| Patent | Date |
|---|
Sensor package structure
Grant 11,309,275 - Hsin April 19, 2 | 2022-04-19 |
Sensor Package Structure
App 20210398934 - HSIN; CHUNG-HSIEN | 2021-12-23 |
Sensor package structure
Grant 10,720,370 - Chen , et al. | 2020-07-21 |
Sensor package structure
Grant 10,692,917 - Tu , et al. | 2020-06-23 |
Sensor package structure
Grant 10,600,830 - Chen , et al. | 2020-03-24 |
Sensor Package Structure
App 20190355639 - CHEN; JIAN-RU ; et al. | 2019-11-21 |
Sensor package structure
Grant 10,411,055 - Chuang , et al. Sept | 2019-09-10 |
Sensor package structure
Grant 10,236,313 - Tu , et al. | 2019-03-19 |
Sensor Package Structure
App 20190074310 - CHUANG; CHUN-HUA ; et al. | 2019-03-07 |
Sensor Package Structure
App 20190057992 - CHEN; JIAN-RU ; et al. | 2019-02-21 |
Sensor package structure
Grant 10,186,538 - Tu , et al. Ja | 2019-01-22 |
Sensor Package Structure
App 20190019834 - TU; HSIU-WEN ; et al. | 2019-01-17 |
Optical package structure
Grant 10,170,508 - Tu , et al. J | 2019-01-01 |
Package Base Core And Sensor Package Structure
App 20180068912 - HSIN; CHUNG-HSIEN ; et al. | 2018-03-08 |
Sensor package structure
Grant 9,905,597 - Yang , et al. February 27, 2 | 2018-02-27 |
Sensor Package Structure
App 20180019274 - YANG; JO-WEI ; et al. | 2018-01-18 |
Sensor Package Structure
App 20180012919 - TU; HSIU-WEN ; et al. | 2018-01-11 |
Sensor Package Structure
App 20180012920 - TU; HSIU-WEN ; et al. | 2018-01-11 |
Optical Package Structure
App 20170365632 - TU; Hsiu Wen ; et al. | 2017-12-21 |
Method for reducing tilt of optical unit during manufacture of image sensor
Grant 9,184,331 - Chuang , et al. November 10, 2 | 2015-11-10 |
Image sensor packaging structure with black encapsulant
Grant 8,928,104 - Tu , et al. January 6, 2 | 2015-01-06 |
Image sensor package structure with casing including a vent without sealing and in communication with package material
Grant 8,847,146 - Tu , et al. September 30, 2 | 2014-09-30 |
Wafer level image sensor packaging structure and manufacturing method of the same
Grant 8,828,777 - Tu , et al. September 9, 2 | 2014-09-09 |
Wafer level image sensor packaging structure and manufacturing method for the same
Grant 8,563,350 - Tu , et al. October 22, 2 | 2013-10-22 |
Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same
Grant 8,481,343 - Hsin , et al. July 9, 2 | 2013-07-09 |
Method For Reducing Tilt Of Optical Unit During Manufacture Of Image Sensor
App 20130149805 - CHUANG; Chun-Hua ; et al. | 2013-06-13 |
Method for reducing tilt of transparent window during manufacturing of image sensor
Grant 8,450,137 - Chuang , et al. May 28, 2 | 2013-05-28 |
Manufacturing method and structure for wafer level image sensor module with fixed focal length
Grant 8,440,488 - Tu , et al. May 14, 2 | 2013-05-14 |
Image sensor packaging structure with predetermined focal length
Grant 8,441,086 - Tu , et al. May 14, 2 | 2013-05-14 |
Image sensor package structure with large air cavity
Grant 8,390,087 - Tu , et al. March 5, 2 | 2013-03-05 |
Manufacturing method and structure of a wafer level image sensor module with package structure
Grant 8,378,441 - Tu , et al. February 19, 2 | 2013-02-19 |
Substrate structure for an image sensor package and method for manufacturing the same
Grant 8,314,481 - Hsin , et al. November 20, 2 | 2012-11-20 |
Method For Reducing Tilt Of Transparent Window During Manufacturing Of Image Sensor
App 20120220065 - CHUANG; Chun-Hua ; et al. | 2012-08-30 |
