer level image sensor packaging structure and manufacturing method of the same Grant 8,828,777 - Tu , et al. September 9, 2	2014-09-09
Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same Grant 8,481,343 - Hsin , et al. July 9, 2	2013-07-09
Image sensor packaging structure with predetermined focal length Grant 8,441,086 - Tu , et al. May 14, 2	2013-05-14
Image sensor package structure with large air cavity Grant 8,390,087 - Tu , et al. March 5, 2	2013-03-05
Manufacturing method and structure of a wafer level image sensor module with package structure Grant 8,378,441 - Tu , et al. February 19, 2	2013-02-19
Manufacturing Method Of Molded Image Sensor Packaging Structure With Predetermined Focal Length And The Structure Using The Same App 20120068288 - Hsin; Chung-Hsien ; et al.	2012-03-22
Manufacturing method for molding image sensor package structure and image sensor package structure thereof Grant 8,093,674 - Tu , et al. January 10, 2	2012-01-10
Manufacturing Method And Structure Of A Wafer Level Image Sensor Module With Package Structure App 20110241146 - Tu; Hsiu-Wen ; et al.	2011-10-06
Wafer Level Image Sensor Packaging Structure And Manufacturing Method Of The Same App 20110241147 - Tu; Hsiu-Wen ; et al.	2011-10-06
Image Sensor Packaging Structure With Predetermined Focal Length App 20110156187 - Tu; Hsiu-Wen ; et al.	2011-06-30
Image Sensor Packaging Structure With Low Transmittance Encapsulant App 20110156188 - Tu; Hsiu-Wen ; et al.	2011-06-30
Image Sensor Package Structure App 20110024610 - Tu; Hsiu-Wen ; et al.	2011-02-03
Image Sensor Package Structure With Large Air Cavity App 20110024862 - Tu; Hsiu-Wen ; et al.	2011-02-03
Manufacturing Method For Molding Image Sensor Package Structure And Image Sensor Package Structure Thereof App 20110024861 - Tu; Hsiu-Wen ; et al.	2011-02-03

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