Manufacturing Method Of Molded Image Sensor Packaging Structure With Predetermined Focal Length And The Structure Using The Same
App 20120068288 - Hsin; Chung-Hsien ; et al. | 2012-03-22 |
Manufacturing method for molding image sensor package structure and image sensor package structure thereof
Grant 8,093,674 - Tu , et al. January 10, 2 | 2012-01-10 |
Wafer Level Image Sensor Packaging Structure And Manufacturing Method For The Same
App 20110291215 - Tu; Hsiu-Wen ; et al. | 2011-12-01 |
Manufacturing Method And Structure For Wafer Level Image Sensor Module With Fixed Focal Length
App 20110279815 - Tu; Hsiu-Wen ; et al. | 2011-11-17 |
Wafer Level Image Sensor Packaging Structure And Manufacturing Method Of The Same
App 20110241147 - Tu; Hsiu-Wen ; et al. | 2011-10-06 |
Manufacturing Method And Structure Of A Wafer Level Image Sensor Module With Package Structure
App 20110241146 - Tu; Hsiu-Wen ; et al. | 2011-10-06 |
Image sensor structure and integrated lens module thereof
Grant 8,004,602 - Hsin , et al. August 23, 2 | 2011-08-23 |
Image Sensor Packaging Structure With Low Transmittance Encapsulant
App 20110156188 - Tu; Hsiu-Wen ; et al. | 2011-06-30 |
Image Sensor Packaging Structure With Predetermined Focal Length
App 20110156187 - Tu; Hsiu-Wen ; et al. | 2011-06-30 |
Manufacturing Method For Molding Image Sensor Package Structure And Image Sensor Package Structure Thereof
App 20110024861 - Tu; Hsiu-Wen ; et al. | 2011-02-03 |
Image Sensor Package Structure With Large Air Cavity
App 20110024862 - Tu; Hsiu-Wen ; et al. | 2011-02-03 |
Image Sensor Package Structure
App 20110024610 - Tu; Hsiu-Wen ; et al. | 2011-02-03 |
Image sensor structure and integrated lens module thereof
App 20090283809 - Hsin; Chung-Hsien ; et al. | 2009-11-19 |
Image sensor module package structure with supporting element
Grant 7,598,580 - Hsin , et al. October 6, 2 | 2009-10-06 |
Image sensor module with air escape hole and a method for manufacturing the same
Grant 7,554,599 - Tu , et al. June 30, 2 | 2009-06-30 |
Image sensor module structure with lens holder having vertical inner and outer sidewalls
Grant 7,511,261 - Hsin , et al. March 31, 2 | 2009-03-31 |
Image Sensor Package And Method For Forming The Same
App 20090045476 - PENG; Chen Pin ; et al. | 2009-02-19 |
Image sensor and method for manufacturing the same
Grant 7,440,263 - Hsin October 21, 2 | 2008-10-21 |
Image sensor module with a protection layer and a method for manufacturing the same
Grant 7,423,334 - Tu , et al. September 9, 2 | 2008-09-09 |
Image sensor package structure
Grant 7,402,839 - Hsin July 22, 2 | 2008-07-22 |
Image sensor module with passive component
Grant 7,368,795 - Hsin May 6, 2 | 2008-05-06 |
Image sensor package structure and method for manufacturing the same
App 20080067334 - Chuang; Jason ; et al. | 2008-03-20 |
Image sensor package
App 20080036025 - Hsin; Chung Hsien ; et al. | 2008-02-14 |
Image sensor package structure and method for manufacturing the same
App 20070241272 - Chuang; Jason ; et al. | 2007-10-18 |
Image sensor package structure
App 20070215972 - Hsin; Chung Hsien | 2007-09-20 |
Structure of stacked integrated circuits and method for manufacturing the same
App 20070210434 - Hsin; Chung Hsien | 2007-09-13 |
Method of disassembling an image sensor package
Grant 7,268,346 - Hsin , et al. September 11, 2 | 2007-09-11 |
Image sensor module with air escape hole and a method for manufacturing the same
App 20070206109 - Tu; Hsiu wen ; et al. | 2007-09-06 |
Simplified image sensor module package
App 20070159543 - Hsin; Chung Hsien | 2007-07-12 |
Image sensor module with passive component
App 20070145569 - Hsin; Chung Hsien | 2007-06-28 |
Image sensor package
App 20070138585 - Hsin; Chung Hsien ; et al. | 2007-06-21 |
Image sensor module package
App 20070138586 - Hsin; Chung Hsien ; et al. | 2007-06-21 |
Image sensor module with a protection layer and a method for manufacturing the same
App 20070108577 - Tu; Hsiu Wen ; et al. | 2007-05-17 |
Image sensor module structure and a method for manufacturing the same
App 20070096280 - Tu; Hsiu Wen ; et al. | 2007-05-03 |
Image sensor structure with a connector
App 20070090380 - Hsin; Chung Hsien | 2007-04-26 |
Image sensor package
Grant 7,196,322 - Hsin , et al. March 27, 2 | 2007-03-27 |
Method for re-forming an image sensor
App 20070045512 - Hsin; Chung Hsien ; et al. | 2007-03-01 |
Substrate structure for an image sensor package and method for manufacturing the same
App 20060275943 - Hsin; Chung Hsien ; et al. | 2006-12-07 |
Image sensor structure
App 20060197201 - Hsin; Chung Hsien | 2006-09-07 |
Stacked structure of integrated circuits and method for manufacturing the same
App 20060175694 - Hsin; Chung Hsien ; et al. | 2006-08-10 |
Image sensor structure
Grant 7,064,404 - Hsin , et al. June 20, 2 | 2006-06-20 |
Image sensor package
App 20060011811 - Hsin; Chung Hsien ; et al. | 2006-01-19 |
Image sensor package structure
App 20060006310 - Chen; Abnet ; et al. | 2006-01-12 |
Image sensor package
App 20060008939 - Chen; Abnet ; et al. | 2006-01-12 |
Image sensor having a photosensitive chip mounted to a metal sheet
Grant 6,933,493 - Hsin August 23, 2 | 2005-08-23 |
Miniaturized small memory card structure
App 20050077620 - Hsin, Chung Hsien | 2005-04-14 |
Method for packaging an image sensor
Grant 6,874,227 - Hsin , et al. April 5, 2 | 2005-04-05 |
Image sensor module and method for manufacturing the same
Grant 6,876,544 - Hsin April 5, 2 | 2005-04-05 |
Image sensor and method for manufacturing the same
App 20050013098 - Hsin, Chung Hsien | 2005-01-20 |
Image sensor module and method for manufacturing the same
App 20050013097 - Hsin, Chung Hsien | 2005-01-20 |
Method for packing transparent layers for image sensor packages
App 20040244908 - Hsin, Chung Hsien | 2004-12-09 |
Method for packaging an image sensor
App 20040244192 - Hsin, Chung Hsien ; et al. | 2004-12-09 |
Image sensor having a photosensitive chip mounted to a metal sheet
App 20040195492 - Hsin, Chung Hsien | 2004-10-07 |
Image sensor structure
Grant 6,791,842 - Hsin September 14, 2 | 2004-09-14 |
Package structure of a photosensor
App 20040150061 - Hsin, Chung Hsien | 2004-08-05 |
Miniaturized image sensor module
App 20040150740 - Hsin, Chung Hsien | 2004-08-05 |
Stacked structure of integrated circuits
App 20040150094 - Hsin, Chung Hsien | 2004-08-05 |
Stacked structure of chips
App 20040135242 - Hsin, Chung Hsien | 2004-07-15 |
Stacked structure for an image sensor
Grant 6,740,973 - Hsin May 25, 2 | 2004-05-25 |
Image Sensor Structure
App 20040089906 - Hsin, Chung Hsien | 2004-05-13 |
Image sensor structure
App 20040092083 - Hsin, Chung-Hsien | 2004-05-13 |
Multi-chip package
App 20030183912 - Hsin, Chung Hsien | 2003-10-02 |
Image sensor and method for packaging the same
App 20030151108 - Hsin, Chung Hsien | 2003-08-14 |
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